Cooling assembly of transistor, motor controller and vehicle

Abstract

The utility model discloses a cooling assembly of a transistor, a motor controller and a vehicle, the cooling assembly of the transistor comprises a transistor; the cooling assembly comprises a first cooling piece and a second cooling piece, the transistor is connected to the side, away from the second cooling piece, of the first cooling piece, the first cooling piece is connected with the second cooling piece, and a cooling inlet and a cooling outlet are defined by the first cooling piece and the second cooling piece; a plurality of cooling columns are arranged on the side, close to the second cooling piece, of the first cooling piece at intervals and extend in the direction of the second cooling piece, the extending lengths of the cooling columns are gradually increased in the direction from the cooling inlet to the cooling outlet, and the cross sectional area of the bottom wall of the second cooling piece is gradually decreased. The extension lengths of the plurality of cooling columns are gradually increased, the temperature uniformity of the transistor can be improved, the cross sectional area of the bottom wall of the second cooling piece is gradually reduced, the cooling columns are convenient to place, meanwhile, cooling medium flowing is facilitated, and the cooling efficiency is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to vehicle technical field especially is related to a cooling assembly of transistor, motor controller and vehicle. BACKGROUND

[0002] In the related art, the transistor first cooling piece is divided into three heat dissipation areas from the cooling inlet to the cooling outlet, the cooling column top surface diameter in each area is the same, the cooling column top surface diameter between each area is different, and different numbers of cooling columns are distributed between each cooling area to achieve uniform heat dissipation.

[0003] However, the existing cooling assembly of transistor also has significant defects: the cooling medium flows from the cooling inlet to the cooling outlet and exchanges heat with the cooling column, the cooling medium has a low temperature when it just enters the second cooling piece, and the temperature of the cooling medium becomes higher and higher as it flows backward after contacting and absorbing heat from the cooling column until it flows out of the second cooling piece, so the temperature of the cooling medium is higher and higher as it flows backward, the heat exchange effect is poorer, the temperature of the transistor near the cooling inlet side is lower than that near the cooling outlet, which affects the overall life of the transistor module, in addition, the presence of the cooling column on the first cooling piece increases the resistance of liquid flow, and since the water pump has a limited load, the flow and speed of the cooling medium are limited, on the other hand, the fluid resistance between the side wall of the cooling tank, the bottom end plane of the cooling column and the gap between the bottom wall of the second cooling piece is small, so the flow rate of the cooling liquid is larger, the cooling liquid quickly passes through the place where there is no cooling column, and the heat dissipation efficiency is reduced. SUMMARY

[0004] The utility model discloses at least one of the technical problems in the prior art. To this end, the utility model provides a cooling assembly of transistor, which can improve the temperature uniformity and cooling efficiency of the transistor.

[0005] The utility model further provides a motor controller.

[0006] The utility model still further provides a vehicle.

[0007] According to the cooling assembly of transistor of the utility model, including: transistor;Cooling assembly, the cooling assembly includes: first cooling piece and second cooling piece, the transistor is connected on the side of the first cooling piece away from the second cooling piece, the first cooling piece is connected with the second cooling piece, and the first cooling piece and the second cooling piece define a cooling inlet and a cooling outlet, a plurality of cooling columns are arranged at the side adjacent to the second cooling piece of the first cooling piece, a plurality of the cooling columns extend to the direction of the second cooling piece respectively, in the direction from the cooling inlet to the cooling outlet, the extension length of a plurality of the cooling columns gradually increases, and the cross-sectional area of the bottom wall of the second cooling piece gradually decreases.

[0008] The cooling assembly of the transistor according to the utility model, the extension length of the plurality of cooling columns gradually increases, the temperature uniformity of the transistor can be improved, the cross-sectional area of the bottom wall of the second cooling member gradually decreases, the cooling column is convenient to place, and meanwhile, the cooling medium flow is facilitated, and the cooling efficiency is improved.

[0009] In some examples of the utility model, the extension length of the cooling column adjacent to the cooling inlet is a, the extension length of the cooling column adjacent to the cooling outlet is b, the distance between one end of the cooling column adjacent to the second cooling member and the bottom wall of the second cooling member is c, a, b and c satisfy the relationship: 1mm≤b-a≤5mm, 0.1mm≤c≤0.3mm.

[0010] In some examples of the utility model, the second cooling member is provided with a cooling groove, and the plurality of cooling columns are located in the cooling groove, and the bottom wall and the side wall of the cooling groove are both provided with a protruding part.

[0011] In some examples of the utility model, the protruding part is configured as a grid structure.

[0012] In some examples of the utility model, in the direction from the cooling inlet to the cooling outlet, the cooling groove is sequentially divided into a first cooling zone, a second cooling zone and a third cooling zone, the cooling columns located in the second cooling zone and the third cooling zone are both provided with cooling through holes, and the number of the cooling through holes provided on the cooling columns located in the third cooling zone is more than the number of the cooling through holes provided on the cooling columns located in the second cooling zone.

[0013] In some examples of the utility model, the cooling inlet comprises a first cooling channel and a second cooling channel, the second cooling channel is respectively connected with the first cooling channel and the cooling groove, and in the direction from the cooling inlet to the cooling outlet, the flow area of the second cooling channel gradually increases; the cooling outlet comprises a third cooling channel and a fourth cooling channel, the fourth cooling channel is respectively connected with the third cooling channel and the cooling groove, and in the direction from the cooling inlet to the cooling outlet, the flow area of the fourth cooling channel gradually decreases.

[0014] In some examples of the utility model, the cooling assembly further comprises a sealing member, and the sealing member is sealed between the first sealing member and the second sealing member.

[0015] In some examples of the utility model, the second sealing member is provided with a sealing groove, and the sealing member is arranged in the sealing groove.

[0016] The motor controller according to the utility model, comprising: above cooling assembly of transistor.

[0017] The vehicle according to the utility model, comprising: above motor controller.

[0018] The additional aspects and advantages of the utility model will be partially given in the following description, some will become obvious from the following description, or be understood by the practice of the utility model. BRIEF DESCRIPTION OF DRAWINGS

[0019] The above and / or additional aspects and advantages of the utility model will become apparent and more readily understood from the following description of the embodiments, taken in conjunction with the accompanying drawings, in which:

[0020] Figure 1 It is the structure schematic diagram of cooling assembly according to the utility model embodiment;

[0021] Figure 2 It is the structure schematic diagram of first cooling piece;

[0022] Figure 3 It is the partial structure schematic diagram of cooling assembly.

[0023] Reference Signs:

[0024] 1, cooling assembly;

[0025] 10, transistor;20, cooling assembly;200, first cooling piece;201, second cooling piece;202, cooling inlet;203, cooling outlet;204, cooling column;205, cooling groove;206, protruding part;207, first cooling area;208, second cooling area;209, third cooling area;210, cooling through hole;211, first cooling channel;212, second cooling channel;213, third cooling channel;214, fourth cooling channel;215, sealing groove. DETAILED DESCRIPTION

[0026] The embodiments of the utility model will be described in detail below, and the embodiments described with reference to the drawings are exemplary, and the embodiments of the utility model will be described in detail below.

[0027] The embodiments of the utility model will be described in detail below, and the embodiments described with reference to the drawings are exemplary, and the embodiments of the utility model will be described in detail below. Figures 1-3 The cooling assembly 1 of the transistor 10 according to the utility model embodiment is described below.

[0028] As Figure 1As shown, the cooling assembly 1 of the transistor 10 according to an embodiment of the present invention includes: a transistor 10 and a cooling component 20. The transistor 10 is mainly used to amplify or switch electronic signals, and the cooling component 20 is mainly used for cooling and heat dissipation, thereby preventing the transistor 10 from overheating. The transistor 10 can be an IGBT (Insulated Gate Bipolar Transistor).

[0029] like Figure 1 As shown, the cooling assembly 20 includes a first cooling element 200 and a second cooling element 201. A transistor 10 is connected to the side of the first cooling element 200 away from the second cooling element 201. The first cooling element 200 and the second cooling element 201 are connected, and the first cooling element 200 and the second cooling element 201 define a cooling inlet 202 and a cooling outlet 203. The first cooling element 200 and the second cooling element 201 are components of the cooling zone assembly 20 and both can perform cooling and heat dissipation functions. The transistor 10 is connected to the side of the first cooling element 200 away from the second cooling element 201. The transistor 10 is connected to the first cooling element 200 and the first cooling element 201 are connected. The first cooling element 200 and the second cooling element 201 are connected to each other, and the first cooling element 200 and the second cooling element 201 define a cooling inlet 202 and a cooling outlet 203. The cooling inlet 202 mainly allows the cooling medium to flow in, and the cooling outlet 203 allows the cooling medium to flow out. It should be noted that both the cooling inlet 202 and the cooling outlet 203 can be set in a funnel shape. This is beneficial for the uniform velocity distribution of the cooling medium when it flows in and out, reducing the generation of eddies and lowering the flow resistance.

[0030] like Figure 1 and Figure 2 As shown, a plurality of cooling columns 204 are spaced apart on the side of the first cooling element 200 adjacent to the second cooling element 201, and the plurality of cooling columns 204 extend toward the second cooling element 201. The cooling columns 204 mainly serve to cool and dissipate heat. The plurality of cooling columns 204 can further enhance the heat dissipation and cooling capacity of the first cooling element 200, thus preventing the transistor 10 from overheating and ensuring the performance of the transistor 10. The plurality of cooling columns 204 are spaced apart on the side of the first cooling element 200 adjacent to the second cooling element 201, which can avoid interference between the plurality of cooling columns 204 and at the same time allow for a wider distribution range of the plurality of cooling columns 204, which can also enhance the heat dissipation and cooling capacity of the first cooling element 200 to a certain extent. The plurality of cooling columns 204 extend toward the second cooling element 201, and the cooling columns 204 are distributed intersectingly on the first cooling element 200.

[0031] As shown in Figure 1 and Figure 2 , in the direction from the cooling inlet 202 to the cooling outlet 203, the extension length of the plurality of cooling columns 204 gradually increases, and the cross-sectional area of the bottom wall of the second cooling member 201 gradually decreases. In the direction from the cooling inlet 202 to the cooling outlet 203, the extension length of the plurality of cooling columns 204 gradually increases, so that the heat dissipation area of the higher temperature region of the transistor 10 can be gradually increased, the cooling medium in contact with the cooling column 204 can transfer more heat, the temperature uniformity of the transistor 10 is improved, thereby improving the service life of the transistor 10, and the cross-sectional area of the bottom wall of the second cooling member 201 gradually decreases, that is, the bottom wall of the second cooling member 201 is provided as an inclined surface, which facilitates the placement of the cooling column 204, and is also conducive to the flow of the cooling medium, thereby improving the cooling efficiency.

[0032] Therefore, the extension length of the plurality of cooling columns 204 gradually increases, which can improve the temperature uniformity of the transistor 10, and the cross-sectional area of the bottom wall of the second cooling member 201 gradually decreases, which facilitates the placement of the cooling column 204 and is also conducive to the flow of the cooling medium, thereby improving the cooling efficiency.

[0033] Specifically, as shown in Figure 1 , the extension length of the cooling column 204 adjacent to the cooling inlet 202 is a, the extension length of the cooling column 204 adjacent to the cooling outlet 203 is b, and the distance between the end of the cooling column 204 adjacent to the second cooling member 201 and the bottom wall of the second cooling member 201 is c, and a, b and c satisfy the relationship: 1mm≤b-a≤5mm, 0.1mm≤c≤0.3mm.

[0034] It should be noted that the extension length a of the cooling column 204 adjacent to the cooling inlet 202 and the extension length b of the cooling column 204 adjacent to the cooling outlet 203 need to meet a certain range, specifically, the difference between the extension length a of the cooling column 204 adjacent to the cooling inlet 202 and the extension length b of the cooling column 204 adjacent to the cooling outlet 203 cannot be too small, that is, less than 1mm, so that the difference between the extension length a of the cooling column 204 adjacent to the cooling inlet 202 and the extension length b of the cooling column 204 adjacent to the cooling outlet 203 is too small, and the heat dissipation area of the high temperature area of the transistor 10 in the direction from the cooling inlet 202 to the cooling outlet 203 is not obviously increased, and the cooling medium cannot transfer more heat when contacting the cooling column 204, which is not conducive to improving the temperature uniformity and service life of the transistor 10. At the same time, the difference between the extension length a of the cooling column 204 adjacent to the cooling inlet 202 and the extension length b of the cooling column 204 adjacent to the cooling outlet 203 cannot be too large, that is, greater than 5mm, so that under the premise that the cooling column 204 gradually increases the heat dissipation area in the direction from the cooling inlet 202 to the cooling outlet 203, the length of the cooling column 204 is too long, which is not conducive to the arrangement of the second cooling member 201, and will increase the cost.

[0035] It should be noted that the distance c between the end of the cooling column 204 adjacent to the second cooling member 201 and the bottom wall of the second cooling member 201 needs to meet a certain range, specifically, the distance c between the end of the cooling column 204 adjacent to the second cooling member 201 and the bottom wall of the second cooling member 201 cannot be too small, that is, less than 0.1mm, so that the distance c between the end of the cooling column 204 adjacent to the second cooling member 201 and the bottom wall of the second cooling member 201 is too small, which is not conducive to the arrangement of the cooling column 204 and the flow of the cooling medium. At the same time, the distance c between the end of the cooling column 204 adjacent to the second cooling member 201 and the bottom wall of the second cooling member 201 cannot be too large, that is, greater than 0.3mm, so that the flow resistance of the cooling medium is small in the direction from the cooling inlet 202 to the cooling outlet 203, and the flow rate is too large, which will cause part of the cooling medium to flow out without sufficient heat exchange.

[0036] As shown in the formula (1), the second cooling member 201 is provided with a cooling groove 205, and the plurality of cooling columns 204 are located in the cooling groove 205. The bottom wall and the side wall of the cooling groove 205 are provided with a protruding portion 206. Figure 3 The cooling groove 205 mainly has a cooling effect, and the plurality of cooling columns 204 are located in the cooling groove 205. The plurality of cooling columns 204 can be installed in the cooling groove 205, and the bottom wall and the side wall of the cooling groove 205 are provided with the protruding portion 206, so that the friction force is increased, the flow rate of the cooling medium in the cooling groove 205 is similar, the flow characteristics are improved, and the heat exchange efficiency is improved.

[0037] In addition, as shown in Figure 3 The protruding part 206 is configured as a grid structure. The grid structure is beneficial to increase the friction force. The protruding part 206 is configured as a grid structure, at this time, the protruding part 206 is more in line with the actual working condition, can make the cooling medium flow rate in the cooling groove 205 everywhere similar, improve the flow characteristics, and improve the heat exchange efficiency.

[0038] Of course, as shown in Figure 1 and Figure 3 In the direction from the cooling inlet 202 to the cooling outlet 203, the cooling groove 205 is sequentially divided into the first cooling area 207, the second cooling area 208, and the third cooling area 209. The cooling column 204 located in the second cooling area 208 and the third cooling area 209 is provided with a cooling through hole 210, and the number of the cooling through hole 210 provided on the cooling column 204 located in the third cooling area 209 is more than the number of the cooling through hole 210 provided on the cooling column 204 located in the second cooling area 208.

[0039] The first cooling area 207, the second cooling area 208, and the third cooling area 209 are components of the cooling groove 205, and can all play a heat exchange cooling role. The cooling column 204 located in the second cooling area 208 and the third cooling area 209 is provided with a cooling through hole 210, which is beneficial to increase the flow area of the cooling medium and reduce the flow resistance. In addition, the number of the cooling through hole 210 provided on the cooling column 204 located in the third cooling area 209 is more than the number of the cooling through hole 210 provided on the cooling column 204 located in the second cooling area 208. At this time, it is convenient to meet the heat dissipation demand of different cooling areas, which is beneficial to increase the flow area of the cooling medium and reduce the flow resistance in the direction from the cooling inlet 202 to the cooling outlet 203, and can make the cooling medium fully contact with the cooling column 204, thereby preventing the transistor 10 from overheating. It should be noted that the number of the cooling through hole 210 provided on the cooling column 204 located in the second cooling area 208 can be 1, and the number of the cooling through hole 210 provided on the cooling column 204 located in the third cooling area 209 can be 2. The cooling column 204 exchanges heat with the cooling medium in the first cooling area 207, the second cooling area 208, and the third cooling area 209.

[0040] Further, as shown in Figure 3As shown in the figure, the cooling inlet 202 comprises a first cooling channel 211 and a second cooling channel 212, the second cooling channel 212 is connected to the first cooling channel 211 and the cooling groove 205 respectively, and the flow area of the second cooling channel 212 gradually increases from the cooling inlet 202 to the cooling outlet 203. The cooling outlet 203 comprises a third cooling channel 213 and a fourth cooling channel 214, the fourth cooling channel 214 is connected to the third cooling channel 213 and the cooling groove 205 respectively, and the flow area of the fourth cooling channel 214 gradually decreases from the cooling inlet 202 to the cooling outlet 203.

[0041] The first cooling channel 211 and the second cooling channel 212 are components of the cooling inlet 202, and can make the cooling medium flow in. The second cooling channel 212 is connected to the first cooling channel 211 and the cooling groove 205 respectively, the first cooling channel 211 and the cooling groove 205 are connected through the second cooling channel 212, and the flow area of the second cooling channel 212 gradually increases from the cooling inlet 202 to the cooling outlet 203. In the direction from the cooling inlet 202 to the cooling outlet 203, the flow area of the second cooling channel 212 gradually increases, which is beneficial to the uniform distribution of the speed of the cooling medium flowing in, reduces the generation of vortex flow, and reduces the flow resistance. The third cooling channel 213 and the fourth cooling channel 214 are components of the cooling outlet 203, and can make the cooling medium flow out. The fourth cooling channel 214 is connected to the third cooling channel 213 and the cooling groove 205 respectively, the third cooling channel 213 and the cooling groove 205 are connected through the fourth cooling channel 214, and the flow area of the fourth cooling channel 214 gradually decreases from the cooling inlet 202 to the cooling outlet 203. In the direction from the cooling inlet 202 to the cooling outlet 203, the flow area of the fourth cooling channel 214 gradually decreases, which is beneficial to the uniform distribution of the speed of the cooling medium flowing out, reduces the generation of vortex flow, and reduces the flow resistance.

[0042] In addition, as shown in the figure, Figure 1 and Figure 3 The cooling assembly 20 further comprises a sealing element, which is sealed between the first sealing element and the second sealing element. The sealing element mainly plays a sealing role, and is sealed between the first sealing element and the second sealing element, that is, the sealing element is arranged between the first cooling element 200 and the second cooling element 201, which can ensure the sealing performance of the first cooling element 200 and the second cooling element 201 after installation, and can prevent the cooling medium from overflowing. The sealing element can be a sealing ring.

[0043] It should be noted that, as shown in the figure, Figure 3As shown, the second sealing member is provided with a sealing groove 215, and the sealing member is arranged in the sealing groove 215. The sealing groove 215 can be mainly used for sealing the sealing member. The second sealing member is provided with the sealing groove 215, and the sealing member is arranged in the sealing groove 215, that is, the second cooling member 201 is provided with the sealing groove 215, and the sealing member is arranged in the sealing groove 215, so that the sealing performance of the first cooling member 200 and the second cooling member 201 after installation can be guaranteed, and the overflow of the cooling medium can be prevented.

[0044] The motor controller according to the embodiments of the present application comprises the cooling assembly 1 of the transistor 10 described in the above embodiments.

[0045] The vehicle according to the embodiments of the present application comprises the motor controller described in the above embodiments.

[0046] In the description of the present application, it should be understood that the orientations or positional relationships indicated by the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0047] In the description of the present application, "a first feature", "a second feature" can include one or more features. In the description of the present application, "a plurality of" means two or more. In the description of the present application, "above" or "below" of a first feature to a second feature can include that the first and second features are in direct contact, or can include that the first and second features are not in direct contact but are in contact through another feature between them. In the description of the present application, "above", "above" and "above" of a first feature to a second feature include that the first feature is directly above and obliquely above the second feature, or only means that the first feature is higher than the second feature in horizontal height.

[0048] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "exemplary embodiment", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present application, the exemplary description of the above terms does not necessarily mean the same embodiment or example.

[0049] Although the embodiments of the utility model have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and purposes of the utility model, and the scope of the utility model is defined by the claims and their equivalents.

Claims

1. A cooling assembly (1) of a transistor, characterized in that, The application relates to a transistor (10) and a cooling assembly (20) for the transistor (10). The transistor (10) is connected to one side of a first cooling piece (200) away from a second cooling piece (201), the first cooling piece (200) is connected with the second cooling piece (201), and the first cooling piece (200) and the second cooling piece (201) define a cooling inlet (202) and a cooling outlet (203); a plurality of cooling columns (204) are arranged at intervals on the side of the first cooling piece (200) adjacent to the second cooling piece (201), and the plurality of cooling columns (204) respectively extend towards the second cooling piece (201); in the direction from the cooling inlet (202) to the cooling outlet (203), the extension lengths of the plurality of cooling columns (204) gradually increase, and the cross-sectional area of the bottom wall of the second cooling piece (201) gradually decreases. The extension length of the cooling column (204) adjacent to the cooling inlet (202) is a, the extension length of the cooling column (204) adjacent to the cooling outlet (203) is b, the distance between the end of the cooling column (204) adjacent to the second cooling piece (201) and the bottom wall of the second cooling piece (201) is c, and a, b and c satisfy the relationship: 1mm<=b-a<=5mm, 0.1mm<=c<=0.3mm.

2. The cooling assembly (1) of a transistor according to claim 1, characterized in that, The second cooling piece (201) is provided with a cooling groove (205), and the plurality of cooling columns (204) are located in the cooling groove (205); the bottom wall and the side wall of the cooling groove (205) are provided with protrusions (206).

3. Cooling assembly (1) of transistors according to claim 2, characterized in that, The protrusions (206) are configured in a grid structure.

4. The cooling assembly (1) of a transistor according to claim 3, characterized in that, In the direction from the cooling inlet (202) to the cooling outlet (203), the cooling groove (205) is sequentially divided into a first cooling zone (207), a second cooling zone (208) and a third cooling zone (209); the cooling columns (204) located in the second cooling zone (208) and the third cooling zone (209) are provided with cooling through holes (210), and the number of the cooling through holes (210) provided on the cooling columns (204) located in the third cooling zone (209) is greater than the number of the cooling through holes (210) provided on the cooling columns (204) located in the second cooling zone (208).

5. The cooling assembly (1) of a transistor according to claim 3, characterized in that, The cooling inlet (202) comprises a first cooling channel (211) and a second cooling channel (212); the second cooling channel (212) respectively communicates with the first cooling channel (211) and the cooling groove (205), and the flow area of the second cooling channel (212) gradually increases in the direction from the cooling inlet (202) to the cooling outlet (203).

6. The cooling assembly (1) of transistors according to claim 3, characterized in that, ​ The cooling outlet (203) comprises a third cooling channel (213) and a fourth cooling channel (214), the fourth cooling channel (214) being communicated with the third cooling channel (213) and the cooling groove (205) respectively, and the flow area of the fourth cooling channel (214) gradually decreases from the direction of the cooling inlet (202) to the cooling outlet (203).

7. The cooling assembly (1) of transistors according to claim 1, characterized in that, The cooling assembly (20) further comprises a sealing member, which is sealed between the first cooling member (200) and the second cooling member (201).

8. The cooling assembly (1) of a transistor according to claim 7, characterized in that, The second cooling member (201) is provided with a sealing groove (215), and the sealing member is arranged in the sealing groove (215).

9. An electric machine controller characterized by The cooling assembly (1) of the transistor according to any one of claims 1-8. The motor controller according to claim 9.

10. A vehicle characterized by comprising: The motor controller according to claim 9. ​

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