Computing device

Abstract

The utility model provides a cold plate and computing equipment, the cold plate comprises a cover plate, a first plate, a second plate and an evaporation structure, the cover plate is mounted on the first plate, the cover plate and the first plate define a first cavity, and the first cavity is used for accommodating a cooling working medium; the second plate is installed on the side, away from the cover plate, of the first plate, a second cavity is defined by the second plate and the first plate, the second cavity is used for containing a phase change medium, and the evaporation structure is arranged on the cavity inner wall face of the second cavity; the outer surface of the second plate comprises a working face which comprises a first face, a second face and a connecting face, the connecting face is connected between the first face and the second face, and the second face protrudes relative to the first face.

Description

[0001] This application claims priority to the application No. 202323267106.1 filed on November 30, 2023, entitled "Cold plate and computing device", the entire contents of which are incorporated herein by reference. TECHNICAL FIELD

[0002] The present application relates to the technical field of electronic equipment, in particular to a cold plate and a computing device. BACKGROUND

[0003] In recent years, with the increase of the power consumption of heat generating devices, air cooling has been unable to meet the heat dissipation requirements. Currently, servers and other computing devices usually use cold plates for liquid cooling of high-power heat generating devices. With the increasing power consumption of heat generating devices, the requirement for the heat dissipation efficiency of the cold plate is becoming higher and higher. Utility model content

[0004] The purpose of the embodiments of the present application is to provide a cold plate and a computing device to solve the technical problem of low heat dissipation efficiency of the existing cold plate.

[0005] In a first aspect, the embodiments of the present application provide a cold plate, which comprises a cover plate, a first plate, a second plate and an evaporation structure. The cover plate is installed on the first plate and forms a first cavity with the first plate. The first cavity is used to accommodate a cooling working medium. The second plate is installed on the side of the first plate away from the cover plate and forms a second cavity with the first plate. The second cavity is used to accommodate a phase change medium. The evaporation structure is arranged on the inner wall surface of the second cavity.

[0006] The outer surface of the second plate comprises a working surface, which comprises a first surface, a second surface and a connecting surface. The connecting surface is connected between the first surface and the second surface. The second surface is convex relative to the first surface.

[0007] Currently, the surface of some heat generating devices is uneven. When the cold plate is used to dissipate heat by contacting the heat generating device, the surface of the cold plate and the heat generating device does not contact sufficiently, which makes it difficult to effectively dissipate heat from the heat generating device, resulting in a decrease in the heat dissipation efficiency of the cold plate. The cold plate provided by the embodiments of the present application forms a convex working surface by setting the second surface convex relative to the first surface, so that the working surface of the cold plate is fitted with the uneven surface of the heat generating device, which helps to improve the heat dissipation efficiency of the cold plate. In addition, the cold plate provided by the embodiments of the present application can be used to dissipate heat from the heat generating device with uneven surface, and can also be used to dissipate heat from the heat generating device with flat surface, which widens the application scenarios of the cold plate.

[0008] In addition, the cold plate provided by the embodiments of the present application sets the second cavity in the cold plate to accommodate the phase change working medium, and uses the phase change process of the phase change working medium to transfer heat, which significantly reduces the thermal resistance of the heat conduction of the cold plate and improves the heat dissipation efficiency of the cold plate.

[0009] In one embodiment, the second surface is one.

[0010] In one embodiment, the second surface is multiple, and the multiple second surfaces are arranged at intervals.

[0011] In the working state, the heat generated by the multiple heat generating devices is transmitted to the working surface of the cold plate through the respective contact surfaces, and the multiple second surfaces of the working surface can be in contact with the contact surfaces of the multiple heat generating devices. The working surface further transmits the heat to the phase change working medium in the second cavity, and then transmits the heat to the first cavity through the vaporization and condensation of the phase change working medium, thereby realizing the simultaneous heat dissipation of the cold plate to the multiple heat generating devices.

[0012] In one embodiment, the multiple second surfaces are flush.

[0013] In one embodiment, there is a height difference between at least two of the multiple second surfaces.

[0014] The embodiments of the present application adjust the height of the second surface protrusion to adapt to various heat generating devices with different sinking depths, so as to maintain the fit between the cold plate and the heat generating device, and to realize the effective heat dissipation of the cold plate to various heat generating devices.

[0015] In one embodiment, the evaporation structure completely covers the inner wall surface of the second cavity.

[0016] In the cold plate provided by the embodiments of the present application, the evaporation structure is arranged in the second cavity, which is beneficial to the evaporation of the working medium and further improves the heat dissipation efficiency of the cold plate.

[0017] In one embodiment, the cold plate further comprises a heat dissipation fin, and the heat dissipation fin is arranged on the surface of the first plate facing the first cavity.

[0018] In one embodiment, the cold plate is provided with a liquid inlet and a liquid outlet, the liquid inlet and the liquid outlet are arranged on the cover plate and penetrate the cover plate along the thickness direction of the cover plate, the liquid inlet and the liquid outlet are both in communication with the first cavity, the heat dissipation fin is multiple, and the multiple heat dissipation fins are arranged at intervals, a channel is formed between two adjacent heat dissipation fins, the channel extends from the liquid inlet to the liquid outlet, and is in communication with the liquid inlet and the liquid outlet.

[0019] In a second aspect, the present application provides a computing device comprising a cold plate and a heat generating device, and the outer surface of the heat generating device is attached to the working surface.

[0020] In one embodiment, the computing device further comprises a circuit board, and the heat generating device comprises a chip, the chip is mounted on the circuit board, and the outer surface of the chip away from the circuit board is attached to the working surface. BRIEF DESCRIPTION OF DRAWINGS

[0021] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a partial structural schematic diagram of the computing device provided in the first embodiment of this application;

[0023] Figure 2 for Figure 1 A schematic diagram of the cross-sectional structure of the computing device shown along the AA direction;

[0024] Figure 3 for Figure 1 A schematic diagram of the cold plate structure in the computing device shown;

[0025] Figure 4 for Figure 3 The diagram shows a cross-sectional structure of the cold plate along the BB surface.

[0026] Figure 5 This is a partial structural diagram of the computing device provided in the second embodiment of this application;

[0027] Figure 6 for Figure 5 A schematic diagram of the exploded structure of the computing device shown.

[0028] Figure 7 This is a partial structural diagram of a computing device provided in the third embodiment of this application;

[0029] Figure 8 for Figure 7 The diagram shows the exploded structure of the computing device. Detailed Implementation

[0030] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0031] Please see Figure 1 and Figure 2 , Figure 1 This is a partial structural schematic diagram of the computing device 1 provided in the first embodiment of this application. Figure 2 for Figure 1 The diagram shows a cross-sectional view of the computing device 1 along the AA direction.

[0032] The computing device 1 can be a server, computer, switch, or other similar device. In this embodiment, a server is used as an example for illustration. For ease of description, the following definitions are provided: Figure 1 In the computing device 1 shown, the width direction of the cold plate 100 is the X-axis direction, the length direction is the Y-axis direction, and the thickness direction is the Z-axis direction. The X-axis direction, Y-axis direction, and Z-axis direction are all perpendicular to each other.

[0033] In this embodiment, computing device 1 includes a chassis ( Figure 1 and Figure 2 (Not shown), circuit board 300, heating element 200, cold plate 100, liquid inlet pipe 400, and liquid outlet pipe 500. Circuit board 300, heating element 200, and cold plate 100 are all mounted inside the chassis. Heating element 200 is mounted on and electrically connected to circuit board 300. Cold plate 100 is mounted on the side of heating element 200 away from circuit board 300, and is in contact with the outer surface of heating element 200, serving to dissipate heat from heating element 200. Liquid inlet pipe 400 and liquid outlet pipe 500 are both connected to the inside of cold plate 100 and are spaced apart from each other. Liquid inlet pipe 400 is used to input coolant into the inside of cold plate 100, and liquid outlet pipe 500 is used to output the cooled coolant after heat absorption from the inside of cold plate 100. For example, the cooling medium can be water, a 25% (v / v) aqueous solution of ethylene glycol, a 25% (v / v) aqueous solution of propylene glycol, tetrafluoroethane, pentafluoropropane, or tetrafluoropropylene, etc.

[0034] Specifically, circuit board 300 can be the motherboard of computing device 1. Heat-generating device 200 can be a chip. Chips include, but are not limited to, CPU (Central Processing Unit) or GPU (Graphics Processing Unit) chips. The outer surface of cold plate 100 includes working surface 121 (see...). Figure 2 The working surface 121 is used to fit against the outer surface of the heat-generating device 200 to dissipate heat from the heat-generating device 200.

[0035] In the working process of the computing device 1, the heat generating device 200 installed on the circuit board 300 generates heat, the outer surface of the heat generating device 200 is attached to the working surface 121 of the cold plate 100, and the heat generated by the heat generating device 200 is transmitted to the inner side of the cold plate 100 through the working surface 121 of the cold plate 100. The cooling working medium enters the inner side of the cold plate 100 from the liquid inlet pipeline 400, absorbs the heat transmitted to the inner side of the cold plate 100, and is output from the liquid outlet pipeline 500 to carry away the heat generated by the heat generating device 200, thereby reducing the surface temperature of the heat generating device 200 and ensuring the use performance of the heat generating device 200, thereby realizing the heat dissipation of the cold plate 100 to the heat generating device 200.

[0036] With reference to Figure 2 , the outer surface of the heat generating device 200 includes a contact surface 210, which is used to attach to the working surface 121 of the cold plate 100 to transmit the heat generated by the heat generating device 200 to the working surface 121 of the cold plate 100, thereby realizing the transmission of the heat generated by the heat generating device 200 to the inner side of the cold plate 100 through the working surface 121 of the cold plate 100. In this embodiment, the contact surface 210 is the outer surface of the heat generating device 200 away from the circuit board 300.

[0037] In this embodiment, the heat generating device 200 is taken as a sunken chip for illustration. Specifically, the contact surface 210 includes a first surface 211, a second surface 212 and a side surface 213. The first surface 211 is arranged around the periphery of the second surface 212, and the side surface 213 is connected between the first surface 211 and the second surface 212. Among them, the second surface 212 is recessed towards the direction of the circuit board 300 relative to the first surface 211, so as to form a sunken chip. It can be understood that in other embodiments, the heat generating device 200 can also be a raised chip, at this time, the second surface 212 in the contact surface 210 of the heat generating device 200 is convex away from the direction of the circuit board 300 relative to the first surface 211. Alternatively, the heat generating device 200 can also be an electronic device with a flat surface, that is, the contact surface 210 of the heat generating device 200 can also be flat, at this time, the plane where the first surface 211 is located and the plane where the second surface 212 is located are located in the same plane.

[0038] Please refer to Figure 3 and Figure 4 , Figure 3 for Figure 1 the structure diagram of the cold plate 100 in the computing device 1 shown in the figure, Figure 4 for Figure 3 the cross-sectional structure diagram of the cold plate 100 along the B-B plane. Among them, Figure 3 the dashed box in

[0039] The cold plate 100 comprises a cover plate 20, a first plate 11, a second plate 12 and a heat dissipation fin 17. The cover plate 20 is mounted on the first plate 11 and forms a first cavity 50 together with the first plate 11. The second plate 12 is mounted on the first plate 11 away from the cover plate 20 and forms a second cavity 60 together with the first plate 11. The cold plate can further comprise an evaporation structure 16, which is located in the second cavity 60 and arranged on the inner wall of the second cavity 60. The heat dissipation fin 17 is located in the first cavity 50 and arranged on the surface of the first plate 11 facing the first cavity 50.

[0040] In the embodiment, the first cavity 50 and the second cavity 60 are arranged apart from each other, and both the first cavity 50 and the second cavity 60 are closed cavities. The first cavity 50 is used for containing a cooling working medium, and the second cavity 60 is used for containing a phase change working medium. The phase change working medium can be water, for example. The second cavity 60 comprises an inner wall and an outer wall, and the inner wall and the outer wall of the second cavity 60 are arranged opposite to each other along the thickness direction of the cavity wall forming the second cavity 60. The "inner wall" of the second cavity 60 refers to the surface of the cavity wall forming the second cavity 60 facing the second cavity 60, and the "outer wall" of the second cavity 60 refers to the surface of the cavity wall forming the second cavity 60 away from the second cavity 60. In the embodiment, the surfaces of the first plate 11 and the second plate 12 facing the second cavity 60 are the inner walls of the second cavity 60. The outer surface of the second plate 12 away from the second cavity 60 is the outer wall of the second cavity 60.

[0041] In the embodiment, the outer wall of the second cavity 60 comprises a working surface 121, i.e. the outer surface of the second plate 12 away from the second cavity 60 comprises the working surface 121. Specifically, the working surface 121 comprises a first surface 122, a connecting surface 124 and a second surface 123. The connecting surface 124 is connected between the first surface 122 and the second surface 123, and the second surface 123 is convex relative to the first surface 122. In the embodiment, the second surface 123 is one, and the first surface 122 is arranged around the entire periphery of the second surface 123. It can be understood that in other embodiments, the first surface 122 can also be arranged around part of the periphery of the second surface 123, and in this case, the first surface 122 does not surround the entire periphery of the second surface 123. It can be understood that the second surface 123 can also be two, three or the like, and the number of the second surface 123 is not limited in the application.

[0042] Referring to Figure 4The height by which the second surface 123 protrudes relative to the first surface 122 is D. In this embodiment, the height D of the second surface 123 protruding relative to the first surface 122 refers to the distance between the second surface 123 and the first surface 122. In this embodiment, the height D of the second surface 123 protruding relative to the first surface 122 is equal to the depth of the indentation of the second surface 212 relative to the first surface 211 in the contact surface 210 of the heating device 200, which is beneficial to achieve a tight fit between the working surface 121 of the cold plate 100 and the contact surface 210 of the heating device 200, thereby improving the heat dissipation effect of the heating device 200 in the cold plate 100.

[0043] For details, please refer to [link / reference]. Figure 4 In this embodiment, the cover plate 20 can be made of a thermally conductive material. For example, the thermally conductive material can be copper or aluminum. The cover plate 20 includes a top wall 21 and a peripheral wall 22, with the peripheral wall 22 surrounding the periphery of the top wall 21. The cover plate 20 is provided with a liquid inlet (…). Figure 4 (not shown) and outlet ( Figure 4 (Not shown). Both the liquid inlet and the liquid outlet are located on the top wall 21 and penetrate the top wall 21 along its thickness direction.

[0044] The first plate 11 is fixedly connected to the peripheral wall 22, and the first plate 11 is disposed opposite to the top wall 21. The first plate 11, the top wall 21, and the peripheral wall 22 enclose a first cavity 50, thereby achieving the enclosure of the first cavity 50 by the first plate 11 and the cover plate 20. Exemplarily, the first plate 11 and the cover plate 20 can be fixed by welding, or they can be connected by threaded fasteners to form a detachable connection, so as to facilitate the inspection and maintenance of the cold plate 100. In other embodiments, the first plate 11 and the cover plate 20 can also be an integral structure, that is, directly manufactured by an integral molding process, such as 3D printing. The first cavity 50 of the integral structure cold plate 100 has good sealing performance.

[0045] The first plate 11 and the second plate 12 can be made of thermally conductive material. For example, the first plate 11 and the second plate 12 can be made of copper. In this embodiment, both the first plate 11 and the second plate 12 are thin-walled components with equal thickness, which facilitates uniform heat transfer and distribution. The second plate 12 and the first plate 11 form the cavity wall of the second cavity 60. The thickness of the cavity wall of the second cavity 60 is W. For example, 1mm ≤ W ≤ 3mm. This ensures that the thickness of the cavity wall of the second cavity 60 is not too thin to guarantee the mechanical strength of the cold plate 100, and also ensures that the thickness of the cavity wall of the second cavity 60 is not too large, which helps to reduce the thermal resistance of the cold plate 100, thereby improving the heat dissipation effect of the cold plate 100.

[0046] The first plate 11 and the second plate 12 are assembled to form the base plate 10. It can be understood that the second cavity 60 is an inner cavity of the base plate 10. In the embodiment, the first plate 11 and the second plate 12 are respectively prepared by a split machining process and then assembled to form the base plate 10. The first plate 11 and the second plate 12 are fixedly connected and sealed to ensure the sealing of the second cavity 60. In other embodiments, the first plate 11 and the second plate 12 can also be a one-piece structure, that is, the base plate 10 is directly prepared by a one-piece forming process, such as a 3D printing process. The second cavity 60 of the one-piece base plate 10 has better sealing performance. In the embodiment, the thickness of the base plate 10 along the Z-axis direction is H. The thickness H of the base plate 10 along the Z-axis direction refers to the distance between the surface of the first plate 11 away from the second cavity 60 and the second surface 123 in the working surface 121. For example, H≤15mm, so as to avoid that the base plate 10 is too thick, thereby reducing the thermal resistance of the base plate 10 and improving the heat dissipation effect of the cold plate 100.

[0047] The evaporation structure 16 is arranged on the surface of the first plate 11 facing the second cavity 60 and / or on the surface of the second plate 12 facing the second cavity 60, so as to be arranged on the inner wall of the second cavity 60. In the embodiment, the "evaporation structure 16" refers to a structure that is beneficial to the evaporation of the phase change working medium. For example, the evaporation structure 16 can be a capillary structure, which is prepared by sintering metal powder on the inner wall of the second cavity 60, or by sintering metal wire mesh on the inner wall of the second cavity 60, or by sintering metal powder and metal wire mesh on the inner wall of the second cavity 60. The metal mesh can be a copper mesh, and the metal powder can be copper powder. For example, the evaporation structure 16 can be a columnar structure, or a structure such as a toothed blade that is beneficial to the evaporation of the working medium.

[0048] In the embodiment, the evaporation structure 16 completely covers the inner wall of the second cavity 60, that is, completely covers the surface of the first plate 11 facing the second cavity 60 and completely covers the surface of the second plate 12 facing the second cavity 60. At this time, the evaporation structure 16 arranged on the inner surface of the first plate 11 and the evaporation structure 16 arranged on the inner surface of the second plate 12 enclose the evaporation structure 16 covering the entire inner wall of the second cavity 60, so as to ensure the stability of the return flow of the phase change working medium. It can be understood that in other embodiments, the evaporation structure 16 can also partially cover the inner wall of the second cavity 60, for example, only cover the surface of the first plate 11 facing the second cavity 60, or only cover the surface of the second plate 12 facing the second cavity 60.

[0049] The plurality of fins 17 are arranged on the surface of the first plate 11 facing the first cavity 50 and are spaced apart from each other along the X-axis direction. In the embodiment, the fins 17 are welded to the surface of the first plate 11 facing the first cavity 50. It can be understood that in other embodiments, the fins 17 can also be integrally formed with the first plate 11. In the embodiment, the surface of each fin 17 away from the first plate 11 is spaced apart from the top wall 21 of the cover plate 20.

[0050] In the embodiment, each fin 17 is in the shape of a rectangular sheet. In the embodiment, the length direction of each fin 17 is the Y-axis direction, the thickness direction is the X-axis direction, and the height direction is the Z-axis direction. For example, the thickness of each fin 17 along the X-axis direction is less than or equal to 1 mm. The height of the fin 17 along the Z-axis direction is less than or equal to 5 mm. Two adjacent fins 17 are spaced apart to form a channel 51 for flowing the cooling medium. In the embodiment, the channel 51 extends from the inlet to the outlet and communicates with the inlet and the outlet. For example, the distance between two adjacent fins 17 is less than 1 mm, that is, the width of the channel is less than 1 mm, which is beneficial to increase the contact area between the cooling medium and the fin 17, so as to facilitate the heat generated on the fin 17 to be fully conducted to the cooling medium flowing in the channel, thereby improving the heat dissipation efficiency of the cold plate 100.

[0051] In combination with Figure 1 and Figure 2 , in the assembled computing device 1, the inlet pipe 400 communicates with the inlet, the outlet pipe 500 communicates with the outlet, the working surface 121 of the cold plate 100 is attached to the contact surface 210 of the heat generating device 200, and the second cavity 60 of the cold plate 100 is filled with the phase change working medium. Among them, the first surface 122 in the working surface 121 of the cold plate 100 is attached to the first surface 211 in the contact surface 210 of the heat generating device 200, the second surface 123 is attached to the second surface 212 in the contact surface 210 of the heat generating device 200, and the connecting surface 124 is attached to the side surface 213 in the contact surface 210 of the heat generating device 200, so as to realize the complete attachment of the working surface 121 of the cold plate 100 and the contact surface 210 of the heat generating device 200, thereby improving the heat dissipation effect of the cold plate 100 on the heat generating device 200. It can be understood that in other embodiments, the connecting surface 124 in the working surface 121 can also be spaced apart and opposite to the side surface 213 in the contact surface 210, so as to realize the partial attachment of the working surface 121 of the cold plate 100 and the contact surface 210 of the heat generating device 200. It can be understood that when the outer surface of the heat generating device 200 is flat, that is, the contact surface 210 of the heat generating device 200 is flat, the second surface 123 in the working surface 121 of the cold plate 100 can be attached to the flat contact surface 210 of the heat generating device 200, so as to realize the heat dissipation of the cold plate 100 on the heat generating device 200.

[0052] It can be understood that in other embodiments, the contact surface 210 of the heat generating device 200 and the working surface 121 of the cold plate 100 can also be bonded by a heat-conducting adhesive to maintain stable contact between the cold plate 100 and the heat generating device 200, and the heat-conducting adhesive can also ensure that heat is sufficiently transferred from the contact surface 210 of the heat generating device 200 to the working surface 121 of the cold plate 100, thereby facilitating the heat dissipation effect of the cold plate 100.

[0053] During operation of the computing device 1, the cooling medium is input into the first cavity 50 of the cold plate 100 through the inlet port via the inlet pipe 400, and flows through the channels formed between adjacent two fins 17, the gaps between the fins and the peripheral wall, and the gaps between the fins and the top wall, and then is output through the outlet port. The heat generating device 200 generates heat during operation, and the heat is transferred from the contact surface 210 of the heat generating device 200 to the working surface 121 of the cold plate 100, and then is transferred to the second cavity 60 via the working surface 121. The phase change medium in the second cavity 60 absorbs heat and changes phase, specifically, the phase change medium absorbs heat and vaporizes from liquid to gas, and the gaseous phase change medium diffuses in the second cavity 60. During the vaporization process, the phase change medium absorbs a large amount of heat to take away the heat transferred to the working surface 121 of the cold plate 100. When the gaseous phase change medium carrying a large amount of heat contacts the first plate 11 which is at a low temperature and far away from the working surface 121, the gaseous phase change medium quickly condenses to form liquid and releases a large amount of condensation latent heat to transfer heat to the first plate 11.

[0054] During the phase change of the phase change medium, the liquid phase change medium continuously absorbs heat and vaporizes, and the liquid phase change medium condensed on the first plate 11 continuously increases. By providing the evaporation structure 16 on the inner wall surface of the second cavity 60, the evaporation structure 16 can suck the liquid phase change medium condensed on the first plate 11 which is far away from the working surface 121 into the area close to the working surface 121 of the second cavity 60, such as the surface of the second plate 12 facing the second cavity 60, to supplement the liquid phase change medium which vaporizes. Then, the liquid phase change medium close to the working surface 121 vaporizes to gaseous phase change medium after absorbing heat from the heat generating device 200, and evaporates to the first plate 11 to release heat and condense to form liquid phase change medium again. The liquid phase change medium suspended on the first plate 11 quickly flows back to the area close to the working surface 121 through the evaporation structure 16 to form a cycle, thereby realizing the cycle of phase change heat transfer of the phase change medium.

[0055] The heat transferred to the first plate 11 is conducted to the fins 17, and the fins 17 contact the cooling medium flowing in the first cavity 50 to transfer heat to the cooling medium. The cooling medium after absorbing heat is output through the outlet port and the outlet pipe 500.

[0056] In the computing device 1 provided by the embodiment of the present application, the second surface 123 is convex relative to the first surface 122 in the working surface 121 of the cold plate 100, so that the second surface 123 and the first surface 122 can be respectively attached to the uneven outer surface of the heat generating device 200, which is conducive to increasing the contact area of the working surface 121 of the cold plate 100 and the contact surface 210 of the heat generating device 200, so that the heat generated by the heat generating device 200 can be more fully conducted to the cold plate 100. On the one hand, the cold plate 100 is suitable for dissipating heat for the heat generating device 200 with uneven surface, such as the sunken chip, which solves the problem that the heat generated by the sunken chip cannot be fully transferred to the cold plate 100 due to the uneven surface, thereby causing the low heat dissipation efficiency of the cold plate 100. On the other hand, the cold plate 100 can also be applied to dissipate heat for the heat generating device 200 with flat surface, which widens the application scenarios of the cold plate 100.

[0057] In addition, the working surface 121 of the cold plate 100 needs to be attached to the uneven outer surface of the heat generating device 200 to transfer heat, which may cause the cold plate 100 to be too thick, and the heat resistance of the cold plate 100 may be increased when only using the heat-conducting material to transfer heat, thereby reducing the heat dissipation efficiency of the cold plate 100 for the heat generating device 200. In the cold plate 100 provided by the embodiment of the present application, the second cavity 60 is arranged in the cold plate 100, and the phase change working medium is arranged in the second cavity 60 when the cold plate 100 is used, so that the heat absorbed from the working surface 121 is transferred to the first plate 11 by using the two-phase change process of the phase change working medium, thereby achieving high heat conduction effect, significantly reducing the heat resistance of the heat conduction of the cold plate 100, and improving the heat dissipation efficiency of the cold plate 100. At the same time, since the liquid phase change working medium is vaporized to form gaseous phase change working medium, the gaseous phase change working medium can be uniformly diffused in the second cavity 60, the gaseous phase change working medium is uniformly distributed on the surface of the first plate 11, and fully contacts the first plate 11 and fully releases the latent heat of condensation. Thus, after the heat exchange between the first plate 11 and the gaseous phase change working medium, the heat is uniformly distributed on the entire first plate 11, so that the heat can be uniformly conducted to the heat dissipation fins 17, that is, the heat is uniformly distributed on the plurality of heat dissipation fins 17, which ensures that the plurality of heat dissipation fins 17 all participate in the heat dissipation process, thereby improving the heat dissipation efficiency of the heat dissipation fins 17 in contact with the cooling working medium. In the embodiment, the cold plate 100 can achieve a temperature gain of 6 degrees Celsius by using phase change heat transfer, that is, the temperature of the heat generating device 200 can be reduced by 6 degrees Celsius during work.

[0058] In addition, in the cold plate 100 provided by the embodiment of the present application, the evaporation structure 16 is arranged in the second cavity 60, so that the suspended liquid phase change working medium condensed on the first plate 11 is quickly absorbed into the area close to the working surface 121 of the cavity inner wall surface of the second cavity 60 to supplement the liquid phase change working medium reduced by vaporization, complete the cycle of phase change heat transfer, provide a path and capillary driving force for the return flow of the liquid phase change working medium, and further improve the heat dissipation efficiency of the cold plate 100.

[0059] Referring to Figure 5 and Figure 6 , Figure 5 a partial structural diagram of a computing device 1 provided by a second embodiment of the present application, Figure 6 for Figure 5 an exploded structural diagram of the computing device 1.

[0060] The computing device 1 of the present embodiment differs from the computing device 1 of the first embodiment in that the cold plate 100 of the computing device 1 of the second embodiment has multiple second faces 123 in the working face, and the heat generating device 200 has multiple heat generating devices.

[0061] Specifically, in the present embodiment, the working face 121 of the cold plate 100 includes a first face 122, multiple second faces 123, and multiple connecting faces 124. Each connecting face 124 is arranged between the first face 122 and one of the multiple second faces 123. In the present embodiment, the multiple second faces 123 are three in number, but in other embodiments, the number of the multiple second faces 123 can also be two or four, and the present application does not limit the specific number of the multiple second faces 123.

[0062] In the present embodiment, the multiple second faces 123 are flush. Here, the "multiple second faces 123 are flush" means that the planes in which each of the multiple second faces 123 lies are substantially in the same plane. At this time, there is no height difference between the multiple second faces 123. In the present embodiment, the first face 122 is a plane, and the height D by which each of the multiple second faces 123 protrudes relative to the first face 122 is equal, so as to achieve the multiple second faces 123 being flush. It can be understood that in other embodiments, the first face 122 can also be a non-planar surface such as a circular arc surface or a stepped surface, and at this time, the height by which each of the multiple second faces 123 protrudes relative to the first face 122 is not completely equal, and the multiple second faces 123 are substantially flush.

[0063] The multiple heat generating devices 200 are all mounted on the same side of the circuit board 300 and are spaced apart from each other. In the present embodiment, the multiple heat generating devices 200 are all identical, and the height of the first surface 211 of the contact face 210 of each heat generating device 200 from the surface of the circuit board 300 is equal, and the depth of the second surface 212 is equal. The depth of the second surface 212 is the distance from the second surface 212 to the first surface 211. The first surface 211 of the contact face 210 of each heat generating device 200 is attached to the first face 122 of the working face 121 of the cold plate 100, and the second surface 212 of the contact face 210 of each heat generating device 200 is attached to the second face 123 of the working face 121 of the cold plate 100, so as to increase the contact area between each heat generating device 200 and the cold plate 100.

[0064] In the working state, the heat generated by the plurality of heat generating devices 200 is transmitted to the working surface 121 of the cold plate through the respective contact surfaces 210, and is further transmitted to the phase change working medium in the second cavity 60, and then is transmitted to the first plate 11 and the heat dissipation fins 17 through the vaporization and condensation of the phase change working medium, so as to realize the simultaneous heat dissipation of the cold plate 100 to the plurality of heat generating devices 200. Moreover, the phase change working medium after vaporization can rapidly spread in the second cavity 60 and realize sufficient heat exchange with the first plate 11, so that the cold plate 100 provided in the embodiment can realize uniform distribution of heat on the heat dissipation fins 17, which is beneficial to improving the efficiency of liquid cooling circulation heat dissipation.

[0065] It can be understood that the cold plate 100 provided in the embodiment can also be applicable to heat dissipation of the heat generating device 200 with a flat surface. Specifically, in other embodiments, the contact surface 210 of the heat generating device 200 can be a plane, that is, the heat generating device 200 is an electronic device with a flat surface. At this time, the area of the second surface 123 of the working surface 121 of the cold plate 100 can be greater than or equal to the area of the contact surface 210 of the heat generating device 200. When the cold plate 100 works, the second surface 123 of the working surface 121 of the cold plate 100 is attached to the contact surface 210 of the heat generating device 200 and completely covers the contact surface 210 of the heat generating device 200, so as to realize heat dissipation of the cold plate 100 to the heat generating device 200.

[0066] Please refer to Figure 7 and Figure 8 , Figure 7 the partial structure diagram of the computing device 1 provided in the third embodiment of the present application, Figure 8 is Figure 7 the exploded structure diagram of the computing device 1.

[0067] The computing device 1 of the embodiment is different from the computing device 1 of the second embodiment in that in the computing device 1 of the second embodiment, there is a height difference between at least two of the plurality of second surfaces 123 of the cold plate 100. Wherein, the height difference between the at least two second surfaces 123 means that the planes on which the at least two second surfaces 123 are located are in different planes.

[0068] In the embodiment, the first surface 122 is a plane. In other embodiments, the first surface 122 can also be a non-plane such as a circular arc surface, a stepped surface, etc., which is not limited in the present application.

[0069] The plurality of second surfaces 123 includes a first sub-surface 141, a second sub-surface 142, and a third sub-surface 143. The first sub-surface 141, the second sub-surface 142, and the third sub-surface 143 are sequentially and spaced apart along the width direction of the cold plate 100. In this embodiment, the first sub-surface 141, the second sub-surface 142, and the third sub-surface 143 all have a height difference with respect to each other. Specifically, the first sub-surface 141 is convex with respect to the second sub-surface 142, and the height difference between the first sub-surface 141 and the second sub-surface 142 is D1. The second sub-surface 142 is convex with respect to the third sub-surface 143, and the height difference between the second sub-surface 142 and the third sub-surface 143 is D2.

[0070] In this embodiment, the plurality of heat generating devices 200 have different depths of the second surfaces 212. Specifically, the plurality of heat generating devices 200 includes a first heat generating device 220, a second heat generating device 230, and a third heat generating device 240. The depth of the second surface 212 of the first heat generating device 220 is greater than the depth of the second surface 212 of the second heat generating device 230, and the depth of the second surface 212 of the second heat generating device 230 is greater than the depth of the second surface 212 of the third heat generating device 240.

[0071] The cold plate 100 covers the plurality of heat generating devices 200, and the plurality of second surfaces 123 of the cold plate 100 respectively abut the second surfaces 212 of the plurality of heat generating devices 200. Each second surface 123 abuts the second surface 212 of one heat generating device 200, and the first surface 122 of the cold plate 100 abuts the first surface 211 of the plurality of heat generating devices 200. Therefore, the height of the convex second surface 123 should be the same as the depth of the concave second surface 212 of the corresponding heat generating device 200 (allowing a certain range of error). It can be understood that the height of the convex second surface 123 of the cold plate 100 can be adjusted according to the depth of the concave second surface 212 of the corresponding heat generating device 200, so that each second surface 123 abuts the second surface 212 of one heat generating device 200. In this embodiment, the second surface 212 in the contact surface 210 of the first heat generating device 220 abuts the first sub-surface 141 of the working surface 121 of the cold plate 100, the second surface 212 in the contact surface 210 of the second heat generating device 230 abuts the second sub-surface 142 of the working surface 121 of the cold plate 100, and the second surface 212 in the contact surface 210 of the third heat generating device 240 abuts the third sub-surface 143 of the working surface 121 of the cold plate 100. The height of the first sub-surface 141 is the same as the depth of the second surface 212 of the first heat generating device 220, the height of the second sub-surface 142 is the same as the depth of the second surface 212 of the second heat generating device 230, and the height of the third sub-surface 143 is the same as the depth of the second surface 212 of the third heat generating device 240 (allowing a certain range of error).

[0072] In this embodiment, the height of the second surface 123 in the working surface 121 is adjusted to adapt to various heat generating devices 200 with different sinking depths, so as to keep the cold plate 100 and the heat generating device 200 in close contact, and achieve effective heat dissipation of various heat generating devices 200.

[0073] In this embodiment, there is a height difference between any two of the plurality of second surfaces 123. It can be understood that in other embodiments, at least two of the plurality of second surfaces 123 can be flush, and there is a height difference between the at least two second surfaces 123. For example, the first sub-surface 141 and the second sub-surface 142 in the plurality of second surfaces 123 can be flush, and both have a height difference with the third sub-surface 143; or the first sub-surface 141 and the third sub-surface 143 are flush, and both have a height difference with the second surface 123; or the second sub-surface 142 and the third sub-surface 143 are flush, and both have a height difference with the first sub-surface 141.

[0074] The above only discloses the preferred embodiments of the present application, of course, cannot limit the scope of the present application, those skilled in the art can understand that the implementation of all or part of the above-mentioned processes, and the equivalent changes made according to the claims of the present application, still belong to the scope covered by the present application.

Claims

1. A computing device, comprising: The cold plate comprises a cover plate, a first plate and a second plate, the cover plate is installed on the first plate and forms a first cavity with the first plate, the first cavity is used for containing a cooling working medium; the second plate is installed on the first plate away from the cover plate and forms a second cavity with the first plate, the second cavity is used for containing a phase change working medium; An outer surface of the second plate comprises a first surface and a second surface, the second surface is convex relative to the first surface; The heating device comprises a first surface and a second surface, the first surface is attached to the first surface, and the second surface is attached to the second surface.

2. The computing device of claim 1, wherein, The second surface has a plurality of second surfaces arranged at intervals; the heating device has a plurality of heating devices arranged side by side; the second surface of each heating device is attached to the second surface, and the first surface of each heating device is located between two adjacent second surfaces.

3. The computing device of claim 2, wherein, The heating device is a graphics processing unit (GPU).

4. The computing device of claim 2, wherein, The plurality of second surfaces are flush.

5. The computing device of claim 2, wherein, At least two of the plurality of second surfaces have a height difference.

6. The computing device of any of claims 1 to 5, wherein, The cold plate further comprises an evaporation structure covering the inner wall surface of the second cavity.

7. The computing device of claim 6, wherein, The cold plate further comprises a heat sink arranged on the surface of the first plate facing the first cavity.

8. The computing device of claim 7, wherein, The cold plate is provided with an inlet and an outlet, the inlet and the outlet are arranged on the cover plate and penetrate the cover plate along the thickness direction of the cover plate, the inlet and the outlet are in communication with the first cavity, the heat sink has a plurality of heat sinks arranged at intervals, and adjacent two heat sinks form a channel extending from the inlet to the outlet and in communication with the inlet and the outlet.

9. The computing device of claim 1, wherein, The cooling working medium is any one of water, a 25% volume fraction ethylene glycol aqueous solution, a 25% volume fraction propylene glycol aqueous solution, tetrafluoroethane, pentafluoropropane or tetrafluoropropylene, and the phase change working medium is water.

10. The computing device of claim 1, wherein, The computing device further comprises a case, a circuit board, an inlet pipe and an outlet pipe, the circuit board, the heating device and the cold plate are installed on the inner side of the case, wherein the heating device is installed on the circuit board and electrically connected to the circuit board, the cold plate is installed on the side of the heating device away from the circuit board and attached to the outer surface of the heating device for heat dissipation, the inlet pipe and the outlet pipe are in communication with the inner side of the cold plate and arranged at intervals, wherein the inlet pipe is used for inputting the cooling working medium into the inner side of the cold plate, and the outlet pipe is used for outputting the cooling working medium after absorbing heat from the inner side of the cold plate; An outer wall surface of the second cavity comprises a working surface, the working surface comprises the first surface, a connecting surface and the second surface, the connecting surface is connected between the first surface and the second surface, the second surface is convex relative to the first surface, the first surface is one, and the first surface is arranged around the entire circumference of the second surface. The outer surface of the heat generating device comprises a contact surface, the contact surface comprises the first surface, the second surface and a side surface, the first surface is arranged around the periphery of the second surface, and the side surface is connected between the first surface and the second surface; The cold plate further comprises an evaporation structure, the evaporation structure is located in the second cavity and arranged on the inner wall surface of the second cavity; and the evaporation structure covers the inner wall surface of the second cavity.

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