Thermal management integration module, thermal management system, energy storage equipment and electric vehicle

Abstract

The utility model provides a heat management integration module, a heat management system, energy storage equipment and an electric vehicle, and relates to the technical field of heat management. The heat management integrated module comprises a liquid cooling assembly, a heat exchange assembly and a refrigerant substrate, and in the first direction, the heat exchange assembly is arranged between the liquid cooling assembly and the refrigerant substrate. The refrigerant base plate comprises a runner plate, a first cover plate and a second cover plate, the first cover plate and the second cover plate are stacked on the two sides of the runner plate in the first direction, the first cover plate is located between the runner plate and the heat exchange assembly, the runner plate is provided with at least one runner, and at least part of each runner penetrates through the runner plate in the first direction. The first direction is the thickness direction of the runner plate. The first cover plate is provided with at least one circulation hole, the at least one circulation hole penetrates through the first cover plate in the first direction, and the at least one circulation hole communicates with the flow channel and the heat exchange assembly. The design that the runner at least partially penetrates through the runner plate is beneficial to improving the machining efficiency of the runner and reducing the cost.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of thermal management, in particular to a thermal management integrated module, a thermal management system, an energy storage device and an electric vehicle. BACKGROUND

[0002] In the existing thermal management integrated module, the refrigerant substrate includes a flow channel plate and a cover plate. The flow channel for conveying refrigerant is arranged on one side of the flow channel plate in the thickness direction and extends along the thickness direction of the flow channel plate. The cover plate is fixed on one side of the flow channel plate in the thickness direction and covers the flow channel to seal the flow channel. The flow channel plate designed in this way needs to be made by forging and a large amount of machining of the blank, which greatly reduces the processing efficiency. Moreover, the utilization rate of the blank is not high, resulting in high cost. CONTENT OF THE UTILITY MODEL

[0003] The present application provides a thermal management integrated module, a thermal management system, an energy storage device and an electric vehicle, aiming to solve the problems of low processing efficiency and high cost of the flow channel plate.

[0004] In a first aspect, the embodiments of the present application provide a thermal management integrated module. The thermal management integrated module includes a liquid cooling assembly, a heat exchange assembly and a refrigerant substrate. In a first direction, the heat exchange assembly is arranged between the liquid cooling assembly and the refrigerant substrate. The refrigerant substrate includes a flow channel plate, a first cover plate and a second cover plate. The first cover plate and the second cover plate are stacked on both sides of the flow channel plate in the first direction. The first cover plate is located between the flow channel plate and the heat exchange assembly. The flow channel plate is provided with at least one flow channel. Each flow channel at least partially penetrates the flow channel plate along the first direction. The first direction is the thickness direction of the flow channel plate. The first cover plate is provided with at least one flow-through hole. The at least one flow-through hole penetrates the first cover plate along the first direction. The at least one flow-through hole is in communication with the flow channel and the heat exchange assembly.

[0005] In the embodiments of the present application, since each flow channel at least partially penetrates the flow channel plate along the first direction, the flow channel plate can be made by a continuous extrusion process. Specifically, the blank is extruded into a mold for molding, and then the molded blank is machined (such as cutting, cutting or punching operations) to make the flow channel plate. In this way, the blank can be avoided to be pressed and forged, the processing procedure is less, the molding efficiency is high, the processing efficiency is high, and then the processing cost of the refrigerant substrate is reduced. Moreover, a small amount of machining is performed on the molded blank to make the flow channel plate, the machining allowance is small, which is conducive to improving the utilization rate of the blank, reducing the cost of the blank, and reducing the processing cost of the refrigerant substrate. In addition, the flow channel plate is made by a continuous extrusion process, which is also conducive to reducing the density and weight of the flow channel plate, ensuring that the density of the flow channel plate is small and the weight is light, and conducive to the lightweight design of the refrigerant substrate. In addition, in the flow channel plate made by the extrusion process, the wall thickness of each flow channel can be very small, which is conducive to the miniaturization design of the refrigerant substrate.

[0006] In some embodiments, the flow channel plate is further provided with a first mounting hole penetrating through the flow channel plate along the first direction, and the second cover plate is further provided with a first matching hole penetrating through the second cover plate along the first direction. The heat management integrated module further comprises a first valve partially arranged in the first mounting hole and the first matching hole, and the flow channel is communicated with the heat exchange assembly through the first valve. In the embodiments of the present application, the first valve can be a throttle valve for controlling the flow of the second medium in the flow channel, or a check valve for preventing the second medium flowing into the heat exchange assembly from flowing back to the flow channel. By arranging the first valve, the flow of the second medium can be controlled and adjusted.

[0007] In some embodiments, the projection of the first mounting hole along the first direction is spaced apart from the projection of the flow channel along the first direction, the flow channel plate is further provided with a through hole, the extension direction of the through hole is perpendicular to the first direction, the first valve comprises a first valve port and a second valve port, the first valve port is communicated with the flow channel through the through hole, and the second valve port is communicated with the heat exchange assembly. In the embodiments, the first mounting hole and the flow channel are spaced apart, and the through hole is arranged to communicate the first mounting hole and the flow channel. The first mounting hole does not occupy the space of the flow channel, so that the space of the flow channel can be made larger in the limited space, more second medium can be accommodated in the flow channel, and the flow of the second medium in the flow channel is better.

[0008] In some embodiments, the projection of the first valve along the first direction overlaps the projection of the flow channel along the first direction. The design that the projection of the first valve along the first direction overlaps the projection of the flow channel along the first direction is beneficial to shorten the flow path of the medium between the first valve and the heat exchange assembly, beneficial to improve the flow efficiency of the medium in the flow channel and the heat exchange assembly, and beneficial to improve the performance of the heat management integrated module.

[0009] In some embodiments, the heat exchange assembly comprises a condenser, the at least one flow channel comprises a first flow channel, the number of the first valves is multiple, the first flow channel corresponds to at least one first valve, and the first flow channel is communicated with the condenser through the corresponding first valve. In the embodiments, the condenser can be used for heating.

[0010] In some embodiments, the flow channel plate is further provided with a second mounting hole penetrating the flow channel plate along the first direction, and the second cover plate is further provided with a second matching hole penetrating the second cover plate along the first direction. The heat management integrated module further comprises a second valve partially fitted into the second mounting hole and the second matching hole, the second valve comprising a third valve port and a fourth valve port, the third valve port being in communication with the flow channel, and the fourth valve port being located at a portion of the second valve exposed outside the refrigerant substrate. In this embodiment, the second valve is in communication with the flow channel, and the flow channel can receive an external second medium (for example, a second medium gas output by a compressor) through the second valve. The valve can be various valves, for example, a check valve to prevent backflow, or a throttle valve to adjust the flow rate. By providing the second valve, the second medium can enter the heat exchange assembly from more positions.

[0011] In some embodiments, the second valve comprises an upper plate, a middle plate and a lower plate, the upper plate and the lower plate being stacked on both sides of the middle plate along the first direction, the third valve port penetrating the upper plate along the first direction, the fourth valve port penetrating the lower plate along the first direction, and the middle plate being provided with a valve passage extending along the first direction and in communication with the third valve port and the fourth valve port.

[0012] In this embodiment, the valve passage penetrates the middle plate along the first direction, so that the middle plate can be made by continuous extrusion process of aluminum profiles, which is high in processing efficiency and thus reduces the cost, and the density of aluminum profiles is small and the weight is light, which is conducive to lightweight design. At the same time, the extrusion process is conducive to reducing the width of the side wall of the valve passage, which is conducive to miniaturization design.

[0013] In some embodiments, the heat exchange assembly comprises an evaporator, the at least one flow channel comprises a second flow channel, and the number of the first valves is plural, the second flow channel corresponding to at least one first valve, and the second flow channel being in communication with the evaporator through the corresponding first valve. In this embodiment, the evaporator can be used for refrigeration. In some embodiments, the flow channel plate is further provided with a third mounting hole penetrating the flow channel plate along the first direction, and the second cover plate is further provided with a third matching hole penetrating the second cover plate along the first direction. The heat management integrated module further comprises a third valve partially fitted into the third mounting hole and the third matching hole, the third valve comprising a fifth valve port and a sixth valve port, the fifth valve port being in communication with the second flow channel, and the sixth valve port being located at a portion of the third valve exposed outside the refrigerant substrate. In this embodiment, the third valve is in communication with the second flow channel, and the second flow channel can deliver the second medium to an external component (for example, a gas-liquid separator) through the third valve. The valve can be various valves, for example, a check valve to prevent backflow, or a throttle valve to adjust the flow rate. By providing the third valve, the second medium can be discharged to the components outside the flow channel from more positions.

[0014] In some embodiments, the heat exchange assembly comprises a condenser and an evaporator, the at least one flow channel comprises a third flow channel, the number of the first valves is plural, the third flow channel corresponds to at least two first valves, and the third flow channel communicates with the condenser and the evaporator through the corresponding first valves. In this embodiment, the condenser is used for heating, and the evaporator is used for cooling, so that the heat management integrated module can both heat and cool, the function of the heat management integrated module is more, and the heat management system can better perform heat management.

[0015] In some embodiments, the flow channel plate comprises a first sub-plate and a second sub-plate, the first sub-plate and the second sub-plate are arranged in a spaced manner along a second direction, the number of the flow channels is plural, at least one flow channel is arranged on the first sub-plate, and at least one flow channel is arranged on the second sub-plate, and the second direction is perpendicular to the first direction. In this embodiment, by splitting the flow channel plate into the first sub-plate and the second sub-plate and arranging the first sub-plate and the second sub-plate in a spaced manner, the heat insulation requirement between the plurality of flow channels is met, the heat of the medium in the flow channel of the second sub-plate is prevented from being transferred to the medium in the flow channel of the first sub-plate, the temperature of the medium in the flow channel of the first sub-plate is prevented from being too high, the temperature of the medium in the flow channel of the first sub-plate is reduced, and the performance of the heat management integrated module is improved.

[0016] In some embodiments, the density of the flow channel plate is equal to the density of the first cover plate. And / or, the density of the flow channel plate is equal to the density of the second cover plate. In this embodiment, the density of the flow channel plate is equal to the density of the first cover plate and / or the density of the second cover plate, which is beneficial to reduce the weight of the refrigerant substrate and facilitate the lightweight design of the heat management integrated module.

[0017] In some embodiments, the material of the flow channel plate is aluminum. The density of aluminum is relatively small, which is beneficial to lightweight design.

[0018] In some embodiments, the flow channel plate is made by extrusion. The processing efficiency of the extrusion process is relatively high, which is beneficial to improve the processing efficiency of the product and thus reduce the cost.

[0019] In a second aspect, the embodiments of the present application provide a heat management system, which comprises a storage tank, a heat management component, a compressor and the heat management integrated module provided in the first aspect of the present application. The storage tank, the liquid cooling assembly and the heat management component are sequentially communicated, the heat management component is communicated with the storage tank, and the compressor is communicated with at least one flow channel.

[0020] In a third aspect, the embodiments of the present application provide an energy storage device, which comprises a battery and the heat management system provided in the second aspect of the present application, and the heat management component is used for heat management of the battery.

[0021] In a fourth aspect, the embodiments of the present application provide an electric vehicle, which comprises a power battery, a power assembly, and the heat management system provided in the second aspect of the present application. The heat management system is used for heat management of the power battery and / or the power assembly. BRIEF DESCRIPTION OF DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the background art, the drawings needed to be used in the embodiments of the present application or the background art will be described below.

[0023] Figure 1 is a working principle diagram of the heat management system provided in the embodiments of the present application;

[0024] Figure 2 is a three-dimensional structural schematic diagram of an energy storage device provided in the embodiments of the present application;

[0025] Figure 3 is a structural schematic diagram of an electric vehicle provided in the embodiments of the present application;

[0026] Figure 4 is a three-dimensional structural schematic diagram of a heat management integrated module provided in the embodiments of the present application;

[0027] Figure 5 is a three-dimensional structural schematic diagram of the heat management integrated module shown in Figure 4 ;

[0028] Figure 6 is a three-dimensional structural schematic diagram of a heat exchange assembly of the heat management integrated module shown in Figure 4 ;

[0029] Figure 7 is a three-dimensional structural schematic diagram of the heat exchange assembly of the heat management integrated module shown in Figure 4 ;

[0030] Figure 8 is a three-dimensional structural schematic diagram of a liquid cooling assembly of the heat management integrated module shown in Figure 4 ;

[0031] Figure 9 is a three-dimensional structural schematic diagram of the liquid cooling assembly shown in Figure 8 ;

[0032] Figure 10 is a three-dimensional structural schematic diagram of a liquid cooling substrate of the liquid cooling assembly shown in Figure 8 ;

[0033] Figure 11 is a three-dimensional structural schematic diagram of the heat management integrated module (omitting the refrigerant assembly) shown in Figure 4 ;

[0034] Figure 12 is a perspective structural schematic diagram of a refrigerant assembly of the thermal management integrated module shown in Figure 4

[0035] Figure 13 is a perspective structural exploded schematic diagram of the refrigerant assembly shown in Figure 12

[0036] Figure 14 is a perspective structural schematic diagram of a flow channel plate of the refrigerant assembly shown in Figure 13

[0037] Figure 15 is a perspective structural schematic diagram of a refrigerant substrate of the refrigerant assembly shown in Figure 12

[0038] Figure 16 is a structural schematic diagram of a first valve of the refrigerant assembly shown in Figure 13

[0039] Figure 17 is a structural schematic diagram of a second valve of the refrigerant assembly shown in Figure 13

[0040] Figure 18 is a perspective structural exploded schematic diagram of the thermal management integrated module shown in Figure 4

[0041] Figure 19 is a perspective structural schematic diagram of a flow channel plate of the refrigerant assembly in another embodiment shown in Figure 13

[0042] Figure 20 is a structural schematic diagram of a second valve of the refrigerant assembly in another embodiment shown in Figure 13 DETAILED DESCRIPTION

[0043] Embodiments of the present application provide a thermal management integrated module, a thermal management system, an energy storage device and an electric vehicle. The thermal management integrated module is applied to the thermal management system, and the thermal management system can be applied to the energy storage device or the electric vehicle. In the present application, the connection between "component A" and "component B" means that "component A" is directly connected to "component B", or "component A" is indirectly connected to "component B" through "component C".

[0044] The embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application.

[0045] Reference is made to Figure 1 , Figure 2 and Figure 3 , Figure 1 ​​​​​​​​​is a working principle diagram of a thermal management system 1000 provided by an embodiment of the present application. Figure 2 is a three-dimensional structure diagram of an energy storage device 1 provided by an embodiment of the present application. Figure 3 is a structure diagram of an electric vehicle 2 provided by an embodiment of the present application.

[0046] As shown in Figure 1 , the thermal management system 1000 is used to detect and control the temperature of a thermal management object 1100, so that the thermal management object 1100 can maintain a normal working temperature. The thermal management system 1000 can include a thermal management integrated module 100, a storage tank 200, a thermal management piece 300, a compressor 400 and a gas-liquid separator 500. The thermal management integrated module 100 is in communication with the storage tank 200 and the thermal management piece 300, and the thermal management piece 300 is in communication with the storage tank 200. The storage tank 200 is used to store a first medium. In the embodiment, the first medium is water, and in some other embodiments, the first medium can be glycol coolant or silicon-free nitrate coolant. The first medium can circulate and flow in the thermal management integrated module 100, the storage tank 200 and the thermal management piece 300. The thermal management integrated module 100 is also in communication with the compressor 400 and the gas-liquid separator 500, and the compressor 400 is in communication with the gas-liquid separator 500. The thermal management integrated module 100 can contain a second medium, and the second medium can circulate and flow in the compressor 400, the thermal management integrated module 100 and the gas-liquid separator 500. The compressor 400 is used to drive the second medium to flow. The second medium can be refrigerant.

[0047] The thermal management system 1000 can cool the thermal management object 1100. The heat generated by the working of the thermal management object 1100 is transferred to the first medium in the thermal management piece 300, and the first medium flows to the thermal management integrated module 100 through the storage tank 200. The first medium and the second medium exchange heat in the thermal management integrated module 100. The first medium after heat exchange flows to the thermal management piece 300 to cool the thermal management object 1100.

[0048] The second medium after heat exchange with the first medium is cooled in the thermal management integrated module 100 and then flows to the gas-liquid separator 500, and the gas-liquid separator 500 removes the water in the second medium. The second medium flows from the gas-liquid separator 500 to the thermal management integrated module 100 through the compressor 400, and re-exchanges heat with the first medium. In this way, the thermal management system 1000 can continuously cool the thermal management object 1100, so that the thermal management object 1100 can maintain a normal working temperature to achieve better working performance.

[0049] The heat management system 1000 can also heat the heat management object 1100. The first medium flows to the heat management integrated module 100 through the storage tank 200, and the first medium exchanges heat with the second medium in the heat management integrated module 100, and the first medium absorbs the heat of the second medium. The first medium after absorbing the heat flows to the heat management member 300 and transmits the heat to the heat management object 1100, so as to heat the heat management object 1100.

[0050] As shown in Figure 1 and Figure 2 , the heat management system 1000 can be applied to the energy storage device 1. The energy storage device 1 can include the heat management system 1000, an AC / DC conversion module 2000, a battery 3000 and an energy storage cabinet 4000. The heat management system 1000, the AC / DC conversion module 2000 and the battery 3000 are all accommodated in the energy storage cabinet 4000. The AC / DC conversion module 2000 can be used to convert the alternating current output by the power grid into direct current and store it in the battery 3000. Among them, the heat management object 1100 is the AC / DC conversion module and / or the battery, the first medium in the heat management member 300 exchanges heat with the AC / DC conversion module 2000 and / or the battery 3000, in other words, the heat management member 300 is used for heat management of the battery 3000, that is, the heat management system 1000 is used to detect and control the temperature of the AC / DC conversion module 2000 and / or the battery 3000, so that the AC / DC conversion module 2000 and / or the battery 3000 can maintain a normal working temperature.

[0051] As shown in Figure 1 and Figure 3As shown, the thermal management system 1000 can also be applied to an electric vehicle 2. The electric vehicle 2 can include a power battery 5000, a power assembly 6000, an electric control system 7000, and the thermal management system 1000. The power battery 5000 provides electric energy for the power assembly 6000 and the electric control system 7000. The power assembly 6000 is used to provide power for the electric vehicle 2. The power assembly 6000 can include a motor, a transmission, a drive system, and an exhaust system. The electric control system 7000 refers to an overall system composed of elements such as automobile electronic control units (ECUs), wiring harnesses, and sensors. The electric control system 7000 can control the operation of the power assembly 6000, for example, the electric control system 7000 can finely control and manage the motor, the transmission, the drive system, or the exhaust system to ensure smooth driving and stability of the vehicle in various complex driving scenarios. Among them, the thermal management object 1100 is at least one of the power battery 5000, the power assembly 6000, and the electric control system 7000, and the first medium in the thermal management piece 300 exchanges heat with at least one of the power battery 5000, the power assembly 6000, and the electric control system 7000, in other words, the thermal management piece 300 is used for thermal management of the power battery 5000 and / or the power assembly 6000. That is, the thermal management system 1000 is used to detect and control the temperature of at least one of the power battery 5000, the power assembly 6000, and the electric control system 7000.

[0052] Please refer to Figure 4 、 Figure 5 、 Figure 6 and Figure 7 , and in combination with Figure 1 , Figure 4 is a perspective structural schematic diagram of a thermal management integrated module 100 provided by an embodiment of the present application. Figure 5 is Figure 4 a perspective structural exploded schematic diagram of the thermal management integrated module 100 shown. Figure 6 is Figure 4 a perspective structural schematic diagram of a heat exchange assembly 10 of the thermal management integrated module 100. Figure 7 is Figure 4 a perspective structural schematic diagram of the heat exchange assembly 10 of the thermal management integrated module 100 from another perspective.

[0053] For ease of description, three directions perpendicular to each other are defined as a first direction, a second direction, and a third direction in sequence, and the first direction, the second direction, and the third direction are perpendicular to each other. As shown in Figure 4As shown, in the embodiment, the first direction (i.e. the direction of the Z axis shown in the figure) is the height direction of the thermal management integrated module 100. The second direction (i.e. the direction of the X axis shown in the figure) is the length direction of the thermal management integrated module 100. The third direction (i.e. the direction of the Y axis shown in the figure) is the width direction of the thermal management integrated module 100. In some other embodiments, the second direction (i.e. the direction of the X axis shown in the figure) can also be the width direction of the thermal management integrated module 100. The third direction (i.e. the direction of the Y axis shown in the figure) can also be the length direction of the thermal management integrated module 100.

[0054] As shown in Figure 1 , Figure 4 and Figure 5 , the thermal management integrated module 100 comprises a heat exchange assembly 10, a liquid cooling assembly 20 and a refrigerant assembly 30. In the Z axis direction, the liquid cooling assembly 20, the heat exchange assembly 10 and the refrigerant assembly 30 are arranged in sequence. The heat exchange assembly 10 is in communication with the liquid cooling assembly 20 and the refrigerant assembly 30. The storage tank 200, the liquid cooling assembly 20 and the thermal management component 300 are in communication in sequence. The thermal management component 300 is in communication with the storage tank 200. The liquid cooling assembly 20 is configured to flow a first medium. The first medium flows in the storage tank 200, the liquid cooling assembly 20 and the thermal management component 300. The storage tank 200, the liquid cooling assembly 20, the heat exchange assembly 10 and the thermal management component 300 constitute a liquid cooling loop: storage tank 200-liquid cooling assembly 20-heat exchange assembly 10-liquid cooling assembly 20-thermal management component 300-storage tank 200. The first medium can flow in the liquid cooling loop in a circulating manner.

[0055] The refrigerant assembly 30 is in communication with a compressor 400 and a gas-liquid separator 500. The compressor 400, the refrigerant assembly 30, the heat exchange assembly 10 and the gas-liquid separator 500 constitute a refrigerant loop: compressor 400-refrigerant assembly 30-heat exchange assembly 10-refrigerant assembly 30-gas-liquid separator 500-compressor 400. A second medium can circulate in the refrigerant loop. The first medium can flow from the liquid cooling assembly 20 to the heat exchange assembly 10. The second medium can flow from the refrigerant assembly 30 to the heat exchange assembly 10. The first medium and the second medium can exchange heat in the heat exchange assembly 10.

[0056] As shown in Figure 5 , Figure 6 and Figure 7As shown, in some embodiments, the heat exchange assembly 10 comprises a first heat exchanger 11 and a second heat exchanger 12. In the X-axis direction, the first heat exchanger 11 is spaced apart from the second heat exchanger 12. In this embodiment, the first heat exchanger 11 is a condenser, and the first heat exchanger 11 is provided with a first water inlet 111, a first water outlet 112, a first refrigerant inlet 113, and a first refrigerant outlet 114. Among them, in the Z-axis direction, the first water inlet 111 and the first water outlet 112 are located on one side of the first heat exchanger 11, and the first water inlet 111 is spaced apart from the first water outlet 112. And the first water inlet 111 and the first water outlet 112 are both in communication with the inner cavity of the first heat exchanger 11. The first refrigerant inlet 113 and the first refrigerant outlet 114 are located on the side of the first heat exchanger 11 away from the first water inlet 111, and the first refrigerant inlet 113 is spaced apart from the first refrigerant outlet 114. And the first refrigerant inlet 113 and the first refrigerant outlet 114 are both in communication with the inner cavity of the first heat exchanger 11.

[0057] The second heat exchanger 12 is an evaporator, and the second heat exchanger 12 is provided with a second water inlet 121, a second water outlet 122, a second refrigerant inlet 123, and a second refrigerant outlet 124. Among them, in the Z-axis direction, the second water inlet 121 and the second water outlet 122 are located on one side of the second heat exchanger 12, and the second water inlet 121 is spaced apart from the second water outlet 122. And the second water inlet 121 and the second water outlet 122 are both in communication with the inner cavity of the second heat exchanger 12. The second refrigerant inlet 123 and the second refrigerant outlet 124 are located on the side of the second heat exchanger 12 away from the second water inlet 121, and the second refrigerant inlet 123 is spaced apart from the second refrigerant outlet 124. And the second refrigerant inlet 123 and the second refrigerant outlet 124 are both in communication with the inner cavity of the second heat exchanger 12.

[0058] Please refer to Figure 8 , Figure 9 , Figure 10 and Figure 11 , and in combination with Figure 1 , Figure 8 is Figure 4 the perspective structural schematic diagram of the liquid cooling assembly 20 of the thermal management integrated module 100 shown. Figure 9 is Figure 8 the perspective structural exploded schematic diagram of the liquid cooling assembly 20 from another perspective. Figure 10 is Figure 8 the perspective structural exploded schematic diagram of the liquid cooling substrate 21 of the liquid cooling assembly 20 from another perspective. Figure 11 is Figure 4 the perspective structural exploded schematic diagram of the thermal management integrated module 100 (omitting the refrigerant assembly 30) from another perspective.

[0059] As Figure 8 , Figure 9 andFigure 10 As shown, in some embodiments, the liquid cooling assembly 20 includes a liquid cooling base plate 21, a first water pump 22, a second water pump 23, and a multi-way valve 24. The liquid cooling base plate 21 is provided with a plurality of first interfaces 2111, a plurality of second interfaces 2131, a plurality of first channels 2121a, and a plurality of second channels 2121b. In the Z-axis direction, the plurality of first channels 2121a is located on one side of the plurality of second channels 2121b. The plurality of first interfaces 2111 is located on the side of the plurality of first channels 2121a away from the plurality of second channels 2121b, and each first channel 2121a is in communication with at least one first interface 2111. The plurality of second interfaces 2131 is located on the side of the plurality of second channels 2121b away from the plurality of first channels 2121a, and each second channel 2121b is in communication with one second interface 2131.

[0060] Specifically, the liquid cooling base plate 21 includes an upper cover 211, a middle cover 212, and a lower cover 213, which are sequentially fixedly connected in the Z-axis direction, and the upper cover 211, the middle cover 212, and the lower cover 213 enclose the plurality of first channels 2121a and the plurality of second channels 2121b. The plurality of first channels 2121a is located on the side of the middle cover 212 facing the upper cover 211, and the plurality of second channels 2121b is located on the side of the middle cover 212 facing the lower cover 213.

[0061] The plurality of first interfaces 2111 is arranged on the side of the upper cover 211 away from the lower cover 213, wherein some of the first interfaces 2111 are in communication with the storage tank 200 (such as the first storage tank 200a shown in FIG. 2) and some of the first interfaces 2111 are in communication with the thermal management member 300. The plurality of second interfaces 2131 is arranged on the side of the lower cover 213 away from the upper cover 211, and each second channel 2121b is in communication with one second interface 2131. For example, the number of second interfaces 2131 is four. The four second interfaces 2131 are a first pair of inner interfaces 2131a, a second pair of inner interfaces 2131b, a third pair of inner interfaces 2131c, and a fourth pair of inner interfaces 2131d, which are arranged at intervals, and the first pair of inner interfaces 2131a, the second pair of inner interfaces 2131b, the third pair of inner interfaces 2131c, and the fourth pair of inner interfaces 2131d are used to connect with the heat exchange assembly 10. Figure 1

[0062] ​The multi-way valve 24 is rotatably mounted on the liquid cooling base 21, and specifically, the multi-way valve 24 is rotatably mounted on the middle cover 212. The multi-way valve 24 is used to make two first channels 2121a communicate with two second channels 2121b respectively. The first water pump 22 and the second water pump 23 are both mounted on the liquid cooling base 21, and specifically, the first water pump 22 and the second water pump 23 are both mounted on the middle cover 212. The first water pump 22 communicates with one of the second channels 2121b, and the second water pump 23 communicates with the other second channel 2121b. The first water pump 22 and the second water pump 23 are used to drive the first medium to flow. Specifically, the first water pump 22 is used to drive the first medium in the second channel 2121b communicating with the first water pump 22 to flow. The second water pump 23 is used to drive the first medium in the second channel 2121b communicating with the second water pump 23 to flow.

[0063] As shown in Figure 1 , Figure 9 and Figure 11 , the first pair of inner interfaces 2131a of the lower cover 213 communicate with the first water inlet 111 of the first heat exchanger 11, and the second pair of inner interfaces 2131b of the lower cover 213 communicate with the first water outlet 112 of the first heat exchanger 11. The third pair of inner interfaces 2131c of the lower cover 213 communicate with the second water inlet 121 of the second heat exchanger 12, and the fourth pair of inner interfaces 2131d of the lower cover 213 communicate with the second water outlet 122 of the second heat exchanger 12.

[0064] One interface of the storage tank 200 (as shown in Figure 1 ) communicates with one of the first interfaces 2111 of the upper cover 211, another first interface 2111 of the upper cover 211 communicates with one interface of the thermal management device 300, and another interface of the thermal management device 300 communicates with another interface of the storage tank 200. By driving the multi-way valve 24 to rotate, a first liquid cooling loop and a second liquid cooling loop can be formed. The first liquid cooling loop is: the storage tank 200-one of the first interfaces 2111-one of the first channels 2121a-the multi-way valve 24-one of the second channels 2121b-the first water pump 22-the first pair of inner interfaces 2131a-the first heat exchanger 11-the second pair of inner interfaces 2131b-the other second channel 2121b-the multi-way valve 24-the other first channel 2121a-the other first interface 2111-the thermal management device 300-the storage tank 200. The first medium can circulate and flow in the first liquid cooling loop under the action of the first water pump 22.

[0065] The second liquid cooling circuit is: the storage tank 200, one of the first interfaces 2111, one of the first channels 2121a, the multi-way valve 24, one of the second channels 1121, the second water pump 23, the third pair of inner interfaces 2131c, the second heat exchanger 12, the fourth pair of inner interfaces 2131d, the other second channel 2121b, the multi-way valve 24, the other first channel 2121a, the other first interface 2111, the thermal management component 300, and the storage tank 200. The first medium can circulate in the second liquid cooling circuit under the action of the second water pump 23. By rotating the multi-way valve 24, the thermal management system 1000 can be switched between the first liquid cooling circuit and the second liquid cooling circuit.

[0066] Please refer to Figure 12 、 Figure 13 、 Figure 14 、 Figure 15 、 Figure 16 and Figure 17 , in combination with Figure 1 and Figure 5 , Figure 12 is a perspective structural schematic diagram of the refrigerant assembly 30 of the thermal management integrated module 100 shown in Figure 4 . Figure 13 is a perspective structural exploded schematic diagram of the refrigerant assembly 30 from another perspective shown in Figure 12 . Figure 14 is a perspective structural schematic diagram of the flow channel plate 311 of the refrigerant assembly 30 shown in Figure 13 . Figure 15 is a perspective structural schematic diagram of the refrigerant base plate 31 of the refrigerant assembly 30 shown in Figure 12 . Figure 16 is a structural schematic diagram of the first valve 323 of the refrigerant assembly 30 shown in Figure 13 . Figure 17 is a structural schematic diagram of the second valve 324 of the refrigerant assembly 30 shown in Figure 13 .

[0067] As Figure 12 、 Figure 13 and Figure 14As shown, in some embodiments, the refrigerant assembly 30 includes a refrigerant substrate 31 and a plurality of functional pieces 32, which are arranged on one side of the refrigerant substrate 31 in the Z-axis direction. The refrigerant substrate 31 includes a flow channel plate 311, a first cover plate 312, and a second cover plate 313. The flow channel plate 311 is fixedly connected with the first cover plate 312 and the second cover plate 313. The flow channel plate 311 is provided with at least one flow channel 310, a plurality of mounting holes 3111, and a through hole 3114. Each flow channel 310 at least partially penetrates the flow channel plate 311 in the thickness direction (i.e., the Z-axis direction) of the flow channel plate 311, and the flow channel 310 is used for the flow of the second medium. It can be understood that the first direction is also the thickness direction of the flow channel plate 311. Each mounting hole 3111 penetrates the flow channel plate 311 in the Z-axis direction, and each flow channel 310 communicates with at least two mounting holes 3111.

[0068] Specifically, the flow channel plate 311 includes a first surface 3112 and a second surface 3113 arranged opposite to each other in the Z-axis direction. The flow channel 310 includes a matching through hole 3104 and a groove 3105. The matching through hole 3104 penetrates the flow channel plate 311 in the Z-axis direction. The groove 3105 extends from the first surface 3112 in the Z-axis direction. The groove 3105 is located on one side of the matching through hole 3104 and communicates with the matching through hole 3104.

[0069] For example, the number of flow channels 310 is three, and the three flow channels 310 are respectively a first flow channel 3101, a second flow channel 3103, and a third flow channel 3102. In the X-axis direction, the third flow channel 3102, the first flow channel 3101, and the second flow channel 3103 are sequentially and spaced apart.

[0070] The first flow channel 3101 includes a first groove 3101a, a second groove 3101b, and a first matching through hole 3101c. The first groove 3101a extends from the first surface 3112 in the Z-axis direction. In the X direction, the second groove 3101b is located on one side of the first groove 3101a, and the second groove 3101b extends from the first surface 3112 in the Z-axis direction. The first matching through hole 3101c penetrates the flow channel plate 311 in the Z-axis direction, and in the X-axis direction, the first matching through hole 3101c is located between the first groove 3101a and the second groove 3101b and communicates with the first groove 3101a and the second groove 3101b.

[0071] The third flow channel 3102 comprises a second matching through hole 3102a, a third matching through hole 3102b and a third groove 3102c. The second matching through hole 3102a penetrates the flow channel plate 311 along the Z-axis direction. The third matching through hole 3102b penetrates the flow channel plate 311 along the Z-axis direction and is located on one side of the second matching through hole 3102a and communicates with the second matching through hole 3102a in the Y-axis direction. The third groove 3102c extends from the first surface 3112 along the Z-axis direction, and in the X-axis direction, the third groove 3102c is located on one side of the third matching through hole 3102b and communicates with the third matching through hole 3102b. The bottom wall of the third groove 3102c can be provided with at least one through hole to reduce the weight of the flow channel plate 311.

[0072] The second flow channel 3103 comprises a fourth groove 3103a, a fifth groove 3103b, a fourth matching through hole 3103c and a fifth matching through hole 3103d. The fourth groove 3103a extends from the first surface 3112 along the Z-axis direction. The fifth groove 3103b extends from the first surface 3112 along the Z-axis direction and is located on one side of the fourth groove 3103a and communicates with the fourth groove 3103a in the Y-axis direction. The fourth matching through hole 3103c penetrates the flow channel plate 311 along the Z-axis direction and is located on one side of the fifth groove 3103b and communicates with the fifth groove 3103b in the Y-axis direction. The fifth matching through hole 3103d penetrates the flow channel plate 311 along the Z-axis direction and is located on one side of the fifth groove 3103b facing the fourth groove 3103a and communicates with the fifth groove 3103b in the X-axis direction.

[0073] The mounting hole 3111 can penetrate the flow channel plate 311 along the Z-axis direction and be located on one side of the flow channel 310 and spaced apart from the flow channel 310. The mounting hole 3111 can also penetrate the bottom wall of the groove 3105 of the flow channel 310 along the Z-axis direction and communicate with the groove 3105 of the flow channel 310. In the embodiment, the mounting hole 3111 comprises a first mounting hole 3115, a second mounting hole 3116, a third mounting hole 3117 and a fourth mounting hole 3118.

[0074] The first mounting hole 3115 penetrates the flow channel plate 311 along the Z-axis direction and communicates with the flow channel 310. Specifically, the projection of the first mounting hole 3115 along the Z-axis direction is spaced apart from the projection of the flow channel 310 along the Z-axis direction. The flow channel plate 311 is further provided with a through hole 3114 which communicates with the first mounting hole 3115 and the flow channel 310. The extension direction of the through hole 3114 is perpendicular to the Z-axis direction. In other embodiments, the extension direction of the through hole 3114 can also be not perpendicular to the Z-axis direction.

[0075] Exemplarily, the number of the first mounting holes 3115 is four, and the four first mounting holes 3115 are respectively a first sub-mounting hole 3115a, a second sub-mounting hole 3115b, a third sub-mounting hole 3115c, and a fourth sub-mounting hole 3115d. The first sub-mounting hole 3115a is located at one end of the first matching through hole 3101c away from the first groove 3101a and the second groove 3101b, and the projection of the first sub-mounting hole 3115a along the Z-axis direction is arranged in a spaced manner with the projection of the first flow channel along the Z-axis direction. The side wall of the first sub-mounting hole 3115a is provided with a through hole 3114 penetrating the inner circumferential surface of the first sub-mounting hole 3115a and the inner circumferential surface of the first matching through hole 3101c, so that the first sub-mounting hole 3115a is in communication with the first matching through hole 3101c, and further in communication with the first flow channel 3101.

[0076] The second sub-mounting hole 3115b is located at one end of the second matching through hole 3102a away from the third matching through hole 3102b, and the projection of the second sub-mounting hole 3115b along the Z-axis direction is arranged in a spaced manner with the projection of the third flow channel 3102 along the Z-axis direction. The side wall of the second sub-mounting hole 3115b is provided with a through hole, so that the second sub-mounting hole 3115b is in communication with the second matching through hole 3102a, and further in communication with the third flow channel 3102. The structure of the through hole of the side wall of the second sub-mounting hole 3115b can refer to the related description of the first sub-mounting hole 3115a, and will not be described again.

[0077] The third sub-mounting hole 3115c is located at one side of the third groove 3102c along the Y-axis direction, and the projection of the third sub-mounting hole 3115c along the Z-axis direction is arranged in a spaced manner with the projection of the third flow channel 3102 along the Z-axis direction. The side wall of the third sub-mounting hole 3115c is provided with a through hole, so that the third sub-mounting hole 3115c is in communication with the third groove 3102c, and further in communication with the third flow channel 3102. The structure of the through hole of the side wall of the third sub-mounting hole 3115c can refer to the related description of the first sub-mounting hole 3115a, and will not be described again.

[0078] The fourth sub-mounting hole 3115d is located at one end of the fourth groove 3103a away from the fifth groove 3103b, and the projection of the fourth sub-mounting hole 3115d along the Z-axis direction is arranged in a spaced manner with the projection of the second flow channel 3103 along the Z-axis direction. The side wall of the fourth sub-mounting hole 3115d is provided with a through hole, so that the fourth sub-mounting hole 3115d is in communication with the fourth groove 3103a, and further in communication with the second flow channel 3103. The structure of the through hole of the side wall of the fourth sub-mounting hole 3115d can refer to the related description of the first sub-mounting hole 3115a, and will not be described again.

[0079] The second mounting hole 3116 penetrates the flow channel plate 311 along the Z-axis direction and communicates with the first flow channel 3101. Specifically, the number of the second mounting hole 3116 is two, and the two second mounting holes 3116 are a fifth sub-mounting hole 3116a and a sixth sub-mounting hole 3116b. The fifth sub-mounting hole 3116a is arranged on the bottom wall of the first groove 3101a, penetrates the bottom wall of the first groove 3101a along the Z-axis direction, and communicates with the first groove 3101a. The sixth sub-mounting hole 3116b is arranged on the bottom wall of the second groove 3101b, penetrates the bottom wall of the second groove 3101b along the Z-axis direction, and communicates with the second groove 3101b. The hole wall of the sixth sub-mounting hole 3116b is provided with a through hole, so that the sixth sub-mounting hole 3116b communicates with the fifth matching through hole 3103d, and further, the sixth sub-mounting hole 3116b communicates with the second flow channel 3103.

[0080] The structure of the through hole in the side wall of the sixth sub-mounting hole 3116b can refer to the related description of the first sub-mounting hole 3115a, and will not be described again.

[0081] The third mounting hole 3117 penetrates the flow channel plate 311 along the Z-axis direction and communicates with the second flow channel 3103. Specifically, the number of the third mounting hole 3117 is one, and the third mounting hole 3117 is located at one end of the fourth matching through hole 3103c away from the fifth groove 3103b. The projection of the third mounting hole 3117 along the Z-axis direction is arranged in a spaced manner with the projection of the second flow channel 3103 along the Z-axis direction. The side wall of the third mounting hole 3117 is provided with a through hole, so that the third mounting hole 3117 communicates with the fourth matching through hole 3103c, and further, the third mounting hole 3117 communicates with the second flow channel 3103. The structure of the through hole in the side wall of the third mounting hole 3117 can refer to the related description of the first sub-mounting hole 3115a, and will not be described again.

[0082] The fourth mounting hole 3118 penetrates the flow channel plate 311 along the Z-axis direction and communicates with the third flow channel 3102. Specifically, the number of the fourth mounting hole 3118 is one, and the fourth mounting hole 3118 is located on one side of the second matching through hole 3102a along the X-axis direction. The projection of the fourth mounting hole 3118 along the Z-axis direction is arranged in a spaced manner with the projection of the third flow channel 3102 along the Z-axis direction. The side wall of the fourth mounting hole 3118 is provided with a through hole, so that the fourth mounting hole 3118 communicates with the second matching through hole 3102a, and further, the fourth mounting hole 3118 communicates with the third flow channel 3102. The structure of the through hole in the side wall of the fourth mounting hole 3118 can refer to the related description of the first sub-mounting hole 3115a, and will not be described again.

[0083] As Figure 13 , Figure 15 and Figure 16As shown, in the Z-axis direction, the first cover plate 312 and the second cover plate 313 are fixed and laminated on both sides of the flow channel plate 311 along the thickness direction (i.e. the Z-axis direction) and cover the plurality of flow channels 310 to close each flow channel 310. Specifically, solder is coated between the flow channel plate 311 and the first cover plate 312 and between the flow channel plate 311 and the second cover plate 313, and by pressing the first cover plate 312 or the second cover plate 313 in the tunnel furnace and heating the solder, the flow channel plate 311 is fixedly connected with the first cover plate 312 and the second cover plate 313.

[0084] In the Z-axis direction, the profile of the first cover plate 312 is the same as the profile of the plurality of flow channels 310, the projection of the first cover plate 312 along the Z-axis direction covers the projection of the plurality of flow channels 310 along the Z-axis direction, and the projection of the second cover plate 313 along the Z-axis direction covers the projection of the plurality of flow channels 310 along the Z-axis direction.

[0085] The first cover plate 312 is provided with at least one flow-through hole 3121, the flow-through hole 3121 penetrates the first cover plate 312 along the Z-axis direction, each flow channel 310 corresponds to at least one flow-through hole 3121, and in the corresponding flow-through hole 3121 and flow channel 310, the flow-through hole 3121 and the flow channel 310 are communicated. In this embodiment, the number of flow-through holes 3121 is multiple, for example, the number of flow-through holes 3121 is four, and the four flow-through holes 3121 are respectively the first flow-through hole 3121a, the second flow-through hole 3121b, the third flow-through hole 3121c and the fourth flow-through hole 3121d, wherein the first flow-through hole 3121a is opposite and communicated with the first sub-mounting hole 3115a. The second flow-through hole 3121b is opposite and communicated with the second sub-mounting hole 3115b. The third flow-through hole 3121c is opposite and communicated with the third sub-mounting hole 3115c. The fourth flow-through hole 3121d is opposite and communicated with the fourth sub-mounting hole 3115d.

[0086] The second cover plate 313 is provided with a plurality of matching holes 3131, and the plurality of matching holes 3131 all penetrate the second cover plate 313 along the Z-axis direction. In the Z-axis direction, the plurality of matching holes 3131 correspond one-to-one to the plurality of mounting holes 3111, and in the corresponding matching hole 3131 and mounting hole 3111, the matching hole 3131 is opposite and communicated with the mounting hole 3111.

[0087] In the embodiment, the plurality of matching holes 3131 include a first matching hole 3132, a second matching hole 3133, a third matching hole 3134, and a fourth matching hole 3135. For example, the number of the first matching holes 3132 is four, and the four first matching holes 3132 are respectively a first sub-matching hole 3132a, a second sub-matching hole 3132b, a third sub-matching hole 3132c, and a fourth sub-matching hole 3132d. Among them, the first sub-matching hole 3132a corresponds to the first sub-mounting hole 3115a, the second sub-matching hole 3132b corresponds to the second sub-mounting hole 3115b, the third sub-matching hole 3132c corresponds to the third sub-mounting hole 3115c, and the fourth sub-matching hole 3132d corresponds to the fourth sub-mounting hole 3115d.

[0088] The number of the second matching holes 3133 is two, and the two second matching holes 3133 are respectively a fifth sub-matching hole 3133a and a sixth sub-matching hole 3133b. The fifth sub-matching hole 3133a corresponds to the fifth sub-mounting hole 3116a, and the sixth sub-matching hole 3133b corresponds to the sixth sub-mounting hole 3116b. The number of the third matching hole 3134 is one, and the third matching hole 3134 corresponds to the third mounting hole 3117. The number of the fourth matching hole 3135 is one, and the fourth matching hole 3135 corresponds to the fourth mounting hole 3118. It can be understood that, in the Z-axis direction, the flow-through hole 3121, the first mounting hole 3115, and the first matching hole 3132 are sequentially communicated.

[0089] The number of the functional pieces 32 is multiple, and part of the functional pieces 32 are valves 321, and part of the functional pieces 32 are temperature and pressure sensors 322. The plurality of valves 321, the plurality of matching holes 3131, and the plurality of mounting holes 3111 correspond one by one. In the corresponding valve 321, matching hole 3131, and mounting hole 3111, the valve 321 is partially installed in the matching hole 3131 and the mounting hole 3111.

[0090] The plurality of valves 321 include a first valve 323, a second valve 324, a third valve 325, and a fourth valve 326. The first valve 323 is partially installed in the first mounting hole 3115 and the first matching hole 3132, and the projection of the first valve 323 along the Z-axis direction overlaps the projection of the flow-through hole 3121 along the Z-axis direction. The first valve 323 includes a first valve port 3231 and a second valve port 3232. The first valve port 3231 is communicated with the through hole 3114 of the first mounting hole 3115, in other words, the first valve port 3231 is communicated with the flow channel 310 through the through hole 3114, so that the first valve 323 is communicated with the flow channel 310, and the second valve port 3232 is located in the first mounting hole 3115 and faces the heat exchange assembly 10. The second valve port 3232 is communicated with the heat exchange assembly 10.

[0091] For example, there are four first valves 323, namely a first sub-valve 323a, a second sub-valve 323b, a third sub-valve 323c, and a fourth sub-valve 323d. The first sub-valve 323a corresponds to the first sub-mating hole 3132a and the first sub-mounting hole 3115a, and is connected to the first flow channel 3101. The second sub-valve 323b corresponds to the second sub-mating hole 3132b and the second sub-mounting hole 3115b, and is connected to the third flow channel 3102. The third sub-valve 323c corresponds to the third sub-mating hole 3132c and the third sub-mounting hole 3115c, and is connected to the third flow channel 3102. The fourth sub-valve 323d corresponds to the fourth sub-mating hole 3132d and the fourth sub-mounting hole 3115d, and is connected to the second flow channel 3103.

[0092] like Figure 13 , Figure 15 and Figure 17 As shown, the second valve 324 has a valve channel 3211, a third valve port 3212, and a fourth valve port 3213. The valve channel 3211 is located inside the valve, and both the third valve port 3212 and the fourth valve port 3213 are connected to the valve channel 3211. When the second valve 324 is installed on the refrigerant substrate 31, the third valve port 3212 is connected to the flow channel 310, which in turn connects the valve channel 3211 to the flow channel 310. The fourth valve port 3213 is located on the portion of the second valve 324 that is exposed outside the refrigerant substrate 31, and it is used to communicate with external components.

[0093] In this embodiment, the third valve port 3212 of the second valve 324 is connected to the first flow channel 3101. Specifically, there are two second valves 324, namely the fifth sub-valve 324a and the sixth sub-valve 324b. The fifth sub-valve 324a corresponds to the fifth sub-fitting hole 3133a and the fifth sub-mounting hole 3116a. The third valve port 3212 of the fifth sub-valve 324a is connected to the first flow channel 3101, so that the fifth sub-valve 324a is connected to the first flow channel 3101. The sixth sub-valve 324b corresponds to the sixth sub-mate hole 3133b and the sixth sub-mount hole 3116b. The third valve port 3212 of the sixth sub-valve 324b is connected to the first flow channel 3101 or the second flow channel 3103, so that the sixth sub-valve 324b is connected to the first flow channel 3101 or the second flow channel 3103. The sixth sub-valve 324b can be controlled to be connected to the first flow channel 3101 or the second flow channel 3103. In some other embodiments, the third valve port 3212 of the second valve 324 can be connected to the second flow channel 3103 or the third flow channel 3102.

[0094] The third valve 325 has the same structure as the second valve 324, and includes a fifth valve port and a sixth valve port. For details, refer to the description of the second valve 324. Figure 17 In this embodiment, the number of the third valve 325 is one, the third valve 325 corresponds to the third matching hole 3134 and the third mounting hole 3117, the fifth valve port of the third valve 325 is in communication with the second flow channel 3103, so that the third valve 325 is in communication with the second flow channel 3103, and the sixth valve port is located at the part of the third valve 325 exposed outside the refrigerant substrate 31, and is used for communication with external components.

[0095] The fourth valve 326 has the same structure as the second valve 324, and includes a seventh valve port and an eighth valve port. For details, refer to the description of the second valve 324. Figure 17 In this embodiment, the number of the fourth valve 326 is one, the fourth valve 326 corresponds to the fourth matching hole 3135 and the fourth mounting hole 3118, the seventh valve port of the fourth valve 326 is in communication with the third flow channel 3102, so that the fourth valve 326 is in communication with the third flow channel 3102, and the eighth valve port is located at the part of the fourth valve 326 exposed outside the refrigerant substrate 31, and is used for communication with external components.

[0096] It can be understood that in this embodiment, the number of the flow-through holes 3121, the number of the first mounting holes 3115, the number of the first matching holes 3132, and the number of the first valves 323 are all multiple, and the multiple flow-through holes 3121, the multiple first mounting holes 3115, the multiple first matching holes 3132, and the multiple first valves 323 correspond one-to-one.

[0097] The number of the temperature and pressure sensor 322 is one, the temperature and pressure sensor 322 is installed on the refrigerant substrate 31, and the detection end of the temperature and pressure sensor 322 extends into the third flow channel 3102 to detect the temperature and pressure of the third flow channel 3102.

[0098] Please refer to Figure 18 , in combination with Figure 5 and Figure 13 , Figure 18 is Figure 4 the perspective structural exploded view of the thermal management integrated module 100 from another angle.

[0099] As shown in Figure 5 , Figure 13 and Figure 18 , the refrigerant assembly 30 is located on the side of the heat exchange assembly 10 away from the liquid cooling assembly 20, and the heat exchange assembly 10 is arranged between the liquid cooling assembly 20 and the refrigerant substrate 31. The first cover plate 312 is located between the flow channel plate 311 and the heat exchange assembly 10, and the flow channel 310, the first valve 323, the flow-through hole 3121, and the heat exchange assembly 10 are in communication.

[0100] Specifically, the first flow-through hole 3121a of the first cover plate 312 is in communication with the first refrigerant inlet 113 of the first heat exchanger 11, so that the first sub-mounting hole 3115a is in communication with the first heat exchanger 11, so that the second valve port 3232 of the first sub-valve 323a in the first sub-mounting hole 3115a is in communication with the first heat exchanger 11, and then the first flow channel 3101, the first sub-valve 323a, and the first heat exchanger 11 are sequentially communicated.

[0101] The second flow-through hole 3121b of the first cover plate 312 is in communication with the first refrigerant outlet 114 of the first heat exchanger 11, so that the second sub-mounting hole 3115b is in communication with the first heat exchanger 11, so that the second valve port 3232 of the second sub-valve 323b in the second sub-mounting hole 3115b is in communication with the first heat exchanger 11, and then the first heat exchanger 11, the second sub-valve 323b, and the third flow channel 3102 are sequentially communicated.

[0102] The third flow-through hole 3121c of the first cover plate 312 is in communication with the second refrigerant inlet 123 of the second heat exchanger 12, so that the third sub-mounting hole 3115c is in communication with the second heat exchanger 12, so that the second valve port 3232 of the third sub-valve 323c in the third sub-mounting hole 3115c is in communication with the second heat exchanger 12, and then the third flow channel 3102, the third sub-valve 323c, and the second heat exchanger 12 are sequentially communicated.

[0103] The fourth flow-through hole 3121d of the first cover plate 312 is in communication with the second refrigerant outlet 124 of the second heat exchanger 12, so that the fourth sub-mounting hole 3115d is in communication with the second heat exchanger 12, so that the second valve port 3232 of the fourth sub-valve 323d in the fourth sub-mounting hole 3115d is in communication with the second heat exchanger 12, and then the second heat exchanger 12, the fourth sub-valve 323d, and the second flow channel 3103 are sequentially communicated.

[0104] It can be understood that in the embodiment, the flow channel 310 is communicated with the heat exchange assembly 10 through the first valve 323. Specifically, the first flow channel 3101 corresponds to at least one first valve 323 (i.e., the first sub-valve 323a), the third flow channel 3102 corresponds to at least two first valves 323 (i.e., the second sub-valve 323b and the third sub-valve 323c), and the second flow channel 3103 corresponds to at least one first valve 323 (i.e., the fourth sub-valve 323d). The first flow channel 3101 is communicated with the first heat exchanger 11 through the corresponding first valve 323 (i.e., the first sub-valve 323a), the third flow channel 3102 is communicated with the first heat exchanger 11 through the corresponding first valve 323 (i.e., the second sub-valve 323b), the third flow channel 3102 is communicated with the second heat exchanger 12 through the corresponding first valve 323 (i.e., the third sub-valve 323c), and the second flow channel 3103 is communicated with the second heat exchanger 12 through the corresponding first valve 323 (i.e., the fourth sub-valve 323d).

[0105] The compressor 400 is communicated with at least one flow channel 310. Specifically, the compressor 400 is communicated with the fifth sub-valve 324a, and thus the compressor 400 is communicated with the first flow channel 3101. The fourth sub-valve 323d is communicated with the gas-liquid separator 500, and the gas-liquid separator 500 is communicated with the compressor 400. The compressor 400 is used to drive the second medium in the flow channel 310 to flow. Specifically, the second medium can flow back to the compressor 400 (as shown in FIG. 6) through the fifth sub-valve 324a corresponding to the fifth sub-mounting hole 3116a, the first flow channel 3101, the first sub-valve 323a corresponding to the first sub-mounting hole 3115a, the first flow-through hole 3121a, the first heat exchanger 11, the second flow-through hole 3121b, the second sub-valve 323b corresponding to the second sub-mounting hole 3115b, the third flow channel 3102, the third sub-valve 323c corresponding to the third sub-mounting hole 3115c, the third flow-through hole 3121c, the second heat exchanger 12, the fourth flow-through hole 3121d, the fourth sub-valve 323d corresponding to the fourth sub-mounting hole 3115d, and the gas-liquid separator 500. Figure 1 Figure 1

[0106] Among them, the second sub-valve 323b, the fourth sub-valve 323d and the fifth sub-valve 324a are expansion valves, mainly used to adjust the flow of the second medium. The first sub-valve 323a is a check valve, mainly used to prevent the second medium entering the first heat exchanger 11 from flowing back to the first flow channel 3101. The third sub-valve 323c is a check valve, mainly used to prevent the second medium flowing into the second heat exchanger 12 from flowing back to the third flow channel 3102.

[0107] ​​In this embodiment, the second medium is refrigerant, and the compressor 400 compresses the refrigerant into high-temperature and high-pressure refrigerant gas. The high-temperature and high-pressure refrigerant gas flows from the compressor 400 to the first heat exchanger 11 in sequence through the fifth sub-valve 324a, the first flow channel 3101, the first sub-valve 323a, and the first flow-through hole 3121a. The high-temperature and high-pressure refrigerant gas releases heat in the first heat exchanger 11 and becomes medium-temperature and high-pressure refrigerant liquid. Then, the medium-temperature and high-pressure refrigerant liquid flows from the first heat exchanger 11 to the second sub-valve 323b through the second flow-through hole 3121b. When the medium-temperature and high-pressure refrigerant liquid flows through the second sub-valve 323b, the second sub-valve 323b throttles, so that the medium-temperature and high-pressure refrigerant liquid becomes low-temperature and low-pressure refrigerant liquid. The low-temperature and low-pressure refrigerant liquid flows from the second sub-valve in sequence through the third flow channel 3102, the third sub-valve 323c, and the third flow-through hole 3121c to the second heat exchanger 12. The low-temperature and low-pressure refrigerant liquid absorbs heat in the second heat exchanger 12 and becomes refrigerant gas. The refrigerant gas flows from the second heat exchanger 12 to the compressor 400 in sequence through the fourth flow-through hole 3121d, the fourth sub-valve 323d, and the gas-liquid separator 500. When the refrigerant gas flows to the gas-liquid separator 500, the gas-liquid separator 500 removes the water mixed in the refrigerant gas, preventing the water mixed in the refrigerant gas from entering the compressor 400.

[0108] If the heat management object 1100 needs to be heated, the first water pump 22 works, and under the action of the first water pump 22, the first medium in the storage tank 200 flows into the first heat exchanger 11. The first medium exchanges heat with the second medium in the first heat exchanger 11, the first medium absorbs the heat released by the refrigerant, and then the first medium flows to the heat management member 300 and transfers heat to the heat management object 1100 to heat the heat management object 1100. After heating is completed, the first medium flows to the storage tank 200, completing a working cycle.

[0109] If the heat management object 1100 needs to be cooled, the first medium in the heat management member 300 (see Figure 1 ) absorbs the heat of the heat management object 1100, and then under the action of the second water pump 23, the first medium flows to the second heat exchanger 12 through the storage tank 200. The first medium and the second medium exchange heat in the second heat exchanger 12, the second medium absorbs the heat of the first medium, so that the temperature of the first medium decreases, and then the first medium flows to the heat management member 300 again and absorbs the heat of the heat management object 1100 to cool the heat management object 1100 again.

[0110] In some other embodiments, the compressor 400 and the gas-liquid separator 500 can also be in communication with other valves 321. For example, the compressor 400 can be in communication with the sixth sub-valve 324b, and the gas-liquid separator 500 can be in communication with the fourth sub-valve 323d. The second medium can flow from the compressor 400, sequentially through the sixth sub-valve 324b corresponding to the sixth sub-mounting hole 3116b, the first flow channel 3101, the first sub-valve 323a corresponding to the first sub-mounting hole 3115a, the first flow-through hole 3121a, the first heat exchanger 11, the second flow-through hole 3121b, the second sub-valve 323b corresponding to the second sub-mounting hole 3115b, the third flow channel 3102, the third sub-valve 323c corresponding to the third sub-mounting hole 3115c, the third flow-through hole 3121c, the second heat exchanger 12, the fourth flow-through hole 3121d, the fourth sub-valve 323d corresponding to the fourth sub-mounting hole 3115d, and the gas-liquid separator 500, back to the compressor 400.

[0111] In some other embodiments, the compressor 400 can be in communication with the fifth sub-valve 324a, and the gas-liquid separator 500 can be in communication with the third valve 325. The second medium can flow from the compressor 400, sequentially through the fifth sub-valve 324a corresponding to the fifth sub-mounting hole 3116a, the first flow channel 3101, the first sub-valve 323a corresponding to the first sub-mounting hole 3115a, the first flow-through hole 3121a, the first heat exchanger 11, the second flow-through hole 3121b, the second sub-valve 323b corresponding to the second sub-mounting hole 3115b, the third flow channel 3102, the third sub-valve 323c corresponding to the third sub-mounting hole 3115c, the third flow-through hole 3121c, the second heat exchanger 12, the fourth flow-through hole 3121d, the fourth sub-valve 323d corresponding to the fourth sub-mounting hole 3115d, the second flow channel 3103, the third valve 325 corresponding to the third mounting hole 3117, and the gas-liquid separator 500, back to the compressor 400.

[0112] In some other embodiments, the compressor 400 can be in communication with the fifth sub-valve 324a, the gas-liquid separator 500 can be in communication with the sixth sub-valve 324b, and the second medium can flow from the compressor 400 to the gas-liquid separator 500 in sequence through the fifth sub-valve 324a corresponding to the fifth sub-mounting hole 3116a, the first flow channel 3101, the first sub-valve 323a corresponding to the first sub-mounting hole 3115a, the first flow-through hole 3121a, the first heat exchanger 11, the second flow-through hole 3121b, the second sub-valve 323b corresponding to the second sub-mounting hole 3115b, the third flow channel 3102, the third sub-valve 323c corresponding to the third sub-mounting hole 3115c, the third flow-through hole 3121c, the second heat exchanger 12, the fourth flow-through hole 3121d, the fourth sub-valve 323d corresponding to the fourth sub-mounting hole 3115d, the second flow channel 3103, the sixth sub-valve 324b corresponding to the sixth sub-mounting hole 3116b, and the gas-liquid separator 500.

[0113] In some other embodiments, the compressor 400 can be in communication with the fifth sub-valve 324a, the gas-liquid separator 500 can be in communication with the sixth sub-valve 324b, and the second medium can flow from the compressor 400 to the gas-liquid separator 500 in sequence through the fifth sub-valve 324a corresponding to the fifth sub-mounting hole 3116a, the first flow channel 3101, the first sub-valve 323a corresponding to the first sub-mounting hole 3115a, the first flow-through hole 3121a, the first heat exchanger 11, the second flow-through hole 3121b, the second sub-valve 323b corresponding to the second sub-mounting hole 3115b, the third flow channel 3102, the third sub-valve 323c corresponding to the third sub-mounting hole 3115c, the third flow-through hole 3121c, the second heat exchanger 12, the fourth flow-through hole 3121d, the fourth sub-valve 323d corresponding to the fourth sub-mounting hole 3115d, the second flow channel 3103, the sixth sub-valve 324b corresponding to the sixth sub-mounting hole 3116b, and the gas-liquid separator 500.

[0114] In some other embodiments, the compressor 400 can be in communication with the fifth sub-valve 324a, the gas-liquid separator 500 can be in communication with the sixth sub-valve 324b, and the second medium can flow from the compressor 400 to the gas-liquid separator 500 in sequence through the fifth sub-valve 324a corresponding to the fifth sub-mounting hole 3116a, the first flow channel 3101, the first sub-valve 323a corresponding to the first sub-mounting hole 3115a, the first flow-through hole 3121a, the first heat exchanger 11, the second flow-through hole 3121b, the second sub-valve 323b corresponding to the second sub-mounting hole 3115b, the third flow channel 3102, the third sub-valve 323c corresponding to the third sub-mounting hole 3115c, the third flow-through hole 3121c, the second heat exchanger 12, the fourth flow-through hole 3121d, the fourth sub-valve 323d corresponding to the fourth sub-mounting hole 3115d, the second flow channel 3103, the sixth sub-valve 324b corresponding to the sixth sub-mounting hole 3116b, and the gas-liquid separator 500.

[0115] When the heat exchange assembly 10 is provided with only the second heat exchanger 12, the compressor 400 is in communication with the fourth valve 326 or the third sub-valve 323c, and the second medium enters the second heat exchanger 12 from the fourth valve 326 or the third sub-valve 323c. The gas-liquid separator 500 is in communication with the fourth sub-valve 323d, the third valve 325, the fifth sub-valve 324a or the sixth sub-valve 324b, and the second medium can be discharged from the fourth sub-valve 323d, the third valve 325, the fifth sub-valve 324a or the sixth sub-valve 324b to the gas-liquid separator 500.

[0116] In the embodiment, each flow channel 310 at least partially penetrates the flow channel plate 311 along the thickness direction of the flow channel plate 311, and the first cover plate 312 and the second cover plate 313 are fixed to the two sides of the flow channel plate 311 along the thickness direction and cover the flow channels 310 to seal the flow channels 310. Since each flow channel 310 at least partially penetrates the flow channel plate 311 along the thickness direction of the flow channel plate 311, the flow channel plate 311 can be made by a continuous extrusion process. Specifically, the blank is extruded into a mold for forming, and then the formed blank is machined (for example, cutting, milling or punching, etc.) to make the flow channel plate 311. In this way, the blank can be avoided to be press-forged, the machining process is less, and the forming efficiency is high. The machining efficiency is high, and thus the cost is reduced. Moreover, only a small amount of machining is required for the formed blank to make the flow channel plate 311, the machining allowance is small, which is beneficial to improve the utilization rate of the blank, reduce the cost of the blank, and reduce the processing cost. In addition, it is beneficial to reduce the density and weight of the flow channel plate 311, and the smaller density and lighter weight are beneficial to the lightweight design of the refrigerant substrate 31. Furthermore, in the flow channel plate 311 made by the extrusion process, the wall thickness (for example, the D1 size shown in the figure) of each flow channel can be made very small, which is beneficial to the miniaturization design. Figure 14

[0117] In the embodiment, the first mounting hole 3115 is spaced apart from the flow channel 310, and the through hole 3114 is arranged to communicate the first mounting hole 3115 and the flow channel 310. The first mounting hole 3115 does not occupy the space of the flow channel 310, so that the space of the flow channel 310 is made larger in the limited space, the flow channel 310 can accommodate more second medium, and the flowability of the second medium in the flow channel 310 is better.

[0118] In the embodiment, the projection of the first valve 323 along the Z-axis direction overlaps the projection of the flow-through hole 3121 along the Z-axis direction. The design that the projection of the first valve 323 along the Z-axis direction overlaps the projection of the flow-through hole 3121 along the Z-axis direction is beneficial to shorten the path of the medium flowing between the first valve 323 and the heat exchange assembly 10, improve the flow efficiency of the medium in the flow channel 310 and the heat exchange assembly 10, and improve the performance of the thermal management integrated module 100.

[0119] ​In the embodiment, the first heat exchanger 11 (condenser) can be used for heating, and the second heat exchanger 12 (evaporator) can be used for refrigeration, so that the heat management integrated module 100 can both heat and refrigerate, the function of the heat management integrated module 100 is more, and the heat management system 1000 can better perform heat management.

[0120] In the embodiment, the second medium can flow into the first flow channel 3101 from the second valve 324 first, and then flow into the heat exchange assembly 10. By arranging the second valve 324, the second medium can enter the heat exchange assembly 10 from more positions. In the embodiment, the second medium can flow into the second flow channel 3103 first, and then be discharged to the outside of the flow channel 310 from the third valve 325. By arranging the third valve 325, the second medium can be discharged to the outside of the flow channel 310 from more positions.

[0121] In some embodiments, the density of the flow channel plate 311 is equal to the density of the first cover plate 312, and / or the density of the flow channel plate 311 is equal to the density of the second cover plate 313. Specifically, the flow channel plate 311, the first cover plate 312, and the second cover plate 313 are all made of aluminum. In the embodiment, the density of the flow channel plate 311 is equal to the density of the first cover plate 312 and / or the density of the second cover plate 313, which is beneficial to reduce the weight of the refrigerant substrate 31 and facilitate the lightweight design of the heat management integrated module 100.

[0122] Please refer to Figure 19 , and combine Figure 14 , Figure 19 is Figure 13 the flow channel plate 311 of the refrigerant assembly 30 shown in another embodiment.

[0123] As Figure 14 and Figure 19 shown, Figure 19 the embodiment shown in the embodiment is similar to the structure of Figure 14 , the difference between the two is that the structure of the flow channel plate 311 is different. In Figure 19 the embodiment shown, the flow channel plate 311 includes a first sub-plate 311a and a second sub-plate 311b, which are arranged at intervals along the X-axis direction. Among the plurality of flow channels 310, at least one flow channel 310 is arranged on the first sub-plate 311a, and at least one other flow channel 310 is arranged on the second sub-plate 311b. Specifically, the first flow channel 3101 and the second flow channel 3103 are arranged on the second sub-plate 311b, and the third flow channel 3102 is arranged on the first sub-plate 311a. In Figure 19In the shown embodiment, by splitting the flow channel plate 311 into a first sub-plate 311a and a second sub-plate 311b, and by spacing the first sub-plate 311a and the second sub-plate 311b, the heat insulation requirement between the first flow channel 3101 and the third flow channel 3102 is met, which is conducive to preventing heat of the second sub-plate 311b from being transferred to the third flow channel 3102 of the first sub-plate 311a, and conducive to avoiding that the temperature of the third flow channel 3102 is too high, thereby improving the performance of the thermal management integrated module 100.

[0124] Please refer to Figure 20 , in combination with Figure 13 and Figure 17 , Figure 20 is Figure 13 the structure diagram of the second valve 324 of the refrigerant assembly 30 in another embodiment.

[0125] As shown in Figure 13 , Figure 17 and Figure 20 , Figure 20 the structure of the embodiment shown is similar to that of the embodiments shown in Figure 13 and Figure 17 , the difference between the two is that the structure of the second valve 324 is different. In Figure 20 the embodiment shown, the second valve 324 includes an upper plate 3214, a middle plate 3215, and a lower plate 3216, a valve passage 3211 is arranged in the middle plate 3215, the valve passage 3211 extends through the middle plate 3215 along the Z-axis direction, and in the Z-axis direction, the upper plate 3214 and the lower plate 3216 are fixed and stacked on both sides of the middle plate 3215 and close the valve passage 3211. A third valve port 3212 is arranged on the upper plate 3214, the third valve port 3212 extends through the upper plate 3214 along the Z-axis direction and communicates with the valve passage 3211. A fourth valve port 3213 is arranged on the lower plate 3216, the fourth valve port 3213 extends through the lower plate 3216 along the Z-axis direction and communicates with the valve passage 3211. It can be understood that the valve passage 3211 extends along the Z-axis direction and communicates with the third valve port 3212 and the fourth valve port 3213.

[0126] In Figure 20 the embodiment shown, the valve passage 3211 extends through the middle plate 3215 along the Z-axis direction, so that the middle plate 3215 can be made by continuous extrusion process of aluminum profile, which has higher processing efficiency, thereby reducing the cost, and the density of aluminum profile is smaller and the weight is lighter, which is conducive to lightweight design. At the same time, by extrusion process, it is conducive to reducing the width of the side wall of the valve passage 3211, and conducive to miniaturization design.

[0127] It can be understood that Figure 20The design of the second valve 324 including the upper plate 3214, the middle plate 3215 and the lower plate 3216 in the shown embodiment can also be applied to the third valve 325 and the fourth valve 326.

[0128] The above merely illustrates some embodiments and implementations of the present application, and the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of changes or replacements within the technical scope disclosed by the present application, which should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A thermal management integrated module, characterized by, The heat management integrated module comprises a liquid cooling assembly, a heat exchange assembly and a refrigerant substrate, the heat exchange assembly is arranged between the liquid cooling assembly and the refrigerant substrate in a first direction; the refrigerant substrate comprises a flow channel plate, a first cover plate and a second cover plate, the first cover plate and the second cover plate are laminated on both sides of the flow channel plate in the first direction, the first cover plate is located between the flow channel plate and the heat exchange assembly, the flow channel plate is provided with at least one flow channel, each flow channel penetrates the flow channel plate at least partially along the first direction, and the first direction is the thickness direction of the flow channel plate; The first cover plate is provided with at least one flow-through hole penetrating the first cover plate along the first direction, and the at least one flow-through hole is in communication with the flow channel and the heat exchange assembly.

2. The thermal management integrated module of claim 1, wherein, The flow channel plate is further provided with a first mounting hole penetrating the flow channel plate along the first direction, and the second cover plate is further provided with a first matching hole penetrating the second cover plate along the first direction; The heat management integrated module further comprises a first valve, the first valve is partially arranged in the first mounting hole and the first matching hole, and the flow channel is in communication with the heat exchange assembly through the first valve.

3. The thermal management integrated module of claim 2, wherein, The projection of the first mounting hole along the first direction is arranged in a spaced manner with the projection of the flow channel along the first direction, the flow channel plate is further provided with a through hole, the extension direction of the through hole is perpendicular to the first direction, the first valve comprises a first valve port and a second valve port, the first valve port is in communication with the flow channel through the through hole, and the second valve port is in communication with the heat exchange assembly.

4. The thermal management integrated module of any of claims 2 or 3, wherein, The heat exchange assembly comprises a condenser, the at least one flow channel comprises a first flow channel, the number of the first valves is plural, the first flow channel corresponds to at least one first valve, and the first flow channel is in communication with the condenser through the corresponding first valve.

5. The thermal management integrated module of any of claims 2 or 3, wherein, The heat exchange assembly comprises an evaporator, the at least one flow channel comprises a second flow channel, the number of the first valves is plural, the second flow channel corresponds to at least one first valve, and the second flow channel is in communication with the evaporator through the corresponding first valve.

6. The thermal management integrated module of any of claims 2 or 3, wherein, The heat exchange assembly comprises a condenser and an evaporator, the at least one flow channel comprises a third flow channel, the number of the first valves is plural, the third flow channel corresponds to at least two first valves, and the third flow channel is in communication with the condenser and the evaporator through the corresponding first valves.

7. The thermal management integrated module of any one of claims 1 to 3, wherein, The flow channel plate is further provided with a second mounting hole penetrating the flow channel plate along the first direction, and the second cover plate is further provided with a second matching hole penetrating the second cover plate along the first direction; The heat management integrated module further comprises a second valve, the second valve is partially arranged in the second mounting hole and the second matching hole, the second valve comprises a third valve port and a fourth valve port, the third valve port is in communication with the flow channel, and the fourth valve port is located at the part of the second valve exposed outside the refrigerant substrate.

8. The thermal management integrated module of claim 7, wherein, The second valve comprises an upper plate, a middle plate and a lower plate, the upper plate and the lower plate are stacked on both sides of the middle plate in the first direction, the third valve port penetrates the upper plate in the first direction, the fourth valve port penetrates the lower plate in the first direction, the middle plate is provided with a valve passage, the valve passage extends in the first direction and communicates with the third valve port and the fourth valve port.

9. The thermal management integrated module of any one of claims 1 to 3, wherein, The flow channel plate comprises a first sub-plate and a second sub-plate, the first sub-plate and the second sub-plate are arranged in a spaced manner in the second direction; the number of the flow channels is plural, at least one of the flow channels is arranged on the first sub-plate, and at least one of the flow channels is arranged on the second sub-plate, the second direction is perpendicular to the first direction.

10. The thermal management integrated module of any one of claims 1 to 3, wherein, The density of the flow channel plate is equal to the density of the first cover plate; and / or, the density of the flow channel plate is equal to the density of the second cover plate.

11. A thermal management system, characterized by, The energy storage device comprises a storage tank, a heat management component, a compressor and the heat management integrated module according to any one of claims 1 to 10; the storage tank, the liquid cooling assembly and the heat management component are sequentially communicated, the heat management component is communicated with the storage tank, and the compressor is communicated with at least one of the flow channels.

12. An energy storage device, characterized by, The energy storage device comprises a battery and the heat management system according to claim 11, and the heat management component is used for heat management of the battery.

13. An electric vehicle, characterized by The electric vehicle comprises a power battery, a power assembly and the heat management system according to claim 11, and the heat management component is used for heat management of the power battery and / or the power assembly. The electric vehicle comprises a power battery, a power assembly and the heat management system according to claim 11, and the heat management component is used for heat management of the power battery and / or the power assembly.

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