Metal carrier plate for semiconductor packaging module
By designing a metal carrier and using magnetic connectors, the problems of easy damage to the packaging module during manual operation and unsuitability of the carrier were solved, achieving efficient and reliable process handling and reducing resource waste.
Patent Information
- Application Number
- CN202423152242.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-19
- Publication Date
- 2025-11-18
- Estimated Expiration
- 2034-12-19
AI Technical Summary
Existing packaging modules are easily damaged during manual operation, and the trays on the market are not suitable for frequent washing and baking processes, resulting in low efficiency and waste of resources.
Design a metal carrier for semiconductor packaging modules, including a metal chassis and a cover plate, which is connected by magnetic components to enable simultaneous processing of multiple packaging modules. Combined with limiting blocks for stable fixation, it is suitable for SAT scanning, water washing and baking processes.
It improves process efficiency, reduces manual intervention, avoids product damage, reduces resource waste, and enhances process reliability and environmental protection.
Smart Images
Figure CN223560272U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the field of semiconductor packaging especially relates to a metal carrier disc for semiconductor packaging module. BACKGROUND
[0002] The existing packaging module, such as FCBGA packaging product, needs to be processed by SAT scanning, washing and baking, and the processing mode usually includes two kinds: one is to take out single product manually, and the product is processed by SAT scanning, washing and baking one by one, which is complicated to take and place the product, has high manual intervention degree, and is low in work efficiency, and the product is easily damaged by falling, scratching and static electricity when the product is contacted manually. The other is to prevent the packaging module by using a carrier disc, and the carrier disc is processed by SAT scanning, washing and baking as a whole, but the suction disc and injection disc commonly used in the market are not suitable for frequent washing and baking process. SUMMARY
[0003] The utility model discloses a metal carrier disc for semiconductor packaging module, which solves the problem that the product is easily damaged by falling, scratching and static electricity when the product is contacted manually in the prior art, and the problem that the existing carrier disc is not suitable for frequent washing and baking process.
[0004] In order to achieve the above-mentioned purpose, the utility model provides a metal carrier disc for semiconductor packaging module, which comprises a metal bottom disc and a metal cover disc matched with the metal bottom disc, the metal bottom disc comprises a first disc body, a plurality of first openings arranged in an array are formed on the first disc body, a plurality of first limiting blocks are arranged on the periphery of each first opening, a plurality of first limiting blocks surround an installation position for installing the semiconductor packaging module, and first magnetic attraction members are arranged at both ends of the first disc body; the metal cover disc comprises a second disc body, a plurality of second openings arranged in an array are formed on the second disc body, the second openings are arranged one by one corresponding to the first openings, a plurality of second limiting blocks are arranged on the periphery of each second opening, second magnetic attraction members are arranged at both ends of the second disc body, and the metal bottom disc and the metal cover disc are connected by the first magnetic attraction members and the second magnetic attraction members to clamp the semiconductor packaging module between the metal bottom disc and the metal cover disc.
[0005] Preferably, the plurality of first limiting blocks comprise two first blocks arranged opposite in the transverse direction and two second blocks arranged opposite in the longitudinal direction, the first block comprises first sub-blocks and second sub-blocks arranged at intervals in the longitudinal direction, the first opening is rectangular, the first sub-blocks and the second sub-blocks are symmetrically arranged on both sides of the center line in the transverse direction of the first opening, and the second block is symmetrically arranged along the center line in the longitudinal direction of the first opening.
[0006] Preferably, the plurality of second limiting blocks comprises two third blocks arranged opposite in the lateral direction and two fourth blocks arranged opposite in the longitudinal direction, the fourth block comprises a third sub-block and a fourth sub-block arranged opposite in the lateral direction, the second opening is rectangular, the third block is arranged symmetrically along the center line in the lateral direction of the second opening, and the third sub-block and the fourth sub-block are symmetrically arranged on both sides of the center line in the longitudinal direction of the second opening.
[0007] Preferably, when the metal bottom disc is covered by the metal cover disc, the projection of the second block in the vertical direction is located between the projection of the third sub-block in the vertical direction and the projection of the fourth sub-block in the vertical direction, and the projection of the third block in the vertical direction is located between the projection of the first sub-block in the vertical direction and the projection of the second sub-block in the vertical direction.
[0008] Preferably, the third block is trapezoidal, and the partial projection of the third block in the vertical direction is located inside the projection of the second opening in the vertical direction, and / or the third sub-block and the fourth sub-block are trapezoidal, and the partial projection of the third sub-block in the vertical direction is located inside the projection of the second opening in the vertical direction and the partial projection of the fourth sub-block in the vertical direction is located inside the projection of the second opening in the vertical direction.
[0009] Preferably, the first sub-blocks on the first disc body are uniformly and sequentially arranged in the lateral direction, the second sub-blocks on the first disc body are uniformly and sequentially arranged in the lateral direction, and the second blocks on the first disc body are uniformly and sequentially arranged in the longitudinal direction; the third blocks on the second disc body are uniformly and sequentially arranged in the lateral direction, the third sub-blocks on the second disc body are uniformly and sequentially arranged in the longitudinal direction, and the fourth sub-blocks on the second disc body are uniformly and sequentially arranged in the longitudinal direction.
[0010] Preferably, the first disc body has a first surface on which the first limiting blocks are arranged, and the first disc body has a first hand-held portion extending outward from both sides of the first disc body, the first hand-held portion has a first outer end face protruding from the first surface, the first hand-held portion has a first recessed hole recessed inward from the first outer end face, and the first magnetic attraction member is arranged in the first recessed hole; the second disc body has a second surface on which the second limiting blocks are arranged, and the second disc body has a second hand-held portion extending outward from both sides of the second disc body, the second hand-held portion has a second outer end face protruding from the second surface, the second hand-held portion has a second recessed hole recessed inward from the second outer end face, and the second magnetic attraction member is arranged in the second recessed hole.
[0011] Preferably, the first hand-holding part is in a strip shape, three first magnetic attraction members are evenly arranged on the first hand-holding part, the three first magnetic attraction members are arranged along the length direction of the first hand-holding part, the second hand-holding part is in a strip shape, three second magnetic attraction members are evenly arranged on the second hand-holding part, the three second magnetic attraction members are arranged along the length direction of the second hand-holding part, and the three second magnetic attraction members are arranged in one-to-one correspondence with the three first magnetic attraction members.
[0012] Preferably, the first disc body has a first surface on which the first limiting stopper is arranged, the third hand-holding part has a third outer end face which is convex to the first surface, the third hand-holding part is recessed inwardly from the third outer end face to form a third recessed hole in which the first magnetic attraction member is arranged, the second disc body has a second surface on which the second limiting stopper is arranged, the fourth hand-holding part has a fourth outer end face which is flush with the second surface, the fourth hand-holding part is recessed inwardly from the fourth outer end face to form a fourth recessed hole in which the second magnetic attraction member is arranged.
[0013] Preferably, the third hand-holding part is in a strip shape, three first magnetic attraction members are evenly arranged on the third hand-holding part, the three first magnetic attraction members are arranged along the length direction of the third hand-holding part, the fourth hand-holding part is in a strip shape, three second magnetic attraction members are evenly arranged on the fourth hand-holding part, the three second magnetic attraction members are arranged along the length direction of the fourth hand-holding part, and the three second magnetic attraction members are arranged in one-to-one correspondence with the three first magnetic attraction members.
[0014] Compared with the prior art, the metal carrier disc can increase the reliability of the semiconductor packaging module in special processes, and will not cause damage to the semiconductor packaging module and the metal carrier disc in harsh environments; and the metal carrier disc of the embodiment of the present application can allow multiple semiconductor packaging modules to simultaneously perform special processes at one time, reduces manual intervention in the process, and improves process efficiency; in addition, the first magnetic attraction member and the second magnetic attraction member are used to adsorb and connect the metal bottom disc and the metal cover disc, the connection is convenient, the semiconductor packaging module is stably fixed in the middle, and the semiconductor packaging module will not be accidentally scattered due to shaking when the whole disc semiconductor packaging module is taken or placed; at the same time, the metal carrier disc can be repeatedly used, which does not cause waste and protects the environment. BRIEF DESCRIPTION OF DRAWINGS
[0015] Figure 1 FIG. 1 is a perspective view of a semiconductor packaging module metal carrier disc according to the present application.
[0016] Figure 2 FIG. 2 is a sectional view of the semiconductor packaging module metal carrier disc according to the present application. Figure 1Enlarged view of the middle A.
[0017] Figure 3 The side view structural drawing of the metal bottom disc in the metal carrier disc for the semiconductor packaging module of the embodiment of the utility model.
[0018] Figure 4 The three-dimensional structure drawing of one angle of the metal cover disc in the metal carrier disc for the semiconductor packaging module of the embodiment of the utility model.
[0019] Figure 5 For Figure 4 Enlarged view of the middle B.
[0020] Figure 6 The three-dimensional structure drawing of another angle of the metal cover disc in the metal carrier disc for the semiconductor packaging module of the embodiment of the utility model.
[0021] Figure 7 The side view structural drawing of the metal cover disc in the metal carrier disc for the semiconductor packaging module of the embodiment of the utility model.
[0022] Figure 8 The structure drawing of the semiconductor packaging module in the embodiment of the utility model.
[0023] Figure 9 The structure drawing of the semiconductor packaging module after installing the semiconductor packaging module on the metal bottom disc in the metal carrier disc for the semiconductor packaging module of the embodiment of the utility model.
[0024] Figure 10 The three-dimensional structure drawing after covering the metal cover disc on the basis of Figure 9 .
[0025] Figure 11 The side view structural drawing after covering the metal cover disc on the basis of Figure 9 .
[0026] Figure 12 For Figure 11 Enlarged view of the middle C.
[0027] Figure 13 The top view structural drawing after covering the metal cover disc on the basis of Figure 9 .
[0028] Figure 14 For Figure 13 Enlarged view of the middle D. DETAILED DESCRIPTION
[0029] In order to make the technical content, structural features and realized effects of the utility model clear, the following will be described in detail in combination with the embodiments and the drawings.
[0030] As Figures 1 to 14As shown, the metal carrier tray for the semiconductor packaging module 10 provided by the embodiment of the utility model includes a metal bottom tray 1 and a metal cover tray 2 matched with the metal bottom tray 1, the metal bottom tray 1 includes a first tray body 11, a plurality of first openings 111 arranged in an array are formed on the first tray body 11, a plurality of first limiting blocks are arranged on the periphery of each first opening 111, the plurality of first limiting blocks enclose a mounting position 12 for mounting the semiconductor packaging module 10, and the first tray body 11 is further provided with a first magnetic member 115 at both ends; the metal cover tray 2 includes a second tray body 21, a plurality of second openings 211 arranged in an array are formed on the second tray body 21, the second openings 211 are arranged one by one in correspondence with the first openings 111, a plurality of second limiting blocks are arranged on the periphery of each second opening 211, the second tray body 21 is further provided with a second magnetic member 215 at both ends, and the metal bottom tray 1 and the metal cover tray 2 are connected by the first magnetic member 115 and the second magnetic member 215 to clamp the semiconductor packaging module 10 between the metal bottom tray 1 and the metal cover tray 2. Specifically, the material of the metal bottom tray 1 and the metal cover tray 2 can be steel, the metal carrier tray of the embodiment of the utility model is aimed at the production process of the semiconductor packaging module 10, the product will go through some special processes, for example, SAT scanning, washing and baking processes are sequentially performed, because the metal material has the characteristics of high strength, good toughness and strong reliability, therefore, the product can be protected from the environment when the product goes through the special process, and the process efficiency can be improved, dozens or even hundreds of products can be processed at a time, and the metal carrier tray of the utility model can be repeatedly used, thereby increasing the protection of the environment.
[0031] The metal carrier tray of the embodiment of the utility model can increase the reliability of the semiconductor packaging module 10 in the special process, and will not damage the semiconductor packaging module 10 and the metal carrier tray in a harsh environment; and the metal carrier tray of the embodiment of the utility model can process a plurality of semiconductor packaging modules 10 at a time, reduce manual intervention in the process, improve the process efficiency; in addition, the first magnetic member 115 and the second magnetic member 215 are used to connect the metal bottom tray 1 and the metal cover tray 2, the connection is convenient, the semiconductor packaging module 10 is stably fixed in the middle, and the semiconductor packaging module 10 will not be accidentally scattered when the whole tray of semiconductor packaging modules 10 is taken out; at the same time, the metal carrier tray can be repeatedly used, thereby reducing waste and protecting the environment.
[0032] In the embodiment of the utility model, Figures 1 to 3As shown, the plurality of first limiting blocks includes two first blocks 112 arranged opposite in the transverse direction and two second blocks 113 arranged opposite in the longitudinal direction, the first block 112 includes a first sub-block 1121 and a second sub-block 1122 arranged in the longitudinal direction, the first opening 111 is rectangular, the first sub-block 1121 and the second sub-block 1122 are symmetrically arranged on both sides of the center line in the transverse direction of the first opening 111, and the second block 113 is symmetrically arranged along the center line in the longitudinal direction of the first opening 111, the mounting position 12 of the semiconductor packaging module 10 is surrounded by the two first blocks 112 and the two second blocks 113, the structure is simple, and the limiting of the semiconductor packaging module 10 is more uniform.
[0033] Further, as shown in the drawings, Figures 4 to 7 the plurality of second limiting blocks includes two third blocks 212 arranged opposite in the transverse direction and two fourth blocks 213 arranged opposite in the longitudinal direction, the fourth block 213 includes a third sub-block 2131 and a fourth sub-block 2132 arranged in the transverse direction, the second opening 211 is rectangular, the third block 212 is symmetrically arranged along the center line in the transverse direction of the second opening 211, and the third sub-block 2131 and the fourth sub-block 2132 are symmetrically arranged on both sides of the center line in the longitudinal direction of the second opening 211. Specifically, the size of the second opening 211 can be slightly smaller than the size of the semiconductor packaging module 10, and in some cases can even be equal to the size of the semiconductor packaging module 10, and the first opening 111 and the second opening 211 can be provided to avoid damage to components on the semiconductor packaging module 10.
[0034] Further, as shown in the drawings, Figures 9 to 14 when the metal bottom disc 1 and the metal cover disc 2 are closed, the projection of the second block 113 in the vertical direction is located between the projection of the third sub-block 2131 in the vertical direction and the projection of the fourth sub-block 2132 in the vertical direction, and the projection of the third block 212 in the vertical direction is located between the projection of the first sub-block 1121 in the vertical direction and the projection of the second sub-block 1122 in the vertical direction. Specifically, by arranging the positions of the second block 113, the third sub-block 2131 and the fourth sub-block 2132, and arranging the positions of the third block 213, the first sub-block 1121 and the second sub-block 1122, the positions of the second block 113, the third sub-block 2131 and the fourth sub-block 2132 can be avoided, and the positions of the third block 212, the first sub-block 1121 and the second sub-block 1122 can also be avoided, the machining precision of the first block 112, the second block 113, the third block 212 and the fourth block 213 can be appropriately reduced, the cost can be effectively reduced, and the limiting effect is better.
[0035] In the embodiments of the utility model, as shown in the drawings, Figure 6 , Figure 7 and Figure 14As shown, the third block 212 is in the shape of a trapezoidal block, the partial projection of the third block 212 in the vertical direction is located inside the projection of the second opening 211 in the vertical direction, the third sub-block 2131 and the fourth sub-block 2132 are both in the shape of a trapezoidal block, the partial projection of the third sub-block 2131 in the vertical direction is located inside the projection of the second opening 211 in the vertical direction and the partial projection of the fourth sub-block 2132 in the vertical direction is located inside the projection of the second opening 211 in the vertical direction, through the design of the third block 212, the third sub-block 2131 and the fourth sub-block 2132, the semiconductor packaging module 10 can be blocked and the size of the second opening 211 can be further increased, so that the size of the second opening 211 can even equal the size of the semiconductor packaging module 10 to avoid affecting the semiconductor packaging module 10, in some other embodiments, only the partial projection of the third block 212 in the vertical direction can be located inside the projection of the second opening 211 in the vertical direction or the partial projection of the third sub-block 2131 in the vertical direction and the partial projection of the fourth sub-block 2132 in the vertical direction can be located inside the projection of the second opening 211 in the vertical direction, and the semiconductor packaging module 10 can also be blocked.
[0036] In the embodiment of the utility model, the first sub-block 1121 on the first disc body 11 is arranged along the horizontal direction in sequence and evenly spaced, the second sub-block 1122 on the first disc body 11 is arranged along the horizontal direction in sequence and evenly, the second block 113 on the first disc body 11 is arranged along the vertical direction in sequence and evenly spaced, the third block 212 on the second disc body 21 is arranged along the horizontal direction in sequence and evenly spaced, the third sub-block 2131 on the second disc body 21 is arranged along the vertical direction in sequence and evenly, the fourth sub-block 2132 on the second disc body 21 is arranged along the vertical direction in sequence and evenly spaced, specifically, two first openings 111 adjacent in the horizontal direction share a first sub-block 1121 and a second sub-block 1122, two first openings 111 adjacent in the vertical direction share a second block 113, two second openings 211 adjacent in the horizontal direction share a third block 212, two second openings 211 adjacent in the vertical direction share a third sub-block 2131 and a fourth sub-block 2132, the structure is more simple and compact, the processing is more convenient, and the design is ingenious.
[0037] The utility model discloses a first hand -held portion 114 is provided with first recessed hole, and the first recessed hole is equipped with first magnetic attraction piece 115, and the second hand -held portion 214 is provided with second recessed hole, and the second recessed hole is equipped with second magnetic attraction piece 215, and the first magnetic attraction piece 115 and the second magnetic attraction piece 215 can be magnet, the height of the first hand -held portion 114 protruding the first disc body 11 and the height of the second hand -held portion 214 protruding the second disc body 21 sum is greater than the thickness of semiconductor package module 10, and the protruding first outer end surface 1141 and the protruding second outer end surface 2141 are docked to realize the adsorption connection of metal bottom tray 1 and metal cover tray 2, and the adsorption is convenient.
[0038] The utility model discloses a first hand -held portion 114 is provided with first recessed hole, and the first recessed hole is equipped with first magnetic attraction piece 115, and the second hand -held portion 214 is provided with second recessed hole, and the second recessed hole is equipped with second magnetic attraction piece 215, and the first magnetic attraction piece 115 and the second magnetic attraction piece 215 can be magnet, the height of the first hand -held portion 114 protruding the first disc body 11 and the height of the second hand -held portion 214 protruding the second disc body 21 sum is greater than the thickness of semiconductor package module 10, and the protruding first outer end surface 1141 and the protruding second outer end surface 2141 are docked to realize the adsorption connection of metal bottom tray 1 and metal cover tray 2, and the adsorption is convenient.
[0039] In some other specific embodiments of the utility model, the first disc body 11 has a first surface provided with a first limiting stopper, the third hand-held part has a third outer end face, the third outer end face is protruded from the first surface, the third hand-held part has a third recessed hole recessed inward from the third outer end face, and the third recessed hole is provided with a first magnetic attraction piece 115; the second disc body 21 has a second surface provided with a second limiting stopper, the fourth hand-held part has a fourth outer end face, the fourth outer end face is flush with the second surface, the fourth hand-held part has a fourth recessed hole recessed inward from the fourth outer end face, and the fourth recessed hole is provided with a second magnetic attraction piece 215; specifically, the fourth outer end face is flush with the second surface, so that the second disc body 21 and the fourth hand-held part are easier to manufacture, and only the protruding height of the third outer end face of the third hand-held part needs to be set and the height of the third hand-held part protruding from the second disc body 21 needs to be set to be greater than the thickness of the semiconductor packaging module 10.
[0040] Specifically, the third hand-held part is in a strip shape, three first magnetic attraction pieces 115 are uniformly arranged on the third hand-held part, the three first magnetic attraction pieces 115 are arranged along the length direction of the third hand-held part, the fourth hand-held part is in a strip shape, three second magnetic attraction pieces 215 are uniformly arranged on the fourth hand-held part, the three second magnetic attraction pieces 215 are arranged along the length direction of the fourth hand-held part, and the three second magnetic attraction pieces 215 are arranged one by one corresponding to the three first magnetic attraction pieces 115.
[0041] The above only discloses preferred embodiments of the utility model, and of course cannot limit the scope of the utility model, so equivalent changes made according to the patent application scope of the utility model still belong to the scope covered by the utility model.
Claims
1. A metal carrier disk for a semiconductor packaging module, characterized in that, The device includes a metal chassis and a metal cover plate that cooperates with the metal chassis. The metal chassis includes a first plate body with a plurality of first openings arranged in an array on the first plate body. Each first opening has a plurality of first limiting blocks on its periphery. The plurality of first limiting blocks form a mounting position for mounting the semiconductor packaging module. The first plate body also has first magnetic suction components at both ends. The metal cover includes a second disc body with a plurality of arrayed second openings. The second openings correspond one-to-one with the first openings. Each second opening has a plurality of second limiting blocks around its periphery. The two ends of the second disc body are also provided with second magnetic suction components. The metal base and the metal cover are connected by the first and second magnetic suction components to clamp the semiconductor packaging module between the metal base and the metal cover.
2. The metal carrier disk for a semiconductor packaging module as described in claim 1, characterized in that, The plurality of first limiting blocks include two first blocks arranged opposite each other in the transverse direction and two second blocks arranged opposite each other in the longitudinal direction. The first block includes a first sub-block and a second sub-block arranged at intervals in the longitudinal direction. The first opening is rectangular. The first sub-block and the second sub-block are symmetrically arranged on both sides of the center line in the transverse direction of the first opening. The second block is symmetrically arranged along the center line in the longitudinal direction of the first opening.
3. The metal carrier disk for a semiconductor packaging module as described in claim 2, characterized in that, The plurality of second limiting blocks include two third blocks arranged opposite each other in the lateral direction and two fourth blocks arranged opposite each other in the longitudinal direction. The fourth block includes a third sub-block and a fourth sub-block arranged at intervals in the lateral direction. The second opening is rectangular. The third blocks are symmetrically arranged along the center line in the lateral direction of the second opening. The third sub-block and the fourth sub-block are symmetrically arranged on both sides of the center line in the longitudinal direction of the second opening.
4. The metal carrier disk for a semiconductor packaging module as described in claim 3, characterized in that, When the metal chassis and the metal cover are closed, the projection of the second block in the vertical direction is located between the projection of the third sub-block in the vertical direction and the projection of the fourth sub-block in the vertical direction, and the projection of the third block in the vertical direction is located between the projection of the first sub-block in the vertical direction and the projection of the second sub-block in the vertical direction.
5. The metal carrier disk for a semiconductor packaging module as described in claim 4, characterized in that, The third block is trapezoidal in shape, and a portion of the vertical projection of the third block lies inside the vertical projection of the second opening, and / or... Both the third sub-block and the fourth sub-block are trapezoidal blocks. The partial projection of the third sub-block in the vertical direction is located inside the projection of the second opening in the vertical direction, and the partial projection of the fourth sub-block in the vertical direction is located inside the projection of the second opening in the vertical direction.
6. The metal carrier disk for a semiconductor packaging module as described in claim 5, characterized in that, The first sub-blocks on the first disc are arranged at uniform intervals in the horizontal direction, the second sub-blocks on the first disc are arranged at uniform intervals in the horizontal direction, and the second block on the first disc is arranged at uniform intervals in the vertical direction; the third block on the second disc is arranged at uniform intervals in the horizontal direction, the third sub-block on the second disc is arranged at uniform intervals in the vertical direction, and the fourth sub-block on the second disc is arranged at uniform intervals in the vertical direction.
7. The metal carrier disk for a semiconductor packaging module as described in claim 1, characterized in that, Both sides of the first disc body extend outwards with first hand-held portions. The first disc body has a first surface on which the first limiting block is disposed. The first hand-held portion has a first outer end face that protrudes from the first surface. The first hand-held portion has a first recessed hole recessed inwards from the first outer end face, and the first magnetic suction element is disposed in the first recessed hole. Both sides of the second disc body extend outwards with second hand-held portions. The second disc body has a second surface on which the second limiting block is disposed. The second hand-held portion has a second outer end face that protrudes from the second surface. The second hand-held portion has a second recessed hole recessed inwards from the second outer end face, and the second magnetic suction element is disposed in the second recessed hole.
8. The metal carrier disk for a semiconductor packaging module as described in claim 7, characterized in that, The first hand-held part is strip-shaped, and three first magnetic components are evenly arranged on the first hand-held part. The three first magnetic components are arranged along the length direction of the first hand-held part. The second hand-held part is strip-shaped, and three second magnetic components are evenly arranged on the second hand-held part. The three second magnetic components are arranged along the length direction of the second hand-held part, and the three second magnetic components correspond one-to-one with the three first magnetic components.
9. The metal carrier disk for a semiconductor packaging module as described in claim 1, characterized in that, Both sides of the first disc body extend outwards with third hand-held portions. The first disc body has a first surface on which the first limiting block is disposed. The third hand-held portion has a third outer end face that protrudes from the first surface. The third hand-held portion has a third recessed hole recessed inwards from the third outer end face, and the first magnetic suction element is disposed in the third recessed hole. Both sides of the second disc body extend outwards with fourth hand-held portions. The second disc body has a second surface on which the second limiting block is disposed. The fourth hand-held portion has a fourth outer end face that is flush with the second surface. The fourth hand-held portion has a fourth recessed hole recessed inwards from the fourth outer end face, and the second magnetic suction element is disposed in the fourth recessed hole.
10. The metal carrier disk for a semiconductor packaging module as described in claim 9, characterized in that, The third hand-held part is strip-shaped, and three first magnetic suction elements are evenly arranged on the third hand-held part. The three first magnetic suction elements are arranged along the length direction of the third hand-held part. The fourth hand-held part is strip-shaped, and three second magnetic suction elements are evenly arranged on the fourth hand-held part. The three second magnetic suction elements are arranged along the length direction of the fourth hand-held part, and the three second magnetic suction elements correspond one-to-one with the three first magnetic suction elements.