Injection mold and injection mold assembly
By using a soft and easily deformable buffer and stop block design, combined with a transparent substrate and UV curing technology, the problem of display module damage caused by injection mold misalignment was solved, achieving high-yield injection sealing.
Patent Information
- Application Number
- CN202423018017.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-06
- Publication Date
- 2025-11-18
- Estimated Expiration
- 2034-12-06
AI Technical Summary
Traditional injection molds are prone to misalignment during the injection molding of display modules, which can damage the display modules and reduce the yield rate.
The injection mold is composed of a soft and easily deformable buffer component and a substrate. The flow channel matches the periphery of the part to be sealed, providing flexible contact and buffer protection. A stop block is formed in the stop block forming groove to block the flow of injection plastic. Combined with a transparent substrate and UV curing technology, the sealing effect and demolding are ensured.
It effectively protects the parts to be sealed, improves the yield rate, avoids plastic overflow that could damage the components, enhances the sealing effect, and simplifies the demolding process.
Smart Images
Figure CN223558935U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application belongs to the technical field of injection molding, and particularly relates to an injection mold and an injection mold assembly. BACKGROUND
[0002] In order to pursue waterproof effect, the edge of the to-be-sealed part needs to be sealed. Referring to Figure 1 , the display screen module is usually assembled by a glass screen 801, an electronic screen 802 and its attached electronic elements 803. In order to meet the waterproof effect of the display screen module, a commonly used method is to use a mold injection method to injection mold a plastic ring at the edge of the display screen module, so that the edges of the glass screen 801, the electronic screen 802 and the electronic elements 803 are bonded together and play a sealing effect. However, there is often an assembly tolerance between the glass screen 801, the electronic screen 802 and the electronic elements 803, and the position of the traditional injection mold is fixed. Therefore, when the traditional injection mold is used to injection mold the display screen module, the injection mold and the display screen module are prone to misalignment, which causes the injection mold to crush the display screen module during the mold closing process, resulting in a low yield of the display screen module. CONTENT OF THE UTILITY MODEL
[0003] In view of the above defects or deficiencies of the prior art, the present application provides an injection mold and an injection mold assembly, which can effectively protect the to-be-sealed part during injection molding, prevent the to-be-sealed part from being damaged, and improve the yield of the to-be-sealed part.
[0004] In order to achieve the above-mentioned purpose, the present application provides an injection mold, which comprises:
[0005] a base plate, the base plate being formed with a base plate injection hole; and
[0006] a buffer part arranged on the bottom surface of the base plate, the buffer part being formed with a buffer part injection hole arranged in position with the base plate injection hole, the buffer part being further formed with a flow guide groove, the flow guide groove being in communication with the buffer part injection hole and being arranged in matching with the peripheral edge of the to-be-sealed part.
[0007] In some embodiments, the buffer part is provided with a to-be-sealed part bearing platform, the to-be-sealed part bearing platform being formed with an element accommodating groove, and the to-be-sealed part bearing platform being located at the inner peripheral edge of the flow guide groove.
[0008] In some embodiments, the buffer part is further provided with a stop block forming groove, the stop block forming groove being arranged across the to-be-sealed part bearing platform and the element accommodating groove, and the groove bottom of the stop block forming groove being lower than the groove bottom of the element accommodating groove.
[0009] In some embodiments, the substrate and the buffer member jointly define the cavity for accommodating the to-be-sealed member, and the substrate is formed with a substrate air hole communicating with the cavity for accommodating the to-be-sealed member.
[0010] The second aspect of the present application provides an injection mold assembly, comprising:
[0011] a front mold core and a rear mold core; and
[0012] the injection mold described above;
[0013] The injection mold is mounted on the bottom surface of the front mold core, the front mold core is provided with a mold core injection hole in alignment with the substrate injection hole, the rear mold core is formed with a mold core cavity for accommodating the injection mold, and the front mold core is arranged opposite to the rear mold core.
[0014] In some embodiments, the bottom surface of the front mold core is provided with a guide post or a guide post hole, and the rear mold core is provided with a guide post hole or a guide post, and the guide post is inserted into the guide post hole.
[0015] In some embodiments, the substrate is formed with a positioning hole or a positioning pin, the bottom surface of the front mold core is provided with the positioning pin or the positioning hole, and the positioning pin passes through the positioning hole.
[0016] In some embodiments, the substrate is formed with a substrate fixing hole, and the front mold core is formed with a mold core through hole, and the substrate fixing hole is connected with the mold core through hole by a fastener.
[0017] In some embodiments, the substrate is a transparent substrate.
[0018] In some embodiments, the front mold core is formed with a mold core through slot in alignment with the flow guide groove.
[0019] By means of the above technical solution, when the to-be-sealed member is injection molded by the injection mold of the present application, the buffer member has the material characteristics of being soft and easily deformed, so that it can form a flexible contact with the to-be-sealed member, thereby preventing the to-be-sealed member from being damaged due to the extrusion of the mold. When the flow guide groove and the peripheral edge of the to-be-sealed member are matched and aligned, the peripheral edge of the slot of the flow guide groove can adaptively deform according to the shape of the to-be-sealed member, which plays a good buffering and protection role on the to-be-sealed member and also plays a good sealing effect on the injection mold, thereby preventing the injection material from escaping from the flow guide groove to the inside of the to-be-sealed member and preventing the element from malfunctioning.
[0020] Other features and advantages of the embodiments of the present application will be described in detail in the following specific embodiments. BRIEF DESCRIPTION OF DRAWINGS
[0021] The accompanying drawings are included to provide a further understanding of embodiments of the application, and are incorporated in and constitute a part of this specification, illustrate embodiments of the application, and together with the description serve to explain embodiments of the application. Other embodiments of the application will be apparent to those skilled in the art from consideration of the specification and drawings. In the drawings:
[0022] Figure 1 is a schematic view of a display module in the prior art;
[0023] Figure 2 is a schematic view of an injection mold in the embodiments of the application;
[0024] Figure 3 is a schematic view of an injection mold in the embodiments of the application; Figure 2
[0025] Figure 4 is a schematic view of a display module with a stopper in the embodiments of the application;
[0026] Figure 5 is a schematic view of a front mold core with an injection mold in the embodiments of the application;
[0027] Figure 6 is a schematic view of the state of placing a piece to be sealed in the injection mold in the embodiments of the application; Figure 5
[0028] Figure 7 is a schematic view of a rear mold core of the injection mold assembly in the embodiments of the application; Figure 5
[0029] Figure 8 is a schematic view of the state of assembling the front mold core and the rear mold core with the injection mold and the display module in the embodiments of the application;
[0030] Figure 9 is a schematic view of the assembled front mold core and the rear mold core in the embodiments of the application; Figure 8
[0031] Figure 10 is a schematic view of the cross section of the assembled front mold core and the rear mold core in the embodiments of the application; Figure 9
[0032] Explanation of Reference Signs
[0033] 1 substrate 2 buffer
[0034] 3 front mold core 4 rear mold core
[0035] 5 stopper 6 positioning pin
[0036] 7 fastener 8 display module
[0037] 101 substrate injection hole 102 substrate air hole
[0038] 103 positioning hole 104 substrate fixing hole
[0039] 201 buffer injection hole 202 flow guide groove
[0040] 203 to-be-sealed member supporting platform 204 element accommodating groove
[0041] 205 stopper forming groove 206 to-be-sealed member accommodating cavity
[0042] 301 core injection hole 302 core through groove
[0043] 303 guide column 401 core accommodating cavity
[0044] 402 guide column hole 801 glass screen
[0045] 802 electronic screen 803 electronic element DETAILED DESCRIPTION
[0046] The specific embodiments of the present application will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are merely intended to illustrate and explain the present application, and are not intended to limit the present application.
[0047] The present application will be described in detail below with reference to the accompanying drawings and in combination with exemplary embodiments.
[0048] As shown in Figures 2 to 10 , the first exemplary embodiment of the present application provides an injection mold, which comprises a substrate 1 and a buffer 2. The substrate 1 has a substrate injection hole 101 formed through the plate body, and the buffer 2 is arranged on the bottom surface of the substrate 1. The buffer 2 has a buffer injection hole 201 formed in alignment with and in communication with the substrate injection hole 101, and further has a flow guide groove 202 in communication with the buffer injection hole 201 and arranged in matching with the peripheral edge of a to-be-sealed member.
[0049] Thus, when performing injection sealing treatment, the to-be-sealed member can be placed in the buffer 2, at this time, the peripheral edge of the to-be-sealed member can just cover the flow guide groove 202, then when injection is performed by using an injection device, the injected injection material can enter the flow guide groove 202 through the substrate injection hole 101 and the buffer injection hole 201 in sequence, until the entire flow guide groove 202 is filled, so that the injection material is adhered to the peripheral edge of the to-be-sealed member, and the injection sealing treatment of the to-be-sealed member is realized. The buffer 2 of the present application can be made of materials such as silicone, TPU, TPE, and soft glue, as long as it has the characteristics of softness and easy deformation.
[0050] The key is that, thanks to the soft and easily deformable material properties of the buffer 2, it can form a flexible contact with the to-be-sealed part, so that the to-be-sealed part will not be damaged due to the extrusion of the mold, and when the flow guide groove 202 matches the position of the circumference of the to-be-sealed part, the slot circumference of the flow guide groove 202 can adaptively deform to the discontinuous section of the to-be-sealed part, providing good buffer protection to the to-be-sealed part while also providing good sealing effect to the injection mold, avoiding overflow of the injection material in the flow guide groove 202 from the to-be-sealed part section.
[0051] It should be noted that the injected injection material can be liquid glue, because liquid glue has strong fluidity and requires less injection molding pressure than traditional plastic, which is more conducive to protecting fragile to-be-sealed parts. At the same time, liquid glue has good light transmittance and can be cured by UV light. In addition, after the liquid glue is cured, it will not react with the buffer 2, and at the same time, it will be affected by the shrinkage of the cured liquid glue, and the cured liquid glue will separate from the inner circumferential wall of the flow guide groove 202, which can facilitate the demolding of the to-be-sealed part and reduce the difficulty of demolding. Those skilled in the art can understand that the injection material is not limited to the above-mentioned liquid glue, as long as it has strong fluidity, good light transmittance, and does not react with the buffer 2.
[0052] For some to-be-sealed parts with a multi-layer structure, such as Figure 1 The display screen module 8 shown has an electronic element 803, an electronic screen 802, and a glass screen 801 stacked in sequence from top to bottom, wherein the electronic element 803 is an accessory element of the electronic screen 802 and is protrudingly arranged from the surface of the electronic screen 802. In order to enable the buffer 2 to closely fit the to-be-sealed part with a multi-layer structure such as the display screen module 8, as shown in Figure 2 and Figure 3 The buffer 2 is provided with a to-be-sealed part support 203, and the to-be-sealed part support 203 is provided with an element accommodating groove 204, wherein the to-be-sealed part support 203 is located at the inner circumferential edge of the flow guide groove 202, and when the to-be-sealed part is placed in the buffer 2, the to-be-sealed part support 203 can support the entire to-be-sealed part, and the element accommodating groove 204 can accommodate accessory elements such as the electronic element 803, so that the to-be-sealed part as a whole can closely fit the buffer 2 to achieve a sealing effect. In this embodiment, considering that the accessory elements such as the electronic element 803 have a multi-layer structure and their edge portions form element step portions with multiple sections, as shown in Figure 3 The edge of the element accommodating groove 204 can be provided with an accommodating groove step portion matching the element step portion, so that the edge of the element accommodating groove 204 can closely fit the edge portion of the accessory element of the to-be-sealed part. This arrangement can enable the buffer 2 to closely fit the to-be-sealed part with a multi-layer structure and achieve a sealing effect, avoiding overflow and causing damage to the elements.
[0053] For the multi-layer structure of the sealed piece, there are often assembly tolerance problems between the structures, such as the assembly tolerance of the attached element. When the sealed piece is placed on the sealed piece support 203, there may be a gap between the edge of the attached element and the groove wall of the element receiving groove 204, and the element receiving groove 204 is adjacent to and connected with the flow guide groove 202. During injection molding, the injection material will flow into the attached element from the above-mentioned gap, causing damage to the element.
[0054] To solve the above problems, as shown in Figure 2 , Figure 3 The bumper 2 is also provided with a stop block forming groove 205, which is arranged across the sealed piece support 203 and the element receiving groove 204. In other words, one part of the stop block forming groove 205 is formed in the sealed piece support 203, and the other part is formed in the element receiving groove 204. The groove bottom of the stop block forming groove 205 is lower than the groove bottom of the element receiving groove 204. In this way, the stop block 5 (similar to a dam structure) can be formed in the stop block forming groove 205 by means of glue dispensing. The stop block 5 can block the injection material from flowing into the attached element from the gap between the attached element and the groove wall of the element receiving groove 204 during injection molding, preventing damage to the attached element.
[0055] More specifically, when injecting glue into the stop block forming groove 205 through a glue dispenser, the amount of glue can be determined by the volume of the stop block forming groove 205. After injecting the glue, the sealed piece with a multi-layer structure is placed on the sealed piece support 203, and the attached element of the sealed piece is placed in the element receiving groove 204. The glue in the stop block forming groove 205 will stick to the cross section of the sealed piece and form a stop block 5 after solidification, thereby blocking the injection material from flowing into the attached element from the gap between the attached element and the groove wall of the element receiving groove 204 during injection molding, preventing damage to the attached element. In the embodiment of the present application, the stop block forming groove 205 is arranged on the sealed piece support 203 and the element receiving groove 204, and the stop block 5 is formed by solidification of the injected glue. The structure design is simple, and the glue dispensing operation is convenient.
[0056] In other embodiments, the stop block 5 can also be prepared when the bumper 2 is prepared, that is, the stop block 5 is integrally formed with the bumper 2. In this way, the stop block forming groove 205 and the glue dispensing step can be omitted. The present application does not limit the forming method of the stop block 5.
[0057] In one embodiment, as shown in Figure 2 and Figure 6As shown, the buffer 2 is also formed with a to-be-sealed member accommodating cavity 206, and the outer side inner circumferential wall of the flow guide groove 202 is formed as the circumferential wall of the to-be-sealed member accommodating cavity 206, and the flow guide groove 202 and the to-be-sealed member supporting platform 203 are arranged in the to-be-sealed member accommodating cavity 206. Thus, when the to-be-sealed member is placed on the sealing member supporting platform 203, the to-be-sealed member can be entirely nested in the to-be-sealed member accommodating cavity 206, in other words, at this time, the buffer 2 can wrap the entire to-be-sealed member, so that the stability of the to-be-sealed member is better.
[0058] Further, as shown in the drawings, Figure 2 The buffer 2 is annular, and the base plate 1 and the buffer 2 jointly define the to-be-sealed member accommodating cavity 206, and the base plate 1 is formed with a base plate gas hole 102 communicating with the to-be-sealed member accommodating cavity 206. When the to-be-sealed member is nested in the to-be-sealed member accommodating cavity 206, the to-be-sealed member accommodating cavity 206 forms a relatively sealed space, and after the injection molding is completed, gas is blown into the to-be-sealed member accommodating cavity 206 through the base plate gas hole 102, so that the air pressure in the to-be-sealed member accommodating cavity 206 rises, thereby pushing the to-be-sealed member out of the to-be-sealed member accommodating cavity 206.
[0059] As shown in the drawings, Figures 5 to 10 The second embodiment of the present application provides an injection mold assembly, which comprises a front mold core 3, a rear mold core 4 and the above-mentioned injection mold. The injection mold is installed on the bottom surface of the front mold core 3, and the front mold core 3 is provided with a mold core injection hole 301 which is in alignment with the base plate injection hole 101, so that the injection material can be injected into the flow guide groove 202 through the mold core injection hole 301, the base plate injection hole 101 and the buffer injection hole 201 in sequence during injection molding. As shown in the drawings, Figure 7 The rear mold core 4 is formed with a mold core accommodating cavity 401 for accommodating the injection mold, and the front mold core 3 is arranged opposite to the rear mold core 4 to clamp the injection mold. Specifically, the bottom surface of the front mold core 3 is provided with a guide column 303 or a guide column hole 402, and correspondingly, the rear mold core 4 is provided with a guide column hole 402 or a guide column 303, and when the front mold core 3 is arranged opposite to the rear mold core 4, the guide column 303 is inserted into the guide column hole 402, so that the front mold core 3 can be aligned with the rear mold core 4, avoiding the rear mold core 4 being misaligned with the injection mold and crushing the to-be-sealed member in the injection mold.
[0060] In an embodiment, as shown in the drawings, Figure 5 and Figure 6 In use, first, the injection mold is placed on the bottom surface of the front mold core, then the to-be-sealed member is nested in the buffer 2 after the blocking block 5 is glued on the blocking block forming groove 205 of the buffer 2, and then the rear mold core is closed on the front mold core to clamp the to-be-sealed member and the injection mold, and then UV light curing is performed to obtain the blocking block 5, and finally the injection molding machine is used for injection molding and sealing treatment.
[0061] In an embodiment, as shown in the drawings, Figure 5As shown, the bottom surface of the front mold core 3 is provided with positioning pins 6 or positioning holes 103, and correspondingly, as shown in Figure 2 As shown, the base plate 1 is provided with positioning holes 103 or positioning pins 6, the positioning pins 6 pass through the positioning holes 103, so that when the injection mold is placed on the front mold core 3, the entire injection mold can be preliminarily positioned by the positioning pins 6 passing through the positioning holes 103. Further, the bottom surface of the front mold core 3 is also provided with a mold core through hole, and the base plate 1 is formed with a base plate fixing hole 104 through which the fastener 7 passes, so that after the injection mold is preliminarily positioned, the fastener 7 can pass through the mold core through hole and the base plate fixing hole 104 which are arranged opposite to each other, so that the injection mold is fixed on the front mold core 3.
[0062] In the present exemplary embodiment, the UV light irradiation method can be used to cure the injection plastic, for this purpose, the base plate 1 is a transparent base plate, and the buffer member 2 is also transparent, so that when the injection plastic is injected into the flow guide groove 202, the UV light can pass through the base plate 1 and the buffer member 2 in turn to irradiate on the injection plastic, which helps the injection plastic to be cured quickly. On the other hand, the base plate 1 also needs to have a certain hardness, because the buffer member 2 is injection molded on the base plate, so that the buffer member 2 can be adhered to the base plate 1 and is not easy to be separated, if it is necessary to replace the buffer member 2 of different sizes, a special chemical solution can be used to remove the buffer member 2, so that the buffer member 2 is separated from the base plate 1, which improves the versatility of the injection mold product. The base plate 1 can be selected from glass base plate, acrylic base plate, plastic base plate, etc., which not only meets the light transmission and has a certain hardness, but also meets the resistance to the melt glue temperature of injection molding, and can be repeatedly used, saving the use cost. Of course, the material of the base plate 1 is not limited in the present application, as long as it meets the light transmission, hardness and high temperature resistance.
[0063] Further, the base plate 1 is a glass base plate, and the front mold core 3 is formed with a mold core through groove 302 which is opposite to the flow guide groove 202. Thus, when the UV light irradiation method is used to cure the injection plastic, the UV light can pass through the mold core through groove 302 to reach the base plate 1, and then pass through the base plate 1 and the buffer member 2 in turn to irradiate on the injection plastic in the flow guide groove 202, which helps the injection plastic to be cured quickly.
[0064] It should be noted that the to-be-sealed member mentioned herein can be a display screen module 8, a circuit board or other electronic products, which is not limited specifically, so that the injection mold and the injection mold assembly of the above exemplary embodiments also have the advantage of strong versatility.
[0065] In combination with the above various embodiments, in order to fully illustrate the use method of the injection mold assembly of the present exemplary embodiment, the following takes the display screen module 8 as an example which is injection sealed and the injection plastic is liquid glue, and then the specific use process of the injection mold assembly of the present application is described.
[0066] Referring to Figures 5 to 10The use steps of the injection mold assembly of the present exemplary embodiment are as follows:
[0067] 1) Use the dispensing process to inject glue into the stopper forming groove 205 of the buffer 2;
[0068] 2) Place the display screen module 8 in the to-be-sealed part accommodating cavity 206 of the deforming buffer 2, so that the glue in the stopper forming groove 205 is adhered to the electronic screen 802 and the electronic element 803 of the display screen module 8;
[0069] 3) Install the injection mold with the display screen module 8 on the bottom surface of the front mold core 3, and then assemble the rear mold core 4 with the front mold core 3, and clamp the injection mold with the display screen module 8;
[0070] 4) Place the clamped rear mold core 4 and front mold core 3 of the injection mold in the UV lamp box, and perform UV light curing on the glue in the stopper forming groove 205 to form the stop block 5;
[0071] 5) Take out the clamped rear mold core 4 and front mold core 3 of the injection mold from the UV lamp box, and install them on the low-pressure injection molding machine to perform glue injection, and the injected glue is liquid glue;
[0072] 6) Again, place the clamped rear mold core 4 and front mold core 3 of the injection mold in the UV lamp box, and perform UV light curing on the liquid glue in the flow guide groove 202 to form;
[0073] 7) Disassemble the rear mold core 4, take out the injection mold with the display screen module 8, and blow air through the base plate air hole 102 to demold the display screen module 8, thereby completing the injection sealing treatment of the display screen module 8.
[0074] In the description of the present application, it should be understood that the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second" can be explicitly or implicitly included at least one of the features. In the description of the present application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise specifically limited.
[0075] In the present application, unless otherwise specifically defined and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected or communicate with each other; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise specifically limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0076] In the description of the specification, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are contained in at least one embodiment or example of the present application. In the specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any appropriate manner in any one or more embodiments or examples. In addition, the person skilled in the art can combine and combine the different embodiments or examples described in the specification and the features of the different embodiments or examples without contradiction.
[0077] Although the embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and are not to be construed as limiting the present application, and the person skilled in the art can make changes, modifications, replacements and variations to the above embodiments within the scope of the present application.
Claims
1. An injection mold, characterized in that, include: A substrate (1) having substrate injection holes (101) formed thereon; and A buffer (2) is disposed on the bottom surface of the substrate (1). The buffer (2) has a buffer injection hole (201) that is aligned with the injection hole (101) of the substrate. The buffer (2) also has a guide groove (202) that communicates with the buffer injection hole (201) and matches the periphery of the part to be sealed.
2. The injection mold according to claim 1, characterized in that, The buffer (2) is provided with a sealing element support (203), and a component receiving groove (204) is formed on the sealing element support (203). The sealing element support (203) is located on the inner periphery of the flow guide groove (202).
3. The injection mold according to claim 2, characterized in that, The buffer (2) is also provided with a stop forming groove (205), which spans the support platform (203) of the component to be sealed and the component receiving groove (204). The bottom of the stop forming groove (205) is lower than the bottom of the component receiving groove (204).
4. The injection mold according to claim 3, characterized in that, The substrate (1) and the buffer (2) together define the cavity (206) for receiving the component to be sealed, and the substrate (1) is formed with substrate vents (102) communicating with the cavity (206) for receiving the component to be sealed.
5. An injection mold assembly, characterized in that, include: Anterior mold core (3) and posterior mold core (4); as well as The injection mold according to any one of claims 1 to 4; The injection mold is installed on the bottom surface of the front mold core (3), the front mold core (3) is provided with a mold core injection hole (301) that is aligned and communicates with the injection hole (101) of the substrate, and the rear mold core (4) is formed with a mold core cavity (401) for accommodating the injection mold. The front mold core (3) and the rear mold core (4) are arranged opposite to each other.
6. The injection mold assembly according to claim 5, characterized in that, The bottom surface of the front mold core (3) is provided with a guide post (303) or a guide post hole (402), and the rear mold core (4) is provided with a guide post hole (402) or a guide post (303), with the guide post (303) inserted into the guide post hole (402).
7. The injection mold assembly according to claim 5 or 6, characterized in that, The substrate (1) is provided with a positioning hole (103) or a positioning pin (6), and the bottom surface of the front mold core (3) is provided with the positioning pin (6) or the positioning hole (103), and the positioning pin (6) passes through the positioning hole (103).
8. The injection mold assembly according to claim 7, characterized in that, The substrate (1) forms a substrate fixing hole (104), and the front mold core (3) forms a mold core through hole. The substrate fixing hole (104) is connected to the mold core through hole by a fastener.
9. The injection mold assembly according to claim 8, characterized in that, The substrate (1) is a transparent substrate.
10. The injection mold assembly according to claim 9, characterized in that, The front mold core (3) has a mold core through groove (302) that is aligned with the flow guide groove (202).