Separation jig and substrate separation device

Abstract

The utility model provides a separation jig and a substrate separation device, and relates to the technical field of semiconductor processing. The separating jig comprises a fixing assembly, a clamping assembly and a separating assembly. The fixing assembly is provided with a fixing groove, the fixing groove is used for placing the substrate bonding structure, the substrate bonding structure comprises a micro LED chip and an auxiliary separation part, and a substrate layer of the micro LED chip is connected with the auxiliary separation part; the clamping assembly is used for clamping and fixing the micro LED chip; the separation assembly comprises a wedge-shaped structure and a first driving part, the driving end of the first driving part is connected with the wedge-shaped structure, and the first driving part is used for driving the wedge-shaped structure to move in the direction parallel to the substrate layer. According to the separating jig, the surface of the driving chip in the micro LED chip can be prevented from being scratched, meanwhile, the stress of the substrate layer is more uniform, the situation that the four edges of the micro LED chip are broken is not prone to occurring, and therefore the product yield can be improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor processing, especially to a separation jig and substrate separation device. BACKGROUND

[0002] In the back-end process of micro LED (Micro light emitting diode) chip preparation, the sapphire substrate needs to be separated to improve the luminous brightness.

[0003] At present, the conventional separation mode is manual prying separation. However, in the prying process, the prying knife is easy to touch the driving chip, causing the surface of the driving chip to be scratched, and thus leading to low product yield. UTILITY MODEL CONTENT

[0004] In order to solve the problems in the prior art, one of the purposes of the utility model is to provide a separation jig.

[0005] The utility model provides the following technical scheme:

[0006] A separation jig comprises:

[0007] A fixing assembly is provided with a fixing groove for placing a substrate bonding structure, the substrate bonding structure comprising a micro LED chip and an auxiliary separation piece, and the substrate layer of the micro LED chip being connected with the auxiliary separation piece;

[0008] A clamping assembly is used to clamp and fix the micro LED chip; and

[0009] A separation assembly comprises a wedge-shaped structure and a first driving piece, the driving end of the first driving piece being connected with the wedge-shaped structure, and the first driving piece being used to drive the wedge-shaped structure to move in a direction parallel to the substrate layer.

[0010] As a further optional scheme of the separation jig, the first driving piece comprises a first lead screw and a first fixing seat, the first lead screw being provided in the first fixing seat and being threadedly matched with the first fixing seat, and one end of the first lead screw being rotationally connected with the wedge-shaped structure.

[0011] As a further optional scheme of the separation jig, the separation assembly further comprises a first sliding rail and a first sliding block, the first sliding block being slidingly arranged on the first sliding rail in the moving direction of the wedge-shaped structure, and the first sliding block being connected with the wedge-shaped structure.

[0012] As a further optional scheme of the separation jig, the separation assembly is arranged in pairs on both sides of the clamping assembly.

[0013] As a further optional solution to the separation tool, the wedge structure has a width W1, and the substrate layer has a width W2, W1 >= W2.

[0014] As a further optional solution to the separation tool, the clamping assembly includes a clamping piece and a second driving piece, a driving end of the second driving piece is connected to the clamping piece, and the second driving piece is used to drive the clamping piece to abut against the micro-LED chip in the fixed groove.

[0015] As a further optional solution to the separation tool, the second driving piece includes a second screw rod and a second fixed seat, the second screw rod is arranged in the second fixed seat and threadedly cooperates with the second fixed seat, and one end of the second screw rod is rotationally connected to the clamping piece.

[0016] As a further optional solution to the separation tool, the clamping assembly further includes a second sliding rail and a second sliding block, the second sliding block is slidably arranged on the second sliding rail along the moving direction of the clamping piece, and the second sliding block is connected to the clamping piece.

[0017] The utility model aims at providing a substrate separation device.

[0018] The utility model provides the following technical scheme:

[0019] A substrate separation device includes the separation tool.

[0020] As a further optional solution to the substrate separation device, the substrate separation device further includes a lamination tool, a plurality of accommodation grooves for placing the micro-LED chips are arranged on the lamination tool, and the lamination tool is used to laminate the micro-LED chips and the auxiliary separation piece to form a substrate bonding structure.

[0021] The embodiments of the utility model have the following beneficial effects:

[0022] When the substrate layer of the micro-LED chip is separated, the auxiliary separation piece is first fixed with the substrate layer of the micro-LED chip to form a substrate bonding structure, then the substrate bonding structure is placed in the fixed groove of the fixed assembly by using the above separation jig, and the micro-LED chip is clamped and fixed by using the clamping assembly. Subsequently, the first driving piece drives the wedge-shaped structure to move in a direction parallel to the substrate layer, so that the wedge-shaped structure abuts against the side of the auxiliary separation piece facing the substrate layer. The wedge-shaped structure and the auxiliary separation piece are in inclined surface contact, and when the wedge-shaped structure abuts against the auxiliary separation piece in a direction parallel to the substrate layer, the force applied by the wedge-shaped structure to the auxiliary separation piece has a component in a direction perpendicular to the substrate layer. The component makes the auxiliary separation piece move away from the micro-LED chip, thereby separating the substrate layer from other parts of the micro-LED chip. In this process, the wedge-shaped structure does not contact the micro-LED chip itself, which can avoid scratching the surface of the driving chip in the micro-LED chip, thereby improving the product yield.

[0023] In order to make the above-mentioned purposes, characteristics and advantages of the utility model more obvious and easy to understand, the following preferred embodiments are taken as an example, and the accompanying drawings are described in detail as follows. BRIEF DESCRIPTION OF DRAWINGS

[0024] In order to more clearly illustrate the technical scheme of the embodiments of the utility model, the following will briefly introduce the drawings needed to be used in the embodiments, it should be understood that the following drawings only show some embodiments of the utility model, therefore should not be regarded as the limitation to the scope, for ordinary skilled person in the art, on the premise of not paying the creative labor, still can obtain other related drawings according to these drawings.

[0025] Figure 1 The overall structure schematic diagram of a separation jig provided by the embodiment of the utility model is shown.

[0026] Figure 2 The structure schematic diagram of a separation assembly in a separation jig provided by the embodiment of the utility model is shown.

[0027] Figure 3 The size relationship schematic diagram between the wedge-shaped structure, the auxiliary separation piece and the substrate layer in a separation jig provided by the embodiment of the utility model is shown.

[0028] Figure 4 The structure schematic diagram of a clamping assembly in a separation jig provided by the embodiment of the utility model is shown.

[0029] Figure 5 The structure schematic diagram of a substrate bonding structure is shown.

[0030] Figure 6 The structure schematic diagram of a substrate separation device provided by the embodiment of the utility model is shown.

[0031] Main element symbol explanation:

[0032] 100-separation jig; 110-fixing assembly; 111-fixing groove; 120-clamping assembly; 121-clamping piece; 122-second driving piece; 1221-second screw rod; 1222-second fixing seat; 1223-second hand wheel; 123-second sliding rail; 124-second sliding block; 130-separation assembly; 131-wedge structure; 132-first driving piece; 1321-first screw rod; 1322-first fixing seat; 1323-first hand wheel; 133-first sliding rail; 134-first sliding block; 140-base; 200-assistant separation piece; 210-shadowless glue layer; 300-bonding jig; 310- accommodating groove; 400-micro LED chip; 410-substrate layer. DETAILED DESCRIPTION

[0033] The embodiments of the present application are described in detail below, examples of which are shown in the drawings, wherein the same or similar notations represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only, and are used to explain the present application, and cannot be understood as a limitation of the present application.

[0034] It should be noted that when an element is referred to as being "fixed" to another element, it can be directly on the other element or there can be an intervening element. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements can be present. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements present. The terms "vertical", "horizontal", "left", "right", and similar expressions used herein are used for illustrative purposes only.

[0035] In the present application, unless specifically defined otherwise and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be broadly understood, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship of two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0036] In addition, the terms "first", "second", "third", etc. are used only for descriptive purposes and should not be construed as implying or suggesting relative importance or an ordered ranking of the indicated technical features. Thus, features defined with "first", "second", etc. can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise explicitly and specifically limited.

[0037] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the template herein is only for the purpose of describing specific embodiments and is not intended to limit the present application. The term "and / or" used herein includes any and all combinations of one or more of the associated listed items.

[0038] The inventors of the present disclosure found that, in the process of manually prying the sapphire substrate of the micro-LED chip, the pry knife easily touches the driving chip, causing the surface of the driving chip to be scratched. In addition, manual prying is unevenly stressed, which easily causes the four edges of the micro-LED chip to be cracked. Both of the above will cause low product yield.

[0039] In order to solve the problems of easy scratching of the surface of the driving chip and uneven stress in manual prying, please refer to Figure 1 and Figure 2 The present embodiment provides a separation jig 100, which comprises a fixing assembly 110, a clamping assembly 120 and a separation assembly 130.

[0040] The fixing assembly 110 is provided with a fixing groove 111, and the fixing groove 111 is used to place a substrate bonding structure. The substrate bonding structure (see Figure 5 ) comprises a micro-LED chip 400 and an auxiliary separation piece 200, and the substrate layer 410 of the micro-LED chip 400 is connected with the auxiliary separation piece 200.

[0041] Correspondingly, the clamping assembly 120 cooperates with the fixing assembly 110 and is used to clamp and fix the micro-LED chip 400.

[0042] In addition, the separation assembly 130 comprises a wedge-shaped structure 131 and a first driving piece 132. The driving end of the first driving piece 132 is connected with the wedge-shaped structure 131, and the first driving piece 132 is used to drive the wedge-shaped structure 131 to move in a direction parallel to the substrate layer 410, so that the wedge-shaped structure 131 abuts against the side of the auxiliary separation piece 200 facing the substrate layer 410.

[0043] The substrate layer 410 of the micro-LED chip 400 is separated (see Figure 5When the auxiliary separation piece 200 is used, the auxiliary separation piece 200 is first fixedly attached to the substrate layer 410 of the micro-LED chip 400 to form a substrate bonding structure, and then the substrate bonding structure is placed in the fixing groove 111 of the fixing assembly 110 by using the separation jig 100, and the micro-LED chip 400 is clamped and fixed by using the clamping assembly 120. Subsequently, the wedge-shaped structure 131 is driven by the first driving piece 132 to move in a direction parallel to the substrate layer 410, so that the wedge-shaped structure 131 abuts against the side of the auxiliary separation piece 200 facing the substrate layer 410. The wedge-shaped structure 131 and the auxiliary separation piece 200 are in inclined surface contact, and when the wedge-shaped structure 131 abuts against the auxiliary separation piece 200 in a direction parallel to the substrate layer 410, the force applied by the wedge-shaped structure 131 to the auxiliary separation piece 200 has a component in a direction perpendicular to the substrate layer 410. The component causes the auxiliary separation piece 200 to move in a direction away from the micro-LED chip 400, thereby separating the substrate layer 410 from other parts of the micro-LED chip 400. In this process, the wedge-shaped structure 131 does not contact the micro-LED chip 400 itself, which can avoid scratching the surface of the driving chip in the micro-LED chip 400, thereby improving product yield.

[0044] In some embodiments, the separation jig 100 further includes a base 140, and the fixing assembly 110, the clamping assembly 120, and the separation assembly 130 are all arranged on the base 140.

[0045] Specifically, the first driving piece 132 includes a first lead screw 1321 and a first fixed seat 1322.

[0046] The first fixed seat 1322 is fixedly connected to the base 140. The first lead screw 1321 is arranged in the first fixed seat 1322 and threadedly cooperates with the first fixed seat 1322, and one end of the first lead screw 1321 is rotationally connected to the wedge-shaped structure 131.

[0047] In use, the first lead screw 1321 is rotated, while the first fixed seat 1322 and the wedge-shaped structure 131 do not rotate. Since the first lead screw 1321 threadedly cooperates with the first fixed seat 1322, the first lead screw 1321 moves along the axis direction of itself, thereby moving the wedge-shaped structure 131.

[0048] Exemplarily, the micro-LED chip 400 clamped and fixed by the clamping assembly 120 is horizontally placed, and the direction parallel to the substrate layer 410 can be any direction in the horizontal plane. Correspondingly, the axis of the first lead screw 1321 remains horizontal.

[0049] In addition, the wedge-shaped structure 131 has a horizontal lower surface and an inclined upper surface. When the first lead screw 1321 drives the wedge-shaped structure 131 to move towards the micro LED chip 400 and the auxiliary separation piece 200, the end of the wedge-shaped structure 131 extends below the auxiliary separation piece 200, so that the inclined upper surface abuts against one side of the auxiliary separation piece 200 towards the substrate layer 410. With the continuous movement of the wedge-shaped structure 131, the auxiliary separation piece 200 is lifted upwards by the wedge-shaped structure 131, thereby driving the substrate layer 410 to separate from other parts of the micro LED chip 400.

[0050] Further, the separation assembly 130 further comprises a first sliding rail 133 and a first sliding block 134. The first sliding rail 133 is fixedly connected with the base 140. The first sliding block 134 is slidingly arranged on the first sliding rail 133 along the moving direction of the wedge-shaped structure 131, which is schematically shown in the X direction, and the first sliding block 134 is connected with the wedge-shaped structure 131.

[0051] During the movement of the wedge-shaped structure 131 driven by the first lead screw 1321, the first sliding block 134 cooperates with the first sliding rail 133 to guide and limit the wedge-shaped structure 131, so that the wedge-shaped structure 131 moves stably.

[0052] Further, the first lead screw 1321 is connected with a first hand wheel 1323 at the end away from the wedge-shaped structure 131, which facilitates the operator to rotate the first lead screw 1321.

[0053] Please refer to Figure 3 In some embodiments, the width of the wedge-shaped structure 131 is W1, and the width of the substrate layer 410 is W2, which satisfies W1≥W2.

[0054] In addition, the width of the auxiliary separation piece 200 is W3, and it satisfies W1≥W3≥W2.

[0055] At this time, the entire side edge of the auxiliary separation piece 200 is abutted by the wedge-shaped structure 131, and is uniformly stressed, and the upward component force of the auxiliary separation piece 200 from the wedge-shaped structure 131 acts on the entire substrate layer 410, so that the substrate layer 410 is uniformly stressed, and the micro LED chip 400 is not easily broken at the four edges.

[0056] It can be understood that the width of the wedge-shaped structure 131 refers to the dimension of the wedge-shaped structure 131 along the horizontal direction perpendicular to the X direction, which is schematically shown in the Y direction. The width of the auxiliary separation piece 200 and the substrate layer 410 is the same, which is not described herein.

[0057] Further, the number of the separation assembly 130 is two, and the two are arranged on the two sides of the clamping assembly 120.

[0058] In use, the two wedge-shaped structures 131 are driven by the respective first lead screws 1321 to move towards each other, and abut the auxiliary separating piece 200 from both sides of the auxiliary separating piece 200, so as to synchronously lift the auxiliary separating piece 200 as a whole upwards, so that the stress on the substrate layer 410 is more uniform.

[0059] Please refer to Figure 1 and Figure 4 In some embodiments, the clamping assembly 120 comprises a clamping piece 121 and a second driving piece 122.

[0060] The driving end of the second driving piece 122 is connected to the clamping piece 121, and the second driving piece 122 is configured to drive the clamping piece 121 to abut the micro-LED chip 400 in the fixing groove 111.

[0061] In use, the micro-LED chip 400 is placed in the fixing groove 111, and then the second driving piece 122 is used to drive the clamping piece 121 to move towards the micro-LED chip 400, so as to clamp and fix the micro-LED chip 400 in cooperation with the inner wall of the fixing groove 111.

[0062] In the present embodiment, as previously described, since the width of the auxiliary separating piece 200 along the Y direction is not less than the width of the substrate layer 410, and both ends of the auxiliary separating piece 200 along the X direction need to overhang outside the substrate layer 410 for abutment by the wedge-shaped structures 131, the auxiliary separating piece 200 completely covers the upper surface of the substrate layer 410. On this basis, the second driving piece 122 drives the clamping piece 121 to move along the horizontal direction (e.g. the Y direction), so that the clamping piece 121 abuts the side surface of the micro-LED chip 400.

[0063] Specifically, the second driving piece 122 comprises a second lead screw 1221 and a second fixed seat 1222.

[0064] The second fixed seat 1222 is fixedly connected to the base 140. The second lead screw 1221 is arranged in the second fixed seat 1222 and threadedly cooperates with the second fixed seat 1222. One end of the second lead screw 1221 is rotationally connected to the clamping piece 121.

[0065] In use, the second lead screw 1221 is rotated, while the second fixed seat 1222 and the clamping piece 121 do not rotate. Since the second lead screw 1221 threadedly cooperates with the second fixed seat 1222, the second lead screw 1221 moves along the axial direction thereof, thereby driving the clamping piece 121 to move.

[0066] It can be understood that the axial direction of the second lead screw 1221 is parallel to the Y direction.

[0067] Further, the clamping assembly 120 further comprises a second sliding rail 123 and a second sliding block 124. The second sliding rail 123 is fixedly connected with the base 140. The second sliding block 124 is slidingly arranged on the second sliding rail 123 along the Y direction, and the second sliding block 124 is connected with the clamping piece 121.

[0068] During the movement of the clamping piece 121 driven by the second lead screw 1221, the second sliding block 124 cooperates with the second sliding rail 123 to guide and limit the clamping piece 121, so that the clamping piece 121 moves stably.

[0069] Further, the second end of the second lead screw 1221 away from the clamping piece 121 is connected with a second hand wheel 1223, which is convenient for the operator to rotate the second lead screw 1221.

[0070] In summary, when separating the substrate layer 410 of the micro-LED chip 400, the auxiliary separation piece 200 is first fixedly attached with the substrate layer 410 of the micro-LED chip 400 to form a substrate bonding structure, then the substrate bonding structure is placed in the fixed groove 111 of the fixing assembly 110 by using the separation jig 100, and the micro-LED chip 400 is clamped and fixed by using the clamping assembly 120. Subsequently, the wedge-shaped structure 131 is driven by the first driving piece 132 to move along a direction parallel to the substrate layer 410, so that the wedge-shaped structure 131 abuts against the side of the auxiliary separation piece 200 facing the substrate layer 410. The wedge-shaped structure 131 and the auxiliary separation piece 200 are in inclined surface contact, and when the wedge-shaped structure 131 abuts against the auxiliary separation piece 200 along a direction parallel to the substrate layer 410, the force applied by the wedge-shaped structure 131 to the auxiliary separation piece 200 has a component in a direction perpendicular to the substrate layer 410. The component causes the auxiliary separation piece 200 to move away from the micro-LED chip 400, thereby separating the substrate layer 410 from other parts of the micro-LED chip 400.

[0071] During this process, the wedge-shaped structure 131 does not contact the micro-LED chip 400 itself, which can avoid scratching the surface of the driving chip in the micro-LED chip 400, thereby improving the product yield. In addition, the force applied by the wedge-shaped structure 131 to the auxiliary separation piece 200 uniformly acts on the substrate layer 410, so that the stress on the substrate layer 410 is more uniform, and the micro-LED chip 400 is less likely to crack at the four edges, which is also conducive to improving the product yield.

[0072] Please refer to Figure 5 In some embodiments, the auxiliary separation piece 200 is made of transparent material. The auxiliary separation piece 200 is fixedly attached with the substrate layer 410 through the shadowless adhesive layer 210.

[0073] In use, the auxiliary separation piece 200 is centrally attached to the substrate layer 410 of the micro-LED chip 400 by using the shadowless glue, and then ultraviolet light is irradiated to make the shadowless glue solidify. Thus, the shadowless glue layer 210 formed by the solidified shadowless glue fixes the auxiliary separation piece 200 and the substrate layer 410 together.

[0074] Exemplarily, the auxiliary separation piece 200 adopts a glass sheet.

[0075] The embodiment also provides a substrate separation device, in particular a mechanical separation sapphire device, which comprises the separation jig 100.

[0076] Please refer to Figure 6 Further, the substrate separation device also comprises the attachment jig 300. The attachment jig 300 is provided with a plurality of accommodation grooves 310 for placing the micro-LED chip 400, and is used to attach the micro-LED chip 400 and the auxiliary separation piece 200 to form a substrate bonding structure.

[0077] In use, the plurality of micro-LED chips 400 are respectively placed in the accommodation grooves 310 on the attachment jig 300 with the substrate layer 410 of the micro-LED chip 400 facing upwards. Then the auxiliary separation piece 200 is attached to the micro-LED chip 400 by using the shadowless glue, and then ultraviolet solidification is performed.

[0078] Understandably, the attachment jig 300 can be used to batch attach and fix the auxiliary separation piece 200 and the substrate layer 410 of the micro-LED chip 400, and facilitate the transfer of the initially attached auxiliary separation piece 200 and the micro-LED chip 400 to the ultraviolet solidification equipment.

[0079] In all the examples shown and described herein, any specific values should be interpreted as merely exemplary and not as a limitation, and thus other examples of the example embodiments can have different values.

[0080] It should be noted that similar reference numbers and letters represent similar items in the following drawings, and thus, once an item is defined in one drawing, it need not be further defined and explained in subsequent drawings.

[0081] The above-described embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed, but it should not be understood as a limitation on the scope of the present application. It should be pointed out that, for ordinary skilled persons in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which all belong to the protection scope of the present application.

Claims

1. A separation tool, characterized by, The substrate separation device comprises: a fixing assembly provided with a fixing groove for placing a substrate bonding structure, the substrate bonding structure comprising a micro-LED chip and an auxiliary separation piece, and a substrate layer of the micro-LED chip being connected with the auxiliary separation piece; a clamping assembly for clamping and fixing the micro-LED chip; and a separation assembly comprising a wedge-shaped structure and a first driving piece, a driving end of the first driving piece being connected with the wedge-shaped structure, the first driving piece being used to drive the wedge-shaped structure to move in a direction parallel to the substrate layer. The first driving piece comprises a first screw rod and a first fixing seat, the first screw rod being provided through the first fixing seat and being in threaded cooperation with the first fixing seat, one end of the first screw rod being rotationally connected with the wedge-shaped structure.

2. The separation tool of claim 1, wherein The separation assembly further comprises a first sliding rail and a first sliding block, the first sliding block being slidingly arranged on the first sliding rail in a moving direction of the wedge-shaped structure, the first sliding block being connected with the wedge-shaped structure.

3. The separation tool of claim 2, wherein, The separation assembly is arranged in pairs on two sides of the clamping assembly.

4. The separation tool of claim 1, wherein A width of the wedge-shaped structure is W1, and a width of the substrate layer is W2, W1≥W2.

5. The separation tool of claim 1, wherein The clamping assembly comprises a clamping piece and a second driving piece, a driving end of the second driving piece being connected with the clamping piece, the second driving piece being used to drive the clamping piece to abut against the micro-LED chip in the fixing groove.

6. The separation tool of any one of claims 1-5, wherein, The second driving piece comprises a second screw rod and a second fixing seat, the second screw rod being provided through the second fixing seat and being in threaded cooperation with the second fixing seat, one end of the second screw rod being rotationally connected with the clamping piece.

7. The separation tool of claim 6, wherein The clamping assembly further comprises a second sliding rail and a second sliding block, the second sliding block being slidingly arranged on the second sliding rail in a moving direction of the clamping piece, the second sliding block being connected with the clamping piece.

8. The separation tool of claim 7, wherein, The substrate separation device further comprises a lamination jig provided with a plurality of accommodation grooves for placing the micro-LED chips, the lamination jig being used to laminate the micro-LED chips and the auxiliary separation piece to form the substrate bonding structure.

9. A substrate separation apparatus characterized by comprising: The substrate separation device further comprises a lamination jig provided with a plurality of accommodation grooves for placing the micro-LED chips, the lamination jig being used to laminate the micro-LED chips and the auxiliary separation piece to form the substrate bonding structure.

10. The substrate separation apparatus of claim 9, wherein ​

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