Heat dissipation device and cooking equipment

Abstract

The utility model discloses a heat dissipation device and cooking equipment, the heat dissipation device comprises a fan assembly, the fan assembly comprises a first fan and a second fan, the first fan is arranged on the rear side of a power supply of the cooking equipment, and the second fan is arranged on the rear side of a PCB of the cooking equipment; an air duct is arranged in the air duct structure, an air inlet hole communicated with the air duct is formed in the rear end of the air duct structure, an air outlet hole communicated with the air duct is formed in the front end of the air duct structure, and the air inlet hole is communicated with the front end of the power source and the front end of the PCB. According to the heat dissipation device provided by the utility model, through the arrangement of the first fan and the second fan, the heat dissipation effect on the power supply is realized, the heat dissipation of the power supply and the heat dissipation of the PCB can be relatively independent, the heat generated during the heat dissipation of the power supply is prevented from influencing the PCB, the heat dissipation effect of the power supply can be ensured, and meanwhile, the PCB is ensured to have a relatively good heat dissipation effect; the structure is simple.

Description

TECHNICAL FIELD

[0001] The utility model relates to kitchen electrical technology field especially, relates to a heat dissipation device and cooking equipment. BACKGROUND

[0002] The power supply of the microwave oven steaming oven generally adopts the frequency conversion power supply, and the frequency conversion power supply is easy to heat when working, which will affect the working and service life of the frequency conversion power supply itself, and also cause the temperature of the PCB board arranged on the side of the frequency conversion power supply to further rise, which is easy to affect the working and service life of the PCB board.

[0003] Therefore, a heat dissipation device is needed to solve the above problems. UTILITY MODEL CONTENT

[0004] The utility model aims at at least in a certain extent solve one of the problems existing in prior art related, and for this purpose, the utility model provides a heat dissipation device, through setting up first fan and second fan, realized the heat dissipation effect of power supply, can be relative independence of power supply and the heat dissipation of PCB board, avoid the heat of power supply heat dissipation influence PCB board, and then can guarantee the heat dissipation effect of power supply, also guarantee that PCB board has good heat dissipation effect, simple structure.

[0005] The above purpose is realized by the following technical scheme:

[0006] A heat dissipation device, comprising:

[0007] Fan assembly, including first fan and second fan, the first fan is arranged at the back of the power supply of cooking equipment, and the second fan is arranged at the back of the PCB board of the cooking equipment;

[0008] Air duct structure, which is provided with an air duct, the rear end of the air duct structure is provided with an air inlet hole in communication with the air duct, and the front end of the air duct structure is provided with an air outlet hole in communication with the air duct, and the air inlet hole is in communication with the front end of the power supply and the front end of the PCB board.

[0009] Optionally, the air duct structure comprises an upper cover plate and a lower cover plate detachably connected to each other, the upper cover plate is arranged on the upper side of the lower cover plate and forms the air duct together with the lower cover plate.

[0010] Optionally, the air duct structure further comprises a partition structure, the partition structure is arranged between the upper cover plate and the lower cover plate in the front-rear direction, the partition structure divides the air duct into a first air duct and a second air duct, the air inlet hole comprises a first air inlet hole and a second air inlet hole, the first air inlet hole is arranged at the rear side of the first air duct and is in communication with the front end of the power supply, and the second air inlet hole is arranged at the rear side of the second air duct and is in communication with the front end of the PCB board.

[0011] Optionally, the separation structure comprises a clamping groove and a clamping plate, the clamping groove is arranged on one of the upper cover plate and the lower cover plate, and the clamping plate is arranged on the other one of the upper cover plate and the lower cover plate, and the clamping plate is clamped into the clamping groove.

[0012] Optionally, the upper cover plate comprises a cover plate body, a first air inlet guide cover plate and a second air inlet guide cover plate are arranged at the rear end of the cover plate body, an arc-shaped guide surface is arranged between the upper side plate and the front side plate of the first air inlet guide cover plate, and / or an arc-shaped guide surface is arranged between the upper side plate and the front side plate of the second air inlet guide cover plate, the first air inlet guide cover plate and the lower cover plate enclose the first air inlet hole, and the second air inlet guide cover plate and the lower cover plate enclose the second air inlet hole.

[0013] Optionally, the power supply comprises a power supply shell and a power supply body arranged in the power supply shell, and the first fan is arranged at the rear side of the power supply shell.

[0014] Optionally, the rear part of the air duct structure is connected with the front end of the power supply shell, so that the first air inlet hole is in communication with the front end of the power supply shell.

[0015] Optionally, the PCB board comprises a PCB board shell and a PCB board body arranged in the PCB board shell, and the second fan is arranged at the rear side of the PCB board shell.

[0016] Optionally, the rear part of the air duct structure is connected with the front end of the PCB board shell, so that the second air inlet hole is in communication with the front end of the PCB board shell.

[0017] The utility model discloses a cooking equipment on another aspect, including the casing, the cooking inner bag of setting in the casing, the control panel and the door body of setting in the front side of the casing, the power and the PCB board of setting in the upper side of the casing, the door body is located the below of control panel and is arranged with the control panel interval, still include the heat abstractor of above, the heat abstractor installs in the upper side of the casing, the air outlet is located between control panel and the door body.

[0018] Compared with the prior art, the utility model at least has following beneficial effect:

[0019] The heat abstractor provided by the utility model realizes the heat dissipation effect of the power supply through the first fan and the second fan, and the heat dissipation of the power supply and the PCB board can be relatively independent, so that the heat of the power supply during heat dissipation does not affect the PCB board, and the heat dissipation effect of the power supply is ensured, and the PCB board also has good heat dissipation effect, and the structure is simple. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 is a three-dimensional structure schematic view of the cooking equipment provided by the utility model;

[0021] Figure 2 is an assembly schematic view between the heat dissipation device of the cooking equipment, the fan assembly after removing, the power supply and the PCB board;

[0022] Figure 3 is Figure 2 an exploded view;

[0023] Figure 4 is Figure 2 a top view;

[0024] Figure 5 is Figure 4 a sectional view at A-A of

[0025] in the figure:

[0026] 1, power supply;

[0027] 2, PCB board;

[0028] 31, fan assembly; 311, first fan; 312, second fan; 32, air duct structure; 321, air inlet hole; 3211, first air inlet hole; 3212, second air inlet hole; 322, air outlet hole; 33, upper cover plate; 331, cover plate body; 332, first air inlet guide cover plate; 333, second air inlet guide cover plate; 34, lower cover plate; 35, separation structure; 351, clamping groove; 352, clamping plate;

[0029] 4, shell;

[0030] 5, control panel;

[0031] 6, door body;

[0032] 100, first air duct; 200, second air duct. DETAILED DESCRIPTION

[0033] The following examples illustrate the utility model, but the utility model is not limited by these examples. The specific implementation of the utility model is modified or some technical features are replaced equivalently without departing from the spirit of the utility model scheme, and they should be covered in the technical scheme range of the utility model claimed.

[0034] Please refer to Figures 1-5The utility model provides a kind of heat dissipation device, including fan assembly 31 and air duct structure 32.Fan assembly 31 includes first fan 311 and second fan 312, first fan 311 is arranged at the rear side of power supply 1 of cooking equipment, and second fan 312 is arranged at the rear side of PCB board 2 of cooking equipment.Air duct is provided in air duct structure 32, and the rear end of air duct structure 32 is provided with air inlet hole 321 communicated with air duct, and the front end of air duct structure 32 is provided with air outlet hole 322 communicated with air duct, and air inlet hole 321 is communicated with the front end of power supply 1 and the front end of PCB board 2.

[0035] The heat dissipation device provided by the utility model realizes the heat dissipation effect of power supply 1 by setting first fan 311 and second fan 312, and the heat dissipation of power supply 1 and PCB board 2 can be relatively independent, so that the heat of power supply 1 during heat dissipation does not affect PCB board 2, and the heat dissipation effect of power supply 1 is ensured, and the heat dissipation effect of PCB board 2 is also ensured, and the structure is simple.

[0036] Optionally, air duct structure 32 includes mutually detachably connected upper cover plate 33 and lower cover plate 34, and upper cover plate 33 is arranged on the upper side of lower cover plate 34 and forms air duct with lower cover plate 34, which is simple in structure and easy to manufacture and install.

[0037] Optionally, air duct structure 32 further includes separation structure 35, which is arranged between upper cover plate 33 and lower cover plate 34 in the front-rear direction, and separation structure 35 separates air duct into first air duct 100 and second air duct 200, and air inlet hole 321 includes first air inlet hole 3211 and second air inlet hole 3212, first air inlet hole 3211 is arranged at the rear side of first air duct 100 and communicated with the front end of power supply 1, and second air inlet hole 3212 is arranged at the rear side of second air duct 200 and communicated with the front end of PCB board 2.

[0038] Optionally, separation structure 35 includes clamping groove 351 and clamping plate 352, clamping groove 351 is arranged on one of upper cover plate 33 and lower cover plate 34, and clamping plate 352 is arranged on the other one of upper cover plate 33 and lower cover plate 34, and clamping plate 352 is clamped into clamping groove 351, which is simple in structure and easy to manufacture.

[0039] Optionally, the upper cover plate 33 comprises a cover plate body 331, a first air inlet guide cover plate 332 and a second air inlet guide cover plate 333 are arranged at the rear end of the cover plate body 331, an arc-shaped guide surface is arranged between the upper side plate and the front side plate of the first air inlet guide cover plate 332, and / or an arc-shaped guide surface is arranged between the upper side plate and the front side plate of the second air inlet guide cover plate 333, the first air inlet guide cover plate 332 and the lower cover plate 34 together enclose a first air inlet hole 3211, and the second air inlet guide cover plate 333 and the lower cover plate 34 together enclose a second air inlet hole 3212. By arranging the arc-shaped guide surface, the hot air can be guided to be smoothly discharged into the air duct and then discharged outside the cooking equipment through the air outlet hole 322.

[0040] Optionally, the power supply 1 comprises a power supply shell and a power supply body arranged in the power supply shell, and the first fan 311 is arranged at the rear side of the power supply shell. By arranging the power supply shell to cover the power supply body, on the one hand, the power supply body is protected, and on the other hand, the heat generated by the power supply body during operation can be trapped in the power supply shell, so that the heat generated by the power supply body can flow into the first air duct 100 along the power supply shell during operation of the first fan 311 and then be discharged from the air outlet hole 322.

[0041] Optionally, the rear part of the air duct structure 32 is connected with the front end of the power supply shell, so that the first air inlet hole 3211 is in communication with the front end of the power supply shell, to prevent the heat in the power supply shell from flowing out between the air duct structure 32 and the power supply shell.

[0042] Optionally, the PCB board 2 comprises a PCB board shell and a PCB board body arranged in the PCB board shell, and the second fan 312 is arranged at the rear side of the PCB board shell. By arranging the PCB board shell to cover the PCB board body, on the one hand, the PCB board body is protected, and on the other hand, the heat generated by the PCB board body during operation can be trapped in the PCB board shell, so that the heat generated by the PCB board body can flow into the second air duct 200 along the PCB board shell during operation of the second fan 312 and then be discharged from the air outlet hole 322.

[0043] Optionally, the rear part of the air duct structure 32 is connected with the front end of the PCB board shell, so that the second air inlet hole 3212 is in communication with the front end of the PCB board shell, to prevent the heat in the PCB board shell from flowing out between the air duct structure 32 and the PCB board shell.

[0044] The utility model provides a kind of cooking equipment, including shell 4, the cooking inner bag being arranged in shell 4, control panel 5 and door body 6 being arranged in the front side of shell 4, power supply 1 and PCB board 2 being arranged in the upper side of shell 4, door body 6 is below control panel 5 and interval arrangement with control panel 5, still include the heat sink of above-mentioned, heat sink is installed in the upper side of shell 4, air outlet hole 322 is between control panel 5 and door body 6, to facilitate hot air to discharge the front side of cooking equipment, simple and compact structure.

[0045] The above only some embodiments of the utility model. For the ordinary skilled person in the art, without departing from the utility model creation concept, can also make a number of deformation and improvement, these all belong to the protection scope of the utility model.

Claims

1. A heat dissipation device, characterized in that, include: The fan assembly (31) includes a first fan (311) and a second fan (312), wherein the first fan (311) is disposed on the rear side of the power supply (1) of the cooking device, and the second fan (312) is disposed on the rear side of the PCB board (2) of the cooking device; A duct structure (32) is provided therein, and an air inlet (321) communicating with the air duct is provided at the rear end of the duct structure (32), and an air outlet (322) communicating with the air duct is provided at the front end of the duct structure (32), and the air inlet (321) is connected to the front end of the power supply (1) and the front end of the PCB board (2).

2. The heat dissipation device according to claim 1, characterized in that, The air duct structure (32) includes an upper cover plate (33) and a lower cover plate (34) that are detachably connected to each other. The upper cover plate (33) covers the upper side of the lower cover plate (34) and encloses the lower cover plate (34) to form the air duct.

3. The heat dissipation device according to claim 2, characterized in that, The air duct structure (32) further includes a partition structure (35), which is disposed between the upper cover plate (33) and the lower cover plate (34) in the front-back direction. The partition structure (35) divides the air duct into a first air duct (100) and a second air duct (200). The air inlet (321) includes a first air inlet (3211) and a second air inlet (3212). The first air inlet (3211) is disposed on the rear side of the first air duct (100) and communicates with the front end of the power supply (1). The second air inlet (3212) is disposed on the rear side of the second air duct (200) and communicates with the front end of the PCB board (2).

4. The heat dissipation device according to claim 3, characterized in that, The partition structure (35) includes a slot (351) and a plate (352). The slot (351) is disposed on one of the upper cover plate (33) and the lower cover plate (34), and the plate (352) is disposed on the other of the upper cover plate (33) and the lower cover plate (34). The plate (352) is engaged in the slot (351).

5. The heat dissipation device according to claim 3, characterized in that, The upper cover plate (33) includes a cover plate body (331). The rear end of the cover plate body (331) is provided with a first air inlet guide cover plate (332) and a second air inlet guide cover plate (333). An arc-shaped guide surface is provided between the upper side plate and the front side plate of the first air inlet guide cover plate (332), and / or an arc-shaped guide surface is provided between the upper side plate and the front side plate of the second air inlet guide cover plate (333). The first air inlet guide cover plate (332) and the lower cover plate (34) enclose each other to form a first air inlet hole (3211), and the second air inlet guide cover plate (333) and the lower cover plate (34) enclose each other to form a second air inlet hole (3212).

6. The heat dissipation device according to any one of claims 3-5, characterized in that, The power supply (1) includes a power supply housing and a power supply body disposed within the power supply housing, and the first fan (311) is disposed on the rear side of the power supply housing.

7. The heat dissipation device according to claim 6, characterized in that, The rear part of the air duct structure (32) is connected to the front end of the power supply housing so that the first air inlet (3211) communicates with the front end of the power supply housing.

8. The heat dissipation device according to any one of claims 3-5, characterized in that, The PCB board (2) includes a PCB board shell and a PCB board body disposed within the PCB board shell, and the second fan (312) is disposed on the rear side of the PCB board shell.

9. The heat dissipation device according to claim 8, characterized in that, The rear part of the air duct structure (32) is connected to the front end of the PCB board shell so that the second air inlet (3212) is connected to the front end of the PCB board shell.

10. A cooking appliance, comprising a housing (4), a cooking inner pot disposed within the housing (4), a control panel (5) disposed on the front side of the housing (4), a door (6), a power supply (1) and a PCB board (2) disposed on the upper side of the housing (4), wherein the door (6) is located below the control panel (5) and spaced apart from the control panel (5), characterized in that, It also includes the heat dissipation device according to any one of claims 1-9, the heat dissipation device being installed on the upper side of the housing (4), and the air outlet (322) being located between the control panel (5) and the door (6).

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