Computer chip water cooling device

The clamping structure, which uses a limiting post and a limiting hole, solves the problem of cumbersome disassembly of heat exchange fans in existing technologies, enabling convenient installation and disassembly and improving maintenance efficiency.

CN223566106UActive Publication Date: 2025-11-18PUTIAN UNIV
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Patent Information

Application Number
CN202423063106.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-12
Publication Date
2025-11-18
Estimated Expiration
2034-12-12

AI Technical Summary

Technical Problem

The disassembly and maintenance process of heat exchange fans in existing computer chip water cooling devices is cumbersome and time-consuming, and there is a need to simplify the disassembly method.

Method used

The heat exchange fan assembly is fixed and disassembled by using a clamping structure with a limiting post and a limiting hole. The clamping mechanism is adapted to the clamping cavity to reduce the use of screws.

Benefits of technology

It enables quick installation and easy disassembly of the heat exchanger fan assembly, simplifies the maintenance process, and improves maintenance efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the field of chip heat dissipation, in particular to a computer chip water cooling device which is characterized in that a water cooling device body is provided with a cooling assembly, the cooling assembly is provided with a plurality of heat exchange fan assemblies, and the top of the cooling assembly is fixedly and vertically provided with a plurality of fixing columns upwards; fixing column cavities are formed in the positions, corresponding to the fixing columns, of the heat exchange fan assembly in a matched mode. Clamping cavities are inwards formed in the fixing columns correspondingly, rotating shafts are rotationally arranged at the positions, located on one sides of the fixing columns, of the tops of the heat exchange fan assemblies correspondingly, clamping pieces matched with the clamping cavities are fixedly arranged on the rotating shafts correspondingly, and top covers are movably arranged at the tops of the fixing columns correspondingly. According to the heat exchange fan assembly, the clamping piece can be fixed through adaptive clamping between the limiting column and the limiting hole, the heat exchange fan assembly can be fixedly installed through adaptive clamping between the clamping piece and the clamping cavity, the assembly mode of the heat exchange fan assembly is rapid and convenient, a large number of screws do not need to be used, and the assembly efficiency is improved. And a user can conveniently disassemble and maintain the heat exchange fan assembly in the later period.
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Description

TECHNICAL FIELD

[0001] The utility model relates to chip heat dissipation technical field especially, relates to a computer chip water cooling device. BACKGROUND

[0002] The computer chip water cooling device is a kind of high-efficiency heat dissipation system, and is particularly suitable for computer equipment needing high performance and long-time operation, such as high-end game computer, workstation and data center server etc.

[0003] The heat exchange fan on the traditional water cooling device on the market is usually fixedly installed on the cold row by a large number of screws, and when the fan needs to be disassembled or repaired, a large number of screws make the disassembly process cumbersome and time-consuming.Therefore, a water cooling device facilitating disassembly and repair of the heat exchange fan is urgently needed. UTILITY MODEL CONTENT

[0004] The utility model aims at solving the shortcomings in the prior art and provides a computer chip water cooling device.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme:

[0006] A computer chip water cooling device, comprising a water cooling device body, a cold row assembly is arranged on the water cooling device body, a plurality of heat exchange fan assemblies are installed on the cold row assembly, a plurality of fixed columns are vertically installed on the top of the cold row assembly upwards, and a fixed column cavity is adapted and opened on the heat exchange fan assembly corresponding to the fixed column; a clamping cavity is inwardly opened on the fixed column, a rotating shaft is rotationally arranged on one side of the top of the heat exchange fan assembly, a clamping piece adapted to the clamping cavity is fixedly arranged on the rotating shaft, and a top cover is movably arranged on the top of the fixed column.

[0007] In addition, preferably, a spring cavity is downwardly opened on the top of the fixed column, a through hole is downwardly opened on the bottom of the spring cavity, and the spring cavity is communicated with the clamping cavity through the through hole.

[0008] In addition, preferably, a spring is installed in the spring cavity, and the other end of the spring is connected with the top cover.

[0009] In addition, preferably, a limiting column is fixedly arranged on the bottom of the top cover, and the limiting column sequentially passes through the spring and the through hole.

[0010] In addition, preferably, a limiting hole is opened on the clamping piece, and the limiting hole is adapted to the limiting column.

[0011] In addition, preferably, when the clamping piece is adapted and clamped in the clamping cavity, the limiting hole is aligned with the through hole.

[0012] The utility model discloses a beneficial effect is: through the adaptation of the card between the limiting post and the limiting hole can realize the fixed of card piece, and through the adaptation of the card between the card cavity can realize the fixed installation of heat exchange fan subassembly to this kind of heat exchange fan subassembly's assembly mode is quick and convenient, need not use a large number of screw, is convenient for the user to dismantle maintenance heat exchange fan subassembly in later period. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 The utility model discloses a computer chip water cooling device's structure schematic diagram is provided;

[0014] Figure 2 The utility model discloses a computer chip water cooling device's structure schematic diagram of cold row subassembly and fixed column is provided;

[0015] Figure 3 The utility model discloses a computer chip water cooling device's structure schematic diagram of heat exchange fan subassembly and fixed column is provided;

[0016] Figure 4 The utility model discloses a computer chip water cooling device's structure schematic diagram of fixed column hidden in Figure 3

[0017] Figure 5 The utility model discloses a computer chip water cooling device's structure schematic diagram of card piece is provided;

[0018] Figure 6 The utility model discloses a computer chip water cooling device's structure schematic diagram of fixed column and top cap is provided;

[0019] Figure 7 The utility model discloses a computer chip water cooling device's structure schematic diagram of explosion in Figure 6

[0020] In the drawing: 1 water cooling device body, 11 cold row subassembly, 2 heat exchange fan subassembly, 21 fixed column cavity, 3 fixed column, 31 card cavity, 32 spring cavity, 33 through -hole, 4 top cap, 41 limiting post, 42 spring, 5 rotating shaft, 51 card piece, 52 limiting hole. DETAILED DESCRIPTION

[0021] The technical scheme in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model, and apparently, the described embodiments only are a part of the embodiments of the utility model, not all the embodiments.

[0022] Refer to Figures 1-7 ​​The utility model provides a computer chip water cooling device, including water cooling device body 1, be provided with cold row subassembly 11 on water cooling device body 1, install a plurality of heat exchange fan subassembly 2 on cold row subassembly 11, the top of cold row subassembly 11 is fixed vertically and is installed with a plurality of fixed column 3 upwards, and heat exchange fan subassembly 2 on corresponding fixed column 3 all adapt to open fixed column cavity 21. The fixed column 3 all are inwards opened and are equipped with the card cavity 31, the top of heat exchange fan subassembly 2 is located in the one side of fixed column 3 all are rotatably arranged with the pivot 5, the pivot 5 all are fixedly provided with the card piece 51 with the card cavity 31 adaptation, and the top of fixed column 3 all movably sets up the top cap 4.

[0023] Wherein, water cooling plate is installed on computer chip, water cooling device body 1 passes through water cooling plate and conduction computer chip's heat to water cooling liquid, water pump drives water cooling liquid to circulate in system, with heat to cold row subassembly 11 place, cold row subassembly 11 then through its internal pipe structure increases the heat dissipation area, simultaneously through heat exchange fan subassembly 2 generates airflow, accelerates the emission of heat on cold row to air, realizes heat dissipation cooling, then cooled water cooling liquid is circulated back to water cooling device body 1 again, to reach the purpose of computer chip heat exchange. It is worth noting that the specific structure of water cooling device body 1, cold row subassembly 11 and heat exchange fan subassembly 2 and its heat dissipation mode are all prior art, therefore do not add more.

[0024] Wherein, the top of fixed column 3 all is downwards opened and is equipped with spring cavity 32, the bottom of spring cavity 32 all is downwards opened and is equipped with through -hole 33, and spring cavity 32 passes through through -hole 33 and is communicated with card cavity 31.

[0025] Wherein, spring 42 is installed in spring cavity 32, and the other end of spring 42 is connected with top cap 4. Through the setting of spring 42, top cap 4 can be pulled down.

[0026] Wherein, the bottom of top cap 4 is fixedly provided with limiting column 41, and limiting column 41 passes through spring 42 and through -hole 33 in turn. Limiting hole 52 is formed in card piece 51, and limiting hole 52 is matched with limiting column 41. Through the matching of limiting column 41 and limiting hole 52, card piece 51 can be fixed.

[0027] Wherein, when card piece 51 is matched and set in card cavity 31, limiting hole 52 is aligned with through -hole 33. In this way, limiting column 41 can be inserted into limiting hole 52.

[0028] In the embodiment, the interaction between water cooling device body 1, cold row subassembly 11 and heat exchange fan subassembly 2 can realize the heat dissipation of computer chip, and the specific heat dissipation principle is prior art, therefore do not add more.

[0029] Further, when the user installs the heat exchange fan assembly 2, only need to adapt the fixing column 3 on the cold row assembly 11 to be set in the fixing column cavity 21 in the heat exchange fan assembly 2. Then the user pulls the top cover 4 on the top of the fixing column 3 upwards in turn, at this time the limiting column 41 follows the top cover 4 and moves upwards synchronously, and the spring 42 is stretched. Then the user drives the clamping piece 51 to rotate synchronously through the rotating shaft 5, when the clamping piece 51 rotates to the clamping cavity 31 on the fixing column 3, the limiting hole 52 on the clamping piece 51 is adapted and aligned between the through hole 33. At this time the user only needs to release the top cover 4, and the top cover 4 and the limiting column 41 can be automatically moved downwards and reset through the elastic force of the spring 42, so as to drive the limiting column 41 to pass through the through hole 33 and be clamped in the limiting hole 52, so as to realize the fixation of the clamping piece 51. And through the adaptive clamping between the clamping piece 51 and the clamping cavity 31, the fixation of the heat exchange fan assembly 2 can be realized.

[0030] Further, when the user needs to disassemble the heat exchange fan assembly 2, only need to pull the top cover 4 upwards, so that the limiting column 41 is separated from the limiting hole 52. Then the user can rotate the clamping piece 51, when all the clamping pieces 51 are rotated out of the clamping cavity 31, the heat exchange fan assembly 2 can be disassembled.

[0031] Further, the clamping piece 51 and the clamping cavity 31 are adapted, and the rotating angle of the clamping piece 51 in the clamping cavity 31 is adapted to reserve a cavity, so that the clamping piece 51 does not hinder when rotating into the clamping cavity 31.

[0032] In the utility model, the fixation of the clamping piece 51 can be realized through the adaptive clamping between the limiting column 41 and the limiting hole 52, and the fixation of the heat exchange fan assembly 2 can be realized through the adaptive clamping between the clamping piece 51 and the clamping cavity 31. The assembly mode of the heat exchange fan assembly 2 is quick and convenient, without using a large number of screws, and the user can disassemble and maintain the heat exchange fan assembly 2 in the later period.

[0033] The above is only the preferred specific embodiment of the utility model, but the protection scope of the utility model is not limited to this, any skilled person in the art can make equivalent replacement or change according to the technical scheme and the utility model concept of the utility model within the technical range disclosed by the utility model, which should be covered in the protection scope of the utility model.

Claims

1. A water-cooling device for computer chips, comprising a water-cooling device body (1), characterized in that, The water cooling device body (1) is provided with a cooling radiator assembly (11), and multiple heat exchange fan assemblies (2) are installed on the cooling radiator assembly (11). Multiple fixing columns (3) are fixedly installed vertically on the top of the cooling radiator assembly (11), and fixing column cavities (21) are adapted to be opened on the heat exchange fan assembly (2) corresponding to the fixing columns (3). Each of the fixed columns (3) has an inwardly opening cavity (31). The top of the heat exchange fan assembly (2) is rotatably provided on one side of the fixed column (3). Each of the rotating shafts (5) has a locking piece (51) that is compatible with the cavity (31) fixedly provided on the rotating shaft (5). Each of the fixed columns (3) has a top cover (4) movably provided on the top.

2. The computer chip water-cooling device according to claim 1, characterized in that, The top of each fixed column (3) is provided with a spring cavity (32) facing downwards, and the bottom of each spring cavity (32) is provided with a through hole (33) facing downwards. The spring cavity (32) is connected to the card cavity (31) through the through hole (33).

3. A computer chip water-cooling device according to claim 2, characterized in that, Each spring cavity (32) is equipped with a spring (42), and the other end of the spring (42) is connected to the top cover (4).

4. A computer chip water-cooling device according to claim 3, characterized in that, The bottom of each of the top covers (4) is fixedly provided with a limiting post (41), and the limiting post (41) passes through the spring (42) and the through hole (33) in sequence.

5. A computer chip water-cooling device according to claim 4, characterized in that, Each of the card components (51) has a limiting hole (52), and the limiting hole (52) is adapted to the limiting post (41).

6. A computer chip water-cooling device according to claim 5, characterized in that, When the card (51) is fitted into the card cavity (31), the limiting hole (52) is aligned with the through hole (33).