Composite circuit board with heat dissipation function

Abstract

The utility model relates to the technical field of circuit boards, in particular to a composite circuit board with a heat dissipation function, which comprises a circuit board body, a mounting frame is arranged at the bottom of the circuit board body, and a heat conducting plate for conducting heat covers the surface of the top of the circuit board body. Convenient operation mechanisms are arranged on the surfaces of the circuit board body and the mounting frame, telescopic columns, mounting plates and convenient operation parts are arranged in the convenient operation mechanisms, and efficient heat dissipation mechanisms are arranged on the surfaces of the circuit board body and the mounting frame; the efficient heat dissipation mechanism internally comprises heat dissipation fins, fastening bolts and an efficient heat dissipation set. According to the utility model, on the premise that the installation stability of the circuit board body can be ensured when the circuit board is used, the circuit board body can be conveniently disassembled, maintained and cleaned subsequently, the service life of the circuit board body is greatly prolonged, the safe use of the circuit board body is ensured, and the heat dissipation efficiency of the circuit board body is ensured.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of circuit board, especially a composite circuit board with heat dissipation function. BACKGROUND

[0002] Circuit board is also called electric circuit board, which can make the circuit miniaturized and intuitive, and plays an important role in the batch production of fixed circuits and the optimization of electric appliance layout. It is divided into ceramic circuit board, aluminum oxide ceramic circuit board, aluminum nitride ceramic circuit board, PCB board, aluminum substrate, high-frequency board, thick copper board, impedance board, ultra-thin circuit board, printed (copper etching technology) circuit board, etc., which has the characteristics of high wiring density, light weight and thin thickness. With the densification, miniaturization and multi-layerization of electronic products, higher requirements are put forward for multi-layer PCB circuit board, and one of the key factors is the heat dissipation performance of the circuit board. Due to the high packaging density of multi-layer circuit board, numerous electronic components are densely installed, and numerous circuit units are distributed, which puts high requirements on the heat dissipation of multi-layer circuit board.

[0003] After searching, the Chinese utility model patent with patent application number CN202323294970.0 discloses a high-efficiency heat dissipation composite circuit board, which belongs to the field of composite circuit board. The existing structure for heat dissipation of circuit board is relatively simple, and there is no protective structure for circuit board. After long-term use, it is easy to be damaged by collision. To solve the problem, the following scheme is proposed. It includes a mounting cover, a circuit board is arranged inside the mounting cover, a first heat-conducting silicone grease is arranged above the circuit board, a second heat-conducting silicone grease is arranged below the circuit board, a plurality of heat dissipation mechanisms are arranged on the upper and lower sides of the mounting cover, a connecting rod is arranged outside the mounting cover, a fixing ear is arranged at the bottom of the connecting rod, a connecting pipe is arranged on the fixing ear, and the connecting pipe is connected with the connecting rod. The double-layer heat dissipation of the heat dissipation fan and the heat dissipation aluminum plate greatly improves the heat dissipation effect of the circuit board. The structure on the mounting cover is used to install and protect the circuit board, thereby increasing the service life of the circuit board.

[0004] For example, the patent application No. CN202321758417.5 discloses a multi-layer composite circuit board with heat dissipation function, which comprises a fixed frame body, a plurality of metal through shafts connected to the fixed frame body, a plurality of fixed blocks movably connected to the metal through shafts, and a blowing element connected to the fixed frame body. The fixed recesses are formed between adjacent fixed blocks. The fixed blocks are provided with positioning holes. The positioning holes are matched in shape and size with the metal through shafts. The fixed blocks are clamped on the metal through shafts. The fixed recesses are provided with circuit boards. The circuit boards are provided with a plurality of metal through holes. The metal through holes are matched in shape and size with the metal through shafts. The metal through holes and the metal through shafts are in one-to-one correspondence. The air outlet position of the blowing element is aligned with the gap between the circuit boards. When the metal through shafts are inserted into the metal through holes, the circuit boards are electrically connected.

[0005] Although the existing composite circuit board can meet the basic heat dissipation requirement, it adopts the air blowing heat dissipation mode, resulting in a complex structure, high manufacturing cost, low heat dissipation efficiency, inconvenience in installation and maintenance, inconvenience for operators to operate, and high maintenance cost in the later period. Practical new type

[0006] The technical problem to be solved by the present application is to provide a composite circuit board with heat dissipation function to solve the problems of complex structure, high implementation cost, inconvenience in installation and maintenance, and low heat dissipation efficiency of the existing circuit board.

[0007] In order to solve the above technical problems, the technical scheme of the present application is:

[0008] A composite circuit board with heat dissipation function, comprising a circuit board body, a mounting frame is arranged at the bottom of the circuit board body, a heat conduction plate for heat conduction is arranged on the surface of the top position of the circuit board body, convenient operation mechanisms are arranged on the surfaces of the circuit board body and the mounting frame, the convenient operation mechanisms comprise telescopic columns, mounting plates and convenient operation parts, high-efficiency heat dissipation mechanisms are arranged on the surfaces of the circuit board body and the mounting frame, and the high-efficiency heat dissipation mechanisms comprise heat dissipation fins, fastening bolts and high-efficiency heat dissipation groups.

[0009] Preferably, positioning clamping columns for positioning and mounting the circuit board body are arranged on the surfaces of the bottom positions of the circuit board body, positioning cylinders are arranged on the surfaces of the top positions of the mounting frames, and one end of the positioning clamping column extends into the interior of the positioning cylinder and is clamped and matched with the positioning cylinder.

[0010] Preferably, the convenient operation part is arranged on the surface of the circuit board body and the mounting frame, the convenient operation part is composed of the press spring and the abutting plate, the surface of the top of the mounting frame is provided with the telescopic column, the surface of the telescopic column is screw-connected with the nail body, one end of the nail body penetrates through the telescopic column and is screw-fastened with the inner wall of the telescopic column, the top end of the telescopic column is provided with the mounting plate, and the telescopic column and the surface of the mounting frame are rotationally matched with each other.

[0011] Preferably, the surface of the telescopic column is screw-connected with the screw for fixing the telescopic column on the surface of the mounting frame, one end of the screw penetrates through the telescopic column and is screw-fastened with the surface of the mounting frame, the surface of the bottom of the mounting plate is provided with the press spring at equal intervals, the surface of the bottom of the press spring is provided with the abutting plate for abutting the circuit board body on the surface of the mounting frame, and the surface of the abutting plate is attached to the surface of the top of the circuit board body.

[0012] Preferably, the high-efficiency heat dissipation group is arranged on the surface of the circuit board body and the mounting frame, the high-efficiency heat dissipation group is composed of the heat dissipation groove and the heat dissipation hole, the surface of the bottom of the circuit board body is provided with the heat dissipation fin for dissipating heat from the surface of the circuit board body, and the surface of the heat dissipation fin is in contact with the surface of the bottom of the circuit board body.

[0013] Preferably, the surface of the heat dissipation fin is screw-connected with the fastening bolt for fixing the heat dissipation fin and the surface of the bottom of the circuit board body, one end of the fastening bolt penetrates through the heat dissipation fin and is screw-fastened with the surface of the bottom of the circuit board body, the surface of the mounting frame is provided with the heat dissipation groove at equal intervals, one end of the heat dissipation fin extends to the inside of the heat dissipation groove, the surface of the mounting frame is provided with the heat dissipation hole at equal intervals for heat conduction and heat dissipation, and the heat dissipation hole is in communication with the inside of the heat dissipation groove.

[0014] The utility model provides a kind of composite circuit board with heat dissipation function, with following beneficial effects:1, by being provided with convenient operation mechanism, user loosens the nail body on the surface of telescopic column, so that telescopic column drives mounting plate to move upwards to the height required, so that mounting frame can install the circuit board body of different thickness specifications, then, user tightens the nail body on the surface of telescopic column, so that the position of mounting plate is fixed, then, user loosens the screw on the surface of telescopic column, rotates telescopic column, so that telescopic column drives mounting plate to move to the top of circuit board body, at this time, under the elastic force of compression spring, drive abutting plate to move downwards, so that abutting plate moves downwards to the surface of circuit board body, under the action of abutting plate, circuit board body is abutted on the surface of mounting frame, so that circuit board body is installed on the surface of mounting frame, realize the function of circuit board easy installation and maintenance, so that circuit board can guarantee the premise of circuit board body installation stability when using, also facilitate subsequent disassembly maintenance and cleaning to circuit board body, later maintenance cost is lower, greatly prolong the service life of circuit board body;

[0015] 2, by being provided with high efficiency heat dissipation mechanism, under the action of fastening bolt, heat dissipation fin is installed on the surface at circuit board body bottom position, at this time, under the action of heat dissipation fin, heat of circuit board body surface is dissipated, at this time, heat is led out circuit board body and mounting frame inside through heat dissipation groove and heat dissipation hole, at this time, under the action of heat conduction plate, heat conduction treatment is carried out, so as to guarantee the heat dissipation efficiency of heat of circuit board body surface, so that the heat of circuit board body surface can be quickly dissipated from the surface of mounting frame, realize the high efficiency heat dissipation function of circuit board to circuit board body, so that the heat dissipation efficiency of circuit board body is greatly improved when using circuit board, guarantee the safe use of circuit board body, can guarantee that heat conduction plate and circuit board body reliably fit, guarantee the heat dissipation efficiency of circuit board body;And overall structure is relatively simple, and manufacturing cost is lower. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is three-dimensional structure schematic diagram of the utility model;

[0017] Figure 2 It is main view cross section structure schematic diagram of the utility model;

[0018] Figure 3 It is the utility model's Figure 2 It is the utility model's convenient operation mechanism's enlarged structure schematic diagram;

[0019] Figure 4 It is the utility model's Figure 2 It is the utility model's high efficiency heat dissipation mechanism's enlarged structure schematic diagram.

[0020] In the figure, 1, the circuit board body; 101, the mounting frame; 102, the heat conduction plate; 103, the positioning clamping column; 104, the positioning cylinder; 2, the convenient operation mechanism; 201, the telescopic column; 202, the mounting plate; 203, the convenient operation part; 2031, the compression spring; 2032, the abutting plate; 3, the high-efficiency heat dissipation mechanism; 301, the heat dissipation fin; 302, the fastening bolt; 303, the high-efficiency heat dissipation group; 3031, the heat dissipation groove; 3032, the heat dissipation hole. DETAILED DESCRIPTION

[0021] The specific embodiments of the utility model will be further described below in conjunction with the drawings. It needs to be explained here that the description of these embodiments is used to help understand the utility model, but does not constitute the limitation to the utility model. In addition, the technical features involved in each embodiment of the utility model described below can be combined with each other as long as they do not conflict with each other.

[0022] In the description of the utility model, it needs to be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the utility model and simplifying the description, and therefore cannot be understood as indicating or implying that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the utility model.

[0023] In addition, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can explicitly or implicitly include at least one of the features. In the description of the utility model, the meaning of "multiple" is at least two, for example, two, three, etc., unless otherwise explicitly and specifically limited.

[0024] The structure of the multifunctional circuit board provided by the utility model is as shown in Figure 1 and Figure 2 The utility model provides a kind of multifunctional circuit board, including circuit board body 1, the bottom of circuit board body 1 is provided with mounting frame 101, the surface of the top position of circuit board body 1 is covered with heat conduction plate 102 for heat conduction, the surface of the bottom position of circuit board body 1 is all installed with positioning clamping column 103 for positioning installation to circuit board body 1, the surface of the top position of mounting frame 101 is all installed with positioning cylinder 104, one end of positioning clamping column 103 extends to the inside of positioning cylinder 104 and is mutually clamped with positioning cylinder 104.

[0025] Further, as shown in Figure 2 and Figure 3 The surface of the circuit board body 1 and the mounting frame 101 is provided with a convenient operation mechanism 2, the inside of the convenient operation mechanism 2 contains a telescopic column 201, a mounting plate 202 and a convenient operation part 203, the convenient operation part 203 is arranged on the surface of the circuit board body 1 and the mounting frame 101, the convenient operation part 203 is composed of a compression spring 2031 and a pressing plate 2032, the surface of the mounting frame 101 at the top position is provided with a telescopic column 201, the surface of the telescopic column 201 is threadedly connected with a nail body, one end of the nail body penetrates through the telescopic column 201 and is threadedly fastened with the inner wall of the telescopic column 201, the top end of the telescopic column 201 is provided with a mounting plate 202, the telescopic column 201 and the surface of the mounting frame 101 are rotationally matched with each other, the surface of the telescopic column 201 is threadedly connected with a screw for fixing the telescopic column 201 on the surface of the mounting frame 101, one end of the screw penetrates through the telescopic column 201 and is threadedly fastened with the surface of the mounting frame 101, the surface of the mounting plate 202 at the bottom position is provided with equidistant compression springs 2031, the surface of the compression spring 2031 at the bottom position is provided with a pressing plate 2032 for pressing the circuit board body 1 against the surface of the mounting frame 101, the surface of the pressing plate 2032 is attached to the surface of the circuit board body 1 at the top position.

[0026] In implementation, the user unscrews the nail body on the surface of the telescopic column 201, so that the telescopic column 201 drives the mounting plate 202 to move upward to the required height, so that the mounting frame 101 can install circuit board bodies 1 of different thickness specifications, then the user tightens the nail body on the surface of the telescopic column 201, so as to fix the position of the mounting plate 202, then the user unscrews the screw on the surface of the telescopic column 201, rotates the telescopic column 201, so that the telescopic column 201 drives the mounting plate 202 to move above the circuit board body 1, at this time, the pressing plate 2032 is driven to move downward by the elastic force of the compression spring 2031, so that the pressing plate 2032 moves downward to be attached to the surface of the circuit board body 1, the circuit board body 1 is pressed against the surface of the mounting frame 101 under the action of the pressing plate 2032, so as to install the circuit board body 1 on the surface of the mounting frame 101, to realize the function of convenient installation and maintenance of the circuit board.

[0027] Further, as shown in Figure 2 and Figure 4As shown, the circuit board body 1 and the surface of the mounting frame 101 are provided with high-efficiency heat dissipation mechanisms 3, the high-efficiency heat dissipation mechanisms 3 internally contain heat dissipation fins 301, fastening bolts 302 and high-efficiency heat dissipation groups 303, the high-efficiency heat dissipation groups 303 are arranged on the surface of the circuit board body 1 and the mounting frame 101, the high-efficiency heat dissipation groups 303 are composed of heat dissipation grooves 3031 and heat dissipation holes 3032, the surface of the circuit board body 1 at the bottom position is provided with heat dissipation fins 301 for dissipating heat of the surface of the circuit board body 1, the surface of the heat dissipation fins 301 is in contact with the surface of the circuit board body 1 at the bottom position, the surface of the heat dissipation fins 301 is threadedly connected with fastening bolts 302 for fixing the heat dissipation fins 301 and the surface of the circuit board body 1 at the bottom position, one end of the fastening bolts 302 penetrates through the heat dissipation fins 301 and is threadedly fastened with the surface of the circuit board body 1 at the bottom position, the surface of the mounting frame 101 is provided with equidistant heat dissipation grooves 3031, one end of the heat dissipation fins 301 extends to the inside of the heat dissipation grooves 3031, the surface of the mounting frame 101 is provided with equidistant heat dissipation holes 3032 for heat conduction and heat dissipation, the heat dissipation holes 3032 are in communication with the inside of the heat dissipation grooves 3031.

[0028] In implementation, the heat dissipation fins 301 are installed on the surface of the circuit board body 1 at the bottom position under the action of the fastening bolts 302, at this time, the heat of the surface of the circuit board body 1 is dissipated under the action of the heat dissipation fins 301, at this time, the heat is conducted out of the inside of the circuit board body 1 and the mounting frame 101 through the heat dissipation grooves 3031 and the heat dissipation holes 3032, at this time, heat conduction treatment is conducted under the action of the heat conduction plate 102, so as to ensure the heat dissipation efficiency of the heat of the surface of the circuit board body 1, so that the heat of the surface of the circuit board body 1 can be quickly dissipated from the surface of the mounting frame 101, so as to realize the high-efficiency heat dissipation function of the circuit board to the circuit board body 1.

[0029] Working principle: in use, first, the circuit board body 1 is placed in the specified position, the circuit board body 1 is placed on the surface of the mounting frame 101, at this time, the circuit board body 1 drives the positioning clamping column 103 to move to the inside of the positioning cylinder 104, the positioning clamping column 103 and the positioning cylinder 104 jointly position the mounting position of the circuit board body 1, then, the user unscrews the nail body on the surface of the telescopic column 201, so that the telescopic column 201 drives the mounting plate 202 to move upwards to the required height, so that the mounting frame 101 can install the circuit board body 1 of different thickness specifications, then, the user tightens the nail body on the surface of the telescopic column 201, so as to fix the position of the mounting plate 202, then, the user unscrews the screw on the surface of the telescopic column 201, rotates the telescopic column 201, so that the telescopic column 201 drives the mounting plate 202 to move above the circuit board body 1, at this time, under the action of the elastic force of the compression spring 2031, the abutting plate 2032 moves downwards, so that the abutting plate 2032 moves downwards to be attached to the surface of the circuit board body 1, under the action of the abutting plate 2032, the circuit board body 1 is tightly attached to the surface of the mounting frame 101, so as to install the circuit board body 1 on the surface of the mounting frame 101, so as to realize the function of convenient installation and maintenance of the circuit board, so that the circuit board can ensure the stability of the circuit board body 1 under the premise of installation, and also facilitate subsequent disassembly, maintenance and cleaning of the circuit board body 1, greatly prolonging the service life of the circuit board body 1.

[0030] Then, under the action of the fastening bolt 302, the heat dissipation fin 301 is installed on the surface at the bottom position of the circuit board body 1, at this time, under the action of the heat dissipation fin 301, the heat on the surface of the circuit board body 1 is dissipated, at this time, the heat is led out of the inside of the circuit board body 1 and the mounting frame 101 through the heat dissipation groove 3031 and the heat dissipation hole 3032, at this time, the heat conduction plate 102 conducts heat, so as to ensure the heat dissipation efficiency of the heat on the surface of the circuit board body 1, so that the heat on the surface of the circuit board body 1 can be quickly dissipated from the surface of the mounting frame 101, so as to realize the high-efficiency heat dissipation function of the circuit board to the circuit board body 1, so that the heat dissipation efficiency of the circuit board body 1 is greatly improved when the circuit board is used, ensuring the safe use of the circuit board body 1, ensuring reliable attachment of the heat conduction plate 102 and the circuit board body 1, so as to improve the heat dissipation efficiency of the circuit board, and the overall structure is relatively simple, which can reduce the manufacturing cost and has low manufacturing cost.

[0031] The embodiments of the utility model are described in detail above combined with the drawings, but the utility model is not limited to the described embodiments. For those skilled in the art, various changes, modifications, replacements and modifications can be made to these embodiments without departing from the principles and spirits of the utility model, which still fall within the protection scope of the utility model.

Claims

1. A composite circuit board with heat dissipation function, characterized in that: The utility model provides a circuit board body (1), it is characterized by: the bottom of the circuit board body (1) is provided with the mounting frame (101), the surface of the top position of the circuit board body (1) is covered with the heat conduction plate (102) for heat conduction, the surface of the circuit board body (1) and mounting frame (101) is provided with the convenient operation mechanism (2), the inside of the convenient operation mechanism (2) contains telescopic column (201), mounting plate (202) and convenient operation part (203), the surface of the circuit board body (1) and mounting frame (101) is provided with the high -efficient heat abstractor (3), the inside of the high -efficient heat abstractor (3) contains heat dissipation fin (301), fastening bolt (302) and high -efficient heat abstractor group (303).

2. The composite wiring board having a heat dissipation function according to claim 1, characterized by: The surface of the bottom position of the circuit board body (1) is provided with the positioning clamping column (103) for positioning installation of the circuit board body (1), the surface of the top position of the mounting frame (101) is provided with the positioning cylinder (104), one end of the positioning clamping column (103) extends to the inside of the positioning cylinder (104) and is mutually clamped with the positioning cylinder (104) and cooperates.

3. The composite wiring board having a heat dissipation function according to claim 1, characterized by: The convenient operation part (203) is arranged on the surface of the circuit board body (1) and mounting frame (101), the convenient operation part (203) is composed of the compression spring (2031) and the abutting plate (2032), the surface of the top position of the mounting frame (101) is provided with the telescopic column (201), the surface of the telescopic column (201) is screw connected with the nail body, one end of the nail body penetrates the telescopic column (201) and is screw fastened with the inner wall of the telescopic column (201), the top end of the telescopic column (201) is provided with the mounting plate (202), the surface of the telescopic column (201) and mounting frame (101) is mutually rotated and cooperates.

4. The composite wiring board having a heat dissipation function according to claim 1, characterized by: The surface of the telescopic column (201) is screw connected with the screw for fixing the telescopic column (201) on the surface of the mounting frame (101), one end of the screw penetrates the telescopic column (201) and is screw fastened with the surface of the mounting frame (101), the surface of the bottom position of the mounting plate (202) is provided with the equal interval compression spring (2031), the surface of the bottom position of the compression spring (2031) is provided with the abutting plate (2032) for abutting the circuit board body (1) on the surface of the mounting frame (101), the surface of the abutting plate (2032) is attached with the surface of the top position of the circuit board body (1).

5. The composite wiring board having a heat dissipation function according to claim 1, characterized by: The high -efficient heat abstractor group (303) is arranged on the surface of the circuit board body (1) and mounting frame (101), the high -efficient heat abstractor group (303) is composed of the heat dissipation groove (3031) and the heat dissipation hole (3032), the surface of the bottom position of the circuit board body (1) is provided with the heat dissipation fin (301) for the surface of the circuit board body (1) and is provided with the heat dissipation fin (301), the surface of the heat dissipation fin (301) is contacted with the surface of the bottom position of the circuit board body (1).

6. The composite wiring board having a heat dissipation function according to claim 1, characterized by: The surface of the heat dissipation fin (301) is threadedly connected with a fastening bolt (302) for fixing the heat dissipation fin (301) and the surface at the bottom position of the circuit board body (1), one end of the fastening bolt (302) penetrates through the heat dissipation fin (301) and is threadedly fastened with the surface at the bottom position of the circuit board body (1); the surface of the mounting frame (101) is provided with equidistant heat dissipation grooves (3031), one end of the heat dissipation fin (301) extends to the inside of the heat dissipation groove (3031), and the surface of the mounting frame (101) is provided with equidistant heat dissipation holes (3032) for heat dissipation, the heat dissipation holes (3032) are communicated with the inside of the heat dissipation groove (3031).

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