Eddy current sensor

Abstract

The utility model relates to the technical field of eddy current sensors, in particular to an eddy current sensor, which comprises a semicircular multilayer PCB (printed circuit board) substrate, a plurality of groups of coils are laid in the PCB substrate, each group of coils has four turns, each turn of coils occupies a mechanical angle of 90 degrees, and the coils are laid on a plurality of layers of the PCB substrate in a sine manner; wherein along the clockwise direction, the multiple turns of coils are sequentially arranged at a mechanical angle of 8.5 degrees; when the coil structure is arranged in a sine mode, the four turns of coils in each group of coils respectively occupy a mechanical angle of 90 degrees, the whole arrangement is uniform, and the magnetic field distribution is more uniform, so that the generated eddy current effect has higher stability and accuracy; the technical problem that the stability and accuracy of the eddy current effect are affected due to non-uniform magnetic field distribution caused by non-uniform winding of the eddy current sensor coil in the prior art is effectively solved.

Description

Technical Field

[0001] This utility model relates to the field of eddy current sensor technology, and specifically to an eddy current sensor. Background Technology

[0002] An eddy current sensor is a sensor that measures various parameters of a metal conductor by detecting the eddy currents generated in the conductor within an alternating magnetic field. Eddy current sensors do not directly provide a three-phase output. Instead, they output analog signals (voltage or current) related to the measured physical quantity. These signals can be further processed or used to control other devices (such as three-phase motors) to achieve a three-phase output.

[0003] An eddy current sensor's coil consists of an excitation coil and an induction coil. When the excitation coil is energized, an alternating electromagnetic field is generated on the surface of the object being detected, thus inducing eddy currents on the surface. These eddy currents then generate their own electromagnetic fields, which interact with the electromagnetic field in the excitation coil, causing changes in the voltage and current induced in the induction coil. By detecting these changes in voltage and current in the induction coil, information about the surface of the object being detected can be indirectly obtained.

[0004] However, existing eddy current sensors have certain problems: 1) Uneven coil winding affects the distribution of the generated magnetic field. Uneven magnetic field distribution affects the stability and accuracy of the eddy current effect; 2) The installation position and orientation of the coil affect its measurement effect. Improper installation may lead to increased measurement errors or malfunction. Utility Model Content

[0005] This invention provides an eddy current sensor to solve the technical problem in the prior art where uneven winding of the eddy current sensor coil leads to uneven magnetic field distribution, thus affecting the stability and accuracy of the eddy current effect.

[0006] To solve the above problems, the eddy current sensor provided by this utility model adopts the following technical solution:

[0007] An eddy current sensor includes a semi-annular, multi-layered PCB substrate, wherein multiple sets of coils are laid in the PCB substrate, each set of coils having four turns, each turn of the coil occupying a mechanical angle of 90°, and laid in a sinusoidal manner on multiple layers of the PCB substrate.

[0008] In this arrangement, the multi-turn coils are arranged sequentially with a mechanical angle difference of 8.5° in a clockwise direction.

[0009] The beneficial effects of the eddy current sensor provided by this utility model are as follows: Compared with the coil arrangement method in the prior art, the coil structure in this utility model is arranged in a sinusoidal manner, and the four turns of each coil group occupy a mechanical angle of 90°. The overall arrangement is uniform, and the magnetic field distribution is more uniform, which makes the generated eddy current effect have higher stability and accuracy. It effectively solves the technical problem in the prior art that uneven winding of the eddy current sensor coil leads to uneven magnetic field distribution, which affects the stability and accuracy of the eddy current effect.

[0010] Furthermore, each coil occupies two or three layers of the PCB substrate.

[0011] Furthermore, the coil is connected to multiple layers of the PCB substrate through connecting holes; the connecting holes include three sets, the first set of connecting holes is located on the large diameter circumference of the semi-annular structure, the second set of connecting holes is located on the small diameter circumference of the semi-annular structure, and the third set of connecting holes is located in the middle of the large diameter circumference and the small diameter circumference.

[0012] Furthermore, the third set of connecting holes forms a mechanical angle of 8.5° between each connecting hole, and the third set of connecting holes is used for coil folding. Each set of connecting holes forms pads on the front and back of the PCB substrate.

[0013] Furthermore, a processing circuit section is also provided on the outer side of the PCB substrate.

[0014] Furthermore, the eddy current sensor is a four-pair eddy current sensor. Attached Figure Description

[0015] The above and other objects, features, and advantages of the present invention will become readily understood by reading the following detailed description of exemplary embodiments with reference to the accompanying drawings. In the drawings, several embodiments of the present invention are shown by way of example and not limitation, and like or corresponding reference numerals denote like or corresponding parts, wherein:

[0016] Figure 1 This is a schematic diagram of the coil winding in the eddy current sensor provided by this utility model.

[0017] Explanation of reference numerals in the attached figures:

[0018] 1. First turn of coil; 2. Second turn of coil; 3. Third turn of coil; 4. Fourth turn of coil; 5. PCB substrate; Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Those skilled in the art should understand that the embodiments described below are only some, not all, of the embodiments disclosed. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the scope of protection of the present utility model.

[0020] It should be noted that the main concept of this utility model is that the coil structure is arranged in a sinusoidal manner, and the four turns of each coil in each group occupy a mechanical angle of 90°. The overall arrangement is uniform, and the magnetic field distribution is more uniform, which makes the generated eddy current effect have higher stability and accuracy. This effectively solves the technical problem in the prior art that uneven winding of the eddy current sensor coil leads to uneven magnetic field distribution, which affects the stability and accuracy of the eddy current effect.

[0021] After introducing the basic principles of this utility model, various non-limiting embodiments of this utility model are described in detail below. Any quantity of elements in the accompanying drawings is for illustrative purposes only and not for limitation, and any naming is for distinction only and has no limiting meaning.

[0022] The principles and spirit of this utility model will be explained in detail below with reference to several representative embodiments.

[0023] An embodiment of the eddy current sensor provided by this utility model:

[0024] like Figure 1 As shown, the eddy current sensor includes a semi-annular, multi-layered PCB substrate 5. Multiple sets of coils are laid in the PCB substrate 5, each set of coils having four turns. Each turn of the coil occupies a mechanical angle of 90° and is laid in a sinusoidal manner on multiple layers of the PCB substrate 5; they are respectively defined as the first turn coil 1, the second turn coil 2, the third turn coil 3, and the fourth turn coil 4.

[0025] In this arrangement, the multi-turn coils are arranged sequentially with a mechanical angle difference of 8.5° in a clockwise direction.

[0026] In this embodiment, each coil occupies two or three layers of the PCB substrate 5. The coil connects multiple layers of the PCB substrate 5 through connecting holes; the connecting holes include three sets: the first set of connecting holes is located on the large diameter circumference of the semi-annular structure, the second set of connecting holes is located on the small diameter circumference of the semi-annular structure, and the third set of connecting holes is located in the middle of the large and small diameter circumferences.

[0027] The third group of connecting holes forms a mechanical angle of 8.5° between each connecting hole. The third group of connecting holes is used for coil folding. Each group of connecting holes forms a pad on the front and back of the PCB substrate 5.

[0028] Finally, a processing circuit is also provided on the outer side of the PCB substrate 5. The eddy current sensor is a four-pair eddy current sensor.

[0029] Compared with the coil arrangement in the prior art, the eddy current sensor provided by this utility model has a coil structure arranged in a sinusoidal manner. In each group of coils, the four turns of the coil each occupy a mechanical angle of 90°, and the overall arrangement is uniform. The magnetic field distribution is more uniform, which makes the generated eddy current effect more stable and accurate. It effectively solves the technical problem in the prior art that uneven winding of the eddy current sensor coil leads to uneven magnetic field distribution, which affects the stability and accuracy of the eddy current effect.

[0030] Based on the above description in this specification, those skilled in the art will also understand that the following terms used, such as "upper," "lower," "front," "rear," "left," "right," "width," "horizontal," "top," "bottom," "inner," and "outer," are terms indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings of this specification. They are only for the purpose of facilitating the explanation of the present invention and simplifying the description, and do not explicitly or implicitly suggest that the device or element involved must have the specific orientation, or be constructed and operated in a specific orientation. Therefore, the above-mentioned orientation or positional relationship terms should not be understood or interpreted as limitations on the present invention.

[0031] In addition, in the description of this specification, "multiple" means at least two, such as two, three or more, etc., unless otherwise expressly and specifically defined.

Claims

1. An eddy current sensor, comprising a semi-annular, multi-layered PCB substrate, wherein multiple sets of coils are disposed in the PCB substrate, characterized in that: Each group of coils has four turns, and each turn of the coil occupies a mechanical angle of 90°, and is laid in a sinusoidal manner on multiple layers of the PCB substrate; In this arrangement, the multi-turn coils are arranged sequentially with a mechanical angle difference of 8.5° in a clockwise direction; The coil is connected to multiple layers of the PCB substrate through a connecting hole; the connecting hole includes three sets, the first set of connecting holes is located on the large diameter circumference of the semi-circular ring, the second set of connecting holes is located on the small diameter circumference of the semi-circular ring, and the third set of connecting holes is located in the middle of the large diameter circumference and the small diameter circumference. The third group of connecting holes forms a mechanical angle of 8.5° between each connecting hole. The third group of connecting holes is used for coil folding. Each group of connecting holes forms pads on the front and back of the PCB substrate.

2. The eddy current sensor according to claim 1, characterized in that: Each coil occupies two or three layers of the PCB substrate.

3. The eddy current sensor according to claim 1 or 2, characterized in that: The outer side of the PCB substrate is also provided with a processing circuit section.

4. The eddy current sensor according to claim 1 or 2, characterized in that: The eddy current sensor is a four-pair eddy current sensor.

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