Surface dirt sufficient cleaning equipment for bonding copper wire processing

Abstract

The utility model discloses surface dirt sufficient cleaning equipment for bonding copper wire machining, which comprises a bottom plate, a long hole is formed in the top side of the bottom plate, a moving assembly is arranged in the long hole, an annular ring is arranged above the moving assembly, a guide groove is formed in one side of the annular ring, and a plurality of guide blocks are slidably mounted in the guide groove. The multiple guide blocks are all in a T shape, the other sides of the multiple guide blocks are fixedly connected with the same gear ring, through cooperation of the gear ring and the gear, when dirt on the outer side of the bonding copper wire needs to be cleaned, the rotating motor operates to drive the gear to rotate, and due to the fact that the gear is meshed with the gear ring, when the gear rotates, the gear ring can be synchronously driven to rotate; the two cleaning plates rotate synchronously, dirt on the outer side of the bonding copper wire can be cleaned by the cleaning plates without dead corners through synchronous rotation, and the cleaning effect of the bonding copper wire can be greatly improved through the moving assembly and the cleaning assembly which are arranged in a matched mode in the rotating cleaning process.

Description

Technical Field

[0001] This utility model relates to the field of copper bonding wire processing technology, and in particular to a device for thoroughly cleaning surface dirt in copper bonding wire processing. Background Technology

[0002] Bonding is an important step in integrated circuit manufacturing, which connects the circuit chip to the lead frame. Bonding wires are fine metal wires used during the assembly of semiconductor devices and integrated circuits to achieve electrical connection between the input / output bonding points of the chip circuit and the internal contact points of the lead frame. The quality of bonding directly affects the performance of the integrated circuit.

[0003] Due to the large amount of dust and dirt on the production line, some impurities will adhere to the surface of the bonding wire after processing. Since the bonding equipment is quite precise, if it is not cleaned, the impurities may cause damage to the chip or poor contact during the bonding process, affecting the bonding effect. Therefore, a surface dirt cleaning device for bonding copper wire processing is proposed to solve the above problems. Utility Model Content

[0004] To address the shortcomings of existing technologies, this invention provides a device for thoroughly cleaning surface contaminants in the processing of bonding copper wires, thereby solving the problems mentioned in the background section.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A device for thoroughly cleaning surface contaminants during copper wire bonding includes a base plate. An elongated hole is formed on the top side of the base plate, and a movable component is disposed within the hole. An annular ring is positioned above the movable component. A guide groove is formed on one side of the annular ring, and multiple guide blocks, each T-shaped, are slidably installed within the guide groove. A toothed ring is fixedly connected to the other side of each guide block. Two side plates are fixedly installed on one side of the toothed ring, and first electric push rods are fixedly installed on the sides of the two side plates that are far apart from each other. The output ends of the two first electric push rods penetrate the side plates and are fixedly connected to cleaning plates. A linkage component and a cleaning component are respectively disposed on the outer side of the annular ring.

[0007] Preferably, the moving component includes a threaded motor fixedly installed on one side of the base plate, the output end of the threaded motor rotatably passing through the base plate and fixedly installed with a threaded rod, the other end of the threaded rod being rotatably connected to the inner wall of one side of the elongated hole, a slider being threadedly sleeved on the outer side of the threaded rod, a fixed seat being fixedly connected to the top side of the slider, and an annular ring being fixedly installed on the top side of the fixed seat.

[0008] Preferably, the linkage component includes a connecting plate fixedly installed on one side of an annular ring, a rotary motor fixedly installed on one side of the connecting plate, the output end of the rotary motor rotating through the connecting plate and fixedly connected to a gear, the gear meshing with the gear ring.

[0009] Preferably, the cleaning assembly includes a top plate fixedly installed on the top side of an annular ring, a water pump fixedly installed on the top side of the top plate, a delivery pipe fixedly installed on one side of the water pump, and a nozzle fixedly connected to the other end of the delivery pipe through the top plate. The nozzle is inclined.

[0010] Preferably, a collection box is fixedly installed on the bottom side of the base plate, the collection box is connected to the elongated hole opened in the base plate, a filter plate is installed inside the collection box, an extraction pipe is fixedly connected to the other side of the water pump, the other end of the extraction pipe is fixedly connected to one side of the collection box and connected to the collection box, and the extraction pipe is made of rubber.

[0011] Preferably, two fixing frames are fixedly installed on the top side of the base plate, and a second electric push rod is fixedly installed on both the top and bottom sides of the fixing frames. The output ends of the two second electric push rods pass through the fixing frames and are fixedly connected to clamps.

[0012] Preferably, two guide plates are fixedly installed on the top side of the base plate. Both guide plates are inclined and face the elongated hole in the base plate.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows: This surface dirt cleaning equipment for bonding copper wire processing, through the cooperation of the gear ring and gear, when it is necessary to clean the dirt on the outside of the bonding copper wire, the rotating motor drives the gear to rotate. Because the gear meshes with the gear ring, the gear can synchronously drive the gear ring to rotate, thereby making the two cleaning plates rotate synchronously. The synchronous rotation allows the cleaning plates to clean the dirt on the outside of the bonding copper wire without dead angles. In addition, the moving component and cleaning component set in the rotation cleaning process can greatly improve the cleaning effect of the bonding copper wire. Attached Figure Description

[0014] Figure 1 This is a three-dimensional structural schematic diagram of the present utility model;

[0015] Figure 2 This is a cross-sectional view of the structure of this utility model;

[0016] Figure 3 This is a schematic diagram of the toothed ring part of the structure of this utility model;

[0017] Figure 4 This is a schematic diagram of some parts of the nozzle structure of this utility model.

[0018] In the diagram: 1. Base plate; 2. Threaded motor; 3. Threaded rod; 4. Slider; 5. Fixing seat; 6. Annular ring; 7. Guide block; 8. Gear ring; 9. Side plate; 10. First electric push rod; 11. Cleaning plate; 12. Connecting plate; 13. Rotary motor; 14. Gear; 15. Top plate; 16. Collection box; 17. Filter plate; 18. Water pump; 19. Delivery pipe; 20. Nozzle; 21. Extraction pipe; 22. Fixing frame; 23. Second electric push rod; 24. Clamping plate; 25. Guide plate. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Reference Figure 1-4 A device for thoroughly cleaning surface contaminants in copper wire bonding processing includes a base plate 1. An elongated hole is formed on the top side of the base plate 1, and a movable component is installed within the hole. An annular ring 6 is positioned above the movable component. A guide groove is formed on one side of the annular ring 6, and multiple guide blocks 7, each T-shaped, are slidably installed within the guide groove. A toothed ring 8 is fixedly connected to the other side of each guide block 7. Two side plates 9 are fixedly installed on one side of the toothed ring 8. First electric push rods 10 are fixedly installed on the sides of the two side plates 9 that are far apart from each other. The output ends of the two first electric push rods 10 penetrate the side plates 9 and are fixedly connected to cleaning plates 11. A linkage component and a cleaning component are respectively arranged on the outer side of the annular ring 6. The linkage component includes a connecting plate 12 fixedly installed on one side of the annular ring 6, and a rotary motor 13 fixedly installed on one side of the connecting plate 12. The output end of the rotary motor 13 rotates through the connecting plate 12 and is fixedly connected to a toothed ring. The wheel 14 and gear 14 mesh with the gear ring 8. After the two ends of the bonding copper wire are fixed by two sets of clamping plates 24, the two first electric push rods 10 are activated to drive the two cleaning plates 11 to move closer to each other synchronously. This allows the side of the two cleaning plates 11 that is close to each other to contact the outer side of the bonding copper wire. Since the distance between the two cleaning plates 11 can be adjusted, it is possible to clean bonding copper wires of different thicknesses. When the two cleaning plates 11 contact the outer side of the bonding copper wire, the rotating motor 13 drives the gear 14 to rotate. Since the gear 14 meshes with the gear ring 8, the rotation of the gear 14 can synchronously drive the gear ring 8 to rotate, thereby causing the two cleaning plates 11 to rotate synchronously. Synchronous rotation allows the cleaning plates 11 to clean the dirt on the outer side of the bonding copper wire without dead angles. The combination of the moving component and the cleaning component can greatly improve the cleaning effect of the bonding copper wire.

[0021] Specifically, the moving component includes a threaded motor 2 fixedly installed on one side of the base plate 1. The output end of the threaded motor 2 rotatably passes through the base plate 1 and is fixedly installed with a threaded rod 3. The other end of the threaded rod 3 is rotatably connected to the inner wall of one side of the elongated hole. A slider 4 is threadedly sleeved on the outer side of the threaded rod 3. A fixed seat 5 is fixedly connected to the top side of the slider 4. An annular ring 6 is fixedly installed on the top side of the fixed seat 5. By setting up the threaded motor 2, while the two cleaning plates 11 are cleaning the dirt on the outside of the bonding copper wire, the operation of the threaded motor 2 can drive the slider 4 to move, thereby causing the slider 4 to synchronously drive the annular ring 6 on the top side of the fixed seat 5 to move horizontally. The horizontal movement can make the two cleaning plates 11 evenly clean the dirt on the outside of the bonding copper wire, which can be more comprehensive.

[0022] Specifically, the cleaning assembly includes a top plate 15 fixedly installed on the top side of the annular ring 6, a water pump 18 fixedly installed on the top side of the top plate 15, a delivery pipe 19 fixedly installed on one side of the water pump 18, and a nozzle 20 fixedly connected to the other end of the delivery pipe 19 through the top plate 15. The nozzle 20 is set at an angle. With the water pump 18 installed, when the rotary motor 13 is started, the water pump 18 will draw water from the collection tank 16 through the extraction pipe 21, and then spray the water onto the cleaning plate 11 through the nozzle 20 at the other end of the delivery pipe 19. This ensures that the cleaning plate 11 is rinsed while the bonding copper wires are cleaned, and avoids that too much dirt on the cleaning plate 11 will lead to a poor cleaning effect.

[0023] Specifically, a collection box 16 is fixedly installed on the bottom side of the base plate 1. The collection box 16 is connected to an elongated hole in the base plate 1. A filter plate 17 is installed inside the collection box 16. An extraction pipe 21 is fixedly connected to the other side of the water pump 18. The other end of the extraction pipe 21 is fixedly connected to one side of the collection box 16 and is connected to the collection box 16. The extraction pipe 21 is made of rubber. Two fixing brackets 22 are fixedly installed on the top side of the base plate 1. A second electric push rod 23 is fixedly installed on both the top and bottom sides of the fixing brackets 22. The output ends of the two second electric push rods 23 pass through the fixing brackets 22 and are fixedly connected to clamps 24. Two guide plates 25 are fixedly installed on the top side of the base plate 1. The two guide plates 25 are inclined and face the elongated hole in the base plate 1. Through the multiple second electric push rods 23, the two bonding copper wires are... When the end is placed on the two sets of clamping plates 24, the operation of multiple second electric push rods 23 can drive the two sets of clamping plates 24 to complete the clamping of both ends of the bonding copper wire. After clamping, it can prevent the wire from falling off during the cleaning process. By setting two guide plates 25, the water dripping from the cleaning plate 11 and the bonding copper wire can be guided to fall into the collection box 16 through the elongated hole in the bottom plate 1. The collection box 16 is equipped with a filter plate 17, which can block dirt or impurities mixed in the water. The filtered water will enter the bottom of the collection box 16, thereby realizing the recycling of water resources. Furthermore, because the extraction tube 21 is made of rubber, which has a certain tensile strength, the extraction tube 21 will not break when it moves with the annular ring 6.

[0024] All electrical components mentioned in this article are connected to an external main controller and 220V AC mains power, and the main controller can be a conventional known device such as a computer for control.

[0025] In use: By placing both ends of the bonding copper wire between two sets of clamping plates 24, and then activating multiple second electric push rods 23, the clamping plates 24 are driven to clamp both ends of the bonding copper wire. This clamping ensures the wire will not detach during cleaning. After clamping, activating two first electric push rods 10 simultaneously moves two cleaning plates 11 closer together, bringing their adjacent sides into contact with the outer side of the bonding copper wire. The distance between the two cleaning plates 11 is adjustable, allowing cleaning of bonding copper wires of different thicknesses. When the two cleaning plates 11 contact the outer side of the bonding copper wire, the rotating motor 13 drives the gear 14 to rotate. Because the gear 14 meshes with the gear ring 8, its rotation synchronously drives the gear ring 8, causing the two cleaning plates 11 to rotate synchronously. Rotation allows the cleaning plate 11 to thoroughly clean the dirt on the outside of the bonding copper wires without any blind spots. While rotating and cleaning, the threaded motor 2 is started simultaneously. The operation of the threaded motor 2 drives the annular ring 6 to move horizontally, thereby causing the two cleaning plates 11 to move horizontally and clean the dirt on the outside of the bonding copper wires. With the water pump 18 installed, when the rotating motor 13 is started, the water pump 18 draws water from the collection tank 16 through the extraction pipe 21, and then sprays the water onto the cleaning plate 11 through the nozzle 20 at the other end of the delivery pipe 19. This ensures that the cleaning plate 11 is rinsed and the bonding copper wires are cleaned at the same time, avoiding the problem of too much dirt adhering to the cleaning plate 11, which would lead to a poor cleaning effect. After cleaning, the operation of multiple second electric push rods 23 will stop the multiple clamping plates 24 from clamping the two ends of the bonding copper wires. Then, the cleaned bonding copper wires can be removed to start cleaning and descaling the next bonding copper wire.

[0026] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0027] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A surface dirt fully cleaning apparatus for bonding copper wire processing, comprising a base plate (1), characterized in that, The top side of the bottom plate (1) is provided with a long hole, a moving assembly is arranged in the long hole, an annular ring (6) is arranged above the moving assembly, a guide groove is arranged on one side of the annular ring (6), a plurality of guide blocks (7) are slidably installed in the guide groove, the plurality of guide blocks (7) are all T-shaped, the other side of the plurality of guide blocks (7) is fixedly connected with the same gear ring (8), two side plates (9) are fixedly installed on one side of the gear ring (8) away from each other, the first electric push rod (10) is fixedly installed on the side plate (9) away from each other, the output end of the two first electric push rods (10) penetrates the side plate (9) and is fixedly connected with the cleaning plate (11), and the outer side of the annular ring (6) is respectively provided with a linkage assembly and a cleaning assembly.

2. The surface contamination fully cleaning apparatus for bonding copper wire processing according to claim 1, wherein The moving assembly comprises a threaded motor (2) fixedly installed on one side of the bottom plate (1), a threaded rod (3) rotatably penetrating the bottom plate (1) and fixedly installed on the output end of the threaded motor (2), and the other end of the threaded rod (3) is rotatably connected with the inner wall of one side of the long hole, the outer side of the threaded rod (3) is threadedly sleeved with a sliding block (4), the top side of the sliding block (4) is fixedly connected with a fixing seat (5), and the annular ring (6) is fixedly installed on the top side of the fixing seat (5).

3. The surface contamination fully cleaning apparatus for bonding copper wire processing according to claim 1, characterized by, The linkage assembly comprises a connecting plate (12) fixedly installed on one side of the annular ring (6), a rotary motor (13) fixedly installed on one side of the connecting plate (12), a gear (14) rotatably penetrating the connecting plate (12) and fixedly connected with the output end of the rotary motor (13), and the gear (14) is engaged with the gear ring (8).

4. The surface contamination fully cleaning apparatus for bonding copper wire processing according to claim 1, characterized by, The cleaning assembly comprises a top plate (15) fixedly installed on the top side of the annular ring (6), a water pump (18) fixedly installed on the top side of the top plate (15), a conveying pipe (19) fixedly installed on one side of the water pump (18), and a spray head (20) penetrating the top plate (15) and fixedly connected with the other end of the conveying pipe (19), wherein the spray head (20) is arranged obliquely.

5. The surface contamination fully cleaning apparatus for bonding copper wire processing according to claim 4, characterized by, The bottom side of the bottom plate (1) is fixedly installed with a collecting box (16), the collecting box (16) is communicated with the long hole of the bottom plate (1), a filter plate (17) is arranged in the collecting box (16), the other side of the water pump (18) is fixedly connected with a suction pipe (21), the other end of the suction pipe (21) is fixedly connected on one side of the collecting box (16) and communicated with the collecting box (16), and the material of the suction pipe (21) is rubber material.

6. The surface contamination fully cleaning apparatus for bonding copper wire processing according to claim 1, wherein The top side of the bottom plate (1) is fixedly installed with two fixed frames (22), the top side and the bottom side of the fixed frame (22) are fixedly installed with the second electric push rod (23), the output end of the two second electric push rods (23) penetrates the fixed frame (22) and is fixedly connected with the clamping plate (24).

7. The surface contamination fully cleaning apparatus for bonding copper wire processing according to claim 1, wherein The top side of the bottom plate (1) is fixedly installed with two guide plates (25), the two guide plates (25) are arranged obliquely, and the two guide plates (25) are all arranged towards the long hole of the bottom plate (1).

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