ACF conductive adhesive film structure

Abstract

The utility model relates to the technical field of conductive adhesive films, in particular to an ACF (anisotropic conductive film) conductive adhesive film structure, which comprises an insulating adhesive layer, an upper conductive layer, a lower conductive layer and a base material, the insulating glue layer is arranged at the top of the upper conducting layer, a plurality of micropores are formed in the bottom of the upper conducting layer, a plurality of micropores are formed in the top of the lower conducting layer, the lower conducting layer is arranged at the bottom of the upper conducting layer, conducting particles are arranged in the micropores between the upper conducting layer and the lower conducting layer, the base material is arranged at the bottom of the lower conducting layer, and the copper-gold foil surface layer is arranged at the top of the base material. The copper-gold foil surface layer is connected with the bottom of the lower conductive layer. According to the utility model, through the micropore design, the accuracy of the scattering position of the conductive particles is improved, the conductive particles can form effective electrical conduction between an electronic component and a substrate after hot pressing is completed, the signal transmission efficiency is improved, the signal loss and noise interference are reduced, and the stability and reliability of a circuit are ensured.

Description

TECHNICAL FIELD

[0001] The utility model relates to conductive glue film technical field, specifically a kind of ACF conductive glue film structure. BACKGROUND

[0002] ACF conductive glue film is a kind of material widely used in electronic packaging field, its characteristics are good conductivity in vertical direction, while keeping insulating in horizontal direction. ACF conductive glue film is mainly composed of insulating glue layer, upper conductive layer, lower conductive layer and conductive particles located therein. These conductive particles play a bridge role in the process of hot pressing, connect electronic components and substrate, realize the transmission of electrical signal.

[0003] In the current ACF conductive glue film technology, conductive particles are mostly gold-plated plastic balls. The core of this conductive particle is plastic material, and the outer layer is plated with a layer of metal to provide conductivity. In the hot pressing process of ACF conductive glue film, the conductive particles are subjected to pressure, and the metal plating layer on the outer layer comes into contact with the upper and lower conductive layers, thereby realizing electrical conduction. This design takes advantage of the good conductivity of metal and the elasticity of plastic balls, so that ACF conductive glue film can ensure a certain flexibility while realizing effective electrical connection.

[0004] However, since the distribution of conductive particles in ACF conductive glue film is random, the position of conductive particles is difficult to control accurately during hot pressing. This leads to the fact that after pressing, the conductive particles may not accurately form effective electrical conduction between electronic components and substrate. SUMMARY

[0005] The utility model aims at at least one of the technical problems existing in the prior art. To this end, the utility model provides an ACF conductive glue film structure, which improves the accuracy of the position of conductive particles scattered by designing micropores, ensures that the conductive particles can form effective electrical conduction between electronic components and substrate after hot pressing, improves the transmission efficiency of signals, reduces signal loss and noise interference, and thus ensures the stability and reliability of the circuit.

[0006] To achieve the above-mentioned purpose, according to the first aspect of the utility model, an ACF conductive glue film structure is provided, which comprises an insulating glue layer, an upper conductive layer, a lower conductive layer and a substrate. The insulating glue layer is arranged on the top of the upper conductive layer, the bottom of the upper conductive layer is provided with a plurality of micropores, the top of the lower conductive layer is provided with a plurality of micropores, the lower conductive layer is arranged on the bottom of the upper conductive layer, the micropores between the upper and lower conductive layers are provided with conductive particles, the bottom of the lower conductive layer is provided with the substrate, the top of the substrate is provided with a copper-gold foil surface layer, and the copper-gold foil surface layer is connected with the bottom of the lower conductive layer.

[0007] As a further scheme of the present application: the conductive particle surface is attached with sticky resin particles.

[0008] As a further scheme of the present application: the insulating adhesive layer adopts thermosetting resin.

[0009] As a further scheme of the present application: the insulating adhesive layer is provided with a graphite layer in the middle.

[0010] As a further scheme of the present application: the base material adopts polyethylene material.

[0011] Compared with the prior art, the present application has the following beneficial effects:

[0012] 1. The present application improves the accuracy of the conductive particle scattering position by setting the micropore, ensures that the conductive particle can form an effective electrical conduction between the electronic component and the base material after hot pressing, improves the signal transmission efficiency, reduces signal loss and noise interference, and thus ensures the stability and reliability of the circuit.

[0013] 2. The present application is provided with a copper-gold foil surface layer, which enhances the electrical connection between the ACF conductive adhesive film and the base material; at the same time, it can effectively transfer the heat generated by the ACF conductive adhesive film during hot pressing, accelerate the solidification speed of the ACF conductive adhesive film, improve the production efficiency, and reduce the thermal stress problem caused by heat accumulation; and in some applications, the copper-gold foil surface layer can also act as an electromagnetic shielding layer to reduce the influence of electromagnetic interference on the ACF conductive adhesive film and surrounding electronic components.

[0014] 3. The present application is provided with sticky resin particles on the surface of the conductive particles, which helps to fix the position of the conductive particles, and also provides better wettability and adhesion during crimping, preventing the conductive particles from moving or displacing excessively during hot pressing, and enabling more accurate filling into the micropore between the upper and lower conductive layers, thereby ensuring the stability and reliability of the conductive path.

[0015] 4. The present application is provided with a graphite layer, which can significantly accelerate heat transfer. During hot pressing, the graphite layer can quickly conduct heat from the heat source to the entire ACF conductive adhesive film structure, ensuring that the conductive particles reach the required compression temperature in a short time; at the same time, the graphite layer helps to achieve uniform temperature distribution, preventing heat accumulation in local areas, avoiding excessive temperature gradient during hot pressing, and ensuring uniform heating and solidification of the ACF conductive adhesive film structure. BRIEF DESCRIPTION OF DRAWINGS

[0016] Fig. 1 It is a three-dimensional structure schematic diagram of an ACF conductive adhesive film structure.

[0017] Fig. 2This is a cross-sectional view of an ACF conductive film structure.

[0018] Fig. 3 This is a schematic diagram of the unfolded structure of an ACF conductive adhesive film.

[0019] The figure is labeled as follows: 1. Insulating adhesive layer; 2. Upper conductive layer; 21. Micropore; 3. Lower conductive layer; 4. Substrate; 5. Conductive particles; 6. Copper-gold foil surface layer; 7. Graphite layer. Detailed Implementation

[0020] The technical solution of this utility model will be clearly and completely described below with reference to the embodiments. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0021] like Figs. 1 to 3 As shown, an ACF conductive film structure includes an insulating adhesive layer 1, an upper conductive layer 2, a lower conductive layer 3, and a substrate 4. The insulating adhesive layer 1 is disposed on top of the upper conductive layer 2, and the bottom of the upper conductive layer 2 is provided with a plurality of micropores 21. The top of the lower conductive layer 3 is provided with a plurality of micropores 21, and the lower conductive layer 3 is disposed on the bottom of the upper conductive layer 2. Conductive particles 5 are disposed in the micropores 21 between the upper conductive layer 2 and the lower conductive layer 3. The substrate 4 is disposed at the bottom of the lower conductive layer 3, and a copper-gold foil surface layer 6 is disposed on top of the substrate 4. The copper-gold foil surface layer 6 is connected to the bottom of the lower conductive layer 3.

[0022] When the ACF conductive film is subjected to external pressure and temperature, the insulating layer 1 begins to soften, but it retains its insulating properties, preventing current from flowing horizontally. Simultaneously, the conductive particles 5 within the micropores 21 between the upper conductive layer 2 and the lower conductive layer 3 deform under pressure, forming a tight contact with the upper and lower conductive layers 3. These conductive particles 5 form conductive pathways in the vertical direction, i.e., the Z-axis, allowing current to flow between the upper conductive layer 2 and the lower conductive layer 3 through these pathways.

[0023] During the hot pressing process, the insulating adhesive layer 1 undergoes a cross-linking reaction and gradually cures, thereby enhancing the overall mechanical properties and stability of the ACF conductive adhesive film. At the same time, the contact between the conductive particles 5 and the upper and lower conductive layers 3 becomes tighter and more stable, further ensuring the reliability and long-term stability of the conductive path.

[0024] By setting the micropores 21, the accuracy of the conductive particle 5 scattering position is improved, ensuring that the conductive particle 5 can form an effective electrical conduction between the electronic components and the substrate 4 after hot pressing, improving the signal transmission efficiency, reducing signal loss and noise interference, and ensuring the stability and reliability of the circuit.

[0025] By setting the copper-gold foil surface layer 6 on the top of the substrate 4, the electrical connection between the ACF conductive adhesive film and the substrate 4 is enhanced. It helps to ensure that the ACF conductive adhesive film forms a stable and reliable conductive channel in the vertical direction, i.e. Z-axis, to meet the electrical conduction requirements between the electronic components and the substrate 4. At the same time, as a good conductor of heat, copper-gold foil can effectively transfer the heat generated by the ACF conductive adhesive film during hot pressing, helping to speed up the curing speed of the ACF conductive adhesive film, improve production efficiency, and reduce the problem of thermal stress caused by heat accumulation; and in some applications, the copper-gold foil surface layer 6 can also act as an electromagnetic shielding layer, reducing the influence of electromagnetic interference on the ACF conductive adhesive film and surrounding electronic components. This helps to improve the stability and reliability of the entire electronic system.

[0026] The conductive particles 5 are attached to the surface of the adhesive resin particles.

[0027] By attaching adhesive resin particles to the surface of the conductive particles 5, it helps to fix the position of the conductive particles 5, and also provides better wettability and adhesion during crimping, preventing the conductive particles 5 from moving or displacing excessively during hot pressing, and enabling more accurate filling into the micropores 21 between the upper and lower conductive layers 2 and 3, thereby ensuring the stability and reliability of the conductive path.

[0028] The insulating adhesive layer 1 uses a thermosetting resin.

[0029] By using a thermosetting resin material, it has excellent insulation performance, and its molecular structure forms a stable cross-linked network after curing, which can effectively prevent abnormal current flow and ensure electrical isolation between electronic components and the substrate 4. This stable insulation performance will not be significantly reduced by changes in time, temperature or humidity, thereby ensuring the reliability of the ACF conductive adhesive film during long-term use.

[0030] The insulating adhesive layer 1 is provided with a graphite layer 7 in the middle.

[0031] By setting the graphite layer 7, the heat transfer can be significantly accelerated, and during hot pressing, the graphite layer 7 can quickly conduct heat from the heat source to the entire ACF conductive adhesive film structure, ensuring that the conductive particles 5 reach the required pressing temperature in a short time; at the same time, the graphite layer 7 helps to achieve uniform temperature distribution, preventing heat accumulation in local areas, avoiding excessive temperature gradient during hot pressing, and ensuring uniform heating and curing of the ACF conductive adhesive film structure.

[0032] The substrate 4 is made of polyethylene material, which has excellent electric insulation performance. In the ACF conductive adhesive film, the polyethylene as the substrate 4 can effectively isolate the upper and lower conductive layers 3, prevent the current from flowing in the abnormal path, and ensure the electrical isolation between the electronic components.

[0033] The working principle of the utility model is: when the ACF conductive adhesive film is placed between two electrodes to be connected, such as the bumps of an IC chip and the electrodes of an LCD substrate, and is crimped under certain temperature and pressure, the thermosetting resin in the insulating adhesive layer 1 will soften and flow, and the conductive particles 5 will be compressed and filled into the micropores 21 between the upper and lower conductive layers 2 and 3 under the action of pressure. These conductive particles 5 form a conductive path through physical contact, thereby realizing the vertical conduction between the electrodes.

[0034] In the planar direction, the distance between the conductive particles 5 is large due to the separation by the resin in the insulating adhesive layer 1, which is insufficient to form a continuous conductive path. Therefore, the ACF maintains insulation in the X and Y directions, avoiding short circuit between adjacent electrodes.

[0035] The above examples are only used to illustrate the technical method of the utility model and not to limit it. Although the utility model has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical method of the utility model can be modified or replaced equivalently without departing from the spirit and scope of the technical method of the utility model.

Claims

1. An ACF conductive adhesive film structure comprising an insulating adhesive layer (1), an upper conductive layer (2), a lower conductive layer (3) and a substrate (4); characterized in that, The insulating adhesive layer (1) is arranged on the top of the upper conductive layer (2), the bottom of the upper conductive layer (2) is provided with a plurality of micropores (21), the top of the lower conductive layer (3) is provided with a plurality of micropores (21), the lower conductive layer (3) is arranged on the bottom of the upper conductive layer (2), the micropores (21) between the upper conductive layer (2) and the lower conductive layer (3) are provided with conductive particles (5), the bottom of the lower conductive layer (3) is provided with the base material (4), the top of the base material (4) is provided with a copper-gold foil surface layer (6), and the copper-gold foil surface layer (6) is connected with the bottom of the lower conductive layer (3).

2. The ACF conductive adhesive film structure of claim 1, wherein, The surface of the conductive particles (5) is attached with adhesive resin particles.

3. The ACF conductive adhesive film structure of claim 1, wherein, The insulating adhesive layer (1) adopts a thermosetting resin.

4. The ACF conductive adhesive film structure of claim 3, wherein, The insulating adhesive layer (1) is provided with a graphite layer (7) in the middle.

5. The ACF conductive adhesive film structure of claim 1, wherein, The base material (4) adopts a polyethylene material.

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