Reflow soldering equipment

Abstract

The utility model relates to the technical field of reflow soldering furnaces, and discloses reflow soldering equipment which comprises a lower furnace body, an upper furnace body is hinged to the upper end of the lower furnace body, and two symmetrically-arranged adjusting frames are arranged in the lower furnace body. According to the reflow soldering equipment, through the transmission mode that the steel belt and the belt wheels are combined and the arrangement of the guide columns is matched, stable conveying of the PCBs is achieved, direct contact and friction between the side faces of the PCBs and the guide rails are greatly reduced, the electrical performance and the appearance quality of the PCBs are improved, meanwhile, the service life of the equipment is prolonged, and the cost is reduced. A first heater and a second heater are arranged at the bottom of the lower furnace body and the bottom of the upper furnace body correspondingly, double-face heating of the upper surface and the bottom of a PCB is achieved, and the problem of temperature difference caused by a traditional bottom heating mode is effectively solved; flexible adjustment of the distance between the adjusting frames is achieved, and the design enables the equipment to easily adapt to PCBs of different sizes.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of reflow soldering furnaces, in particular to a reflow soldering device. BACKGROUND

[0002] After the components are mounted by the chip mounter, the components enter the furnace chamber of the reflow soldering furnace, and the furnace chamber temperature is set according to the temperature curve of the tin paste provided by the manufacturer through the principles of heat conduction, convection and radiation, so that the active / passive components are welded on the printed circuit board.

[0003] The existing patent (publication number: CN220830570U) discloses a reflow soldering furnace, which aims to solve the technical problem that the PCB is prone to shaking during conveying. The reflow soldering furnace comprises a lower furnace body, an upper furnace body arranged above the lower furnace body, a fixed block fixedly connected inside the lower furnace body, a rotating groove formed in the middle of the fixed block, a servo motor fixedly connected to the left side of the fixed block through bolts at the left end, and the like. The reflow soldering furnace can drive the rotating rod to rotate, thereby driving the first bevel gear to rotate in the rotating groove. During the rotation of the first bevel gear, the second bevel gear in the middle of the fixed block can be driven to rotate. The second bevel gear is slidably connected with the limiting groove and the limiting block. During the rotation of the second bevel gear, the limiting block can be driven to move forward and backward in the limiting groove, thereby driving the two groups of guide rails to move relatively or reversely on the upper surface of the fixed block. The distance between the two groups of guide rails can be adjusted according to the size of the PCB, thereby further improving the stability of the PCB during conveying.

[0004] However, the side surface of the PCB is prone to continuous friction with the two side surfaces of the guide rail during the conveying of the PCB, the conveying process is not smooth enough, and the PCB may be stuck. In addition, the traditional reflow soldering furnace usually uses a bottom heating device to preheat the PCB. Although this heating method can effectively improve the temperature of the bottom of the PCB, there is a significant temperature difference between the upper surface and the bottom of the PCB due to the non-uniformity of heat conduction during the heating process. This temperature difference not only affects the melting and flowing performance of the welding material, resulting in unstable welding quality, but also may cause welding defects such as virtual welding and overwelding due to local overheating or underheating, which seriously affects the electrical performance and reliability of the product. Invention content

[0005] In view of the deficiencies of the prior art, the application provides a reflow soldering device, which has the advantages of uniform heating and reducing wear, and solves the problems raised in the background art.

[0006] To achieve the above object, the present application provides the following technical scheme: The reflow soldering equipment comprises a lower furnace body, the upper end of the lower furnace body is hinged with an upper furnace body, the inside of the lower furnace body is provided with two symmetrically arranged adjusting frames, the left and right ends of the front and rear inner side walls of the two adjusting frames are both rotationally connected with transmission shafts, the outer surfaces of the two transmission shafts are both fixedly connected with pulleys, the inside of each adjusting frame is provided with a steel belt, and each group of pulleys is drivingly connected with the steel belt close thereto.

[0007] The inside top wall and the middle end inner bottom wall of each adjusting frame are both rotationally connected with a plurality of equidistantly arranged guide columns.

[0008] Through the above scheme, by using the transmission mode combining the steel belt and the pulley, cooperating with the arrangement of the guide column, not only the stable conveying of the PCB board is realized, but also the direct contact and friction between the side surface of the PCB board and the guide rail are greatly reduced, the electrical performance and appearance quality of the PCB board are improved, and the service life of the equipment is prolonged. The first heater and the second heater are arranged at the bottom of the lower furnace body and the bottom of the upper furnace body respectively, the double-sided heating of the upper surface and the bottom of the PCB board is realized, the temperature difference problem caused by the traditional bottom heating mode is effectively solved, the double-sided heating mode can ensure that the PCB board is evenly heated during the heating process, the melting and flowing performance of the welding material is improved, and the occurrence of welding defects such as virtual welding and overwelding is reduced, so that the welding quality and electrical performance of the product are significantly improved. Through the comprehensive action of the bidirectional threaded rod, the limiting rod and the distance measuring sensor, the flexible adjustment of the spacing between the adjusting frames is realized. This design makes the equipment easily adapt to PCB boards of different sizes without the need to replace or adjust the guide rail, and improves the flexibility and production efficiency of the production line.

[0009] Further, a group of first heaters are installed at the bottom ends of the front and rear inner side walls of the lower furnace body, and a group of second heaters are fixedly installed at the bottom of the upper furnace body.

[0010] Through the above scheme, through the arrangement of the first heater and the second heater, the purpose of heating the upper surface and the bottom of the circuit board can be achieved, and the heating uniformity can be improved.

[0011] Further, a plurality of equidistantly arranged supporting rollers are rotationally connected between the front and rear inner side walls of each adjusting frame, and each supporting roller is in contact with the inner wall of the steel belt.

[0012] Through the above scheme, through the arrangement of the supporting roller, the supporting purpose of the steel belt can be achieved, the deformation of the steel belt is slowed down, and the stability of conveying is improved.

[0013] Further, a bidirectional threaded rod is rotationally connected between the front and rear inner side walls of the lower furnace body, and the two adjusting frames are threadedly connected with the two ends of the bidirectional threaded rod.

[0014] Through the above scheme, through the setting of the bidirectional threaded rod, the mutual approach or away of the adjusting frame can be realized.

[0015] Further, one side of the two adjusting frames close to each other is fixedly installed with a distance measuring sensor, and the optical paths between the two distance measuring sensors are connected.

[0016] Through the above scheme, through the setting of the distance measuring sensor, the distance between the two adjusting frames can be monitored.

[0017] Further, a group of limiting rods are fixedly connected between the front and rear inner side walls of the lower furnace body, and each adjusting frame is slidably sleeved with the limiting rod close to it.

[0018] Through the above scheme, through the setting of the limiting rod, the stable movement of the adjusting frame can be realized, and the circuit boards of different sizes can be conveyed.

[0019] Further, one side of the two adjusting frames away from each other is installed with a motor, and the output end of each motor is fixedly connected with the transmission shaft close to it.

[0020] Through the above scheme, through the setting of the motor, power can be provided for the rotation of the transmission shaft.

[0021] Further, the front end of the bidirectional threaded rod is fixedly connected with the output end of the external motor.

[0022] Through the above scheme, through the setting of the external motor, power can be provided for the rotation of the bidirectional threaded rod.

[0023] Compared with the prior art, the technical scheme of the present application has the following beneficial effects:

[0024] The reflow soldering equipment, through the transmission mode combining steel belts and pulleys, cooperates with the setting of the guide columns, not only realizes the stable conveying of the PCB board, but also greatly reduces the direct contact and friction between the side surface of the PCB board and the guide rail, improves the electrical performance and appearance quality of the PCB board, and prolongs the service life of the equipment. The first heater and the second heater are respectively arranged at the bottom of the lower furnace body and the bottom of the upper furnace body, realizing double-sided heating of the upper surface and the bottom of the PCB board, effectively solving the temperature difference problem caused by the traditional bottom heating mode. This double-sided heating mode can ensure uniform heating of the PCB board during the heating process, improve the melting and flowing performance of the soldering material, reduce the occurrence of soldering defects such as virtual welding and overwelding, thereby significantly improving the soldering quality and electrical performance of the product. Through the comprehensive action of the bidirectional threaded rod, the limiting rod and the distance measuring sensor, the flexible adjustment of the distance between the adjusting frames is realized. This design makes the equipment easily adapt to PCB boards of different sizes without the need to replace or adjust the guide rail, improving the flexibility and production efficiency of the production line. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 is a perspective view of the overall structure of the present application;

[0026] Figure 2 is a perspective view of the overall structure of the present application;

[0027] Figure 3 is a structure diagram of the adjusting frame of the present application;

[0028] Figure 4 is a structure diagram of the adjusting frame of the present application.

[0029] In the drawings:

[0030] 1, lower furnace body; 2, upper furnace body; 3, adjusting frame; 4, transmission shaft; 5, belt pulley; 6, steel belt; 7, guide column; 8, first heater; 9, second heater; 10, supporting roller; 11, bidirectional threaded rod; 12, distance measuring sensor; 13, limiting rod; 14, motor. DETAILED DESCRIPTION

[0031] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0032] Please refer to Figure 1 , Figure 3 and Figure 4 The reflow soldering equipment in the embodiment includes a lower furnace body 1, the upper end of the lower furnace body 1 is hingedly connected with an upper furnace body 2, the inside of the lower furnace body 1 is provided with two symmetrically arranged adjusting frames 3, the left and right ends of the front and rear inner side walls of each adjusting frame 3 are rotationally connected with a transmission shaft 4, the outer surfaces of the two transmission shafts 4 are fixedly connected with belt pulleys 5, the inside of each adjusting frame 3 is provided with a steel belt 6, and each group of belt pulleys 5 is drivingly connected with the steel belt 6 close thereto. Through the arrangement of the belt pulleys 5 and the steel belts 6, the conveying purpose of the circuit board can be achieved. A group of first heaters 8 is installed at the bottom ends of the front and rear inner side walls of the lower furnace body 1, and a group of second heaters 9 is fixedly installed at the bottom of the upper furnace body 2. Through the arrangement of the first heaters 8 and the second heaters 9, the purpose of heating the upper surface and the bottom of the circuit board can be achieved, and the heating uniformity can be improved.

[0033] Please refer to Figure 1 , Figure 3 and Figure 4A plurality of support rollers 10 are rotationally connected between the front and rear inner side walls of each adjusting frame 3, each support roller 10 is in contact with the inner wall of the steel belt 6, through the arrangement of the support rollers 10, the support purpose of the steel belt 6 can be achieved, the deformation is slowed down, and the stability of the conveying is improved, a plurality of guide columns 7 are rotationally connected between the inner top wall and the inner bottom wall of each adjusting frame 3, through the arrangement of the guide columns 7, the guiding purpose of the circuit board can be achieved, and the wear of the circuit board on both sides during transmission is reduced.

[0034] Please refer to Figure 1 , Figure 2 and Figure 3 , the front and rear inner side walls of the lower furnace body 1 are rotationally connected with a bidirectional threaded rod 11, and the two adjusting frames 3 are threadedly connected with both ends of the bidirectional threaded rod 11, through the arrangement of the bidirectional threaded rod 11, the mutual approaching or moving away of the adjusting frames 3 can be achieved, one side of each of the two adjusting frames 3 is fixedly installed with a distance measuring sensor 12, and the two distance measuring sensors 12 are connected in optical path, through the arrangement of the distance measuring sensor 12, the distance between the two adjusting frames 3 can be monitored.

[0035] Please refer to Figure 1 , Figure 2 and Figure 3 , the front end of the bidirectional threaded rod 11 is fixedly connected with the output end of the external motor, through the arrangement of the external motor, power can be provided for the rotation of the bidirectional threaded rod 11, a set of limiting rods 13 are fixedly connected between the front and rear inner side walls of the lower furnace body 1, each adjusting frame 3 is slidably sleeved with the limiting rod 13 close to it, through the arrangement of the limiting rod 13, the stable movement of the adjusting frame 3 can be achieved, and circuit boards of different sizes can be conveyed, one side of each of the two adjusting frames 3 is installed with a motor 14, the output end of each motor 14 is fixedly connected with the transmission shaft 4 close to it, through the arrangement of the motor 14, power can be provided for the rotation of the transmission shaft 4.

[0036] The reflow soldering device in this embodiment, through the transmission mode combined with the steel belt 6 and the pulley 5, cooperates with the setting of the guide column 7, not only realizes the stable conveying of the PCB board, but also greatly reduces the direct contact and friction between the side surface of the PCB board and the guide rail, improves the electrical performance and appearance quality of the PCB board, and prolongs the service life of the equipment. The first heater 8 and the second heater 9 are respectively arranged at the bottom of the lower furnace body 1 and the bottom of the upper furnace body 2, which realizes the double-sided heating of the upper surface and the bottom of the PCB board, effectively solves the temperature difference problem caused by the traditional bottom heating mode, and ensures the uniform heating of the PCB board during the heating process, improves the melting and flowing performance of the soldering material, reduces the occurrence of soldering defects such as virtual welding and overwelding, thereby significantly improves the soldering quality and electrical performance of the product. Through the comprehensive action of the bidirectional threaded rod 11, the limiting rod 13 and the distance measuring sensor 12, the flexible adjustment of the distance between the adjusting frames 3 is realized. This design makes the equipment easily adapt to PCB boards of different sizes without the need to replace or adjust the guide rail, improving the flexibility and production efficiency of the production line.

[0037] The working principle of the above embodiment is as follows: first, start the equipment, the external motor starts to work, drives the bidirectional threaded rod 11 to rotate, the bidirectional threaded rod 11 is connected with the two adjusting frames 3 through threads, with the rotation of the bidirectional threaded rod 11, the two adjusting frames 3 move along the limiting rod 13 to the center or the two sides until the preset distance is reached to adapt to PCB boards of different widths. The adjusting frame 3 is internally provided with a steel belt 6 and a pulley 5, and the steel belt 6 is drivingly connected through the pulley 5. At this time, the PCB board to be soldered is placed stably on the steel belt 6, and the two sides of the PCB board are guided by the guide column 7 to ensure the stability and reduce the wear during transmission. The motor 14 installed on the side away from the adjusting frame 3 is started to drive the transmission shaft 4 to rotate, thereby driving the pulley 5 and the steel belt 6 to move, and the PCB board slowly enters the heating area with the movement of the steel belt 6. In this process, the supporting roller 10 provides additional support for the steel belt 6 to slow down its deformation and ensure the stability of the conveying. When the PCB board enters the heating area, it is first heated at the bottom by the first heater 8 installed at the bottom of the lower furnace body 1, and then, as the PCB board continues to move forward, it enters the space between the upper furnace body 2 and the lower furnace body 1. At this time, the second heater 9 at the bottom of the upper furnace body 2 and the first heater 8 at the bottom end of the lower furnace body 1 are started, and through the cooperative action of the first heater 8 and the second heater 9, the PCB board is uniformly heated on the upper and lower surfaces, eliminating the temperature difference problem caused by the traditional bottom heating mode.

[0038] It is to be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting; it is not intended to exclude myriad other embodiments of the present application that other inventors can develop based on the same general inventive concepts embodied by the enclosed claims. That is, although the present application is described in terms of particular embodiments and illustrative figures, it should be apparent that the application can be varied in a multitude of ways. Such alterations, many of which will be apparent to those skilled in the art, can be based on current technology, and as such, this application should not be limited to the particular embodiments described herein, but should be understood to include all embodiments that are within the scope of the appended claims and their equivalents.

[0039] While the embodiments of the application have been shown and described herein, it will be understood by those skilled in the art that many changes, modifications, substitutions and alterations to these embodiments can be made without departing from the principles and spirits of the application, which can be limited only by the scope of the appended claims and their equivalents.

Claims

1. Reflow soldering apparatus comprising a lower furnace body (1), characterized in that: The upper end of the lower furnace body (1) is hinged with an upper furnace body (2), the inside of the lower furnace body (1) is provided with two symmetrically arranged adjusting frames (3), the left and right ends of the front and rear inner side walls of the two adjusting frames (3) are rotatably connected with transmission shafts (4), the outer surfaces of the two transmission shafts (4) are fixedly connected with pulleys (5), the inside of each adjusting frame (3) is provided with a steel belt (6), and each group of pulleys (5) is drivingly connected with the steel belt (6) adjacent thereto. A plurality of equidistantly arranged guide columns (7) are rotatably connected between the inner top wall and the inner bottom wall of each adjusting frame (3).

2. The reflow soldering apparatus according to claim 1, characterized by: A group of first heaters (8) are mounted at the bottom ends of the front and rear inner side walls of the lower furnace body (1), and a group of second heaters (9) are fixedly mounted at the bottom of the upper furnace body (2).

3. The reflow soldering apparatus according to claim 1, characterized by: A plurality of equidistantly arranged supporting rollers (10) are rotatably connected between the front and rear inner side walls of each adjusting frame (3), and each supporting roller (10) is in contact with the inner wall of the steel belt (6).

4. The reflow soldering apparatus according to claim 1, characterized by: A bidirectional threaded rod (11) is rotatably connected between the front and rear inner side walls of the lower furnace body (1), and the two adjusting frames (3) are threadedly connected with the two ends of the bidirectional threaded rod (11).

5. The reflow soldering apparatus according to claim 1, characterized by: A distance measuring sensor (12) is fixedly mounted on one side of each of the two adjusting frames (3) close to each other, and the two distance measuring sensors (12) are optically connected.

6. The reflow soldering apparatus according to claim 1, characterized by: A group of limiting rods (13) are fixedly connected between the front and rear inner side walls of the lower furnace body (1), and each adjusting frame (3) is slidably sleeved with the limiting rod (13) adjacent thereto.

7. The reflow soldering apparatus according to claim 1, characterized by: A motor (14) is mounted on the side of each of the two adjusting frames (3) away from each other, and the output end of each motor (14) is fixedly connected with the transmission shaft (4) adjacent thereto.

8. The reflow soldering apparatus according to claim 4, characterized by: The front end of the bidirectional threaded rod (11) is fixedly connected with the output end of the motor.

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