Current carrying and heat dissipation two-in-one structure of driving circuit board and water pump applying same

Abstract

The utility model discloses a current-carrying and heat-radiating two-in-one structure of a driving circuit board and a water pump using the same. The current-carrying and heat-radiating two-in-one structure comprises the driving circuit board, at least one surface of the driving circuit board is provided with a plurality of high heating elements, and the driving circuit board is also provided with a current carrying-heat dissipation terminal; the flat plate attaching body of the current carrying-heat dissipation terminal is attached to the other face, opposite to the high-heating component, of the driving circuit board, and when the direction perpendicular to the driving circuit board serves as the projection direction, the projection of the flat plate attaching body and the projection of the high-heating component are overlapped. And the flat plate attaching body can penetrate through the driving circuit board to exchange heat with at least one part of high-heating components. The utility model mainly solves the problem of how to provide a more efficient heat dissipation structure for the driving circuit board of the electronic water pump and improve the terminal current-carrying capability of the driving circuit board at the same time. The performance limitation of the driving circuit board is reduced, and more possibilities are provided for the circuit design of the electronic water pump.

Description

TECHNICAL FIELD

[0001] The utility model relates to electronic water pump and its spare part technical field, concretely is a kind of current-carrying and heat-dissipating two-in-one structure of drive circuit board and water pump of application thereof. BACKGROUND

[0002] Electronic water pump has higher output efficiency and can realize accurate flow control, therefore, electronic water pump is widely used in automobile, household appliance and industrial equipment, for example, new energy automobile is usually configured with two or even more electronic water pumps to serve as the power source of entire cooling system.

[0003] Electronic water pump is equipped with main control, power electronic device for driving stator assembly to run and other peripheral circuits on drive circuit board, therefore, drive circuit board is large heat-generating component.

[0004] In order to dissipate heat for drive circuit board and other components of electronic water pump, there are usually two ways in prior art:

[0005] 1, metal end cover with heat dissipation fins or heat dissipation column is arranged at one end of electronic water pump, drive circuit board is installed close to the position of the metal end cover, heat exchange between drive circuit board and the metal end cover is realized through heat-conducting silicone grease or other heat-conducting medium, so as to dissipate heat outward through heat dissipation fins or heat dissipation column of the metal end cover, Chinese utility model patent publication text with publication number CN216343046U and name of "water pump rear cover with heat dissipation function and water pump applying same" discloses the above structure;

[0006] 2, metal inner end cover is arranged in electronic water pump, so that the inner end cover can exchange heat with liquid medium in the cavity of electronic water pump, drive circuit board is installed close to the position of the inner end cover, heat exchange between drive circuit board and the inner end cover is realized through heat-conducting silicone grease or other heat-conducting medium, so as to dissipate heat through liquid medium, Chinese utility model patent publication text with publication number CN116857200A and name of "electronic water pump" discloses the above structure.

[0007] The above two heat dissipation methods rely on heat-conducting medium such as heat-conducting silicone grease to conduct heat from drive circuit board to metal end cover / inner end cover, however, the heat-conducting performance of heat-conducting medium is limited, and for drive circuit board with large heat generation, the heat-conducting performance is still insufficient, and the problem of overheating of drive circuit board still exists.

[0008] In addition, drive circuit board of electronic water pump usually outputs current to stator assembly through terminal, as the power of electronic water pump increases, the power output by drive circuit board of electronic water pump also increases accordingly, and the requirement for current-carrying capacity of terminal of drive circuit board is also higher and higher.

[0009] Therefore, how to provide a more efficient heat dissipation structure for the driving circuit board of the electronic water pump and improve the terminal current-carrying capacity of the driving circuit board has become one of the problems to be solved. Practical new type content

[0010] The utility model discloses a kind of current-carrying and heat dissipation two-in-one structure of driving circuit board and water pump using it, which can provide efficient heat dissipation structure for driving circuit board, and also can improve the terminal current-carrying capacity of driving circuit board.

[0011] To achieve the above object, the utility model provides the following technical scheme: a kind of current-carrying and heat dissipation two-in-one structure of driving circuit board, it includes driving circuit board;At least one side of the driving circuit board is loaded with several high heat generating components, and, current-carrying-heat dissipation terminal is also loaded on the driving circuit board;The current-carrying-heat dissipation terminal includes flat plate placement body, the external connecting body for being contacted with the external conductor connection, and, the intermediate connecting body connecting the flat plate placement body and external connecting body;The flat plate placement body of the current-carrying-heat dissipation terminal is placed in the other side of the driving circuit board relative to the high heat generating component, and, when the direction perpendicular to the driving circuit board is taken as projection direction, the projection of the flat plate placement body and the projection of the high heat generating component have overlapping relationship, so that the flat plate placement body can be passed through the driving circuit board and at least a part of the high heat generating component occurs heat exchange.

[0012] In the above technical solution, the flat plate placement body of the current-carrying-heat dissipation terminal is integrally formed with several terminal pins;The driving circuit board is provided with circuit board through hole in the side of at least a part of the high heat generating component, and the number and position of the circuit board through hole are corresponding with the terminal pin of the current-carrying-heat dissipation terminal;Each terminal pin of the current-carrying-heat dissipation terminal is respectively inserted into and welded in each circuit board through hole of the driving circuit board, and the flat plate placement body of the current-carrying-heat dissipation terminal is closely attached to the surface of the driving circuit board.

[0013] In the above technical solution, the two sides of each terminal pin of the current-carrying-heat dissipation terminal are respectively formed with crack stop groove.

[0014] In the above technical solution, the driving circuit board is provided with several pads at the corresponding position of the current-carrying-heat dissipation terminal;The flat plate placement body of the current-carrying-heat dissipation terminal is welded on the pad of the driving circuit board.

[0015] In the above technical solution, the flat plate placement body is provided with several through holes in the current-carrying-heat dissipation terminal;The through hole can be passed through itself by welding material to reach the bottom of the flat plate placement body, and the through hole can also be used for welding material to be stored therein.

[0016] In the technical scheme, the current-carrying and heat-dissipating two-in-one structure of the drive circuit board further comprises a main heat-conducting plate; the drive circuit board is mounted on the main heat-conducting plate, or the drive circuit board and the main heat-conducting plate are mutually attached, so that the flat plate of the current-carrying and heat-dissipating terminal can exchange heat with the main heat-conducting plate; and the main heat-conducting plate can exchange heat with liquid medium and / or gas medium, so as to export heat.

[0017] In the technical scheme, the main heat-conducting plate is concave on the surface, and a heat-conducting slot is formed; the heat-conducting slot is matched with the shape of the flat plate of the current-carrying and heat-dissipating terminal; and when the drive circuit board is mounted on the main heat-conducting plate, the flat plate of the current-carrying and heat-dissipating terminal is embedded in the heat-conducting slot of the main heat-conducting plate.

[0018] In the technical scheme, a heat-conducting medium is filled between the drive circuit board and the main heat-conducting plate.

[0019] In the technical scheme, the external connecting body of the current-carrying and heat-dissipating terminal comprises two clamping arms which are opposite to each other; the free ends of the two clamping arms are narrowed, and clamping arm narrowing parts are formed; the inner sides of the two clamping arms are protruded, and clamping arm protruding ribs are formed; and the middle connecting body of the current-carrying and heat-dissipating terminal forms a straight neck part.

[0020] A water pump comprises the current-carrying and heat-dissipating two-in-one structure of the drive circuit board.

[0021] Compared with the prior art, the current-carrying and heat-dissipating two-in-one structure of the drive circuit board and the water pump using the same have the following beneficial effects: the current-carrying and heat-dissipating terminal is mounted on the drive circuit board, the current-carrying and heat-dissipating terminal is used as a current channel of the drive circuit board, the current-carrying and heat-dissipating terminal can carry larger current through the large-area flat plate, and the current-carrying and heat-dissipating terminal is used for heat conduction to quickly export heat generated by high-heat components, so that the drive circuit board can have better heat dissipation performance; the current-carrying and heat-dissipating two-in-one structure of the drive circuit board and the water pump using the same reduce the performance limitation of the drive circuit board, and provide more possibilities for circuit design of the electronic water pump. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 It is a perspective view of the utility model.

[0023] Figure 2 It is an exploded view of the utility model.

[0024] Figure 3 It is one of the structure views of the drive circuit board in the utility model.

[0025] Figure 4 It is the structure view two of the driving circuit board in the utility model.

[0026] Figure 5 It is the structure view of the current-carrying-heat-dissipating terminal in the utility model.

[0027] Figure 6 It is the structure view of the water pump in the utility model.

[0028] The figure mark is: 1, driving circuit board;11, high heat generating component;12, circuit board through hole;2, current-carrying-heat-dissipating terminal;21, flat plate placement body;211, terminal pin;212, through hole;213, crack stop groove;22, external connecting body;221, clamping arm;222, clamping arm narrowing part;223, clamping arm convex rib;23, intermediate connecting body;231, straight type neck;3, main heat conducting plate;31, heat conducting slot;32, component slot;10, water pump body;20, chamber. DETAILED DESCRIPTION

[0029] The technical scheme in the embodiments of the utility model will be described clearly and completely below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the utility model.

[0030] The embodiment provides a current-carrying and heat-dissipating two-in-one structure of driving circuit board, which can be applied to a water pump (especially an electronic water pump), is used as the output end current-carrying structure of the driving circuit board 1, and is used for dissipating heat for the driving circuit board 1 to maintain normal operation of the driving circuit board 1.

[0031] Please refer to Figures 1-5 The current-carrying and heat-dissipating two-in-one structure of the driving circuit board of the embodiment comprises a driving circuit board 1.

[0032] The driving circuit board 1 is a printed circuit board (PCB), which at least carries a main control, power electronic devices for driving the operation of a stator assembly and other peripheral circuits, so that the driving circuit board 1 can at least realize the function of driving the operation of the stator assembly.

[0033] At least one side of the driving circuit board 1 carries a plurality of high heat generating components 11.

[0034] It should be noted that the high heat generating component 11 can be a power electronic device (such as a field effect tube, a thyristor, an IGBT, etc.), a driving / control device (such as a master control, a special chip, etc.), or a basic component (such as a capacitor, a resistor, a transformer, etc.); the high heat generating component 11 can be a packaged device (such as a surface mount packaged device, which is commonly used for field effect tubes), or a bare device; the high heat generating component 11 can be mounted on the driving circuit board 1 by surface mounting or plug-in mounting; it can be understood that a component that generates enough heat to affect the normal operation of the driving circuit board 1, or a component that has heat dissipation requirements, can be defined as a high heat generating component 11.

[0035] In this embodiment, a surface mount packaged field effect tube (MOSFET) is taken as a typical example of the high heat generating component 11 to explain the technical solution of the present application.

[0036] The high heat generating component 11 (i.e., the surface mount packaged field effect tube) of this embodiment is mounted on the driving circuit board 1 in an array form; regardless of the form of the high heat generating component 11, it is mounted on the driving circuit board 1 by welding (i.e., there is a welding material between the high heat generating component 11 and the body of the driving circuit board 1, and the welding material usually has good heat conduction performance), so that the heat generated by the high heat generating component 11 is easily conducted to the body of the driving circuit board 1, thereby forming a high heat generating area on the driving circuit board 1, which has the highest heat dissipation requirements.

[0037] In order to provide an output terminal structure of the driving circuit board 1 and effectively conduct the heat in the high heat generating area of the driving circuit board 1, a current-carrying and heat dissipating terminal 2 is also mounted on the driving circuit board 1.

[0038] The current-carrying and heat dissipating terminal 2 not only serves as a current-carrying terminal, but also serves as a heat dissipating terminal, so the current-carrying and heat dissipating terminal 2 is a one-piece hardware terminal, and its material has good current-carrying and heat conduction performance; in this embodiment, the current-carrying and heat dissipating terminal 2 is a copper terminal, such as pure copper or alloy copper with a heat conductivity coefficient of 350-400 W / (m*K).

[0039] The current-carrying and heat dissipating terminal 2 includes a flat plate mounting body 21, an external connecting body 22 for contact connection with an external conductor, and an intermediate connecting body 23 connecting the flat plate mounting body 21 and the external connecting body 22, i.e., the flat plate mounting body 21, the intermediate connecting body 23, and the external connecting body 22 are a one-piece structure.

[0040] The flat-plate-attaching body 21 of the current-carrying and heat-dissipating terminal 2 is attached to the other side of the driving circuit board 1 relative to the high-heat-generating component 11, and when the projection direction is perpendicular to the driving circuit board 1, the projection of the flat-plate-attaching body 21 has an overlapping relationship with the projection of the high-heat-generating component 11, so that the flat-plate-attaching body 21 can exchange heat with at least part of the high-heat-generating component 11 through the driving circuit board 1; Figure 3 The relative position relationship between the flat-plate-attaching body 21 and the high-heat-generating component 11 is shown in a perspective view (the components shown by the dashed lines are the flat-plate-attaching body 21).

[0041] Specifically, the flat-plate-attaching body 21 of the current-carrying and heat-dissipating terminal 2 is integrally formed with a plurality of terminal pins 211, and in fact, the plurality of terminal pins 211 can be integrally formed on the flat-plate-attaching body 21 by stamping or one-piece die casting; the driving circuit board 1 is provided with a plurality of circuit board through holes 12 beside at least part of the high-heat-generating component 11, and the number and position of the circuit board through holes 12 correspond to the terminal pins 211 of the current-carrying and heat-dissipating terminal 2; in this embodiment, the circuit board through holes 12 are through holes with copper plating on both sides of the driving circuit board 1, which facilitates the welding process and improves the heat dissipation performance of the driving circuit board 1 at each circuit board through hole 12; each terminal pin 211 of the current-carrying and heat-dissipating terminal 2 is inserted into and welded in each circuit board through hole 12 of the driving circuit board 1, and the flat-plate-attaching body 21 of the current-carrying and heat-dissipating terminal 2 is tightly attached to the surface of the driving circuit board 1; the flat-plate-attaching body 21 of the current-carrying and heat-dissipating terminal 2 is tightly attached to the surface of the driving circuit board 1, so that the current-carrying and heat-dissipating terminal 2 and the driving circuit board 1 can easily exchange heat, in addition, each terminal pin 211 of the current-carrying and heat-dissipating terminal 2 is inserted into and welded in each circuit board through hole 12 of the driving circuit board 1, so that each terminal pin 211 can also exchange heat with the driving circuit board 1, thereby enabling the current-carrying and heat-dissipating terminal 2 to absorb heat beside the high-heat-generating component 11; in this embodiment, each terminal pin 211 of the current-carrying and heat-dissipating terminal 2 is in clearance fit with each circuit board through hole 12 of the driving circuit board 1, which facilitates the insertion of the terminal pin 211 into the circuit board through hole 12; in this embodiment, the connection between each terminal pin 211 of the current-carrying and heat-dissipating terminal 2 and the flat-plate-attaching body 21 is chamfered or rounded to guide the insertion of the terminal pin 211 into the circuit board through hole 12.

[0042] Further, in the current-carrying and heat-dissipating terminal 2, a crack arrest groove 213 is formed on each side of each terminal pin 211, that is, the crack arrest groove 213 is a small groove body integrally formed on each side of each terminal pin 211, and the crack arrest groove 213 can be formed by punching or machining; the crack arrest groove 213 can avoid burrs generated during the molding of the terminal pin 211, so that when the terminal pin 211 of the current-carrying and heat-dissipating terminal 2 is inserted into the circuit board through hole 12 of the driving circuit board 1, the current-carrying and heat-dissipating terminal 2 does not interfere with the driving circuit board 1, thereby ensuring the tightness and flatness when the current-carrying and heat-dissipating terminal 2 is attached to the driving circuit board 1.

[0043] Further, the driving circuit board 1 is provided with a plurality of pads at the corresponding positions of the current-carrying and heat-dissipating terminal 2, and it can be understood that the pads are electrically connected to the components on the driving circuit board 1 (the electrical connection is achieved by printing a circuit); the flat plate attachment body 21 of the current-carrying and heat-dissipating terminal 2 is welded on the pads of the driving circuit board 1, which realizes the electrical connection between the current-carrying and heat-dissipating terminal 2 and the components on the driving circuit board 1, and further improves the heat exchange efficiency between the driving circuit board 1 and the current-carrying and heat-dissipating terminal 2 through the pads and the welding material.

[0044] Further, in the current-carrying and heat-dissipating terminal 2, a plurality of through holes 212 are formed in the flat plate attachment body 21, the through holes 212 are through holes penetrating through both sides of the flat plate attachment body 21, and the through holes 212 can be formed by punching or machining; the through holes 212 can allow the welding material to pass through itself to the bottom of the flat plate attachment body 21, and the through holes 212 can also allow the welding material to be stored therein; the through holes 212 can facilitate the welding and fixation of the current-carrying and heat-dissipating terminal 2, and make the welding of the current-carrying and heat-dissipating terminal 2 more reliable, and further improve the heat exchange efficiency between the driving circuit board 1 and the current-carrying and heat-dissipating terminal 2 through the welding material.

[0045] Further, the current-carrying and heat-dissipating structure of the driving circuit board of the embodiment further comprises a main heat-conducting plate 3, which is a plate-shaped workpiece made of metal material, such as stainless steel or aluminum alloy material, and can be used as a structural member of a water pump (especially an electronic water pump). The main heat-conducting plate 3 has good heat-conducting performance. The driving circuit board 1 is mounted on the main heat-conducting plate 3, or the driving circuit board 1 is attached to the main heat-conducting plate 3, so that the flat plate attachment body 21 of the current-carrying and heat-dissipating terminal 2 can exchange heat with the main heat-conducting plate 3. In the embodiment, a positioning column is formed on the main heat-conducting plate 3, and a positioning hole is formed on the driving circuit board 1. The positioning column of the main heat-conducting plate 3 cooperates with the positioning hole of the driving circuit board 1 to position the driving circuit board 1. If the positioning column of the main heat-conducting plate 3 and the positioning hole of the driving circuit board 1 are in interference fit, the driving circuit board 1 can be fixed. Alternatively, the driving circuit board 1 can be locked and fixed on the main heat-conducting plate 3 by buckling or screwing. The main heat-conducting plate 3 can exchange heat with liquid medium and / or gaseous medium to conduct heat out.

[0046] Further, the surface of the main heat-conducting plate 3 is concave, forming a heat-conducting recess 31, which is matched in shape with the flat plate attachment body 21 of the current-carrying and heat-dissipating terminal 2. In fact, the heat-conducting recess 31 can be formed on the surface of the main heat-conducting plate 3 by integral die casting or machining. When the driving circuit board 1 is mounted on the main heat-conducting plate 3, the flat plate attachment body 21 of the current-carrying and heat-dissipating terminal 2 is embedded in the heat-conducting recess 31 of the main heat-conducting plate 3. In this way, the heat exchange area between the current-carrying and heat-dissipating terminal 2 and the main heat-conducting plate 3 can be increased, thereby improving the heat exchange efficiency between the current-carrying and heat-dissipating terminal 2 and the main heat-conducting plate 3.

[0047] Further, the driving circuit board 1 also carries a plurality of high-heat-generating components 11 on the same side of the current-carrying and heat-dissipating terminal 2, that is, the driving circuit board 1 carries a plurality of high-heat-generating components 11 on both sides. The surface of the main heat-conducting plate 3 is concave, forming a component recess 32, which can be formed on the surface of the main heat-conducting plate 3 by integral die casting or machining. When the driving circuit board 1 is mounted on the main heat-conducting plate 3, the high-heat-generating components 11 on the driving circuit board 1 are embedded in the component recess 32 of the main heat-conducting plate 3. In this way, the heat exchange area between the high-heat-generating components 11 and the main heat-conducting plate 3 can be increased, thereby improving the heat exchange efficiency between the high-heat-generating components 11 and the main heat-conducting plate 3.

[0048] It should be noted that the body of the drive circuit board 1, each component on the drive circuit board 1 (including the high-heat component 11), and the current-carrying and heat-dissipating terminal 2 on the drive circuit board 1 are all not in contact with the main heat-conducting plate 3, and the fixing structure of the drive circuit board 1 and the main heat-conducting plate 3 should also be insulated to avoid short circuit between the drive circuit board 1 and the main heat-conducting plate 3.

[0049] Further, a heat-conducting medium is filled between the drive circuit board 1 and the main heat-conducting plate 3, in particular, the current-carrying and heat-dissipating terminal 2 of the drive circuit board 1 and the main heat-conducting plate 3, and the high-heat component 11 of the drive circuit board 1 and the main heat-conducting plate 3 are all filled with the heat-conducting medium, so as to fill the gap between the drive circuit board 1 and the main heat-conducting plate 3 with the heat-conducting medium, and further improve the heat exchange efficiency between the drive circuit board 1 and the main heat-conducting plate 3; in the embodiment, the heat-conducting medium is an insulating heat-conducting gel, so as to ensure the insulation performance between the drive circuit board 1 and the main heat-conducting plate 3.

[0050] Further specifically, the external connecting body 22 of the current-carrying and heat-dissipating terminal 2 includes two clamping arms 221 opposite to each other, which form an open structure for inserting the conductor between the two clamping arms 221; in order to increase the clamping force of the two clamping arms 221 on the conductor, the free ends of the two clamping arms 221 are narrowed to form clamping arm narrowing portions 222; and in order to further increase the clamping force of the two clamping arms 221 on the conductor, the inner sides of the two clamping arms 221 are protruded to form clamping arm protruding ribs 223, that is, the clamping arm protruding ribs 223 are integrally formed on the inner sides of the two clamping arms 221, which can be used to press the conductor to deform the conductor to some extent, so as to effectively increase the clamping force of the two clamping arms 221 on the conductor; the middle connecting body 23 of the current-carrying and heat-dissipating terminal 2 forms a straight neck portion 231, which is in the form of a flat plate in the embodiment; the middle connecting body 23 is arranged as the straight neck portion 231, so that the external connecting body 22 can be extended to an avoiding position (that is, to avoid interference with the main heat-conducting plate 3), and also can provide elastic support for the external connecting body 22.

[0051] Please refer to Figure 6 The embodiment also provides a water pump including the current-carrying and heat-dissipating two-in-one structure of the drive circuit board.

[0052] The water pump of the embodiment is provided with a water pump body 10, and a cavity 20 is formed in the water pump body 10, which is used for flowing of liquid medium; it can be understood that the flow of the liquid medium is driven by a rotor assembly and an impeller of the water pump body 10, and the rotor assembly of the water pump body 10 is driven by a rotating magnetic field generated by a stator assembly.

[0053] The main heat-conducting plate 3 is used as an inner end cover of the water pump body 10 to close the rear opening of the cavity 20, and the main heat-conducting plate 3 can directly contact the liquid medium in the cavity 20 to exchange heat with the liquid medium, and the heat of the main heat-conducting plate 3 can be quickly taken away by the flowing liquid medium to quickly dissipate the heat of the driving circuit board 1 (especially the high-heat-generating component 11).

[0054] The driving circuit board of the embodiment is provided with the current-carrying and heat-dissipating terminal 2, which is used as the current channel of the driving circuit board 1 and can carry larger current through the large-area flat plate body 21, and the current-carrying and heat-dissipating terminal 2 is used for heat conduction to quickly take away the heat generated by the high-heat-generating component 11, so that the driving circuit board 1 can have better heat dissipation performance.

[0055] Although the embodiments of the utility model have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirits of the utility model, and the scope of the utility model is defined by the appended claims and their equivalents.

Claims

1. A combined current-carrying and heat-dissipating structure for a drive circuit board, characterized in that, Including the driver circuit board; At least one side of the driving circuit board is equipped with a plurality of high-heat-generating components, and the driving circuit board is also equipped with a current-carrying-heat-dissipating terminal. The current-carrying-heat-dissipating terminal includes a flat plate mount, an external connector for contacting and connecting with an external conductor, and an intermediate connector connecting the flat plate mount and the external connector. The flat plate of the current-carrying-heat-dissipating terminal is attached to the other side of the driving circuit board opposite to the high-heat-generating component. When the projection direction is perpendicular to the driving circuit board, the projection of the flat plate overlaps with the projection of the high-heat-generating component, so that the flat plate can exchange heat with at least a portion of the high-heat-generating component through the driving circuit board.

2. The current-carrying and heat-dissipating combined structure of the driving circuit board according to claim 1, characterized in that, The current-carrying and heat-dissipating terminal has a number of terminal pins integrally formed on its flat plate mounting body. The driving circuit board has through holes on the side of at least some of the high-heat-generating components, and the number and position of the through holes correspond to the terminal pins of the current-carrying-heat-dissipating terminal. Each terminal pin of the current-carrying and heat-dissipating terminal is inserted into and soldered into each circuit board through hole of the driving circuit board, and the flat plate of the current-carrying and heat-dissipating terminal is in close contact with the surface of the driving circuit board.

3. The current-carrying and heat-dissipating combined structure of the driving circuit board according to claim 2, characterized in that, In the current-carrying and heat-dissipating terminal, anti-crack grooves are formed on both sides of each terminal pin.

4. The current-carrying and heat-dissipating combined structure of the driving circuit board according to claim 2, characterized in that, The drive circuit board has a number of pads arranged at the corresponding positions of the current-carrying and heat-dissipating terminals. The flat plate mount of the current-carrying-heat-dissipating terminal is soldered onto the pads of the drive circuit board.

5. The current-carrying and heat-dissipating combined structure of the driving circuit board according to claim 4, characterized in that, In the current-carrying and heat-dissipating terminal, a plurality of through holes are provided at the flat plate mounting body; The through-hole allows the welding material to pass through itself to reach the bottom of the flat plate substrate, and the through-hole also allows the welding material to remain therein.

6. The current-carrying and heat-dissipating combined structure of the driving circuit board according to claim 1, characterized in that, It also includes the main hot plate component; The driving circuit board is mounted on the main heat sink, or the driving circuit board is attached to the main heat sink so that the flat plate of the current-carrying-heat sink terminal can exchange heat with the main heat sink. The main heating plate is capable of exchanging heat with liquid and / or gaseous media to dissipate heat.

7. The current-carrying and heat-dissipating combined structure of the driving circuit board according to claim 6, characterized in that, The surface of the main heat-conducting plate is recessed to form a heat-conducting groove, and the shape of the heat-conducting groove matches the shape of the flat plate of the current-carrying and heat-dissipating terminal. When the drive circuit board is installed on the main heat sink, the flat plate mount of the current-carrying-heat dissipation terminal is embedded in the heat-conducting groove of the main heat sink.

8. The current-carrying and heat-dissipating combined structure of the driving circuit board according to claim 7, characterized in that, A thermally conductive medium is filled between the drive circuit board and the main heat sink.

9. The current-carrying and heat-dissipating combined structure of the driving circuit board according to claim 1, characterized in that, The external connector of the current-carrying-heat-dissipating terminal includes two clamping arms that are opposite each other. The free ends of the two clamping arms narrow to form the clamping arm narrowing section, and the inner sides of the two clamping arms protrude to form clamping arm ribs. The intermediate connector of the current-carrying and heat-dissipating terminal forms a straight neck.

10. A water pump, characterized in that, The current-carrying and heat-dissipating structure of the driving circuit board as described in any one of claims 1-9 is included.

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