Automatic filling online detection mechanism

Abstract

The utility model discloses an automatic filling on-line detection mechanism which comprises a mechanical arm, a vacuum chuck is installed on the mechanical arm, a support is arranged on one side of the mechanical arm, an adsorption shell is installed on the support, adsorption holes are evenly formed in the upper surface of the adsorption shell, and positioning plates are installed on some portions of the support. A vacuum adsorption mode is adopted, redundant soldering lugs are removed, production efficiency is improved, badness generated in the production process is reduced, product consistency is improved, product failure caused by soldering tin thickness consistency difference is eradicated, it is guaranteed that only one soldering lug is arranged at the connecting position of an original device of each product, and therefore product quality is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to diode technical field, concretely is a kind of automatic filling on-line detection mechanism. BACKGROUND

[0002] Diode structure is composed of chip, soldering sheet, lead wire and base. The production process of diode includes chip making, assembly welding, potting molding, testing and packaging etc. The existing assembly welding mode mainly has two kinds: one is to combine base, soldering sheet, chip and lead wire by means of assembly machine, and then complete welding operation after welding furnace;Two is to directly assemble and weld soldering sheet, base, chip and lead wire together by means of assembly and welding machine.

[0003] The current assembly process is to assemble base, chip and lead wire into one by soldering sheet, and then weld through welding furnace. When using tin paste, there is residual flux, and cleaning process is needed after welding process to clean soldering oil. Another is to use soldering sheet, which has high melting point and corrosion resistance, and will not lose its effect when exposed to air or water vapor for a long time, and the storage environment requirement for materials is relatively low.

[0004] Therefore, the soldering sheet assembly welding mode is preferred, and the first consideration when using soldering sheet in welding process is the taking and placing of soldering sheet. When using soldering sheet, power devices / diodes are usually thin, and the weight of soldering sheet itself is light, so that multiple layers of soldering sheet may be adsorbed together during automatic assembly process. When multiple layers of soldering sheet are adsorbed, the performance of power device may be affected or production process may be scrapped, and too thick soldering tin may lead to poor heat dissipation during use and easy product failure. In addition, too much soldering tin may cause device short circuit during production process, and there is quality risk, so that automatic assembly process monitoring is extremely important.

[0005] Therefore, an automatic filling on-line detection mechanism is provided. SUMMARY

[0006] The utility model discloses a kind of automatic filling on-line detection mechanism, to solve the problem raised in the above background technology.

[0007] To achieve the above object, the utility model provides the following technical scheme: an automatic filling on-line detection mechanism, including mechanical arm, vacuum chuck is installed on the mechanical arm, the side of the mechanical arm is equipped with support, suction shell is installed on the support, the upper surface of the suction shell is evenly equipped with suction hole, some of the support are equipped with positioning plate.

[0008] Preferably, the support is rotatably connected with a connecting plate, and the suction shell is installed on the connecting plate.

[0009] Preferably, the support is installed with a driving motor for driving the connecting plate to rotate.

[0010] Preferably, a collecting box for collecting the soldering pieces is arranged below the support.

[0011] Preferably, a plurality of positioning holes are uniformly arranged on the positioning plate.

[0012] Preferably, a tapered hole is arranged on the top of the positioning hole.

[0013] Preferably, an exhaust hole is arranged on the bottom of the positioning hole.

[0014] Preferably, a filling plate is arranged on one side of the positioning plate.

[0015] Compared with the prior art, the beneficial effects of the present application are as follows: the vacuum adsorption method is adopted to remove the excess soldering pieces, improve the production efficiency, reduce the defects generated in the production process, improve the product consistency, eliminate the product failure caused by the difference in the soldering thickness consistency, and ensure that only one soldering piece is arranged at the original device connection of each product, thereby improving the product quality. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 is a structural schematic view of the present application;

[0017] Figure 2 is a structural schematic view of the positioning plate of the present application;

[0018] Figure 3 is a structural schematic view of the adsorption shell of the present application.

[0019] In the figure, 1 is a mechanical arm, 2 is a vacuum chuck, 3 is a support, 4 is a collecting box, 5 is an adsorption shell, 6 is a positioning plate, 61 is a positioning hole, 62 is a tapered hole, 63 is an exhaust hole, 7 is a filling plate, 8 is an adsorption hole, 9 is a connecting plate, and 10 is a driving motor. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application.

[0021] Please refer to Figures 1-3 The present application provides a technical solution: an automatic filling online detection mechanism, which comprises a mechanical arm 1, a vacuum chuck 2 is installed on the mechanical arm 1, a support 3 is arranged on one side of the mechanical arm 1, an adsorption shell 5 is installed on the support 3, adsorption holes 8 are uniformly arranged on the upper surface of the adsorption shell 5, and a positioning plate 6 is installed on the support 3.

[0022] As Figure 3As shown: the connecting plate 9 is rotatably connected on the support 3, and the adsorption shell 5 is installed on the connecting plate 9; through the above setting, the adsorption shell 5 can adsorb the excess solder pieces adhered together, so as to separate the solder pieces from the solder pieces on the vacuum chuck 2, and the connecting plate 9 can drive the adsorption shell 5 to rotate.

[0023] As shown: Figure 3 The driving motor 10 for driving the connecting plate 9 to rotate is installed on the support 3; through the above setting, the connecting plate 9 and the adsorption shell 5 can be more conveniently and quickly rotated.

[0024] As shown: Figure 3 The collecting box 4 for collecting the solder pieces is arranged below the support 3; through the above setting, the excess solder pieces can be collected by the collecting box 4, which is convenient for subsequent work.

[0025] As shown: Figure 2 The positioning holes 61 are uniformly arranged on the positioning plate 6; through the above setting, the solder pieces adsorbed by the vacuum chuck 2 can fall into the positioning holes 61, but the position of the solder pieces sucked up often deviates slightly, which will cause the position of the solder pieces placed on the filling plate 7 to deviate and affect the subsequent processing work. The position of the solder pieces on the vacuum chuck 2 is adjusted through the positioning holes 61, and then the solder pieces after the position adjustment are adsorbed by the vacuum chuck 2 again, so as to ensure the accuracy of the filling position.

[0026] As shown: Figure 2 The tapered hole 62 is arranged at the top of the positioning hole 61, and the exhaust hole 63 is arranged at the bottom of the positioning hole 61; through the above setting, the tapered hole 62 can make the solder pieces more conveniently and quickly enter the inside of the positioning hole 61, and the exhaust hole 63 can make the solder pieces fall stably to the bottom of the positioning hole 61.

[0027] As shown: Figure 1 The filling plate 7 is arranged on one side of the positioning plate 6; through the above setting, the filling plate 7 can place the solder pieces adsorbed by the vacuum chuck 2, which is convenient for subsequent work.

[0028] Working principle: first, through the mechanical arm 1 drives the vacuum chuck 2 to move the soldering sheet stacked together, then the soldering sheet is moved to the above adsorption shell 5, through the adsorption hole 8 on the adsorption shell 5 can be adsorbed to the soldering sheet adhered together, so that it is separated from the soldering sheet on the vacuum chuck 2, then the excess soldering sheet can be made to fall into the inside of the collecting box 4 through the rotating connecting plate 9, after cleaning the adhered soldering sheet, the mechanical arm 1 drives the soldering sheet on the vacuum chuck 2 to come to the above positioning plate 6, then control the vacuum chuck 2 to place the soldering sheet in the inside of the positioning hole 61, thereby making the soldering sheet fall to the bottom of the positioning hole 61, the position of the soldering sheet is adjusted through the positioning hole 61, so that the position of the soldering sheet can correspond to the position on the filling plate 7, then the soldering sheet is sucked again through the vacuum chuck 2 and placed on the filling plate 7.

[0029] Although the embodiments of the present application have been shown and described, it is to be understood that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An automatic loading online detection mechanism, comprising a robotic arm (1), characterized in that: The robotic arm (1) is equipped with a vacuum suction cup (2), and a bracket (3) is provided on one side of the robotic arm (1). An adsorption shell (5) is installed on the bracket (3). Adsorption holes (8) are uniformly provided on the upper surface of the adsorption shell (5). A positioning plate (6) is installed on one side of the bracket (3).

2. The automatic filling online detection mechanism according to claim 1, characterized in that: A connecting plate (9) is rotatably connected to the bracket (3), and the adsorption shell (5) is installed on the connecting plate (9).

3. The automatic filling online detection mechanism according to claim 2, characterized in that: The bracket (3) is equipped with a drive motor (10) for driving the connecting plate (9) to rotate.

4. The automatic filling online detection mechanism according to claim 2, characterized in that: A collection box (4) for collecting solder pieces is provided below the support (3).

5. The automatic filling online detection mechanism according to claim 1, characterized in that: The positioning plate (6) is provided with a plurality of positioning holes (61) evenly spaced.

6. The automatic filling online detection mechanism according to claim 5, characterized in that: The top of the positioning hole (61) is provided with a tapered hole (62).

7. The automatic filling online detection mechanism according to claim 5, characterized in that: An exhaust hole (63) is provided at the bottom of the positioning hole (61).

8. The automatic filling online detection mechanism according to claim 1, characterized in that: A loading plate (7) is provided on one side of the positioning plate (6).

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