Controller and vehicle

Abstract

The utility model discloses a controller and a vehicle, and belongs to the technical field of vehicles. The controller comprises a shell assembly, a first circuit board, a liquid cooling radiator and a first connector, a containing cavity is formed in the shell assembly, a preset area of the first circuit board is located in the containing cavity, the liquid cooling radiator is used for heat dissipation of the first circuit board, and the liquid cooling radiator is arranged in the containing cavity; the first circuit board is provided with a first connecting port, the first connecting port is located outside the containing cavity, and the first connector is connected with the first circuit board through the first connecting port. According to the controller provided by the invention, the preset area of the first circuit board is located in the accommodating cavity, so that the shell assembly can seal the preset area of the first circuit board, and condensate water generated by liquid cooling heat dissipation is prevented from influencing the first circuit board; the first connecting port is located outside the accommodating cavity, so that the connector is also located outside the accommodating cavity, the sealing performance requirement of the connector can be reduced, and the type selection of the connector is more flexible.

Description

Technical Field

[0001] This application relates to the field of vehicle technology, and in particular to a controller and a vehicle. Background Technology

[0002] Vehicles are equipped with controllers, which include circuit boards connected to connectors. These connectors allow the circuit boards to connect to other devices. With the increasing intelligence of vehicles, the computing power requirements for controllers are rising. The electronic components on the circuit boards generate a significant amount of heat during operation, and natural cooling alone is insufficient to meet the heat dissipation needs. Some controllers employ liquid cooling to prevent the circuit boards from overheating. However, condensation from liquid cooling can affect the circuit boards, potentially causing short circuits. In related technologies, to prevent condensation from affecting the circuit boards, the controller assembly is designed as a fully sealed structure, with the circuit board installed in a sealed cavity. This approach requires all connectors connected to the circuit board to be themselves sealed, leading to difficulties in connector selection and even the lack of usable connectors. Utility Model Content

[0003] This application provides a controller and vehicle that can solve the technical problems of condensation from liquid cooling affecting circuit boards and difficulties in connector selection.

[0004] To address the aforementioned technical problems, this application provides a controller for use in a vehicle. The controller includes a housing assembly, a first circuit board, a liquid-cooled radiator, and a first connector. The housing assembly forms a receiving cavity, a preset area of ​​the first circuit board is located within the receiving cavity, and the liquid-cooled radiator is used for heat dissipation of the first circuit board and is disposed within the receiving cavity. The first circuit board has a first connection port located outside the receiving cavity, and the first connector is connected to the first circuit board through the first connection port.

[0005] In one embodiment, the controller includes a desiccant housed within a containment cavity, the desiccant being used to adsorb water vapor in the gas within the containment cavity.

[0006] In one embodiment, the controller includes a waterproof and breathable valve mounted on the housing assembly. The waterproof and breathable valve connects the accommodating cavity to the outside air and is used to balance the gas pressure inside the accommodating cavity and prevent moisture from the outside air from entering the accommodating cavity.

[0007] In one embodiment, the housing assembly includes an upper shell, a middle frame, and a lower shell stacked vertically, which together form a receiving cavity. A first circuit board is sandwiched between the upper shell and the middle frame. The controller includes a second circuit board and a second connector. A preset area of ​​the second circuit board is located within the receiving cavity. The second circuit board is sandwiched between the lower shell and the middle frame. A liquid cooling radiator is also used for heat dissipation of the second circuit board. The second circuit board is provided with a second connection port located outside the receiving cavity. The second connector is connected to the second circuit board through the second connection port.

[0008] In one embodiment, the top surface of the upper shell is provided with a first mounting position at the first connection port, and a first connector is disposed at the first mounting position; the side surface of the lower shell is provided with a second mounting position at the second connection port, and a second connector is disposed at the second mounting position.

[0009] In one embodiment, the outer periphery of the upper shell is connected to a first upper baffle extending toward the direction of the lower shell, and the outer periphery of the middle frame is connected to a first lower baffle extending toward the direction of the upper shell; the first lower baffle is disposed around the connection between the upper shell, the first circuit board and the middle frame, and the first upper baffle is disposed around the outer periphery of the first lower baffle. In a reference plane parallel to the vertical, the orthographic projection of the first upper baffle and the orthographic projection of the first lower baffle at least partially overlap.

[0010] In one embodiment, the outer periphery of the middle frame is connected to a second upper baffle extending toward the direction of the lower shell, and the outer periphery of the lower shell is connected to a second lower baffle extending toward the direction of the upper shell; the second lower baffle is disposed around the connection between the lower shell, the second circuit board and the middle frame, and the second upper baffle is disposed around the outer periphery of the second lower baffle. In a reference plane parallel to the vertical, the orthographic projection of the second upper baffle and the orthographic projection of the second lower baffle at least partially overlap.

[0011] In one embodiment, a waterproof flange protrudes from the top surface of the upper shell and surrounds the outer periphery of the first mounting position.

[0012] In one embodiment, the middle frame is provided with a drainage groove at the position corresponding to the first mounting position, and the middle frame is provided with a drainage hole at the bottom of the drainage groove, the drainage hole being connected to the drainage groove.

[0013] This application also provides a vehicle that includes the controller described above.

[0014] The controller provided in this application has a preset area of ​​the first circuit board located inside the accommodating cavity, which allows the housing assembly to seal the preset area of ​​the first circuit board, thereby preventing condensate generated by liquid cooling from affecting the first circuit board. The first connection port is located outside the accommodating cavity, and the first connector is connected to the first circuit board through the first connection port, so that the connector is also located outside the accommodating cavity. Since the sealing performance requirements of the components outside the accommodating cavity are relatively low, the sealing performance requirements of the connector can be reduced, making the selection of the connector more flexible. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is an exploded view of an embodiment of the controller provided in this application;

[0017] Figure 2 This is a partial cross-sectional structural diagram of an embodiment of the controller provided in this application from a certain perspective;

[0018] Figure 3 This is a partial cross-sectional structural schematic diagram of an embodiment of the controller provided in this application from another perspective. Detailed Implementation

[0019] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be particularly noted that the following embodiments are for illustrative purposes only and do not limit the scope of the application. Similarly, the following embodiments are only some, not all, embodiments of the present application, and all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of the present application.

[0020] In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. The terms "first," "second," and "third" in the embodiments of this application are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of that feature. All directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationships and movements between components in a specific orientation (as shown in the figures). If the specific orientation changes, the directional indication will also change accordingly. The terms "comprising" and "having," and any variations thereof, in the embodiments of this application are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or components inherent to these processes, methods, products, or devices.

[0021] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0022] This application provides a controller for use in a vehicle. See also... Figures 1-2 The controller 100 may include a housing assembly 10, a first circuit board 20, a liquid cooling radiator 30, and a first connector 40. The housing assembly 10 forms a receiving cavity 14, which provides installation space for other components. The housing assembly 10 may be made of metal; a metal housing can shield electromagnetic radiation, which helps reduce interference from electromagnetic radiation to the components within the receiving cavity 14. A predetermined area of ​​the first circuit board 20 is located within the receiving cavity 14. This predetermined area may be an area on the first circuit board 20 with high requirements for waterproofing or electromagnetic shielding, such as the core area where chips are mounted. By placing the predetermined area of ​​the first circuit board 20 within the receiving cavity 14, the housing assembly 10 can seal this area, preventing condensation from the liquid cooling system from affecting the first circuit board 20. The liquid cooling radiator 30 is used for heat dissipation of the first circuit board 20 and is located within the receiving cavity 14. The liquid cooling radiator 30, through the flow of liquid, can remove heat generated on the first circuit board 20, thereby preventing the temperature of the first circuit board 20 from becoming too high and affecting its operational stability.

[0023] Please see Figure 1 , Figure 3 The first circuit board 20 is provided with a first connection port 21, which is located outside the accommodating cavity 14. The first connector 40 is connected to the first circuit board 20 through the first connection port 21. The first connector 40 is used to connect to other devices. There can be multiple first connection ports 21, and correspondingly, there can also be multiple first connectors 40, so that the controller 100 can connect to multiple devices simultaneously, which is beneficial for expanding the functions of the controller 100. By setting the first connection port 21 to be located outside the accommodating cavity 14, the first connector 40 is also located outside the accommodating cavity 14. Since the sealing performance requirements of the components outside the accommodating cavity 14 are relatively low, the sealing performance requirements of the connectors can be reduced, making the selection of connectors more flexible.

[0024] The controller 100 provided in this application has a preset area of ​​the first circuit board 20 located inside the accommodating cavity 14, which allows the housing assembly 10 to seal the preset area of ​​the first circuit board 20, thereby preventing condensate generated by liquid cooling from affecting the first circuit board 20. The first connection port 21 is located outside the accommodating cavity 14, and the first connector 40 is connected to the first circuit board 20 through the first connection port 21, so that the first connector 40 is also located outside the accommodating cavity 14. Since the sealing performance requirements of the external components of the accommodating cavity 14 are relatively low, the sealing performance requirements of the connector can be reduced, making the selection of the connector more flexible.

[0025] During the assembly of the housing assembly 10 to form the receiving cavity 14, external air enters the receiving cavity 14. This air contains a small amount of moisture, which may affect the components within the receiving cavity 14. In one embodiment, as... Figure 1 As shown, the controller 100 includes a desiccant 70, which is housed within a containment cavity 14. The desiccant 70 is used to adsorb moisture in the gas within the containment cavity 14. By placing the desiccant 70 within the containment cavity 14, the desiccant 70 can adsorb moisture in the gas within the containment cavity 14, thereby reducing the impact of moisture on the components within the containment cavity 14. The desiccant 70 can be one of silica gel desiccant, molecular sieve desiccant, activated carbon desiccant, or polymer desiccant.

[0026] In one embodiment, such as Figure 1 , Figure 2As shown, the controller 100 includes a waterproof and breathable valve 80, which is mounted on the housing assembly 10. The waterproof and breathable valve 80 connects the accommodating cavity 14 with the outside air. The waterproof and breathable valve 80 is used to balance the gas pressure inside the accommodating cavity 14 and prevent moisture from the outside air from entering the accommodating cavity 14. A waterproof and breathable membrane may be provided on the waterproof and breathable valve 80, which allows gas to pass through while preventing water molecules from passing through. The heat dissipated by the components inside the accommodating cavity 14 will cause the gas temperature inside the accommodating cavity 14 to rise, which in turn increases the gas pressure and causes it to expand. At this time, the gas can be discharged from the accommodating cavity 14 through the waterproof vent valve 80, thereby balancing the gas pressure inside the accommodating cavity 14 and preventing excessive gas pressure from affecting the components inside the accommodating cavity 14. When the gas pressure inside the accommodating cavity 14 decreases, external air can enter the accommodating cavity 14 through the waterproof vent valve 80 to balance the gas pressure. The waterproof vent valve 80 also prevents water vapor in the external air from entering the accommodating cavity 14, thus preventing water vapor from affecting the components inside the accommodating cavity 14.

[0027] The number of circuit boards housed in cavity 14 can be one, two, or more. Please refer to [link / reference]. Figure 1 , Figure 2In one embodiment, two circuit boards are disposed in the accommodating cavity 14, and the controller 100 includes a first circuit board 20 and a second circuit board 50. The housing assembly 10 includes an upper shell 11, a middle frame 12, and a lower shell 13 stacked vertically, which together form the accommodating cavity 14. The first circuit board 20 is clamped between the upper shell 11 and the middle frame 12 to prevent displacement of the first circuit board 20. A sealant is provided between the first circuit board 20 and the upper shell 11 and the middle frame 12 to enhance the airtightness of the accommodating cavity 14. A predetermined area of ​​the second circuit board 50 is located within the accommodating cavity 14, allowing the housing assembly 10 to seal the predetermined area of ​​the second circuit board 50, thereby preventing condensate generated by liquid cooling from affecting the second circuit board 50. The predetermined area of ​​the second circuit board 50 can be an area on the second circuit board 50 with high requirements for waterproofing or electromagnetic shielding, such as the core area where a chip is mounted on the circuit board. The second circuit board 50 is clamped between the lower shell 13 and the middle frame 12 to prevent displacement of the second circuit board 50. Sealant is applied between the second circuit board 50 and the lower housing 13 and the middle frame 12 to enhance the airtightness of the accommodating cavity 14. The liquid-cooled heat sink 30 is also used for heat dissipation of the second circuit board 50, preventing excessive temperature and ensuring operational stability. The controller 100 includes a second connector 60. The second circuit board 50 has a second connection port 51 located outside the accommodating cavity 14. The second connector 60 connects to the second circuit board 50 through the second connection port 51. Because the second connection port 51 is located outside the accommodating cavity 14, the second connector 60 is also located outside the accommodating cavity 14. The sealing performance requirements for components outside the accommodating cavity 14 are relatively low, thus reducing the sealing performance requirements of the connector and allowing for more flexible connector selection. The controller 100 includes two circuit boards, each with a connector, allowing for a greater number of connectors and expanding the functionality of the controller 100.

[0028] Both the first connector 40 and the second connector 60 can be disposed on the side of the housing assembly 10. (See also...) Figures 1-3In one embodiment, the top surface of the upper shell 11 has a first mounting position 113 at the first connection port 21, and a first connector 40 is disposed at the first mounting position 113, such that the first connector 40 is disposed on the top surface of the housing assembly 10. The first mounting position 113 may be a through hole formed on the top surface of the upper shell 11. The side surface of the lower shell 13 has a second mounting position 132 at the second connection port 51, and a second connector 60 is disposed at the second mounting position 132, such that the second connector 60 is disposed on the side surface of the housing assembly 10. The second mounting position 132 may be a through hole, notch, or groove formed on the side surface of the lower shell 13. By distributing the first mounting position 113 on the top surface of the upper shell 11 and the second mounting position 132 on the side surface of the lower shell 13, the first connector 40 is disposed on the top surface of the housing assembly 10 and the second connector 60 is disposed on the side surface of the housing assembly 10. The distribution of the first connector 40 and the second connector 60 on the housing assembly 10 is more dispersed, which facilitates the arrangement of devices connected to the controller 100.

[0029] In one embodiment, such as Figure 2 , Figure 3 As shown, the outer periphery of the upper shell 11 is connected to a first upper baffle 111 extending toward the direction of the lower shell 13, and the outer periphery of the middle frame 12 is connected to a first lower baffle 121 extending toward the direction of the upper shell 11. The first lower baffle 121 is arranged around the connection between the upper shell 11, the first circuit board 20, and the middle frame 12, and the first upper baffle 111 surrounds the outer periphery of the first lower baffle 121. In a reference plane parallel to the vertical direction, the orthographic projection of the first upper baffle 111 and the orthographic projection of the first lower baffle 121 at least partially overlap. With this arrangement, the upper baffle surrounds the outer side of the lower baffle, thereby forming two layers of protective baffles at the connection between the upper shell 11, the first circuit board 20, and the middle frame 12. Both layers of protective baffles can prevent water from the outside of the housing assembly 10 from flowing to the seam of the housing assembly 10, which helps to improve the waterproof performance of the housing assembly 10.

[0030] In one embodiment, such as Figure 2 , Figure 3As shown, a second upper baffle 122 extending towards the lower shell 13 is connected to the outer periphery of the middle frame 12, and a second lower baffle 131 extending towards the upper shell 11 is connected to the outer periphery of the lower shell 13. The second lower baffle 131 is arranged around the connection between the lower shell 13, the second circuit board 50, and the middle frame 12, and the second upper baffle 122 is arranged around the outer periphery of the second lower baffle 131. In a reference plane parallel to the vertical direction, the orthographic projection of the second upper baffle 122 and the orthographic projection of the second lower baffle 131 at least partially overlap. With this arrangement, the upper baffle surrounds the outer side of the lower baffle, thereby forming two layers of protective baffles at the connection between the lower shell 13, the second circuit board 50, and the middle frame 12. Both layers of protective baffles can prevent water from the outside of the housing assembly 10 from flowing to the seam of the housing assembly 10, which helps to improve the waterproof performance of the housing assembly 10.

[0031] Please see Figure 3 In one embodiment, a waterproof flange 112 protrudes from the top surface of the upper shell 11, and the waterproof flange 112 surrounds the outer periphery of the first mounting position 113. The waterproof flange 112 can prevent water from flowing from the top surface of the upper shell 11 to the first mounting position 113, making it difficult for water to penetrate the first connector 40.

[0032] In one embodiment, such as Figure 3 As shown, the middle frame 12 is provided with a drainage groove 123 at the corresponding position of the first mounting position 113, and the middle frame 12 is provided with a drainage hole 124 at the bottom of the drainage groove 123, which is connected to the drainage groove 123. With this arrangement, even if water enters the first mounting position 113, the water can be discharged in time through the drainage groove 123 and the drainage hole 124, preventing water accumulation at the first connection port 21 of the first circuit board 20, thereby reducing the impact of water on the first circuit board 20 and the first connector 40.

[0033] This application provides a vehicle including the controller 100 as described above. Exemplarily, the controller 100 can be used to control the vehicle's autonomous driving. The vehicle can be a vehicle powered by a combustion engine or a vehicle powered by an electric motor. Other aspects of the vehicle's structure will not be described further.

[0034] The above description is only a part of the embodiments of this application and does not limit the scope of protection of this application. Any equivalent device or equivalent process transformation made based on the content of this application specification and drawings, or direct or indirect application in other related technical fields, are similarly included in the patent protection scope of this application.

Claims

1. A controller, characterized in that, The controller is used in a vehicle and includes a housing assembly, a first circuit board, a liquid-cooled radiator, and a first connector. The housing assembly forms a receiving cavity, a preset area of ​​the first circuit board is located in the receiving cavity, and the liquid-cooled radiator is used for heat dissipation of the first circuit board and is disposed in the receiving cavity. The first circuit board is provided with a first connection port, which is located outside the accommodating cavity. The first connector is connected to the first circuit board through the first connection port.

2. The controller according to claim 1, characterized in that, The controller includes a desiccant disposed within the containment cavity, the desiccant being used to adsorb water vapor in the gas within the containment cavity.

3. The controller according to claim 1, characterized in that, The controller includes a waterproof and breathable valve, which is mounted on the housing assembly. The waterproof and breathable valve connects the accommodating cavity to the outside air and is used to balance the gas pressure inside the accommodating cavity and prevent moisture from the outside air from entering the accommodating cavity.

4. The controller according to claim 1, characterized in that, The housing assembly includes an upper shell, a middle frame, and a lower shell stacked vertically, the upper shell, the middle frame, and the lower shell enclosing the receiving cavity, and the first circuit board is sandwiched between the upper shell and the middle frame; The controller includes a second circuit board and a second connector. A preset area of ​​the second circuit board is located within the accommodating cavity. The second circuit board is sandwiched between the lower shell and the middle frame. The liquid cooling radiator is also used for heat dissipation of the second circuit board. The second circuit board is provided with a second connection port, which is located outside the accommodating cavity. The second connector is connected to the second circuit board through the second connection port.

5. The controller according to claim 4, characterized in that, The top surface of the upper shell has a first mounting position at the first connection port, and the first connector is located at the first mounting position. The side of the lower shell has a second mounting position at the second connection port, and the second connector is located at the second mounting position.

6. The controller according to claim 5, characterized in that, The outer periphery of the upper shell is connected to a first upper baffle extending toward the direction of the lower shell, and the outer periphery of the middle frame is connected to a first lower baffle extending toward the direction of the upper shell. The first lower baffle is disposed around the connection between the upper shell, the first circuit board and the middle frame, and the first upper baffle is disposed around the outer periphery of the first lower baffle. In a reference plane parallel to the vertical, the orthographic projection of the first upper baffle and the orthographic projection of the first lower baffle at least partially overlap.

7. The controller according to claim 5, characterized in that, The outer periphery of the middle frame is connected to a second upper baffle extending toward the direction of the lower shell, and the outer periphery of the lower shell is connected to a second lower baffle extending toward the direction of the upper shell; The second lower baffle is disposed around the connection between the lower shell, the second circuit board and the middle frame, and the second upper baffle is disposed around the outer periphery of the second lower baffle. In a reference plane parallel to the vertical, the orthographic projection of the second upper baffle and the orthographic projection of the second lower baffle at least partially overlap.

8. The controller according to claim 5, characterized in that, The top surface of the upper shell is provided with a waterproof flange that surrounds the outer periphery of the first mounting position.

9. The controller according to claim 5, characterized in that, The middle frame has a drainage groove at the position corresponding to the first mounting position, and the middle frame has a drainage hole at the bottom of the drainage groove, the drainage hole being connected to the drainage groove.

10. A vehicle, characterized in that, Includes the controller as described in any one of claims 1-9.

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