Container for wet etching and wet etching system

Abstract

The embodiment of the utility model discloses a container for wet etching and a wet etching system, and the container for wet etching can comprise a groove body which is used for carrying etching liquid so as to etch a wafer in the groove body; the filtering assembly is arranged at the bottom of the tank body and used for collecting impurities with the size larger than a preset value so that the impurities with the size larger than the preset value can be removed from the tank body when the filtering assembly is taken out of the tank body.

Description

TECHNICAL FIELD

[0001] The embodiment of the present disclosure relates to the technical field of semiconductor manufacturing, in particular to a container for wet etching and a wet etching system. BACKGROUND

[0002] In the process of wet etching of a wafer, due to the particularity of the process, the wafer will be caused to have fragments remaining in the wet etching container due to hidden cracks, edge collapse or improper operation of a mechanical hand, etc. These wafer fragments not only will be scattered in the bottom of the wet etching container and inside the tank body, causing a "dead angle" that is difficult to clean, but also will have an impact on the subsequent etching process and purity of the etching liquid.

[0003] At present, the wet etching container used is difficult to effectively collect and clean the wafer fragments, affecting the efficiency of the etching process and the product quality. CONTENT OF THE UTILITY MODEL

[0004] Therefore, the embodiment of the present disclosure expects to provide a container for wet etching and a wet etching system, which can reduce the impact of wafer fragments and improve the efficiency of wafer fragment cleaning and the stability of the etching process.

[0005] The technical solution of the embodiment of the present disclosure is as follows:

[0006] In a first aspect, the embodiment of the present disclosure provides a container for wet etching, which comprises:

[0007] A tank body for carrying an etching liquid to etch a wafer in the tank body;

[0008] A filter assembly arranged at the bottom of the tank body for collecting impurities with a size greater than a preset value, so as to remove the impurities with the size greater than the preset value from the tank body when the filter assembly is taken out of the tank body.

[0009] In some examples, the tank body comprises:

[0010] An etching part arranged between the filter assembly and the opening of the tank body;

[0011] An impurity collection part arranged on the side of the etching part away from the opening of the tank body for collecting impurities with a size less than or equal to the preset value, the area of the cross section of the impurity collection part perpendicular to the extension direction of the tank body being less than the area of the cross section of the etching part perpendicular to the extension direction of the tank body.

[0012] In some examples, the etching part and the impurity collection part are smoothly transitioned.

[0013] In some examples, the container for wet etching further comprises:

[0014] A foreign matter monitoring assembly is arranged at the bottom of the tank body and is configured to monitor the total amount of foreign matter collected by the foreign matter collecting assembly and to send an alarm signal when the total amount of foreign matter is greater than a set value.

[0015] In some examples, the filtering assembly comprises:

[0016] A filtering net is arranged to collect foreign matter with a size greater than a preset value.

[0017] A lifting mechanism is connected to the filtering net and is configured to take out the filtering net from the tank body along a direction parallel to the extending direction of the tank body.

[0018] In some examples, the filtering net comprises:

[0019] Two oppositely arranged blocking portions are arranged parallel to the inner wall of the tank body.

[0020] A filtering portion is arranged at a side of the two blocking portions away from the opening of the tank body.

[0021] In some examples, the wet etching container further comprises:

[0022] A gravity detecting mechanism is arranged between the filtering assembly and the inside of the tank body and is configured to detect the weight of foreign matter on the filtering net.

[0023] A controller is configured to control the lifting mechanism to take out the filtering net from the tank body when the weight is greater than a weight threshold.

[0024] In some examples, the wet etching container further comprises:

[0025] A liquid outlet is arranged at the bottom of the tank body and / or the sidewall between the filtering assembly and the bottom and is configured to discharge the etching liquid from the tank body.

[0026] A foreign matter collecting assembly is connected to the liquid outlet and is configured to collect foreign matter with a size less than or equal to the preset value from the etching liquid.

[0027] In a second aspect, the embodiments of the present disclosure provide a wet etching system, which comprises:

[0028] The wet etching container of the first aspect;

[0029] A foreign matter collecting assembly is configured to take out foreign matter with a size less than or equal to the preset value from the tank body after the etching liquid is discharged from the tank body.

[0030] The embodiment of the present disclosure provides a container for wet etching and a wet etching system; by introducing a filtering assembly, impurities with a size greater than a preset value can be automatically collected and removed, manual intervention is reduced, the cleaning efficiency of wafer fragments is significantly improved, and the continuity and stability of the wet etching process are ensured. The filtering assembly can adjust the pore size according to actual needs, so that the etching liquid can normally flow, and impurities smaller than or equal to the preset value can be effectively filtered and concentrated, so that the cleaning process is more controllable and efficient, and the operation complexity and process interference are reduced. BRIEF DESCRIPTION OF DRAWINGS

[0031] Figure 1 It is a structural schematic diagram of a container for wet etching;

[0032] Figure 2 It is a structural schematic diagram of a container for wet etching provided by the embodiment of the present disclosure;

[0033] Figure 3 It is a component schematic diagram of a groove provided by the embodiment of the present disclosure;

[0034] Figure 4 It is a component schematic diagram of another groove provided by the embodiment of the present disclosure;

[0035] Figure 5 It is a component schematic diagram of a filtering assembly provided by the embodiment of the present disclosure;

[0036] Figure 6 It is a component schematic diagram of a filtering net provided by the embodiment of the present disclosure;

[0037] Figure 7 It is a component schematic diagram of a lifting mechanism provided by the embodiment of the present disclosure;

[0038] Figure 8 It is a structural schematic diagram of another container for wet etching provided by the embodiment of the present disclosure;

[0039] Figure 9 It is a structural schematic diagram of still another container for wet etching provided by the embodiment of the present disclosure;

[0040] Figure 10 It is a structural schematic diagram of yet another container for wet etching provided by the embodiment of the present disclosure;

[0041] Figure 11 It is a structural schematic diagram of a liquid discharge port provided by the embodiment of the present disclosure;

[0042] Figure 12 It is a component schematic diagram of a wet etching system provided by the embodiment of the present disclosure;

[0043] Figure 13A composition schematic diagram of an impurity collection assembly provided by an embodiment of the present disclosure is shown in the following figure.

[0044] Figure 14 A composition schematic diagram of another impurity collection assembly provided by an embodiment of the present disclosure is shown in the following figure.

[0045] The specific embodiments of the present disclosure have been shown in the above figures, and will be described in more detail hereinafter. These figures and the written description are not intended to limit the scope of the present disclosure in any way, but to illustrate the concept of the present disclosure to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0046] Example implementations will now be described more fully with reference to the accompanying drawings. Example implementations can be implemented in any

[0047] In addition, the drawings are merely schematic and are not necessarily drawn to scale. Like reference numerals designate like or similar parts throughout the drawings and the written description and the drawings should not be interpreted to require that each part make specific thermodynamic contact with every other part, although thermodynamic contact between parts can be beneficial in some embodiments. Certain ones of the elements in the drawings are represented by simplified representations and illustrations of the drawings (including block diagrams of functional components) are to be regarded as generally preferred architectures only and not as limiting of the broad disclosure to that limit. That is, certain elements in the drawings can also have other uses and can be used to some extent in other embodiments, even though some of these uses can not be described in the present disclosure.

[0048] The wet etching container is mainly applied to the semiconductor manufacturing industry. In the wet etching process of the wafer, the etching liquid is carried and circulated to effectively collect and clean the impurities generated in the etching process of the wafer, so as to ensure the purity of the etching liquid and the stability of the etching process.

[0049] Referring to Figure 1 , a structural schematic diagram of a wet etching container is shown, as Figure 1 The wet etching container 10 includes a tank body 1, wherein the tank body 1 is used to provide a controllable environment for chemical etching on the wafer surface to remove the unnecessary material layer, so as to form the precise pattern required by the integrated circuit or other micro-nano structure.

[0050] Specifically, the wafer to be etched is placed in the tank 1, and the chemical reaction is realized by controlling the ratio, temperature and reaction time of the solution. After the chemical reaction is completed, the wafer is taken out of the tank 1, rinsed to remove the residual liquid on the surface, and then spun and dried, thereby completing the entire wet etching process of the wafer. In the wet etching process of the wafer, due to the complexity of the operation, the wafer may produce impurities such as large silicon slag or fine silicon chips due to internal cracks, edge disintegration or improper mechanical operation, as shown in Figure 1 The bottom and interior of the tank 1 form a difficult-to-clean deposition area, and also pollute the etching liquid used in the subsequent etching process, affecting the purity thereof.

[0051] It is difficult to collect and remove the generated wafer fragments through the tank 1 as shown in Figure 1 , which reduces the production efficiency and has a negative impact on the quality of the final product.

[0052] Therefore, the embodiments of the present disclosure aim to provide a container for wet etching, which provides an efficient and clean fragment management and cleaning solution for the wet etching process of the wafer. Referring to Figure 2 , which shows a structure schematic diagram of a container for wet etching 10 provided by the embodiments of the present disclosure, as shown in Figure 2 , the container for wet etching 10 comprises a tank 1 and a filter assembly 2, wherein the tank 1 is used to carry the etching liquid to etch the wafer in the tank 1; the filter assembly 2 is arranged at the bottom of the tank 1 and is used to collect impurities with a size greater than a preset value, so as to remove the impurities with a size greater than the preset value from the tank 1 when the filter assembly 2 is taken out of the tank 1, wherein the impurities with a size greater than the preset value refer to large silicon slag with a size greater than the preset value generated in the wet etching process of the wafer.

[0053] It should be noted that the preset value, i.e. the upper limit of the size of the impurities collected by the filter assembly 2, can be adjusted in size according to actual needs to ensure that the etching liquid can flow normally and the impurities can be effectively collected, filtered and cleaned. Specifically, it can be determined according to process requirements, material properties and properties of the etching liquid, for example, according to the requirements for etching uniformity and accuracy in the wet etching process, a suitable preset value is set to ensure that the impurities with a size greater than the preset value generated in the etching process are effectively removed, so as to avoid affecting the subsequent process. Since the etching rate and properties of different materials are different, the preset value needs to be set according to the properties of the etching material to ensure that the filter assembly 2 can effectively collect the impurities with a size greater than the preset value which affect the etching effect. In addition, the preset value can also be set according to the chemical properties and concentration of the etching liquid, for example, for the etching liquid which is easy to produce large size particles, a smaller preset value needs to be set to ensure the cleanliness of the etching liquid. By reasonably setting the preset value, the efficiency and quality of the wet etching process can be ensured.

[0054] According to the above-mentioned wet etching container 10, by introducing the filter assembly 2, impurities larger than the preset value can be automatically collected and removed, manual intervention is reduced, the cleaning efficiency of wafer fragments is significantly improved, and the continuity and stability of the wet etching process are ensured. The filter assembly 2 can adjust the aperture size according to actual needs to ensure that the etching liquid can flow normally, and impurities smaller than or equal to the preset value can be effectively filtered and concentrated for processing, so that the cleaning process is more controllable and efficient, and the operation complexity and process interference are reduced.

[0055] In some examples, referring to Figure 3 , the groove body 1 includes an etching part 11 and an impurity collection part 12, wherein the etching part 11 is arranged between the filter assembly 2 and the opening of the groove body 1; the impurity collection part 12 is arranged on the side of the etching part 11 away from the opening of the groove body 1, and is used for collecting impurities smaller than or equal to the preset value. The area of the impurity collection part 12 in the cross section perpendicular to the extension direction of the groove body 1 is smaller than the area of the etching part 11 in the cross section perpendicular to the extension direction of the groove body 1.

[0056] For the above-mentioned example, the etching part 11 is located between the filter assembly 2 and the opening of the groove body 1, is responsible for contacting with the etching liquid, and is used for etching treatment of the wafer in the wet etching container 10 to realize removal of a specific area of the wafer. By accurately controlling the chemical reagent and process parameters, efficient, uniform and cost-effective etching effect is realized.

[0057] For the above-mentioned example, the area of the impurity collection part 12 in the cross section perpendicular to the extension direction of the groove body 1 is smaller than the area of the etching part 11 in the cross section perpendicular to the extension direction of the groove body 1, that is, the impurity collection part 12 is designed as a longitudinal conical cross section, that is, the longitudinal cross section of the impurity collection part gradually decreases in width in the extension direction of the groove body (such as the direction indicated by the arrow in Figure 3 .

[0058] Designing the impurity collection part 12 as a longitudinal conical cross section facilitates drainage, that is, the impurities are drained, preventing the impurities from accumulating at the corners of the impurity collection part 12 to cause "dead corners" and allowing smaller impurities to directly slide into the collection area, thereby improving the collection efficiency. Exemplarily, the longitudinal conical cross section gradually thickens from top to bottom, can withstand the pressure generated when the high-temperature silicon slag rapidly impacts, and protects the impurity collection part 12 from being damaged.

[0059] In combination with the groove body 1 shown in Figure 3 , for example, referring to Figure 4 , the etching part 11 and the impurity collection part 12 in the groove body 1 are smoothly transitioned.

[0060] For the above example, the smooth transition between the etching part 11 and the impurity collection part 12, i.e. the impurity collection part 12 is designed to have a circular arc shape in the longitudinal cross section, and the two endpoints of the circular arc are located at the junction of the longitudinal etching part and the impurity collection part, and the opening of the circular arc is directed in the same direction as the opening direction of the groove body. The above design guides the impurities to the center of the groove body bottom, which can make the impurities more easily concentrate in the impurity collection part 12, thereby improving the collection efficiency and reducing the accumulation and dispersion of impurities in the impurity collection part 12, facilitating management and cleaning.

[0061] In combination with Figure 3 and Figure 4 the longitudinal conical cross section and the longitudinal arc-shaped cross section of the impurity collection part 12, a smooth material can also be used to reduce the friction and adhesion between the impurities and the collection part, making the cleaning process more efficient and convenient, thereby reducing the maintenance cost and the labor intensity of cleaning. Optionally, the wet etching container 10 using a smooth material to resist etching liquid erosion can effectively prolong the service life of the groove body by selecting a material with stable chemical properties. The above-mentioned material usually has high corrosion resistance and can maintain stable performance in high-chemical-activity etching liquid, reducing damage or failure of the groove body caused by material corrosion. Therefore, selecting a smooth and chemically stable material can improve the corrosion resistance of the wet etching container 10 and prolong its service life.

[0062] In some examples, referring to Figure 5 , the filter assembly 2 includes a filter screen 21 and a lifting mechanism 22, wherein the filter screen 21 is used to collect impurities with a size greater than a preset value; the lifting mechanism 22 is connected to the filter screen 21 and is used to take out the filter screen 21 from the groove body 1 along a direction parallel to the extension direction of the groove body 1.

[0063] For the above example, during the wet etching process, the filter screen 21 usually has a certain size of pore size, allowing the etching liquid to pass through while intercepting impurities larger than a preset value, and ensuring the flowability of the etching liquid while effectively removing impurities that affect the wet etching process. Specifically, the function of the filter screen 21 is to collect impurities with a size greater than a preset value. The preset value can be determined according to the diameter of the wafer. For example, for a wafer with a diameter of 300 mm, the preset value can be set to one-fourth of its diameter, i.e. 75 mm, or one-fifth of its diameter, i.e. 60 mm. This setting allows the filter screen 21 to intercept impurities with a size greater than the preset value that adversely affect subsequent process steps, while allowing impurities with a size less than or equal to the preset value to pass through, reducing the obstruction to the flow of etching liquid. The specific value of the preset value can be customized according to the specific needs of the user and the process requirements to adapt to different production environments and quality control standards. The filter screen 21 not only improves the cleanliness of the etching liquid, but also helps to maintain the stability of the etching process and the consistency of the product.

[0064] Exemplarily, the lifting mechanism 22 is directly connected to the filter screen 21, so that the filter screen 21 moves up and down in the tank body 1 to perform the collection and removal operation of impurities. Specifically, the lifting mechanism 22 enables the filter screen 21 to move in a direction parallel to the extending direction of the tank body 1, i.e., the filter screen 21 can be lifted vertically to the length direction of the tank body 1 without interfering with other components inside the tank body 1, wherein the filter screen 21 can move in a direction parallel to the extending direction of the tank body 1 as shown by the black solid arrow in Figure 5 , and the filter screen 21 can move vertically to the length direction of the tank body 1 as shown by the black dashed arrow in Figure 5 .

[0065] Exemplarily, when the filter screen 21 needs to be cleaned or replaced, the lifting mechanism 22 can take the filter screen 21 out of the tank body 1 in the direction as shown by the black dashed arrow in Figure 5 . The lifting mechanism 22 can ensure that the filter screen 21 can be smoothly removed from the tank body 1 for cleaning or replacement without interfering with other components inside the tank body 1.

[0066] Based on the above description, the cooperation of the filter screen 21 and the lifting mechanism 22 enables the wet etching container 10 to have higher flexibility and efficiency during operation. The filter screen 21 can effectively intercept and collect impurities with a size greater than a preset value, and the lifting mechanism 22 provides a simple method to remove and replace the filter screen 21, thereby maintaining the cleanliness of the etching liquid and the stability of the process, improving the production efficiency and reducing the maintenance cost and operation complexity.

[0067] In combination with the composition of the filter assembly 2 shown in Figure 5 , see Figure 6 , for example, the filter screen 21 includes two oppositely arranged blocking parts 211 and a filtering part 212, wherein the blocking parts 211 are arranged in parallel with the inner wall of the tank body 1, and the filtering part 212 is arranged on the side of the two blocking parts 211 away from the opening of the tank body 1.

[0068] For the above example, the filter screen 21 provides additional support through the two oppositely arranged blocking parts 211, enhancing the stability of the filter screen 21 in the tank body 1 and reducing deformation or damage caused by fluid power or impurity impact. The filtering part 212, as the core part of the filter screen 21, is responsible for intercepting impurities with a size greater than a preset value, and is arranged on the side of the two blocking parts 211 away from the opening of the tank body 1, which helps to concentrate and remove impurities, and is located between the two blocking parts 211, so that the etching liquid can be uniformly distributed when passing through the filter screen 21, avoiding local overload and prolonging the service life of the filter screen 21.

[0069] In some examples, see Figure 7The lifting mechanism 22 includes a lifting motor 221 and a connecting belt 222. The lifting motor 221 is used to drive the lifting mechanism 22 to move up and down. The precise control of the lifting mechanism 22 by the lifting motor 221 ensures the accurate positioning and stable movement of the filter screen 21 within the tank 1. The connecting belt 222 is used to transmit the power of the lifting motor 221 to the filter screen 21, ensuring that the filter screen 21 can rise and fall smoothly, thereby realizing the lifting action of the filter screen 21. This lifting action allows the filter screen 21 to be easily removed from the tank 1 for cleaning or replacement, while maintaining the compactness of the structure and the simplicity of the operation. The combination of the lifting motor 221 and the connecting belt 222 provides an efficient and reliable way to automatically control the position of the filter screen 21, optimizing the management of impurities during the wet etching process.

[0070] In some examples, referring to Figure 8 The wet etching container 10 further includes an impurity monitoring assembly 3 disposed at the bottom of the tank 1 for monitoring the total amount of impurities in the impurity collection portion 12 and issuing an alarm signal when the total amount of impurities is greater than a set value.

[0071] For the above examples, specifically, the impurity monitoring assembly 3 can monitor the total amount of impurities in the impurity collection portion 12 at the bottom of the tank 1 in real time, allowing the operator to timely understand the impurity situation in the tank 1, thereby improving the precision of process control. By monitoring the total amount of impurities and issuing an alarm signal, equipment failure or damage caused by excessive impurities can be prevented, protecting the safety of the equipment.

[0072] In some examples, referring to Figure 9 The wet etching container 10 further includes a gravity detection mechanism 4 and a controller 5. The gravity detection mechanism 4 is disposed between the filter assembly 2 and the inside of the tank 1 for detecting the weight of the impurities on the filter screen 21. The controller 5 is used to control the lifting mechanism 22 to remove the filter screen 21 from the tank 1 when the weight is greater than a weight threshold.

[0073] For the above examples, the gravity detection mechanism 4 can monitor the weight of the impurities on the filter screen 21 in real time. When the weight exceeds the weight threshold, the controller 5 automatically starts the lifting mechanism 22 to realize the automatic removal of the filter screen 21. The combination of the gravity detection mechanism 4 and the controller 5 allows maintenance to be arranged according to the actual weight of the impurities, rather than only based on time periods, improving the efficiency of maintenance.

[0074] In some examples, referring to Figure 10 The wet etching container 10 further includes a drain 6 and an impurity recovery portion 7. The drain 6 is disposed at the bottom of the tank 1 for draining the etching liquid from the tank 1. The impurity recovery portion 7 is connected to the drain 6 for recovering impurities with a size less than or equal to a preset value from the etching liquid.

[0075] In the example above, during wet etching, the etching solution comes into contact with the wafer and dissolves some of the material. Therefore, the used etching solution contains particles of the etched material and other impurities. The drain port 6 is located at the bottom of the tank 1, i.e., at the lowest point of the tank 1, ensuring that the etching solution is completely drained under gravity. Therefore, to improve drainage efficiency, the design of the drain port 6 needs to consider its size and shape, as well as its compatibility with the drainage pipe, to ensure that the etching solution can be quickly and completely drained from the tank 1.

[0076] By connecting the impurity recovery unit 7 to the drain port 6, impurities smaller than or equal to a preset value are recovered during the process of discharging the etching solution from the drain port 6. This helps protect the environment, reduces waste liquid treatment costs, and prevents impurities from affecting subsequent processes. Therefore, by working together with the drain port 6, the impurity recovery unit 7 effectively collects and treats impurities in the etching solution, improving the efficiency and environmental friendliness of the entire wet etching process.

[0077] In some examples, combined Figure 10 Drain 6 shown, see Figure 11 The drain port can also be set on the side wall between the filter assembly 2 and the bottom of the tank 1 to discharge the etching solution from the tank 1.

[0078] For example, the drain port 6 is located on the side wall between the filter assembly 2 and the bottom of the tank 1, i.e., a side drain port. This allows the etching solution to flow out from a higher position in the tank. Utilizing gravity, the drainage speed of the etching solution can be accelerated, improving drainage efficiency. The side drain port can also reduce the amount of etching solution used when replacing it, because the etching solution overflows simultaneously from the drain port 6 and the top of the tank 1, improving the efficiency of etching solution replacement and thus reducing etching solution consumption.

[0079] Based on the foregoing description, the various components of the wet etching container 10 enable effective management and control of impurities during the wafer etching process, improving etching uniformity and efficiency, reducing production costs, minimizing environmental pollution and equipment damage risks, enhancing operational safety and process automation, ensuring the cleanliness of the etching solution and product quality, thereby improving the performance and reliability of the entire wet etching process.

[0080] Based on the above description, this disclosure provides a wet etching system 20, see [link to relevant documentation]. Figure 12 The wet etching system 20 includes a wet etching container 10 and an impurity collection component 30. The impurity collection component 30 is used to remove impurities with a size smaller than or equal to a preset value from the tank 1 after the etching solution is discharged from the tank 1.

[0081] According to suchFigure 12 The wet etching system 20 shown can maintain a high etching rate when etching a large area of material by using the wet etching container 10, is suitable for processing thick material layers, and reduces processing time and cost. The impurity collection assembly 30 collects impurities with a size less than or equal to a preset value in the tank 1 after the etching solution is discharged, reduces the risk of residual etching solution on the material surface, reduces the difficulty of cleaning, and reduces pollution to high-precision processes. Therefore, the wet etching system 20 improves etching efficiency and quality by effectively collecting and processing impurities, reduces the risk of operators contacting hazardous chemicals, and improves the safety of operations.

[0082] For example, referring to Figure 13 , the impurity collection assembly 30 includes a collection port 31 and a suction part 32, wherein the suction part 32 is connected to the collection port 31 to provide suction to the collection port 31 to remove impurities from the tank 1.

[0083] For the above example, the suction part 32 provides a continuous suction to the collection port 31 to effectively suck and remove impurities in the tank 1 to improve cleaning efficiency and ensure the quality of the etching solution. The operator only needs to operate the suction part 32 to automatically extract the impurities, simplifying the complex steps of traditional manual cleaning. By automatically sucking impurities, the risk of operators directly contacting hazardous chemicals is reduced, thereby improving the safety of the operation process.

[0084] For example, referring to Figure 14 , the impurity collection assembly 30 further includes an image collection part 33, wherein the image collection part 33 is integrated into the collection port 31 to determine the amount of impurities in the tank 1.

[0085] For example, the image collection part 33 is designed as a camera as shown in Figure 14 , which can automatically monitor the amount of impurities in the tank 1, reducing the need for manual detection and improving the automation level of the entire system. By real-time monitoring of the amount of impurities in the tank 1 through the image collection part 33, the wet etching process can be more accurately controlled to ensure the quality of the etching solution and the etching effect, and impurity problems can be discovered and handled in a timely manner to avoid the impact of impurities on product quality and improve product yield.

[0086] In the above embodiments, the description of each embodiment focuses on different aspects, and the parts not described in detail in a certain embodiment can be referred to the related description of other embodiments. The technical features of the above embodiments can be combined in any way. To make the description concise, not all possible combinations of the technical features in the above embodiments are described, however, as long as the combinations of the technical features do not exist contradictory, they should be considered as the scope of the present disclosure.

[0087] Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the features of the disclosure as set forth here. It is intended that the disclosure be construed as including any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such insubstantial variations and changes as come within the purpose of the disclosure or fair

[0088] It is to be understood that the disclosure is not limited to the precise construction here described and illustrated in the accompanying drawings, and that various modifications and changes can be made by those skilled in the art without departing from the scope of the disclosure. The scope of the disclosure is limited only by the claims appended hereto.

Claims

1. A container for wet etching, characterized by, The wet etching container comprises: a groove for carrying etching liquid to etch a wafer in the groove; a filter assembly arranged at the bottom of the groove for collecting impurities with a size greater than a preset value, so that the impurities with the size greater than the preset value are removed from the groove when the filter assembly is taken out of the groove.

2. The container for wet etching according to claim 1, wherein The groove comprises: an etching part arranged between the filter assembly and the opening of the groove; an impurity collecting part arranged on the side of the etching part away from the opening of the groove for collecting impurities with a size less than or equal to the preset value, the area of the cross section of the impurity collecting part perpendicular to the extending direction of the groove is less than the area of the cross section of the etching part perpendicular to the extending direction of the groove.

3. The container for wet etching according to claim 2, wherein The etching part and the impurity collecting part are smoothly connected.

4. The container for wet etching according to claim 1, wherein The wet etching container further comprises: an impurity monitoring assembly arranged at the bottom of the groove for monitoring the total amount of impurities in the impurity collecting part and sending an alarm signal when the total amount of impurities is greater than a set value.

5. The container for wet etching according to claim 1, wherein The filter assembly comprises: a filter screen for collecting impurities with a size greater than a preset value; a lifting mechanism connected to the filter screen for taking the filter screen out of the groove along a direction parallel to the extending direction of the groove.

6. The container for wet etching according to claim 5, wherein The filter screen comprises: two oppositely arranged blocking parts arranged in parallel with the inner wall of the groove; a filtering part arranged on the side of the two blocking parts away from the opening of the groove.

7. The container for wet etching according to claim 5, wherein The wet etching container further comprises: a gravity detection mechanism arranged between the filter assembly and the inside of the groove for detecting the weight of impurities on the filter screen; a controller for controlling the lifting mechanism to take the filter screen out of the groove when the weight is greater than a weight threshold.

8. The container for wet etching according to claim 1, wherein The wet etching container further comprises: a liquid discharge port arranged at the bottom of the groove and / or the side wall between the filter assembly and the bottom for discharging etching liquid out of the groove; an impurity recovery part connected to the liquid discharge port for recovering impurities with a size less than or equal to the preset value in the etching liquid.

9. A wet etching system, characterized by, The wet etching container comprises: the wet etching container of any one of claims 1 to 8; an impurity collecting assembly for taking out impurities with a size less than or equal to the preset value in the groove after the etching liquid is discharged out of the groove.

10. The wet etch system of claim 9, wherein, The impurity collecting assembly comprises: a collecting port; a suction part connected to the collecting port for providing suction force to the collecting port to take out the impurities from the groove.

11. The wet etch system of claim 10, wherein, The impurity collecting assembly further comprises: an image collecting part integrated with the collecting port for determining the remaining amount of impurities in the groove.

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