Light machine heat dissipation structure of projector

Abstract

The utility model discloses an optical machine heat dissipation structure of a projector, which comprises an optical machine body, a PCB (Printed Circuit Board) and an integrated heat dissipation structure, the bottom end of the side part of the optical machine body is provided with the PCB, and the lower surface of the PCB is provided with a groove for placing an imaging chip; the imaging chip leads out heat to the cold surface of the thermoelectric refrigeration sheet through the heat conduction cold head in contact with the imaging chip, so that the temperature of the imaging chip is reduced and controlled, and the hot surface of the thermoelectric refrigeration sheet is cooled through the water-cooled radiator, so that a cycle is formed; a turbofan and a radiator are arranged in the closed cavity of the ray machine body, so that the heat balance of the inner cavity is kept; the axial fan introduces external cold air through the gap of the optical machine cover, thereby reducing the temperature of the rear group of the lens. According to the utility model, heat dissipation is carried out on the high-power projector and the imaging chip by adding the space structure radiator and combining different heat dissipation modes, all important heat dissipation devices of the optical machine are considered on the whole, and the design requirements are met.

Description

TECHNICAL FIELD

[0001] The utility model relates to a heat dissipation structure, especially a light machine heat dissipation structure of projector. BACKGROUND

[0002] The light machine in the laser projection display equipment generates a lot of heat in the work because of the loss of optical path energy, especially when the high-power machine projects a black picture, the light absorbed by the imaging chip and the reflected strong light are all gathered in the light machine, which leads to the rapid temperature rise on the light machine, prism and imaging chip, causing the machine to have a too high temperature, the prism to break and the imaging chip to be damaged, and affecting the quality of the machine.

[0003] The traditional light machine heat dissipation mode mainly includes that the imaging chip uses a heat pipe for heat dissipation, and a small fan is added in the light machine for heat dissipation, but due to the limitation of the overall space, the heat dissipation has a certain bottleneck, and it is difficult to meet the heat dissipation requirement under high power. UTILITY MODEL CONTENT

[0004] The utility model solves the technical problem of the prior art, and provides a light machine heat dissipation structure of projector, which dissipates heat from the whole light machine and chip by increasing a space structure radiator and different heat dissipation modes, so as to meet the actual use requirement.

[0005] To solve the above technical problems, the utility model adopts the technical scheme that

[0006] A light machine heat dissipation structure of projector, including light machine body, PCB board and integrated heat dissipation structure, the bottom end of the side of the light machine body is provided with the PCB board, the lower surface of the PCB board is provided with a groove for placing the imaging chip.

[0007] The integrated heat dissipation structure includes a heat-conducting cold head, a thermoelectric refrigeration piece and a water-cooled radiator.

[0008] The heat-conducting cold head is connected with the imaging chip in a manner of adhesion and is used for leading out the heat of the imaging chip.

[0009] The thermoelectric refrigeration piece has two end faces, one end face is a hot face, and the other end face is a cold face.

[0010] The cold face of the thermoelectric refrigeration piece is connected with the heat-conducting cold head in a manner of adhesion, and the heat-conducting cold head leads out the heat to the cold face of the thermoelectric refrigeration piece.

[0011] The water-cooled radiator is connected with the hot face of the thermoelectric refrigeration piece in a manner of adhesion, and the hot face of the thermoelectric refrigeration piece is cooled by the water-cooled radiator.

[0012] The heat-conducting cold head comprises a plate body and an integrally formed cold head protrusion, the plate body is provided with a sensor, the cold head protrusion is formed on the side of the plate body close to the PCB, and the cold head protrusion is inserted and assembled with the groove, so that the cold head protrusion is connected with the imaging chip.

[0013] The heat-conducting cold head can adopt an integrated heat sink or a pre-embedded heat pipe heat sink.

[0014] The cold face of the thermoelectric refrigeration piece is connected with the side of the plate body away from the PCB, and the thermoelectric refrigeration piece is provided with two pieces in parallel combination.

[0015] The integrated heat dissipation structure further comprises a cold head fixing seat, the cold head fixing seat is a hollow frame structure, the side of the plate body away from the PCB is formed with an L-shaped boss, the inner circumferential edge of the cold head fixing seat away from the PCB is formed with an L-shaped groove, the plate body is assembled with the L-shaped groove of the cold head fixing seat through the L-shaped boss, and the inner circumferential frame of the cold head fixing seat is further assembled with the thermoelectric refrigeration piece.

[0016] The water-cooled radiator comprises a heat dissipation cold head and a radiator water exhaust, one side of the heat dissipation cold head is connected with the hot face of the thermoelectric refrigeration piece, and the other side is assembled with a water storage tank; the side of the water storage tank away from the heat dissipation cold head is provided with a water inlet pipe head and a water outlet pipe head; a water exhaust fan is arranged on the side of the radiator water exhaust, the bottom surface of the radiator water exhaust is connected with the water inlet pipe head of the water storage tank through a water inlet pipe, and the bottom surface of the radiator water exhaust is connected with the water outlet pipe head of the water storage tank through a water outlet pipe.

[0017] The outer circumferential side of the heat dissipation cold head is flush with the outer circumferential side of the cold head fixing seat; the first foam sealing layer is assembled between the heat dissipation cold head and the cold head fixing seat, and the outer circumferential side of the first foam sealing layer is flush with the outer circumferential side of the cold head fixing seat.

[0018] The PCB further comprises a PCB fixing pressing plate for pressing the PCB; the PCB fixing pressing plate is a hollow frame structure, the outer circumferential side of the PCB fixing pressing plate is flush with the outer circumferential side of the cold head fixing seat, and the inner circumferential side of the PCB fixing pressing plate is tightly assembled with the outer circumferential side of the plate body of the heat-conducting cold head; a rubber pad is arranged between the PCB fixing pressing plate and the PCB, and the rubber pad is circumferentially arranged; a second foam sealing layer is arranged between the gap between the PCB fixing pressing plate and the cold head fixing seat, and the second foam sealing layer is circumferentially arranged.

[0019] The interior of the optical machine body is a closed cavity, the closed cavity comprises a main flow cavity and a branch flow cavity; the turbine fan is arranged at a corner of the main flow cavity, the heat sink 18 is arranged on the low-pressure side of the turbine fan, and the prism is arranged on the high-pressure side of the turbine fan; the heat sink is composed of a circulation area and a heat dissipation area, the circulation area is arranged in the main flow cavity, and the heat dissipation area is arranged outside the main flow cavity and communicates with the external air.

[0020] The light guide pipe and the color wheel are arranged in the branch flow cavity, the branch flow cavity is communicated with the low pressure area side of the turbine fan through an opening A, and is communicated with the high pressure area side of the turbine fan through an opening B; and the fins are arranged in the closed cavity.

[0021] The lens rear group is arranged on the light machine body, the fan cavity is formed on the light machine body close to the lens rear group, the axial flow fan is arranged in the fan cavity, the gap is formed on the light machine body for the fan cavity to communicate with the external air, the external cold air is introduced into the fan cavity through the gap of the fan cavity to continuously blow the cold air to the lens rear group for cooling, and the fins are arranged at the lens rear group to absorb the hot air of the lens rear group to cool the whole lens rear group cavity.

[0022] The light machine cooling structure of the utility model has the following beneficial effects:

[0023] 1、The utility model discloses a space structure radiator is increased and different heat dissipation mode combination is carried out to high -power projector and imaging chip heat dissipation, and the whole gives attention to each important heat dissipation device of light machine, is used for satisfying design demand.

[0024] 2、For imaging chip, set up integrated heat dissipation structure to cool and temperature control it, through the heat conduction cold head of contact with it, export heat to thermoelectric refrigeration piece cold surface, thereby reduce and control the temperature of imaging chip, and the hot surface of thermoelectric refrigeration piece carries out cooling to it again through water -cooling radiator, and this forms circulation.

[0025] 3、During the heat dissipation of imaging chip, the temperature of heat conduction cold head is very low due to the working of thermoelectric refrigeration piece, and condensation phenomenon is easy to occur, so the first bubble cotton sealing layer, heat insulating layer, second bubble cotton sealing layer and rubber pad surface are arranged at the layer gap of integrated heat dissipation structure and PCB fixed pressing plate, low-temperature parts are closed and covered, one layer is buckled to another layer, so as to realize overall sealing assembly, can effectively prevent external moisture from entering the low-temperature area, thereby preventing condensation.

[0026] 4、The light machine body airtight cavity is arranged with a turbine fan and a radiator, and the turbine fan and the radiator maintain the thermal balance of the internal cavity.

[0027] 5、The axial flow fan introduces external cold air through the gap of the light machine cover, thereby reducing the temperature of the lens rear group, and fins are added at the lens rear group to cool the whole lens rear group cavity by absorbing the hot air of the lens rear group. BRIEF DESCRIPTION OF DRAWINGS

[0028] Figure 1 It is a structure schematic view of the light machine cooling structure of the utility model.

[0029] Figure 2 It is a bottom view of the utility model a projector PCB.

[0030] Figure 3 is a bottom view of the projector mounted with the integrated heat dissipation structure.

[0031] Figure 4 is an enlarged view of the projector mounted with the integrated heat dissipation structure.

[0032] Figure 5 is a sectional view of the integrated heat dissipation structure and the PCB pressing plate of the projector.

[0033] Figure 6 is an assembly effect schematic view of the heat-conducting cold head and the cold head fixing seat of the projector.

[0034] Figure 7 is an installation structure schematic view of the turbine fan and the radiator of the projector.

[0035] Figure 8 is an effect schematic view of the main air flow channel of the projector.

[0036] Figure 9 is an installation structure schematic view of the color wheel and the light guide pipe of the projector.

[0037] Figure 10 is an effect schematic view of the internal circulation flow channel of the projector.

[0038] Figure 11 is an installation structure schematic view of the lens rear group and the axial flow fan of the projector.

[0039] Among them: 1. Light machine body; 2. PCB board; 2.1 recess; 2.2 PCB fixed pressing plate; 3. Imaging chip; 4. Heat-conducting cold head; 4.1 plate body; 4.2 cold head protruding block; 4.3 sensor; 5. Thermoelectric refrigeration piece; 6. Water-cooled radiator; 6.1 radiator cold head; 6.2 water inlet pipe head; 6.3 water outlet pipe head; 6.4 water inlet pipe; 6.5 water outlet pipe; 6.6 radiator water exhaust; 6.7 water exhaust fan; 6.8 water storage tank; 7. Cold head fixing seat; 8. Integrated heat dissipation structure; 9. First foam sealing layer; 10. Second foam sealing layer; 11. Rubber pad surface; 12. Prism; 13. Light guide pipe; 14. Color wheel; 15. Lens rear group; 15.1 fan cavity; 15.2 notch; 16. Turbine fan; 17. Axial flow fan; 18. Radiator; 18.1 circulation area; 18.2 heat dissipation area. DETAILED DESCRIPTION

[0040] The utility model will be further explained in detail in combination with the drawings and specific preferred embodiments.

[0041] In the description of the utility model, it needs to be understood that the orientation or position relationship indicated by the terms "left side", "right side", "upper part", "lower part" and the like is the orientation or position relationship based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and "first", "second" and the like do not represent the importance of the parts, therefore, it cannot be understood as the limitation of the utility model. The specific size adopted in the embodiment is only for illustrating the technical scheme, and does not limit the protection scope of the utility model.

[0042] As shown in the utility model discloses a projector's light machine heat dissipation structure, including light machine body 1, PCB board 2 and integral heat dissipation structure 8, the light machine body side bottom is equipped with PCB board, and the lower surface of PCB board is provided with recess 2.1, and is used for placing imaging chip 3. Figures 1-6

[0043] Among them, the light machine body is the carrier of bearing optical device and optical path.

[0044] Among them, the imaging chip: DMD chip, is the imaging photoelectric element of machine, and is also the important heat source, and is sensitive to temperature requirement, and needs to be controlled at a certain temperature.

[0045] Among them, the PCB board is the board for placing imaging chip.

[0046] Further, the integral heat dissipation structure 8 includes heat conduction cold head 4, thermoelectric refrigeration piece 5 and water-cooling radiator 6.

[0047] The heat conduction cold head is connected with the imaging chip, and is used for leading out the heat of the imaging chip.

[0048] Among them, the heat conduction cold head is the device for leading out the heat of the imaging chip.

[0049] The thermoelectric refrigeration piece has two end faces, one end face is a hot face, and the other end face is a cold face.

[0050] Among them, the thermoelectric refrigeration piece is an active electric drive cooling device, and one end cold face one end hot face when electrified.

[0051] The cold face of the thermoelectric refrigeration piece is connected with the heat conduction cold head, and the heat conduction cold head leads out the heat to the cold face of the thermoelectric refrigeration piece.

[0052] The water-cooling radiator is connected with the hot face of the thermoelectric refrigeration piece, and the hot face of the thermoelectric refrigeration piece is cooled through the water-cooling radiator.

[0053] Among them, the water-cooling radiator cold head is used for cooling the hot face of the thermoelectric refrigeration piece, so that the chip is cooled greatly.

[0054] ​Further, the heat-conducting cold head 4 includes a plate body 4.1 and an integrally formed cold head bump 4.2. A sensor 4.3 is arranged inside the plate body. The cold head bump is formed on one side of the plate body close to the PCB board. The cold head bump is inserted and assembled with the groove, so that the cold head bump is in close connection with the imaging chip.

[0055] Understandably, the cold head bump needs to be in direct contact with the imaging chip; and the cold head bump and the groove are matched in size to achieve sealed insertion and assembly, and the cold head bump conducts away the heat of the imaging chip arranged in the groove.

[0056] Preferably, the cold head bump can be formed at the edge of a long side of the plate body for easy butt joint installation.

[0057] Further, the cold surface of the thermoelectric cooling sheet is in close connection with the side of the plate body away from the PCB board.

[0058] Understandably, the cold surface of the thermoelectric cooling sheet and the plate body are matched in size to achieve sealed close connection. Further, in order to improve the heat conduction effect, the heat-conducting cold head can adopt an integral heat pipe or a pre-embedded heat pipe heat pipe.

[0059] Further, the integral heat dissipation structure further includes a cold head fixing seat 7, and the heat-conducting cold head is installed and assembled through the cold head fixing seat.

[0060] The cold head fixing seat is a hollow frame structure, in the shape of a "hui" character. The plate body of the heat-conducting cold head is assembled inside its hollow frame structure, and the cold head fixing seat is closely assembled on the peripheral side of the plate body.

[0061] Further, in order to improve the assembly and fixing effect of the cold head fixing seat on the heat-conducting cold head, an L-shaped boss is formed on the peripheral side of the plate body away from the PCB board; an L-shaped groove is formed on the inner peripheral edge of the cold head fixing seat away from the PCB board; the plate body is clamped and assembled with the L-shaped groove of the cold head fixing seat through the L-shaped boss; and a thermoelectric cooling sheet is also assembled inside the inner peripheral frame of the cold head fixing seat.

[0062] Further, two thermoelectric cooling sheets can be provided, and the two thermoelectric cooling sheets are combined in parallel.

[0063] Understandably, the thermoelectric cooling sheet should cover the entire inner peripheral frame of the cold head fixing seat and be in large-area contact and close connection with the plate body. Thus, the cold head fixing seat is closely assembled on the peripheral sides of the heat-conducting cold head and the thermoelectric cooling sheet.

[0064] Further, the water-cooled heat sink comprises a heat dissipation cold head 6.1 and a heat sink water row 6.6, one side of the heat dissipation cold head is connected with the hot surface of the thermoelectric refrigeration piece, and the other side is equipped with a water storage tank 6.8; the side away from the heat dissipation cold head of the water storage tank is equipped with a water inlet pipe head 6.2 and a water outlet pipe head 6.3; the heat sink water row is installed with a water row fan 6.7 on the side, and the bottom of the heat sink water row is connected with the water inlet pipe head of the water storage tank through a water inlet pipe 6.4 and connected with the water outlet pipe head of the water storage tank through a water outlet pipe 6.5.

[0065] The hot surface of the thermoelectric refrigeration piece is in contact with the heat dissipation cold head, so that the hot surface of the thermoelectric refrigeration piece is cooled by the heat dissipation cold head.

[0066] The heat sink water row is used for liquid cooling of the heat dissipation cold head; the water pipe is a water pipeline of the water-cooled heat sink and is used for water circulation of the water-cooled heat sink; the liquid at the heat dissipation cold head is stored in the water storage tank equipped on the side of the heat dissipation cold head; the heat sink water row is installed with a water row fan on the side, and the water row fan is used for directly cooling the heat sink water row. Specifically, the cold water in the heat sink water row flows into the water inlet pipe head through the water inlet pipe, thereby entering the water storage tank at the heat dissipation cold head, taking away the heat at the heat dissipation cold head, realizing liquid cooling of the heat dissipation cold head, and the heated water flows out through the water outlet pipe head and returns to the heat sink water row through the water outlet pipe; the water row fan directly and efficiently cools the water in the heat sink water row.

[0067] Further, in order to meet the overall assembly requirement of the integrated heat dissipation structure, the outer peripheral side of the heat dissipation cold head is flush with the outer peripheral side of the cold head fixing seat.

[0068] Further, in order to prevent condensation, the cold head fixing seat is made of heat insulation material.

[0069] Further, foam can be arranged between the contact surface of the L-shaped boss and the L-shaped groove.

[0070] Further, a first foam sealing layer 9 is arranged between the heat dissipation cold head and the cold head fixing seat, the first foam sealing layer is circumferentially arranged, and the outer peripheral side thereof is flush with the outer peripheral side of the cold head fixing seat.

[0071] The arrangement of the first foam sealing layer can effectively prevent condensation caused by the contact of the heat-conducting cold head with air.

[0072] Further, a heat insulation layer can be arranged at the first foam sealing layer, the heat insulation layer is circumferentially arranged, and the outer peripheral side thereof is flush with the outer peripheral side of the cold head fixing seat.

[0073] The heat insulation layer and the first foam sealing layer act simultaneously and are used for sealing the integrated heat dissipation structure, thereby effectively preventing condensation caused by the contact of the heat-conducting cold head with air.

[0074] Further, the PCB board further includes a PCB fixing pressure plate 2.2 for pressing the PCB board; the PCB fixing pressure plate is a hollow frame structure in the shape of a "hui" character. Considering the overall assembly requirements, its outer peripheral side is flush with the outer peripheral side of the cold head fixing seat, and its inner peripheral side is tightly assembled with the outer peripheral side of the plate body of the heat-conducting cold head; a rubber gasket surface 11 is installed between the PCB fixing pressure plate and the PCB board, and the rubber gasket surface is circumferentially arranged.

[0075] Among them, the rubber gasket surface is used for insulating electricity from the PCB board; and, it realizes the sealing function between the PCB fixing pressure plate and the PCB board.

[0076] Further, a second foam sealing layer 10 is installed between the gaps of the PCB fixing pressure plate and the cold head fixing seat, and the second foam sealing layer is circumferentially arranged, playing a role in overall system sealing and heat insulation.

[0077] When the optical machine operates, it is excited to work. While the imaging chip is working, it absorbs a large amount of heat. At the same time, the loss of the optical path inside the optical machine also generates a large amount of heat. For the imaging chip, the heat is exported to the cold surface of the thermoelectric cooler through the heat-conducting cold head in contact with it, thereby reducing and controlling the temperature of the imaging chip. The hot surface of the thermoelectric cooler is then cooled by the heat-dissipating cold head of the water-cooled radiator, thus forming a cycle to dissipate heat from the imaging chip. During the heat dissipation process of the imaging chip, due to the working of the thermoelectric cooler, the temperature of the heat-conducting cold head is very low, and condensation is likely to occur. Therefore, through the first foam sealing layer, the heat insulation layer, the second foam sealing layer and the rubber gasket surface are arranged at the gaps of each layer of the integrated heat dissipation structure and the PCB fixing pressure plate, and the low-temperature parts are enclosed layer by layer to achieve overall sealed assembly, which can effectively prevent external water vapor from entering the low-temperature area, thereby preventing condensation.

[0078] The optical machine body is used to carry optical devices and optical paths. The inside of the optical machine body is a closed cavity, and a large number of components are arranged inside the closed cavity. The main optical elements include a prism 12, an optical duct 13, a color wheel 14, etc. The loss of the optical path inside the optical machine also generates a large amount of heat. The gaps between the components inside the optical machine body form an internal circulation flow channel.

[0079] As Figures 7-11 shown, the inside of the optical machine body is a closed cavity, and the closed cavity includes a main cavity and a branch cavity. The turbine fan 16 is arranged at a corner of the main cavity. A radiator 18 is arranged on the low-pressure area side of the turbine fan, and a prism 12 is arranged on the high-pressure area side of the turbine fan.

[0080] Among them, the prism: an optical component, used for optical path reflection.

[0081] Among them, the turbine fan is used to provide power for the internal air flow movement of the optical machine, and the heat inside the optical machine body is circulated internally through the air path driven by the internally arranged turbine fan; the radiator is used for heat exchange inside and outside the optical machine.

[0082] Further, the heat sink 18 is composed of two parts, a circulation area 18.1 and a heat dissipation area 18.2, the circulation area is placed in the main flow cavity, and the heat dissipation area is placed outside the main flow cavity and communicates with the external air.

[0083] The air on the high-pressure side of the turbine fan blows to the prism, and the prism is cooled and cooled, and the air is cooled and cooled through the circulation area of the heat sink, and is reabsorbed into the turbine fan.

[0084] Further, the light guide pipe and the color wheel are arranged in the branch flow cavity.

[0085] Further, the branch flow cavity is provided with a through port A communicating with the low-pressure side of the turbine fan, and a through port B communicating with the high-pressure side of the turbine fan.

[0086] The air on the high-pressure side of the turbine fan flows through the prism, and is blown into the branch flow cavity through the through port B to cool the elements in the branch flow cavity, and is sucked into the low-pressure side of the turbine fan through the through port A to realize the circulation of the air in the branch flow cavity.

[0087] The light guide pipe is a light path component that can uniformly distribute light.

[0088] The color wheel is a light path component that mainly functions to optimize the color performance of the projection.

[0089] The specific steps are as follows: when the turbine fan rotates, the air pressure in the turbine fan inlet is reduced, the air in the main flow cavity and the branch flow cavity moves to the low-pressure side of the turbine fan and is sucked into the turbine fan, and the air in the branch flow cavity flows into the low-pressure side of the turbine fan through the through port A; the air in the main flow cavity and the branch flow cavity converges in the turbine fan.

[0090] The mixed air in the turbine fan is discharged through the high-pressure side of the turbine fan, blown to the prism in the main flow cavity, and cooled, and then part of the air moves to the circulation area of the heat sink in the main flow cavity, and the other part moves to the branch flow cavity through the through port B and blows to the light guide pipe and the color wheel to cool them.

[0091] Because of the movement of the turbine fan, the internal system continuously circulates the air, and exchanges heat with the internal air through the heat sink to dissipate heat in the internal cavity of the light machine, so as to maintain the heat balance of the internal cavity and transfer the heat to the external air through the heat dissipation area of the heat sink.

[0092] Further, fins are arranged inside the light machine body to comprehensively reduce the temperature of the light machine.

[0093] As Figure 11As shown, the optical machine body is arranged with a lens rear group 15, the optical machine body is provided with a fan cavity 15.1 near the lens rear group, an axial flow fan 17 is arranged in the fan cavity, the optical machine body is provided with a gap 15.2 for the fan cavity to communicate with external air, the axial flow fan introduces external cold air through the gap of the fan cavity to continuously blow cold air to the lens rear group for cooling; fins can also be arranged at the lens rear group to absorb hot air of the lens rear group to cool the whole lens rear group cavity.

[0094] The axial flow fan introduces external cold air through the gap of the optical machine cover to reduce the temperature of the lens rear group, and fins are added at the lens rear group to absorb hot air of the lens rear group to cool the whole lens rear group cavity.

[0095] The technical features of the above-described embodiments can be combined in any manner, and to make the description concise, all possible combinations of the technical features in the above-described embodiments are not described, but as long as the combinations of the technical features do not exist, they should be considered as the protection scope of the present application.

[0096] The preferred embodiments of the present application are described in detail above, but the present application is not limited to the specific details in the above-described embodiments, and various equivalent transformations of the technical solutions of the present application can be made within the technical concept of the present application, and these equivalent transformations all belong to the protection scope of the present application.

Claims

1. A heat dissipation structure for the optical engine of a projector, characterized in that: It includes an optical engine body, a PCB board and an integrated heat dissipation structure. The PCB board is located at the bottom side of the optical engine body, and a groove is opened on the lower surface of the PCB board for placing the imaging chip. The integrated heat dissipation structure includes a heat-conducting cold head, a thermoelectric cooling chip, and a water-cooled radiator; The heat-conducting cold head is bonded to the imaging chip to dissipate the heat from the imaging chip; Thermoelectric cooling elements have two ends, one end being the hot side and the other end being the cold side; The cold side of the thermoelectric cooler is bonded to the heat-conducting cold head, which conducts heat to the cold side of the thermoelectric cooler. The water-cooled radiator is bonded to the hot side of the thermoelectric cooler, which cools the hot side of the thermoelectric cooler.

2. The optical-mechanical heat dissipation structure of the projector according to claim 1, characterized in that: The thermally conductive cold head includes a plate body and an integrally molded cold head bump. A sensor is installed inside the plate body, and the cold head bump is formed on one side of the plate body near the PCB board. The cold head bump is inserted and assembled with a groove, so that the cold head bump is attached and connected to the imaging chip. The thermally conductive cold head can be an integral heat spreader or a heat spreader with pre-embedded heat pipes.

3. The optical-mechanical heat dissipation structure of the projector according to claim 2, characterized in that: The cold side of the thermoelectric cooling element is bonded to the side of the board away from the PCB; two thermoelectric cooling elements are provided, and the two thermoelectric cooling elements are connected in parallel.

4. The optical-mechanical heat dissipation structure of the projector according to claim 2, characterized in that: The integrated heat dissipation structure also includes a cold head mounting base, which is a hollow frame structure. An L-shaped boss is formed on the periphery of the plate away from the PCB board. An L-shaped groove is formed on the inner periphery of the cold head mounting base away from the PCB board. The plate is assembled by engaging the L-shaped boss with the L-shaped groove of the cold head mounting base. A thermoelectric cooling chip is also installed in the inner periphery of the cold head mounting base. The cold head mounting base is tightly assembled around the heat-conducting cold head and the thermoelectric cooling chip.

5. The optical-mechanical heat dissipation structure of the projector according to claim 1, characterized in that: The water-cooled radiator includes a cooling head and a radiator radiator. One side of the cooling head is in contact with the hot side of the thermoelectric cooling fins, and the other side is equipped with a water tank. The side of the water tank away from the cooling head is equipped with an inlet pipe and an outlet pipe. A radiator fan is installed on the side of the radiator radiator. The bottom of the radiator radiator is connected to the inlet pipe of the water tank through an inlet pipe, and the bottom of the radiator radiator is connected to the outlet pipe of the water tank through an outlet pipe.

6. The optical-mechanical heat dissipation structure of the projector according to claim 5, characterized in that: The outer periphery of the heat dissipation cold head is flush with the outer periphery of the cold head mounting base; a first foam sealing layer is installed between the heat dissipation cold head and the cold head mounting base, the first foam sealing layer is circumferentially arranged, and its outer periphery is flush with the outer periphery of the cold head mounting base.

7. The optical-mechanical heat dissipation structure of the projector according to claim 4, characterized in that: The PCB board also includes a PCB fixing plate for pressing the PCB board; the PCB fixing plate has a hollow frame structure, its outer periphery is flush with the outer periphery of the cold head mounting base, and its inner periphery is tightly assembled with the outer periphery of the heat-conducting cold head; a rubber pad is installed between the PCB fixing plate and the PCB board, and the rubber pad is circumferentially arranged; a second foam sealing layer is installed between the PCB fixing plate and the cold head mounting base, and the second foam sealing layer is circumferentially arranged.

8. The optical engine heat dissipation structure of the projector according to claim 1, characterized in that: The interior of the optical engine body is a closed cavity, which includes a main cavity and a branch cavity. The turbine fan is located in a corner of the main cavity. A heat sink is arranged on the low-pressure side of the turbine fan, and a prism is arranged on the high-pressure side of the turbine fan. The heat sink consists of two parts: a circulation area and a heat dissipation area. The circulation area is located inside the main cavity, and the heat dissipation area is located outside the main cavity. The heat dissipation area is connected to the outside air.

9. The optical-mechanical heat dissipation structure of the projector according to claim 8, characterized in that: The tributary cavity contains a light guide and a color wheel. The tributary cavity has an opening A that connects to the low-pressure side of the turbofan and an opening B that connects to the high-pressure side of the turbofan. Fins are arranged inside the sealed cavity.

10. The optical engine heat dissipation structure of the projector according to claim 1, characterized in that: The optical engine body houses the rear lens array. A fan cavity is located near the rear lens array on the optical engine body, and an axial flow fan is installed inside the fan cavity. The optical engine body has a notch to allow the fan cavity to communicate with the outside air. The axial flow fan introduces external cold air through the notch in the fan cavity and continuously blows cold air to cool the rear lens array. Fins are installed at the rear lens array to absorb the hot air from the rear lens array and cool the entire rear lens array cavity.

Images