High-performance elargol curing device for semiconductor packaging

Abstract

The utility model discloses a high-performance elargol curing device for semiconductor packaging, which relates to the technical field of electronic manufacturing and comprises a main frame, a conveying belt is mounted in the middle of the main frame, a cover box is fixedly connected to the middle of the top end of the main frame, a groove is formed in the inner wall of the cover box, an electric push rod is fixedly mounted at the bottom of the groove, and the electric push rod is fixedly connected with the conveying belt. The output end of the electric push rod is fixedly connected with a transverse plate frame, an electric heating pipe is fixedly installed on the inner wall of the transverse plate frame, the top end of the cover box is fixedly connected with a top box, a fan is installed in the middle of the inner side of the top box, an activated carbon net is arranged on the top of the inner side of the top box, and a hose is arranged on the top of the top box. By arranging a series of structures, frequent adjustment of the power of the electric heating pipe is avoided, the loss of electric energy during use of the device is reduced, more energy is saved, accumulation of harmful gas in the device is avoided, and harm to human health is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to electronic manufacturing technical field, concretely is a kind of high-performance silver glue curing device for semiconductor packaging. BACKGROUND

[0002] Semiconductor packaging refers to the process that wafer tested is processed to independent chip according to product model and functional requirement, and in the packaging process, wafer is attached to the island of substrate with glue, and the glue needs to have conductive function, usually conductive silver glue is used, and the wafer after packaging needs to be cured, so that the glue can stick wafer on the substrate.

[0003] The existing high-performance silver glue for semiconductor packaging is usually heated when curing, and needs to be heated for different lengths of time under different temperature conditions, and the existing device adjusts the temperature by adjusting the power to generate different heat of heat source, which needs to frequently adjust the heating mechanism, and the continuous change of power will cause the loss of electric energy, which increases the energy consumption of the device. In addition, since silver glue is an organic adhesive, it may release toxic gases such as VOCs during heat curing, and the longer the heating time, the more gas is released. If a large amount of gas is released and accumulated in the air, it may be harmful to human health if inhaled by the human body. UTILITY MODEL CONTENT

[0004] The utility model aims at providing a kind of high-performance silver glue curing device for semiconductor packaging to solve the problems raised in the above background.

[0005] To achieve the above object, the utility model provides the following technical scheme: a kind of high-performance silver glue curing device for semiconductor packaging, including main frame, the middle part of the main frame is equipped with conveyor belt, the middle part of the top of the main frame is fixedly connected with cover box, recess is set in the inner wall of the cover box, electric push rod is fixedly installed at the bottom of the recess, the output end of the electric push rod is fixedly connected with horizontal plate frame, electric heating pipe is fixedly installed in the inner wall of the horizontal plate frame, the top of the cover box is fixedly connected with top box, fan is installed in the middle part of the inner side of the top box, activated carbon screen is equipped on the top of the inner side of the top box, the top of the top box is equipped with hose, and circulation pipe is sleeved on the top end of the hose.

[0006] Preferably, the front of the cover box is provided with a feeding port, and the back of the cover box is provided with a discharging port.

[0007] Preferably, the top of the top box is covered with a cover plate, the bottom end of the cover plate is fixedly connected with a vertical rod, and the activated carbon screen is fixedly connected with the cover plate through the vertical rod.

[0008] Preferably, the bottom end of the hose penetrates the middle of the top end of the cover plate, and the hose is communicated with the inside of the top box through the cover plate.

[0009] Preferably, the bottom end of the circulation pipe penetrates a side wall of the cover box, and the circulation pipe is communicated with the inside of the cover box.

[0010] Preferably, the horizontal plate frame is slidably connected with the groove through the electric push rod, and the horizontal plate frame is located directly above the conveying belt.

[0011] Preferably, the inside of the cover box is communicated with the inside of the top box.

[0012] Compared with the prior art, the semiconductor packaging high-performance silver glue curing device has the beneficial effects that:

[0013] The semiconductor packaging high-performance silver glue curing device can adjust the height of the horizontal frame when the temperature of the device needs to be adjusted, so that the distance between the conveying belt and the electric heating pipe on the horizontal frame changes. In this way, the electric heating pipe can generate higher heat effect at the same power, thereby avoiding frequent adjustment of the power of the electric heating pipe and reducing the power loss of the device during use, and the device is more energy-saving.

[0014] The semiconductor packaging high-performance silver glue curing device can adjust the height of the horizontal frame when the temperature of the device needs to be adjusted, so that the distance between the conveying belt and the electric heating pipe on the horizontal frame changes. In this way, the electric heating pipe can generate higher heat effect at the same power, thereby avoiding frequent adjustment of the power of the electric heating pipe and reducing the power loss of the device during use, and the device is more energy-saving. BRIEF DESCRIPTION OF DRAWINGS

[0015] Fig. 1 It is a whole structure schematic view of the utility model;

[0016] Fig. 2 It is a groove and active carbon net structure schematic view of the utility model;

[0017] Fig. 3 It is a horizontal plate frame and electric push rod structure schematic view of the utility model;

[0018] Fig. 4 It is a top box and circulation pipe structure schematic view of the utility model.

[0019] In the drawing: 1, main frame; 2, conveying belt; 3, feeding port; 4, cover box; 5, top box; 6, cover plate; 7, hose; 8, circulation pipe; 9, vertical rod; 10, active carbon net; 11, fan; 12, horizontal plate frame; 13, electric heating pipe; 14, groove; 15, electric push rod; 16, discharging port. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] In the description of this utility model, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," and "the other end," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0022] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," and "connected," etc., should be interpreted broadly. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0023] like Figs. 1 to 4 As shown, the high-performance silver paste curing device for semiconductor packaging in this embodiment includes a main frame 1, a conveyor belt 2 installed in the middle of the main frame 1, a cover box 4 fixedly connected to the middle of the top of the main frame 1, a groove 14 opened in the inner wall of the cover box 4, an electric push rod 15 fixedly installed at the bottom of the groove 14, a horizontal plate frame 12 fixedly connected to the output end of the electric push rod 15, an electric heating tube 13 fixedly installed in the inner wall of the horizontal plate frame 12, a top box 5 fixedly connected to the top of the cover box 4, a fan 11 installed in the middle of the inner side of the top box 5, an activated carbon mesh 10 provided in the top of the inner side of the top box 5, a flexible tube 7 provided in the top of the top box 5, and a circulation tube 8 sleeved on the top of the flexible tube 7.

[0024] Specifically, the main frame 1 is composed of two vertical support plates at the bottom and horizontal support plates on both sides of the conveying belt 2, which can support the whole device. The conveying belt 2 can convey the encapsulated semiconductor chips to the cover box 4 for heating and curing, so that the conductive silver paste on the chip can be cured. The cover box 4 can concentrate heat, so that the semiconductor chip can be in a relatively stable temperature environment during curing, thereby facilitating the curing of the silver paste on the chip. The grooves 14 can connect the extensions of the both ends of the horizontal plate frame 12 with the output end of the electric push rod 15, and can make the horizontal plate frame 12 have better stability during lifting. The electric heating pipe 13 can generate heat inside the cover box 4, thereby achieving heating of the encapsulated semiconductor. The cover box 4 is also provided with a temperature control system inside, which can adjust the temperature to keep it constant. The top box 5 can guide the harmful gas in the cover box 4 to the activated carbon net 10, thereby facilitating the adsorption and purification of the harmful gas by the activated carbon net 10. The fan 11 can accelerate the movement of the gas in the cover box 4 to the inside of the top box 5, thereby accelerating the air circulation in the cover box 4 and achieving rapid treatment of the harmful gas in the cover box 4. The hose 7 can facilitate the removal of the cover plate 6 from the top of the top box 5, thereby facilitating the replacement of the activated carbon net 10. The circulation pipe 8 can make the heat mixed in the gas return to the cover box 4, thereby reducing unnecessary heat loss and accelerating the circulation of the air in the cover box 4, which is more conducive to the adsorption and treatment of harmful gas.

[0025] Further, the front of the cover box 4 is provided with an inlet 3, and the back of the cover box 4 is provided with an outlet 16. The inlet 3 and the outlet 16 make it more convenient for the semiconductor chips to enter and exit the device, thereby facilitating the operation of the user.

[0026] Further, the top end of the top box 5 is provided with a cover plate 6, the bottom end of the cover plate 6 is fixedly connected with a vertical rod 9, and the activated carbon net 10 is fixedly connected with the cover plate 6 through the vertical rod 9. The cover plate 6 can open the top of the top box 5, thereby facilitating the disassembly and subsequent replacement of the failed activated carbon net 10 in the top box 5, and ensuring the adsorption treatment effect of the activated carbon net 10.

[0027] Further, the bottom end of the hose 7 penetrates the middle of the top end of the cover plate 6, the hose 7 communicates with the inside of the top box 5 through the cover plate 6, and the hose 7 can smoothly detach the cover plate 6 from the top of the top box 5, while keeping the cover plate 6 connected with the circulation pipe 8, thereby facilitating the subsequent resetting of the cover plate 6.

[0028] Further, the bottom end of the circulation pipe 8 penetrates one side wall of the cover box 4, and the circulation pipe 8 communicates with the inside of the cover box 4. The circulation pipe 8 can make the heat blown out from the top box 5 be re-introduced into the cover box 4, thereby facilitating the cover box 4 to maintain a constant temperature.

[0029] Further, the cross plate frame 12 is connected with the groove 14 through the electric push rod 15, the cross plate frame 12 is located directly above the conveying belt 2, the cross plate frame is used for erecting the electric heating pipe 13 above the conveying belt 2, thereby facilitating the change of the distance between the electric heating pipe 13 and the semiconductor chip on the conveying belt 2, and then the heat effect of the electric heating pipe 13 is enhanced through the distance adjustment.

[0030] Further, the inside of the cover box 4 is communicated with the inside of the top box 5, the harmful gas generated in the process of the silver glue being heated and solidified will float upwards along with the heat, so that the gas and the heat accumulated at the top of the cover box 4 can smoothly enter the top box 5, and the harmful substances in the gas will be adsorbed and treated by the activated carbon net 10 in the top box 5, thereby reducing the probability that the human body inhales the harmful substances and affects the health.

[0031] The use method of the embodiment is as follows: before using the high-performance silver glue solidification device for semiconductor packaging, the device needs to be connected with the external power supply, then the semiconductor chip after being glued is placed on the conveying belt 2, so that the chip is conveyed into the cover box 4 after passing through the feeding port 3 along with the conveying belt 2, then the electric heating pipe 13 in the cover box 4 starts to radiate heat to the chip, so that the silver glue on the chip starts to be heated and solidified, in the process of adjusting the temperature in the cover box 4, the electric push rod 15 can be started to drive the cross plate frame 12 to ascend and descend in the cover box 4, the electric heating pipe 13 on the cross plate frame 12 drives the distance between the electric heating pipe 13 and the chip on the conveying belt 2 to change, so that the heat source generated by the electric heating pipe 13 can be closer to the chip, so that the temperature around the chip is higher, and the silver glue on the chip is more conducive to being heated and solidified, meanwhile, the harmful gas will be generated in the process of the silver glue being solidified, the harmful gas will rise to the top of the cover box 4 along with the heat, then is blown into the top box 5 through the rotating fan 11, then passes through the activated carbon net 10 in the inside of the top box 5, so that the harmful gas can be adsorbed and purified after contacting the activated carbon net 10, then the gas and the heat after being purified are returned to the cover box 4 through the hose 7 and the circulating pipe 8, so that the circulating air flow can be formed in the inside of the cover box 4, and the harmful gas in the cover box 4 can be treated in time.

[0032] Finally, it should be noted that the above only describes the preferred embodiments of the present application and is not intended to limit the present application, although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions recorded in the foregoing embodiments or make equivalent replacement for some technical features. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A high-performance silver paste curing apparatus for semiconductor packaging, comprising a main frame (1), characterized in that: The middle part of the main frame (1) is provided with a conveying belt (2), the middle part of the top end of the main frame (1) is fixedly connected with a cover box (4), the inner wall of the cover box (4) is provided with a groove (14), the bottom of the groove (14) is fixedly installed with an electric push rod (15), the output end of the electric push rod (15) is fixedly connected with a horizontal plate frame (12), the inner wall of the horizontal plate frame (12) is fixedly installed with an electric heating pipe (13), the top end of the cover box (4) is fixedly connected with a top box (5), the middle part of the inner side of the top box (5) is installed with a fan (11), the top of the inner side of the top box (5) is provided with an activated carbon screen (10), the top of the top box (5) is provided with a hose (7), the top end of the hose (7) is sleeved with a circulating pipe (8).

2. The high-performance silver paste curing device for semiconductor packaging according to claim 1, characterized in that: The front surface of the cover box (4) is provided with an inlet (3), and the back surface of the cover box (4) is provided with an outlet (16).

3. The high-performance silver paste curing device for semiconductor packaging according to claim 1, characterized in that: The top end of the top box (5) is covered with a cover plate (6), the bottom end of the cover plate (6) is fixedly connected with a vertical rod (9), and the activated carbon screen (10) is fixedly connected with the cover plate (6) through the vertical rod (9).

4. The high-performance silver paste curing device for semiconductor packaging according to claim 3, characterized in that: The bottom end of the hose (7) penetrates the middle part of the top end of the cover plate (6), and the hose (7) communicates with the inside of the top box (5) through the cover plate (6).

5. The high-performance silver paste curing device for semiconductor packaging according to claim 1, characterized in that: The bottom end of the circulating pipe (8) penetrates one side wall of the cover box (4), and the circulating pipe (8) communicates with the inside of the cover box (4).

6. The high-performance silver paste curing device for semiconductor packaging according to claim 1, characterized in that: The horizontal plate frame (12) is slidably connected with the groove (14) through the electric push rod (15), and the horizontal plate frame (12) is located directly above the conveying belt (2).

7. The high-performance silver paste curing device for semiconductor packaging according to claim 1, characterized in that: The inside of the cover box (4) communicates with the inside of the top box (5).

Images