Glue pouring mold for intelligent ring

Abstract

The utility model discloses a glue pouring mold of an intelligent ring, and relates to the technical field of intelligent rings. Comprising a top cover plate, a lower template and a lower bottom plate, the lower mold plate is provided with a forming cavity used for containing an intelligent ring to be filled with glue, and the bottom of the forming cavity is provided with a first through hole penetrating through the forming cavity; the lower bottom plate is provided with a protruding forming positioning column, and the forming positioning column is sleeved with hot melt adhesive paper. The forming positioning column penetrates through the first through hole and extends into the forming cavity of the lower mold plate, and the intelligent ring to be filled with glue is arranged on the forming positioning column in a sleeving manner; the top cover plate is detachably mounted at the top end of the forming positioning column; the glue pouring mold has the beneficial effects that the glue can be prevented from being adhered to the inner wall of the mold, and the mold stripping of the intelligent finger ring can be conveniently realized.

Description

TECHNICAL FIELD

[0001] The utility model relates to intelligent ring technical field more specifically, the utility model relates to a kind of glue pouring mould of intelligent ring. BACKGROUND

[0002] The intelligent ring for health detection has become a new star in the wearable electronic device market due to its convenience, non-inductive and continuous measurement. In order to meet the user's needs in various scenarios, the glue pouring process of the intelligent ring needs to meet high waterproof sealing and excellent wearing comfort.

[0003] The existing technology of ring glue pouring mainly includes the following steps:

[0004] 1. Place the ring in the mold of the glue pouring equipment and fix it to ensure the accuracy of glue pouring.

[0005] 2. Pour the prepared glue material into the glue pouring equipment.

[0006] 3. Start glue pouring according to the predetermined amount of glue to fill the internal gap of the ring.

[0007] 4. After glue pouring, take out the ring from the mold and check the amount of glue to ensure that the amount of glue is not too much or too little.

[0008] 5. Place the glued ring in the oven to harden the glue.

[0009] The existing glue pouring mold has the limitation of structure, which easily causes the inner wall of the ring to adhere to the mold, resulting in low demolding efficiency and product damage when forcibly removing the ring. In addition, burrs and bubbles are easily formed on the inner wall of the ring, which requires high labor cost for manual polishing and poor consistency of manual polishing. SUMMARY

[0010] To overcome the shortcomings of the prior art, the present application provides a glue pouring mold for intelligent ring, which can avoid the adhesion of glue to the inner wall of the mold and facilitate the demolding of intelligent ring.

[0011] The technical solution adopted by the present application to solve its technical problems is: a glue pouring mold for intelligent ring, which is improved in that it includes a top cover plate, a lower mold plate and a lower bottom plate.

[0012] The lower mold plate is provided with a forming cavity for accommodating the intelligent ring to be glued, and the bottom of the forming cavity has a first through hole;

[0013] The lower bottom plate is provided with a protruding shaped positioning column, and hot melt adhesive paper is sleeved on the shaped positioning column; the shaped positioning column passes through the first through hole and extends into a forming cavity of the lower mold plate, and the intelligent ring to be filled with adhesive is sleeved on the shaped positioning column; and the top cover plate is detachably installed at the top end of the shaped positioning column.

[0014] In the above structure, the shaped positioning column is in a cylindrical shape and has a cross section in the axial direction.

[0015] In the above structure, the outer surface of the shaped positioning column is provided in a stepped shape to form a first positioning column at the bottom and a second positioning column at the top, and the bottom surface of the forming cavity is flush with the step between the first positioning column and the second positioning column.

[0016] In the above structure, the top cover plate is in a cylindrical shape, and the diameter of the top cover plate is slightly larger than the diameter of the second positioning column.

[0017] In the above structure, the lower bottom plate is in a square shape, and positioning protrusions are arranged at the corners of the lower bottom plate to realize positioning of the lower mold plate.

[0018] In the above structure, a first notch recessed inward is arranged on the side edge of the lower bottom plate.

[0019] In the above structure, a protrusion outward protruding is arranged at the bottom of the top cover plate, and a groove matched with the protrusion is arranged at the top end of the shaped positioning column.

[0020] In the above structure, magnets with opposite polarities are arranged inside the top cover plate and the shaped positioning column.

[0021] The present application has the following beneficial effects: since the hot melt adhesive paper is sleeved on the shaped positioning column, the intelligent ring filled with adhesive can be directly taken off from the shaped positioning column, adhesion between the inner wall of the intelligent ring and the shaped positioning column is avoided, the demolding efficiency of the product is improved, the burrs on the inner wall of the ring can be reduced or even removed, the cost of manual polishing of the burrs is reduced, and the consistency of the product is improved. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 It is a three-dimensional structure schematic view of the intelligent ring filling adhesive mold.

[0023] Figure 2 It is an exploded structure schematic view of the intelligent ring filling adhesive mold.

[0024] Figure 3 It is a structure schematic view of the intelligent ring filled with adhesive.

[0025] Figure 4The utility model discloses a kind of intelligent ring's glue pouring mould's plan view.

[0026] Figure 5 For Figure 4 Middle A-A section schematic view.

[0027] In the drawing: top cover plate 10, first section 101, lower mould plate 30, forming cavity 301, first through-hole 302, adjusting groove 303, adjusting through-hole 304, slot 305, second notch 306, lower bottom plate 40, forming positioning column 401, recess 402, second section 403, positioning protrusion 404, first notch 405, first positioning column 4011, second positioning column 4012, intelligent ring 50, R angle 501, first encapsulation 502. DETAILED DESCRIPTION

[0028] The present application is further illustrated below in conjunction with the drawings and examples.

[0029] The concept, specific structure and technical effects of the present application will be described clearly and completely in conjunction with the examples and drawings, so as to fully understand the purpose, features and effects of the present application. Obviously, the described examples are only a part of the examples of the present application, but not all the examples. Based on the examples of the present application, other examples obtained by those skilled in the art without creative labor are within the scope of protection of the present application. In addition, all the coupling / connection relationships involved in the patent do not mean that the components are directly connected, but that a better coupling structure can be formed by adding or reducing coupling accessories according to the specific implementation situation. The technical features in the present application can be combined interactively without conflict.

[0030] Referring Figures 1 to 5 As shown in the drawing, the utility model discloses a kind of intelligent ring's glue pouring mould, by the glue pouring mould, intelligent ring is glued, to encapsulate the circuit board, battery and other components of intelligent ring by glue, generally, the glue is epoxy resin. Specifically, in the present embodiment, the glue pouring mould includes top cover plate 10, lower mould plate 30 and lower bottom plate 40;Wherein lower mould plate 30 and lower bottom plate 40 are substantially square, combined Figure 2 As shown in the drawing, lower mould plate 30 is provided with the forming cavity 301 for accommodating the intelligent ring to be glued, and the bottom of the forming cavity 301 has a first through-hole 302;Lower bottom plate 40 is provided with the protruding forming positioning column 401, the forming positioning column 401 is sleeved with hot melt adhesive paper (not shown in the drawing), after lower mould plate 30 is placed on lower bottom plate 40, forming positioning column 401 passes through first through-hole 302, and extends into the forming cavity 301 of lower mould plate 30;When the intelligent ring to be glued is placed in forming cavity 301, the intelligent ring is sleeved on forming positioning column 401.

[0031] Further, the top cover plate 10 is just located at the top end of the forming positioning column 401; it should be noted that the top cover plate 10 and the forming positioning column 401 are in a detachable state, and in the embodiment, the inside of the top cover plate 10 and the forming positioning column 401 is provided with magnets with opposite polarities, and the top cover plate 10 is arranged at the top end of the forming positioning column 401 through the adsorption effect of the magnets. Figure 2 , Figure 5 As shown in the figure, the bottom of the top cover plate 10 is provided with a protruding bump (not shown in the figure), and the top end of the forming positioning column 401 is provided with a groove 402 matched with the bump, and through the matching of the bump and the groove 402, the assembly precision between the top cover plate 10 and the forming positioning column 401 is ensured.

[0032] For the specific structure of the forming positioning column 401, in combination with Figure 2 The utility model provides a specific embodiment, the forming positioning column 401 is cylindrical, and has a second section 403 in the axial direction, which can be understood as: after removing a part of the cylindrical forming positioning column 401 in the axial direction, a side surface perpendicular to the top surface of the forming positioning column 401 and square is formed. Figure 3 As shown in the figure, the structure of the intelligent ring 50 after glue pouring is shown, through the structural design of the forming positioning column 401, the R angle 501 structure in Figure 3 can be formed during glue pouring, so that the structure of the first packaging part 502 is formed on the intelligent ring 50.

[0033] In addition, in combination with Figure 2 , Figure 5 As shown in the figure, the outer surface of the forming positioning column 401 is provided in a stepped shape, forming a first positioning column 4011 at the bottom and a second positioning column 4012 at the top, and the bottom surface of the forming cavity 301 is flush with the step between the first positioning column 4011 and the second positioning column 4012; and in combination with Figure 5 As shown in the figure, the top cover plate 10 is cylindrical, and the diameter of the top cover plate 10 is slightly larger than the diameter of the second positioning column 4012, and after the top cover plate 10 is placed on the forming positioning column 401, the intelligent ring is just clamped on the second positioning column 4012, and the step between the top cover plate 10 and the second positioning column 4012 facilitates the positioning of the intelligent ring and the glue pouring operation.

[0034] Before applying the adhesive, hot melt adhesive paper is placed on the molding positioning post 401. By heating the hot melt adhesive paper, it shrinks and adheres tightly to the outer surface of the molding positioning post 401. Then, the smart ring 50 to be applied is placed on the molding positioning post 401. At this time, the smart ring 50 is just placed on the second positioning post 4012 (the outer surface of the second positioning post 4012 has hot melt adhesive paper). Then, the top cover plate 10 is placed on the top of the molding positioning post 401. The height of the second positioning post 4012 is the same as the depth of the molding cavity 301. After applying the adhesive to the molding cavity 301, the adhesive wraps around the smart ring. After it cures, the application of adhesive to the smart ring is completed. During demolding, the top cover plate 10 is removed first, and then the glued smart ring and lower mold plate 30 are removed together from the lower base plate 40. Since the molding positioning post 401 is covered with hot melt adhesive paper, the glued smart ring 50 can be directly removed from the molding positioning post 401, avoiding adhesion between the inner wall of the smart ring and the molding positioning post 401. This allows for the detection and elimination of air bubbles, ensuring a high yield rate and significantly reducing production costs. Based on the glue-filling process technology of this patent application, burrs on the inner wall of the bracelet can be reduced or even eliminated. After curing, the finished product does not require grinding or polishing to achieve the required gloss and dimensional consistency, improving product consistency. In addition, it should be noted that during glue filling, detachable components can be placed in the molding cavity 301 to facilitate glue filling and molding.

[0035] In the above embodiment, a positioning protrusion 404 is provided at the corner of the lower base plate 40. The positioning protrusion 404 is used to position the lower template 30. Figure 1 As shown, the lower template 30 is positioned within the four positioning protrusions 404 of the lower base plate 40. One of the positioning protrusions 404 protrudes inward from its inner side. The corners of the lower template 30 are chamfered, thus forming a foolproof design that ensures the lower template 30 can only be combined with the lower base plate 40 at a unique angle. In addition, the lower base plate 40 has an inwardly recessed first notch 405 on its side, which facilitates the removal of the lower template 30 from the lower base plate 40.

[0036] The above is a detailed description of the preferred embodiments of the present invention. However, the present invention is not limited to the embodiments described. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present invention. All such equivalent modifications or substitutions are included within the scope defined by the claims of this application.

Claims

1. A glue-filling mold for a smart ring, characterized by: The top cover plate, the lower mold plate and the lower bottom plate are included; The lower mold plate is provided with a forming cavity for accommodating the smart ring to be filled with glue, and the bottom of the forming cavity is provided with a first through hole; The lower bottom plate is provided with a protruding forming positioning column, and a hot melt adhesive paper is sleeved on the forming positioning column; the forming positioning column passes through the first through hole and extends into the forming cavity of the lower mold plate, and the smart ring to be filled with glue is sleeved on the forming positioning column; and the top cover plate is detachably installed on the top end of the forming positioning column.

2. The glue-filling mold for a smart ring according to claim 1, wherein: The forming positioning column is in a cylindrical shape and has a cutting surface in the axial direction.

3. The glue-filling mold for a smart ring according to claim 1, wherein: The outer surface of the forming positioning column is in a stepped shape, forming a first positioning column at the bottom and a second positioning column at the top, and the bottom surface of the forming cavity is flush with the step between the first positioning column and the second positioning column.

4. The glue-filling mold of the intelligent ring according to claim 3, characterized in that: The top cover plate is in a cylindrical shape, and the diameter of the top cover plate is greater than the diameter of the second positioning column.

5. The glue-filling mold of the intelligent ring according to claim 1, characterized in that: The lower bottom plate is in a square shape, and a positioning protrusion is arranged at the corner of the lower bottom plate to realize positioning of the lower mold plate.

6. The glue-filling mold of the intelligent ring according to claim 5, characterized in that: A first notch is arranged on the side edge of the lower bottom plate and recessed inward.

7. The mold of claim 1, wherein: A protrusion is arranged on the bottom of the top cover plate and protrudes outward, and the top end of the forming positioning column is provided with a groove matched with the protrusion.

8. The glue-filling mold of the intelligent ring according to claim 1, characterized in that: Magnets with opposite polarities are arranged inside the top cover plate and the forming positioning column.

Images