PCR (polymerase chain reaction) control device

Abstract

The utility model provides a PCR (Polymerase Chain Reaction) control device which comprises at least one heating component, a reaction tube corresponding to the heating component and a control component, the heating assembly is provided with at least one first sensor; the heating assembly is provided with at least one heat dissipation assembly; the heat dissipation assembly comprises at least one second sensor; an air duct is arranged around the heat dissipation assembly; the air duct is connected with fans; the first sensors are used for collecting first temperature signals of the corresponding heating assemblies; the second sensor is used for collecting a second temperature signal of the corresponding heat dissipation assembly; the control assembly comprises a conversion device used for converting the first temperature signal and / or the second temperature signal to obtain a first digital signal corresponding to the first temperature signal and / or a second digital signal corresponding to the second temperature signal; the control assembly further comprises a control device used for determining a PWM signal based on the first digital signal and / or the second digital signal. And the working state of the fan is controlled according to the PWM signal, so that the temperature in the reaction tube is stable.

Description

TECHNICAL FIELD

[0001] The utility model relates to control field especially relates to a control device of polymerase chain reaction (PCR). BACKGROUND

[0002] In order to improve the PCR temperature control's temperature rising and falling rate, adopt semiconductor refrigeration unit (Thermo Electric Cooler, TEC) semiconductor heating refrigerating sheet to carry out temperature rising and falling control, and TEC semiconductor will produce heat under the action of positive and negative current, but in the process of temperature falling and constant temperature, if the heat produced heat is bigger than the radiator dissipates, will apply the temperature control sensor in reverse, resulting in in order to keep the temperature control sensor maintains at the target temperature constant temperature, controller will reduce the power of TEC, resulting in the temperature of reagent in the tube is smaller and smaller.And with the increase of cycle number, the heat accumulated on the radiator causes the heat dissipation capacity to decline, and the average temperature rising and falling rate will also attenuate, how to provide a kind of PCR control device to solve the problem of average temperature rising and falling rate attenuation and very fast rate to make the temperature in reaction tube stable is urgently needed. SUMMARY

[0003] To solve the existing technical problems, the utility model embodiment provides a kind of PCR control device.

[0004] To achieve the above purpose, the technical scheme of the utility model embodiment is as follows:

[0005] The utility model embodiment provides a kind of PCR control device, the device includes: at least one heating component, corresponding reaction tube with the heating component and control component;At least one first sensor is provided on the heating component;At least one heat dissipation component is further provided on the heating component;The heat dissipation component includes at least one second sensor;Air duct is arranged around the heat dissipation component;The air duct is connected with fan;Wherein,

[0006] The first sensor is used to collect the first temperature signal of the corresponding heating component;

[0007] The second sensor is used to collect the second temperature signal of the corresponding heat dissipation component;

[0008] The control component includes a conversion device connected with the first sensor and the second sensor respectively, for converting and processing the first temperature signal and / or the second temperature signal, to obtain the first digital signal corresponding to the first temperature signal and / or the second digital signal corresponding to the second temperature signal;

[0009] The control component further comprises a control device connected with the conversion device and the fan respectively, for determining a PWM signal based on the first digital signal and / or the second digital signal; controlling the working state of the fan according to the PWM signal, so as to stabilize the temperature in the reaction tube.

[0010] In the above scheme, the control device comprises:

[0011] an MCU for determining a first temperature value based on the first digital signal and a second temperature value based on the second digital signal, and determining a PWM signal based on the first temperature value and / or the second temperature value; a driving circuit for determining a voltage parameter or a current parameter of the fan based on the PWM signal; the voltage parameter or the current parameter is used to control the working state of the fan; the driving circuit is connected with the MCU and the fan respectively.

[0012] In the above scheme, the voltage parameter comprises a first voltage parameter and a second voltage parameter; the current parameter comprises a first current parameter and a second current parameter;

[0013] The MCU is further used to judge whether the first temperature value is greater than a preset target temperature; in the case that the first temperature value is greater than the target temperature, the PWM signal with a first duty cycle is determined; in the case that the first temperature value is less than or equal to the target temperature, the PWM signal with a second duty cycle is determined; the first duty cycle and the second duty cycle are different;

[0014] The driving circuit is further used to determine the first voltage parameter or the first current parameter based on the PWM signal with the first duty cycle, and determine the second voltage parameter or the second current parameter based on the PWM signal with the second duty cycle; the first voltage parameter or the first current parameter is used to control the working state of the fan as the maximum air volume; the second voltage parameter or the second current parameter is used to control the working state of the fan as stopping working.

[0015] In the above scheme, the voltage parameter comprises a third voltage parameter, a fourth voltage parameter and a fifth voltage parameter; the current parameter comprises a third current parameter, a fourth current parameter and a fifth current parameter;

[0016] The MCU is further configured to determine whether the second temperature value is greater than a first threshold value or less than a second threshold value; the second threshold value is greater than the first threshold value; the first threshold value and the second threshold value are related to a volume of the heat dissipation component; in a case where the second temperature value is less than or equal to the first threshold value, the PWM signal of a third duty cycle is determined; in a case where the second temperature value is greater than the first threshold value or less than the second threshold value, the PWM signal of a fourth duty cycle is determined; in a case where the second temperature value is greater than or equal to the second threshold value, the PWM signal of a fifth duty cycle is determined; the third duty cycle, the fourth duty cycle, and the fifth duty cycle are different;

[0017] The driving circuit is further configured to determine the third voltage parameter or the third current parameter based on the PWM signal of the third duty cycle, and determine the fourth voltage parameter or the fourth current parameter based on the PWM signal of the fourth duty cycle, and determine the fifth voltage parameter or the fifth current parameter based on the PWM signal of the fifth duty cycle; the third voltage parameter or the third current parameter is used to control the working state of the fan to be stopped working; the fourth voltage parameter or the fourth current parameter is used to control the working state of the fan to be in a minimum air volume degree; and the fifth voltage parameter or the fifth current parameter is used to control the working state of the fan to be in a maximum air volume degree.

[0018] In the above scheme, the at least one heating component includes a first heating component and a second heating component; the at least one first sensor includes a first temperature sensor and a second temperature sensor; the first temperature sensor is connected with the first heating component; the second temperature sensor is connected with the second heating component; the first temperature signal includes a first temperature sub-signal and a second temperature sub-signal;

[0019] The first temperature sensor is configured to collect the first temperature sub-signal of the first heating component.

[0020] The second temperature sensor is configured to collect the second temperature sub-signal of the second heating component.

[0021] In the above scheme, the at least one heat dissipation component includes a first heat dissipation component and a second heat dissipation component; the at least one second sensor includes a third temperature sensor and a fourth temperature sensor; the third temperature sensor is connected with the first heat dissipation component; the fourth temperature sensor is connected with the second heat dissipation component; the second temperature signal includes a third temperature sub-signal and a fourth temperature sub-signal;

[0022] The third temperature sensor is configured to collect the third temperature sub-signal of the first heat dissipation component.

[0023] The fourth temperature sensor is configured to collect the fourth temperature sub-signal of the second heat dissipation component.

[0024] In the above scheme, the first heating component and the second heating component each comprise a semiconductor TEC, and the first heat dissipation component and the second heat dissipation component each comprise a heat sink.

[0025] The control component is further configured to control the working state of the fan based on the first temperature sub-signal, the second temperature sub-signal, the third temperature sub-signal and / or the fourth temperature sub-signal.

[0026] In the above scheme, the first temperature sub-signal corresponds to a first digital sub-signal, the second temperature sub-signal corresponds to a second digital sub-signal, the third temperature sub-signal corresponds to a third digital sub-signal, the fourth temperature sub-signal corresponds to a fourth digital sub-signal, and the conversion device comprises an ADC.

[0027] The ADC is configured to perform conversion processing on the first temperature sub-signal, the second temperature sub-signal, the third temperature sub-signal and / or the fourth temperature sub-signal to obtain a first digital sub-signal corresponding to the first temperature sub-signal, a second digital sub-signal corresponding to the second temperature sub-signal, a third digital sub-signal corresponding to the third temperature sub-signal and / or a fourth digital sub-signal corresponding to the fourth temperature sub-signal.

[0028] The MCU is further configured to determine the first temperature value based on the first digital sub-signal and / or the second digital sub-signal and determine the second temperature value based on the third digital sub-signal and / or the fourth digital sub-signal.

[0029] In the above scheme, the ADC comprises:

[0030] a processor configured to determine the first digital signal and / or the second digital signal based on the first temperature signal and / or the second temperature signal.

[0031] In the above scheme, the MCU comprises:

[0032] a controller configured to control the PWM signal based on the first temperature value and / or the second temperature value.

[0033] The utility model discloses an embodiment of PCR's controlling means, and the device includes: at least one heating assembly, the reaction tube and control assembly corresponding with heating assembly, heating assembly is provided with at least one first sensor, heating assembly still is provided with at least one heat dissipation assembly, heat dissipation assembly includes at least one second sensor, heat dissipation assembly is provided with air duct around, air duct connects fan, first sensor is used for gathering the first temperature signal of corresponding heating assembly, second sensor is used for gathering the second temperature signal of corresponding heat dissipation assembly, control assembly is used for controlling the working condition of fan based on first temperature signal and / or second temperature signal, to make the temperature stability in reaction tube. The technical scheme of the embodiment of the application, through heating assembly still is provided with at least one heat dissipation assembly, heat dissipation assembly includes at least one second sensor, first sensor gathers the first temperature signal of corresponding heating assembly, second sensor gathers the second temperature signal of corresponding heat dissipation assembly, control assembly includes the conversion device connected with first sensor and second sensor respectively, is used for the conversion processing of first temperature signal and / or second temperature signal, obtains the first digital signal corresponding to first temperature signal and / or the second digital signal corresponding to second temperature signal, control assembly still includes the control device connected with conversion device and fan respectively, is used for determining PWM signal based on first digital signal and / or second digital signal, according to PWM signal control fan's working condition, to make the temperature stability in reaction tube. That is, through conversion device based on first sensor gathers the first temperature signal of corresponding heating assembly and / or second sensor gathers the second temperature signal of corresponding heat dissipation assembly conversion processing, obtains the first digital signal corresponding to first temperature signal and / or the second digital signal corresponding to second temperature signal, and the control device determines PWM signal based on first digital signal and / or second digital signal, according to PWM signal control fan's working condition, to make the temperature stability in reaction tube, provide a kind of PCR's controlling means, solve the problem of average temperature rising and falling rate attenuation and very fast rate and make the temperature stability in reaction tube. BRIEF DESCRIPTION OF DRAWINGS

[0034] Figure 1 For abnormal temperature control and normal temperature control, power generation heat diagram is shown;

[0035] Figure 2 For the schematic diagram of the PCR control device provided by the embodiment of the application;

[0036] Figure 3 For another schematic diagram of the PCR control device provided by the embodiment of the application;

[0037] Figure 4 For another schematic diagram of the PCR control device provided by the embodiment of the application;

[0038] Figure 5 This is yet another schematic diagram of a PCR control device provided in an embodiment of this application;

[0039] Figure 6 This is yet another schematic diagram of a PCR control device provided in an embodiment of this application;

[0040] Figure 7 This is a schematic diagram of the heating TEC element and its temperature sensor in the PCR control device of this application embodiment;

[0041] Figure 8 This is a schematic diagram illustrating an application scenario of the PCR control device in the embodiments of this application;

[0042] Figure 9 This is a schematic diagram illustrating another application scenario of the PCR control device in the embodiments of this application;

[0043] Figure 10 This is a schematic diagram of the hardware configuration of the PCR module temperature control component in an embodiment of this application;

[0044] Figure 11 This is a schematic diagram of the hardware control in the PCR control device in the embodiments of this application;

[0045] Figure 12 This is a schematic diagram comparing ordinary control with the control described in this application;

[0046] Figure 13 A schematic diagram for determining the temperature threshold of a heat sink;

[0047] Figure 14 This is a schematic diagram of the temperature control logic in an embodiment of this application;

[0048] Figure 15 This is a schematic diagram of the printed circuit board of the PCR control device in an embodiment of this application;

[0049] Figure 16 This is a schematic diagram of the controller and processor in the PCR control device in the embodiments of this application. Detailed Implementation

[0050] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the specific technical solutions of the utility model will be further described in detail below with reference to the accompanying drawings of the embodiments of this utility model. The following embodiments are used to illustrate this utility model, but are not intended to limit the scope of this utility model.

[0051] In abnormal situations, the heatsink's own power increases, which in turn controls the sensor to reduce the TEC's power, such as... Figure 1 As shown, Figure 1For abnormal temperature control and normal temperature control, the heat generated by power generation schematic diagram; abnormal temperature control, fine black line gradually downward.

[0052] The principle of TEC semiconductor heating control sheet: semiconductor heating device by AB two faces, in the structure of A face and heat dissipation connection, B face and reaction tube connection. TEC through the forward current, B face heating, A face refrigeration, tube temperature rise. Can refer to the following formula (1):

[0053] Q c = Q TEC + Q A-B (1);

[0054] TEC through the reverse current, B face refrigeration, A face heating, tube temperature drop. Can refer to the following formula (2):

[0055] Q c = Q TEC + Q B-A (2);

[0056] In formula (1), (2), QA-B, QB-A indicate the heat transferred from A face to B face, the heat transferred from B face to A face; QTEC indicates the heat generated by the power on TEC.

[0057] Then when the temperature rises, the higher the temperature of the heat sink, the faster the temperature rises, and the power required by QTEC is less, which is beneficial to the life of TEC; When the temperature drops, the lower the temperature of the heat sink, the faster the temperature drops, and the power required by QTEC is less, which is beneficial to the life of TEC.

[0058] The embodiment of the utility model provides a control device of PCR, Figure 2 A control device of PCR provided by the embodiment of the application schematic diagram; Figure 3 Another kind of schematic diagram of the control device of PCR provided by the embodiment of the application; Figure 4 Another kind of schematic diagram of the control device of PCR provided by the embodiment of the application; Figure 5 Another kind of schematic diagram of the control device of PCR provided by the embodiment of the application; Figure 6 Another kind of schematic diagram of the control device of PCR provided by the embodiment of the application; below can combine Figure 2 、 Figure 3 、 Figure 4 、 Figure 5 and Figure 6For understanding, the device 100 comprises at least one heating assembly 101, a reaction tube 102 corresponding to the heating assembly and a control assembly 103; the heating assembly 101 is provided with at least one first sensor 104; the heating assembly 101 is further provided with at least one heat dissipation assembly 105; the heat dissipation assembly 105 comprises at least one second sensor 106; the heat dissipation assembly 105 is provided with an air duct 107; the air duct is connected with a fan 108; the first sensor 104 is used for collecting a first temperature signal of the corresponding heating assembly 101;

[0059] The second sensor 106 is used for collecting a second temperature signal of the corresponding heat dissipation assembly 105;

[0060] The control assembly 103 comprises a conversion device 1031 connected with the first sensor 104 and the second sensor 106 respectively, which is used for converting and processing the first temperature signal and / or the second temperature signal to obtain a first digital signal corresponding to the first temperature signal and / or a second digital signal corresponding to the second temperature signal;

[0061] The control assembly 103 further comprises a control device 1032 connected with the conversion device 1031 and the fan 108 respectively, which is used for determining a PWM signal based on the first digital signal and / or the second digital signal; and controlling the working state of the fan 108 according to the PWM signal, so as to stabilize the temperature in the reaction tube 102.

[0062] It should be noted that the control device of the PCR can be determined according to actual conditions, which is not limited herein. As an example, the control device of the PCR can be understood as a constant temperature control device of the PCR.

[0063] The specific number of the at least one heating assembly 101 can be determined according to actual conditions, which is not limited herein. As an example, the specific number of the heating assembly 101 can be 2. In actual application, the heating assembly 101 can be a heating element, such as a TEC.

[0064] The control component 103 includes conversion devices 1031 and control devices 1032, which can be determined according to actual conditions and are not limited herein. As an example, the conversion device 1031 can include an ADC, etc.; the ADC and the processor can be determined according to actual conditions and are not limited herein. In actual application, the ADC can include a processor; the ADC can be an ADC chip; the ADC chip can include a processor. The control device 1032 can include an MCU and a driving circuit. In actual application, the MCU can include a controller.

[0065] The at least one heat dissipation component 105 can be determined according to actual conditions and is not limited herein. As an example, the specific number of the heat dissipation component 105 can be 2. In actual application, the heat dissipation component 105 can be a heat sink.

[0066] The conversion device 1031 is connected with the first sensor 104 and the second sensor 106 respectively; the connection can be determined according to actual conditions and is not limited herein. As an example, the connection can be understood as an electrical connection, which can be a wired connection or a wireless connection; wherein the wired connection can be a wire connection capable of transmitting data; the wireless connection can be a near distance communication technology, such as Bluetooth, Zigbee, etc.; or a long distance communication technology, such as a WiFi connection.

[0067] The control device 1032 is connected with the conversion device 1031 and the fan 108 respectively; the connection can be determined according to actual conditions and is not limited herein. As an example, the connection can be understood as an electrical connection, which can be a wired connection or a wireless connection; wherein the wired connection can be a wire connection capable of transmitting data; the wireless connection can be a near distance communication technology, such as Bluetooth, Zigbee, etc.; or a long distance communication technology, such as a WiFi connection.

[0068] The first sensor 104 can be determined according to actual conditions and is not limited herein. As an example, the first sensor 104 can be a temperature sensor.

[0069] The first sensor 104 for collecting the first temperature signal of the corresponding heating component 101 can be understood as one heating component 101 corresponding to one first sensor 104, and collecting the first temperature signal of the corresponding heating component 101 by each first sensor 104.

[0070] The second sensor 106 can be determined according to actual conditions, which is not limited herein. As an example, the second sensor 106 can be a temperature sensor.

[0071] The second sensor 106 for collecting the second temperature signal of the corresponding heat dissipation component 105 can be understood as one heat dissipation component 105 corresponding to one second sensor 106, and the second temperature signal of the corresponding heat dissipation component 105 is collected by each second sensor 106.

[0072] The specific conversion process of the first temperature signal and / or the second temperature signal to obtain the first digital signal corresponding to the first temperature signal and / or the second digital signal corresponding to the second temperature signal can be determined according to actual conditions, which is not limited herein. As an example, the first temperature signal and / or the second temperature signal can be analog-to-digital converted to obtain the first digital signal corresponding to the first temperature signal and / or the second digital signal corresponding to the second temperature signal.

[0073] The specific determination process of the PWM signal based on the first digital signal and / or the second digital signal can be determined according to actual conditions, which is not limited herein. The working state of the fan 108 controlled according to the PWM signal can be determined according to actual conditions, which is not limited herein. As an example, the working state can include stopping working, minimum air volume, and maximum air volume.

[0074] The embodiment of the application further comprises at least one heat dissipation assembly arranged on the heating assembly; the heat dissipation assembly comprises at least one second sensor; the first sensor collects a first temperature signal of the corresponding heating assembly; the second sensor collects a second temperature signal of the corresponding heat dissipation assembly; the control assembly comprises a conversion device connected with the first sensor and the second sensor respectively, and is used for converting and processing the first temperature signal and / or the second temperature signal to obtain a first digital signal corresponding to the first temperature signal and / or a second digital signal corresponding to the second temperature signal; the control assembly further comprises a control device connected with the conversion device and the fan respectively, and is used for determining a PWM signal based on the first digital signal and / or the second digital signal; and the working state of the fan is controlled according to the PWM signal, so that the temperature in the reaction tube is stable. That is, the conversion device converts and processes the first temperature signal collected by the first sensor and / or the second temperature signal collected by the second sensor to obtain the first digital signal corresponding to the first temperature signal and / or the second digital signal corresponding to the second temperature signal; the control device determines the PWM signal based on the first digital signal and / or the second digital signal; and the working state of the fan is controlled according to the PWM signal, so that the temperature in the reaction tube is stable. The application provides a PCR control device, and solves the problems of average temperature rising and falling rate attenuation and very fast rate to stabilize the temperature in the reaction tube.

[0075] In an optional embodiment of the application, the control device 1032 comprises:

[0076] An MCU 10321 for determining a first temperature value based on the first digital signal and a second temperature value based on the second digital signal, and determining a PWM signal based on the first temperature value and / or the second temperature value; a driving circuit 10322 of the MCU 10321 for determining a voltage parameter or a current parameter of the fan based on the PWM signal; the voltage parameter or the current parameter is used for controlling the working state of the fan; and the driving circuit is connected with the MCU 10321 and the fan 108 respectively.

[0077] In the embodiment, the ADC 1031 can be determined according to actual conditions, which is not limited herein. In actual application, the ADC 1031 can be an ADC chip, and as an example, the ADC chip can comprise a processor.

[0078] The MCU 10321 can be determined according to actual conditions, which is not limited herein. In actual application, the MCU 10321 can also be referred to as an MCU control unit, and as an example, the MCU control unit can comprise a controller.

[0079] The driving circuit 10322 can be determined according to actual conditions, which is not limited here. In actual application, the driving circuit 10322 can also be referred to as a hardware circuit.

[0080] The ADC 1031 is connected with the first sensor 104, the second sensor 106 and the MCU 10321 respectively; the connection can be determined according to actual conditions, which is not limited here. As an example, the connection can be wired connection or wireless connection; wherein the wired connection can be a wire connection capable of transmitting data; the wireless connection can be a near distance communication technology, such as Bluetooth, Zigbee, etc.; or a long distance communication technology, such as WiFi connection.

[0081] The driving circuit 10322 is connected with the MCU 10321 and the fan 108 respectively; the connection can be determined according to actual conditions, which is not limited here. As an example, the connection can be wired connection or wireless connection; wherein the wired connection can be a wire connection capable of transmitting data; the wireless connection can be a near distance communication technology, such as Bluetooth, Zigbee, etc.; or a long distance communication technology, such as WiFi connection.

[0082] The specific conversion processing process of the first temperature signal and / or the second temperature signal to obtain the first digital signal corresponding to the first temperature signal and / or the second digital signal corresponding to the second temperature signal can be determined according to actual conditions, which is not limited here. As an example, the conversion processing of the first temperature signal and / or the second temperature signal to obtain the first digital signal corresponding to the first temperature signal and / or the second digital signal corresponding to the second temperature signal can be analog-digital conversion processing of the first temperature signal and / or the second temperature signal to obtain the first digital signal corresponding to the first temperature signal and / or the second digital signal corresponding to the second temperature signal.

[0083] The specific determination process of determining the first temperature value based on the first digital signal can be determined according to actual conditions, which is not limited here. As an example, the determination of the first temperature value based on the first digital signal can be calculation of the first temperature value based on the first digital signal.

[0084] The specific determination process of determining the second temperature value based on the second digital signal can be determined according to actual conditions, which is not limited here. As an example, the determination of the second temperature value based on the second digital signal can be calculation of the second temperature value based on the second digital signal.

[0085] The specific determination process of determining the PWM signal based on the first temperature value and / or the second temperature value can be determined according to actual conditions, which is not limited herein. As an example, the determination of the PWM signal based on the first temperature value and / or the second temperature value can be calculating the PWM signal with different duty cycles based on the first temperature value and / or the second temperature value.

[0086] The specific determination process of determining the voltage parameter or the current parameter of the fan 108 based on the PWM signal can be determined according to actual conditions, which is not limited herein. As an example, the voltage parameter or the current parameter of the fan 108 is converted from the PWM signal. In actual applications, the voltage parameter can include a voltage value; and the current parameter can include a current value.

[0087] The voltage parameter or the current parameter is used to control the working state of the fan 108. The working state can be determined according to actual conditions, which is not limited herein. As an example, the working state can include stopping working, the minimum air volume level, and the maximum air volume level.

[0088] In an optional embodiment of the utility model, the voltage parameter includes a first voltage parameter and a second voltage parameter; and the current parameter includes a first current parameter and a second current parameter.

[0089] The MCU 10321 is further configured to determine whether the first temperature value is greater than a preset target temperature; determine the PWM signal with a first duty cycle when the first temperature value is greater than the target temperature; and determine the PWM signal with a second duty cycle when the first temperature value is less than or equal to the target temperature; the first duty cycle and the second duty cycle are different.

[0090] The driving circuit 10322 is further configured to determine the first voltage parameter or the first current parameter based on the PWM signal with the first duty cycle, and determine the second voltage parameter or the second current parameter based on the PWM signal with the second duty cycle; the first voltage parameter or the first current parameter is used to control the working state of the fan 108 as the maximum air volume level; and the second voltage parameter or the second current parameter is used to control the working state of the fan 108 as stopping working.

[0091] It should be noted that the voltage parameter includes a first voltage parameter and a second voltage parameter; and the first voltage parameter and the second voltage parameter can be determined according to actual conditions, which is not limited herein. As an example, the first voltage parameter can include a first voltage value; and the second voltage parameter can include a second voltage value.

[0092] The current parameters include a first current parameter and a second current parameter; the first current parameter and the second current parameter can be determined according to actual conditions, which are not limited herein. As an example, the first current parameter can include a first current value; and the second current parameter can include a second current value.

[0093] The target temperature can be determined according to actual conditions, which is not limited herein. As an example, the target temperature can be understood as a set temperature.

[0094] The first temperature value greater than the target temperature can be understood as the difference between the target temperature and the first temperature value of the first sensor being less than zero. In actual application, it indicates that the process needs to be cooled.

[0095] The first temperature value less than or equal to the target temperature can be understood as the difference between the target temperature and the first temperature value of the first sensor being greater than or equal to zero. In actual application, it indicates that the process does not need to be cooled.

[0096] The first duty cycle and the second duty cycle are different; wherein the first duty cycle and the second duty cycle can be determined according to actual conditions, which are not limited herein. As an example, the first duty cycle and the second duty cycle can be 0 or a negative number or a positive number.

[0097] The specific determination process of determining the first voltage parameter or the first current parameter based on the PWM signal of the first duty cycle can be determined according to actual conditions, which is not limited herein. As an example, the determination of the first voltage parameter or the first current parameter based on the PWM signal of the first duty cycle can be converting the PWM signal of the first duty cycle into the first voltage parameter or the first current parameter.

[0098] The specific determination process of determining the second voltage parameter or the second current parameter based on the PWM signal of the second duty cycle can be determined according to actual conditions, which is not limited herein. As an example, the determination of the second voltage parameter or the second current parameter based on the PWM signal of the second duty cycle can be converting the PWM signal of the second duty cycle into the second voltage parameter or the second current parameter.

[0099] In actual application, as an example, the temperature of the first sensor is used as a switch control first input signal of the fan. When the difference between the target temperature and the temperature of the first sensor is less than 0, it indicates that the process needs to be cooled, at this time the fan is opened with the maximum air volume, when the difference between the target temperature and the temperature of the first sensor is greater than or equal to 0, the fan is closed.

[0100] In an optional embodiment of the utility model, in an optional embodiment of the application, the voltage parameter includes third voltage parameter, fourth voltage parameter and fifth voltage parameter;The current parameter includes third current parameter, fourth current parameter and fifth current parameter;

[0101] The MCU 10321 is further used for judging whether the second temperature value is greater than a first threshold value or less than a second threshold value;The second threshold value is greater than the first threshold value;The first threshold value and the second threshold value are related to the volume of the heat dissipation assembly;In the case that the second temperature value is less than or equal to the first threshold value, the PWM signal of the third duty ratio is determined;In the case that the second temperature value is greater than the first threshold value or less than the second threshold value, the PWM signal of the fourth duty ratio is determined;In the case that the second temperature value is greater than or equal to the second threshold value, the PWM signal of the fifth duty ratio is determined;The third duty ratio, the fourth duty ratio and the fifth duty ratio are different;

[0102] The driving circuit 10322 is further used for determining the third voltage parameter or the third current parameter based on the PWM signal of the third duty ratio;And determining the fourth voltage parameter or the fourth current parameter based on the PWM signal of the fourth duty ratio;And determining the fifth voltage parameter or the fifth current parameter based on the PWM signal of the fifth duty ratio;The third voltage parameter or third current parameter is used for controlling the working state of the fan 108 to stop working;The fourth voltage parameter or fourth current parameter is used for controlling the working state of the fan 108 to be the minimum wind amount degree;The fifth voltage parameter or fifth current parameter is used for controlling the working state of the fan 108 to be the maximum wind amount degree.

[0103] It needs to be explained that the voltage parameter includes third voltage parameter, fourth voltage parameter and fifth voltage parameter;The third voltage parameter, the fourth voltage parameter and the fifth voltage parameter can be determined according to actual conditions, which are not limited here.As an example, the third voltage parameter can include a third voltage value;The fourth voltage parameter can include a fourth voltage value;The fifth voltage parameter can include a fifth voltage value.

[0104] The current parameter includes third current parameter, fourth current parameter and fifth current parameter;The third current parameter, the fourth current parameter and the fifth current parameter can be determined according to actual conditions, which are not limited here.As an example, the third current parameter can include a third current value;The fourth current parameter can include a fourth current value;The fifth current parameter can include a fifth current value.

[0105] The first threshold value and the second threshold value can be determined according to actual conditions, which are not limited herein. As an example, the first threshold value can be a set threshold value of -3℃; the second threshold value can be a set threshold value of +3℃; wherein the set threshold value can be determined according to actual conditions.

[0106] The first threshold value and the second threshold value are related to the volume of the heat dissipation assembly; wherein the first threshold value and the second threshold value can be obtained by precise thermodynamic simulation, or can be adjusted according to experience. In actual application, as an example, the heat dissipation assembly temperature threshold value is determined, the temperature in the reaction tube is controlled to 95℃, the constant temperature is 1000s, the temperature of the heat dissipation assembly and the temperature in the tube are monitored, and when the temperature in the tube drops to 94.5℃, the temperature of the heat dissipation assembly is taken as the threshold value of the heat dissipation assembly temperature, and greater than this temperature, the fan is turned on to help the heat dissipation assembly to dissipate heat quickly. The threshold value range is related to the volume of the heat dissipation assembly, and generally ranges within 40-50℃. It can be obtained by precise thermodynamic simulation, or can be adjusted according to experience.

[0107] The third duty cycle, the fourth duty cycle and the fifth duty cycle are different; wherein the third duty cycle, the fourth duty cycle and the fifth duty cycle can be determined according to actual conditions, which are not limited herein. As an example, the third duty cycle, the fourth duty cycle and the fifth duty cycle can be 0 or a negative number or a positive number.

[0108] The specific determination process of determining the third voltage parameter or the third current parameter based on the PWM signal of the third duty cycle can be determined according to actual conditions, which is not limited herein. As an example, the third voltage parameter or the third current parameter based on the PWM signal of the third duty cycle can be converting the PWM signal of the third duty cycle into the third voltage parameter or the third current parameter.

[0109] The specific determination process of determining the fourth voltage parameter or the fourth current parameter based on the PWM signal of the fourth duty cycle can be determined according to actual conditions, which is not limited herein. As an example, the fourth voltage parameter or the fourth current parameter based on the PWM signal of the fourth duty cycle can be converting the PWM signal of the fourth duty cycle into the fourth voltage parameter or the fourth current parameter.

[0110] The specific determination process of the fifth voltage parameter or the fifth current parameter based on the fifth duty cycle of the PWM signal can be determined according to actual conditions, which is not limited herein. As an example, the fifth voltage parameter or the fifth current parameter based on the fifth duty cycle of the PWM signal can be that the fifth duty cycle of the PWM signal is converted into the fifth voltage parameter or the fifth current parameter.

[0111] The third voltage parameter or the third current parameter is used to control the working state of the fan 108 to be a stop working state; wherein the stop working state can be understood as a fan off state.

[0112] The fourth voltage parameter or the fourth current parameter is used to control the working state of the fan 108 to be a minimum air volume degree; wherein the minimum air volume degree can be understood as a minimum fan air volume.

[0113] The fifth voltage parameter or the fifth current parameter is used to control the working state of the fan 108 to be a maximum air volume degree; wherein the maximum air volume degree can be understood as a maximum fan air volume.

[0114] In actual application, as an example, a second sensor is used to collect the temperature on the radiator, which is used to control the fan air volume. The fan is also controlled by PWM. The second sensor electric signal is converted into a digital signal through ADC, and then converted into a temperature value through the calculation of the MCU. After it is judged that the second sensor enters the range of [threshold-3℃, threshold+3℃], the fan starts to work. When the sensor temperature is lower than threshold-3℃, the fan is turned off. When the difference between the sensor temperature value and the threshold is within [-3℃, 3℃], the duty cycle is calculated according to PID, and then the voltage value or the current value corresponding to the fan is converted through the driving circuit. When the sensor temperature is greater than threshold+3℃, the fan air volume is turned to the maximum. In this way, the radiator temperature can be stably controlled within the range of [threshold-3℃, threshold+3℃], and the heat dissipation capacity of the radiator is relatively stable, so that the temperature rising and falling rate can be relatively consistent.

[0115] In an optional embodiment of the utility model, the at least one heating assembly 101 includes a first heating assembly 1011 and a second heating assembly 1012; the at least one first sensor 104 includes a first temperature sensor 1041 and a second temperature sensor 1042; the first temperature sensor 1041 is connected with the first heating assembly 1011; the second temperature sensor 1042 is connected with the second heating assembly 1012; the first temperature signal includes a first temperature sub-signal and a second temperature sub-signal;

[0116] The first temperature sensor 1041 is configured to collect the first temperature sub-signal of the first heating assembly 1011.

[0117] The second temperature sensor 1042 is configured to collect the second temperature sub-signal of the second heating assembly 1012.

[0118] It should be noted that the first heating assembly 1011 and the second heating assembly 1012 can be determined according to actual conditions, which are not limited herein. As an example, the first heating assembly 1011 and the second heating assembly 1012 can both be heating elements. In actual application, the first heating assembly 1011 can be referred to as heating element 1, and the second heating assembly 1012 can be referred to as heating element 2.

[0119] The first temperature sensor 1041 and the second temperature sensor 1042 can be determined according to actual conditions, which are not limited herein. In actual application, the first temperature sensor 1041 can also be referred to as sensor 1, and the second temperature sensor 1042 can also be referred to as sensor 2.

[0120] The first temperature sensor 1041 is connected with the first heating assembly 1011. The connection can be determined according to actual conditions, which is not limited herein. As an example, the connection can be wired connection or wireless connection. The wired connection can be a wire connection capable of transmitting data. The wireless connection can be a near field communication technology, such as Bluetooth, Zigbee, etc. A long-distance communication technology, such as WiFi connection, can also be used.

[0121] The second temperature sensor 1042 is connected with the second heating assembly 1012. The connection can be determined according to actual conditions, which is not limited herein. As an example, the connection can be wired connection or wireless connection. The wired connection can be a wire connection capable of transmitting data. The wireless connection can be a near field communication technology, such as Bluetooth, Zigbee, etc. A long-distance communication technology, such as WiFi connection, can also be used.

[0122] The first temperature sensor 1041 collects the first temperature sub-signal of the first heating assembly 1011.

[0123] The second temperature sensor 1042 collects the second temperature sub-signal of the second heating assembly 1012.

[0124] In actual application, sensor 1 and sensor 2 are respectively used to collect the temperature above heating element 1 and heating element 2, which are used as target temperature control.

[0125] In an optional embodiment of the utility model, the at least one heat dissipation component 105 includes first heat dissipation component 1051 and second heat dissipation component 1052;The at least one second sensor 106 includes third temperature sensor 1061 and fourth temperature sensor 1062;Third temperature sensor 1061 is connected with first heat dissipation component 1051;Fourth temperature sensor 1062 is connected with second heat dissipation component 1052;Second temperature signal includes third temperature sub-signal and fourth temperature sub-signal;

[0126] Third temperature sensor 1061 is used to collect third temperature sub-signal of first heat dissipation component 1051;

[0127] Fourth temperature sensor 1062 is used to collect fourth temperature sub-signal of second heat dissipation component 1052.

[0128] It should be noted that first heat dissipation component 1051 and second heat dissipation component 1052 can be determined according to actual conditions, which are not limited here.As an example, first heat dissipation component 1051 and second heat dissipation component 1052 can both be heat sinks.In practical applications, first heat dissipation component 1051 can also be referred to as heat sink 1;Second heat dissipation component 1052 can also be referred to as heat sink 2.

[0129] Third temperature sensor 1061 and fourth temperature sensor 1062 can be determined according to actual conditions, which are not limited here.In practical applications, third temperature sensor 1061 can also be referred to as sensor 3;Fourth temperature sensor 1062 can also be referred to as sensor 4.

[0130] Third temperature sensor 1061 is connected with first heat dissipation component 1051;The connection can be determined according to actual conditions, which is not limited here.As an example, the connection can be wired connection or wireless connection;Among them, the wired connection can be a wire connection capable of transmitting data;The wireless connection can be using short-distance communication technology, such as Bluetooth, Zigbee, etc.;It can also use long-distance communication technology, such as WiFi connection.

[0131] Fourth temperature sensor 1062 is connected with second heat dissipation component 1052;The connection can be determined according to actual conditions, which is not limited here.As an example, the connection can be wired connection or wireless connection;Among them, the wired connection can be a wire connection capable of transmitting data;The wireless connection can be using short-distance communication technology, such as Bluetooth, Zigbee, etc.;It can also use long-distance communication technology, such as WiFi connection.

[0132] The third temperature sensor 1061 collects the third temperature sub-signal of the first heat dissipation component 1051.

[0133] The fourth temperature sensor 1062 collects the fourth temperature sub-signal of the second heat dissipation component 1052.

[0134] In actual application, the sensor 3 and the sensor 4 are used to collect the temperatures on the heat sink 1 and the heat sink 2 respectively, and are used for controlling the fan wind volume.

[0135] In an optional embodiment of the utility model, the first heating component 1011 and the second heating component 1012 all include semiconductor refrigerators TEC; the first heat dissipation component 1051 and the second heat dissipation component 1052 all include heat sinks; wherein,

[0136] The control component 103 is further used for controlling the working state of the fan 108 based on the first temperature sub-signal, the second temperature sub-signal, the third temperature sub-signal and / or the fourth temperature sub-signal.

[0137] It needs to be explained that the specific control process in the control of the working state of the fan 108 based on the first temperature sub-signal, the second temperature sub-signal, the third temperature sub-signal and / or the fourth temperature sub-signal can be determined according to actual situation, which is not limited here. As an example, the control of the working state of the fan 108 based on the first temperature sub-signal, the second temperature sub-signal, the third temperature sub-signal and / or the fourth temperature sub-signal can include the control of the working state of the fan 108 based on the first temperature sub-signal and the second temperature sub-signal; or the control of the working state of the fan 108 based on the third temperature sub-signal and the fourth temperature sub-signal; or the control of the working state of the fan 108 based on the first temperature sub-signal, the second temperature sub-signal, the third temperature sub-signal and the fourth temperature sub-signal.

[0138] In actual application, in the cooling process, the temperature of the sensor 1 and the sensor 2 is used as the first input signal for the switch control of the fan. When the difference between the target temperature and the temperature of the sensor 1 and the sensor 2 is less than 0, it indicates that cooling is carried out, at this time, the fan is opened to the maximum wind volume and runs, and when the difference between the target temperature and the temperature of the sensor 1 or the sensor 2 is greater than or equal to 0, the fan is closed.

[0139] Sensor 3 and sensor 4 are used to collect the temperature on the radiator 1 and radiator 2 respectively, and are used as the control fan air volume. The fan is also controlled by PWM, and the sensor 3 and 4 electrical signals are converted into digital signals through ADC, and then converted into temperature values through the calculation of MCU. When any one of sensor 3 or sensor 4 enters the range of [threshold-3℃, threshold+3℃], the fan starts to work, and when the sensor temperature is lower than threshold-3℃, the fan is turned off; when the difference between the sensor temperature value and the threshold is within [-3℃, 3℃], the duty cycle is calculated according to PID, and the voltage value or current value corresponding to the fan is converted through the drive circuit; when the sensor temperature is greater than threshold+3℃, the fan air volume is opened to the maximum. In this way, the radiator temperature can be stably controlled within the range of [threshold-3℃, threshold+3℃], and the heat dissipation capacity of the radiator is relatively stable, so that the temperature rising and falling rate can be relatively consistent.

[0140] In the cooling process, the temperature of sensor 1 and sensor 2 is used as the first input signal of the fan switch control. When the difference between the target temperature and the temperature of sensor 1 and sensor 2 is less than 0, it means that the cooling process is carried out, and at this time the fan is opened to the maximum air volume and runs; when the difference between the target temperature and the temperature of sensor 1 or sensor 2 is greater than or equal to 0, the fan is turned off. In addition, the radiator sensor 3 and sensor 4 are used as the second input signal of the fan control. When any one of sensor 3 or sensor 4 enters the range of [threshold-3℃, threshold+3℃], the fan starts to work, and when the sensor temperature is lower than threshold-3℃, the fan is turned off; when the difference between the sensor temperature value and the threshold is within [-3℃, 3℃], the duty cycle is calculated according to PID, and the voltage value or current value corresponding to the fan is converted through the drive circuit; when the sensor temperature is greater than threshold+3℃, the fan air volume is opened to the maximum. The first input signal has the highest priority, and the second input signal has the second priority. When the trigger conditions of the first input signal and the second input signal are met at the same time, the processing logic of the first input signal is executed.

[0141] In an optional embodiment of the utility model, the first temperature sub signal corresponds to a first digital sub signal; the second temperature sub signal corresponds to a second digital sub signal; the third temperature sub signal corresponds to a third digital sub signal; the fourth temperature sub signal corresponds to a fourth digital sub signal; the converter 1031 includes ADC 10311;

[0142] The ADC 10311 is configured to convert the first temperature sub-signal, the second temperature sub-signal, the third temperature sub-signal and / or the fourth temperature sub-signal to obtain a first digital sub-signal corresponding to the first temperature sub-signal, a second digital sub-signal corresponding to the second temperature sub-signal, a third digital sub-signal corresponding to the third temperature sub-signal and / or a fourth digital sub-signal corresponding to the fourth temperature sub-signal.

[0143] The MCU 103211 is further configured to determine the first temperature value based on the first digital sub-signal and / or the second digital sub-signal, and determine the second temperature value based on the third digital sub-signal and / or the fourth digital sub-signal.

[0144] It should be noted that the specific conversion process of converting the first temperature sub-signal, the second temperature sub-signal, the third temperature sub-signal and / or the fourth temperature sub-signal to obtain a first digital sub-signal corresponding to the first temperature sub-signal, a second digital sub-signal corresponding to the second temperature sub-signal, a third digital sub-signal corresponding to the third temperature sub-signal and / or a fourth digital sub-signal corresponding to the fourth temperature sub-signal can be determined according to actual conditions, which is not limited herein. As an example, the conversion of the first temperature sub-signal, the second temperature sub-signal, the third temperature sub-signal and / or the fourth temperature sub-signal to obtain a first digital sub-signal corresponding to the first temperature sub-signal, a second digital sub-signal corresponding to the second temperature sub-signal, a third digital sub-signal corresponding to the third temperature sub-signal and / or a fourth digital sub-signal corresponding to the fourth temperature sub-signal can be analog-to-digital conversion of the first temperature sub-signal, the second temperature sub-signal, the third temperature sub-signal and / or the fourth temperature sub-signal to obtain a first digital sub-signal corresponding to the first temperature sub-signal, a second digital sub-signal corresponding to the second temperature sub-signal, a third digital sub-signal corresponding to the third temperature sub-signal and / or a fourth digital sub-signal corresponding to the fourth temperature sub-signal.

[0145] The specific determination process of determining the first temperature value based on the first digital sub-signal and / or the second digital sub-signal can be determined according to actual conditions, which is not limited herein. As an example, the determination of the first temperature value based on the first digital sub-signal and / or the second digital sub-signal can be calculating the first temperature value based on the first digital sub-signal and / or the second digital sub-signal.

[0146] The specific determination process of determining the second temperature value based on the third digital sub-signal and / or the fourth digital sub-signal can be determined according to actual conditions, which is not limited herein. As an example, the determination of the second temperature value based on the third digital sub-signal and / or the fourth digital sub-signal can be calculating the second temperature value based on the third digital sub-signal and / or the fourth digital sub-signal.

[0147] In an optional embodiment of the utility model, the ADC 10311 comprises:

[0148] A processor 103111 for determining the first digital signal and / or the second digital signal based on the first temperature signal and / or the second temperature signal.

[0149] The processor can be determined according to actual conditions, which is not limited herein.

[0150] The specific determination process of determining the first digital signal and / or the second digital signal based on the first temperature signal and / or the second temperature signal can be determined according to actual conditions, which is not limited herein. As an example, the determination of the first digital signal and / or the second digital signal based on the first temperature signal and / or the second temperature signal can be analog-digital conversion processing of the first temperature signal and / or the second temperature signal, to obtain the first digital signal corresponding to the first temperature signal and / or the second digital signal corresponding to the second temperature signal.

[0151] In an optional embodiment of the utility model, the MCU 10321 comprises:

[0152] A controller 103211 for controlling the PWM signal based on the first temperature value and / or the second temperature value.

[0153] The controller can be determined according to actual conditions, which is not limited herein.

[0154] The specific control process of controlling the PWM signal based on the first temperature value and / or the second temperature value can be determined according to actual conditions, which is not limited herein. As an example, the control of the PWM signal based on the first temperature value and / or the second temperature value can be controlling the PWM signal with different duty cycles based on the first temperature value and / or the second temperature value.

[0155] For the convenience of understanding, the control device of PCR is specifically the constant temperature control device of PCR. The device adds a temperature sensor on the heat sink to monitor the temperature of the heat sink as another input of the temperature control system, and the temperature sensor in the TEC and the temperature sensor on the heat sink are used as inputs to form a new control method to make the system stable. This content can be combined Figure 7 understood, Figure 7 The schematic diagram of heating TEC element and its temperature sensor in the control device of PCR in the embodiment of the application.

[0156] 1) Hardware form:

[0157] The temperature control module structure in the application can be combined with Figure 8 , Figure 9 , Figure 10 as shown, Figure 8 The schematic diagram of an application scenario of the control device of PCR in the embodiment of the application is shown. Figure 9 The schematic diagram of another application scenario of the control device of PCR in the embodiment of the application is shown. Figure 10 The schematic diagram of the hardware form of the PCR module temperature control assembly in the embodiment of the application is shown. In Figure 8 , the heat dissipation assembly 105, the heating assembly 101 and the reaction tube 102 are shown; in actual application, the heat dissipation assembly 105 can be specifically a heat sink; the heating assembly 101 can be specifically a TEC, which can include a TEC-A surface and a TEC-B surface, as an example, one surface of the lower side of the TEC can be understood as the TEC-A surface, and one surface of the upper side of the TEC can be understood as the TEC-A surface. In Figure 9 , the first heating assembly 1011, the second heating assembly 1012, the reaction tube 102, the heat dissipation assembly 105 and the second sensor 106 are shown; in actual application, the first heating assembly 1011 can also be referred to as heating element 1; the second heating assembly 1012 can also be referred to as heating element 2; the heat dissipation assembly 105 can be specifically a heat sink; the second sensor 106 can be specifically understood as a temperature sensor corresponding to the heat sink, and can also be referred to as a heat sink temperature sensor. In Figure 10 , the hardware form of the PCR module temperature control assembly includes a heating module and a reaction chamber.

[0158] The deep black is a heat sink, the two pipes are TEC (heating elements), the rightmost is a fan, and the reaction tube between the two heating elements. That is, it is double-sided heating, with heating elements and heat sinks on the upper and lower sides.

[0159] 2) Hardware control:

[0160] The temperature control module in the present application collects the temperature of the sensor on the heating element and the temperature of the temperature sensor on the heat sink as input. This content can be combined with Figure 11 It is understood that Figure 11 The schematic diagram of the hardware control in the control device of PCR in the embodiment of the present application.

[0161] Sensor 1 and sensor 2 are used to collect the temperature above heating element 1 and heating element 2 respectively, which are used as target temperature control. The two heating elements are independently controlled. The temperature electrical signal of sensor 1 is converted into digital signal through ADC, and then converted into temperature value through the calculation of MCU. After setting the target temperature, the MCU outputs the duty cycle through PID algorithm with the sensor temperature value as input. When the duty cycle is 0 or negative, the circuit always outputs low level, and the heating sensor is not heated. When the duty cycle is positive, the corresponding PWM waveform is outputted, which is converted into corresponding voltage value or current value added to the heating element through the driving circuit to generate heat power for heating. According to the working principle of TEC, in the heating process, the heat is concentrated to the side of the reaction tube, and the temperature of the side close to the heat sink will decrease a little. In the cooling process, the heat is concentrated to the side close to the heat sink, and the temperature of the heat sink will increase at this time. After many cycles of heating and cooling, the temperature on the heat sink will continue to rise, and the heat dissipation capacity will decrease. Because the TEC heats up and cools down quickly, if only the fan is turned on according to the target temperature of sensor 1 or sensor 2 in the cooling process, it cannot meet the stable heating and cooling rate and constant temperature range.

[0162] Scheme one adopts sensor 3 and sensor 4 to collect the temperature above heat sink 1 and heat sink 2 respectively, which are used to control the fan air volume. The fan is also controlled by PWM. The electrical signals of sensor 3 and 4 are converted into digital signals through ADC, and then converted into temperature values through the calculation of MCU. When any one of sensor 3 or sensor 4 enters the range of [threshold-3℃, threshold+3℃], the fan starts to work. When the sensor temperature is lower than threshold-3℃, the fan is turned off. When the difference between the sensor temperature value and the threshold is within [-3℃, 3℃], the duty cycle is outputted through PID calculation, which is converted into corresponding voltage value or current value added to the fan through the driving circuit. When the sensor temperature is greater than threshold+3℃, the fan air volume is opened to the maximum. In this way, the temperature of the heat sink can be stably controlled within the range of [threshold-3℃, threshold+3℃], and the heat dissipation capacity of the heat sink is relatively stable, so that the heating and cooling rate can be relatively consistent each time.

[0163] Scheme two, in the cooling process, the temperature of sensor 1 and sensor 2 are used as the switch control of the first input signal of the fan. When the difference between the target temperature and the temperature of sensor 1 and sensor 2 is less than 0, it means that the cooling process is needed, at this time the fan is opened to the maximum wind volume. When the difference between the target temperature and the temperature of sensor 1 or sensor 2 is greater than or equal to 0, the fan is closed. In addition, the sensor 3 and sensor 4 of the radiator are used as the second input signal of the fan control. When any one of sensor 3 or sensor 4 enters the range of [threshold-3℃, threshold+3℃], the fan starts to work. When the sensor temperature is lower than threshold-3℃, the fan is closed. When the difference between the sensor temperature and the threshold is within [-3℃, 3℃], the duty cycle is calculated according to the PID, and the voltage value or current value corresponding to the fan is converted through the drive circuit. When the sensor temperature is greater than threshold+3℃, the fan wind volume is opened to the maximum. The first input signal has the highest priority, and the second input signal has the second priority. When the trigger conditions of the first input signal and the second input signal are met at the same time, the processing logic of the first input signal is executed.

[0164] This content can be understood in combination with Figure 12 , and Figure 12 is a comparison diagram of ordinary control and the control in the present application; in Figure 12 , the upper diagram is a diagram of ordinary control, and the lower diagram is a diagram of the control in the present application.

[0165] 3) Software control (before leaving the factory):

[0166] The radiator temperature threshold is determined, the temperature in the reaction tube is controlled to 95℃, the temperature of the radiator is monitored for 1000s, and the temperature in the tube is monitored. When the temperature in the tube drops to 94.5℃, the temperature of the radiator is taken as the threshold of the radiator temperature. When the temperature is greater than this temperature, the fan is opened to the maximum to help the radiator dissipate heat quickly.

[0167] The threshold range is related to the volume of the radiator. Generally, the range is within 40-50℃. It can also be obtained through accurate thermodynamic simulation, but it is basically difficult to obtain. Generally, the radiator heat dissipation capacity is adjusted according to experience. This content can be understood in combination with Figure 13 , and Figure 13 is a diagram of the determination of the radiator temperature threshold.

[0168] 4) Temperature control logic (working condition).

[0169] This content can be understood in combination with Figure 14 , and Figure 14 is a diagram of the temperature control logic of the embodiment of the present application.

[0170] In order to facilitate the understanding of the embodiment of the present application, the above content can be understood in combination withFigure 15 and Figure 16 understanding, Figure 15 Fig. 1 is a schematic view of a printed circuit board (PCB) of a control device of PCR in an embodiment of the present application; Figure 16 Fig. 2 is a schematic view of a controller and a processor in the control device of PCR in an embodiment of the present application.

[0171] The embodiment of the present application provides a control device of PCR, at least one heat dissipation assembly is further arranged on the heating assembly; the heat dissipation assembly comprises at least one second sensor; the first sensor collects the first temperature signal of the corresponding heating assembly; the second sensor collects the second temperature signal of the corresponding heat dissipation assembly; the control assembly controls the working state of the fan based on the first temperature signal and / or the second temperature signal, so that the temperature in the reaction tube is stable. That is, the working state of the fan is controlled based on the first temperature signal collected by the first sensor and / or the second temperature signal collected by the second sensor, so that the temperature in the reaction tube is stable, a control device of PCR is provided, and the problems of average temperature rising and falling rate attenuation and very fast rate to make the temperature in the reaction tube stable are solved.

[0172] The above is only a specific embodiment of the present application, but the protection scope of the present application is not limited to this, any skilled person in the art can easily think of changes or replacements within the technical range disclosed by the present application, which should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A PCR control device, characterized in that, The device includes: at least one heating component, a reaction tube corresponding to the heating component, and a control component; at least one first sensor is disposed on the heating component; at least one heat dissipation component is also disposed on the heating component; the heat dissipation component includes at least one second sensor; an air duct is disposed around the heat dissipation component; the air duct is connected to a fan; wherein... The first sensor is used to collect the first temperature signal of the corresponding heating component; The second sensor is used to collect the second temperature signal of the corresponding heat dissipation component; The control component includes a conversion device connected to the first sensor and the second sensor respectively, for converting the first temperature signal and / or the second temperature signal to obtain a first digital signal corresponding to the first temperature signal and / or a second digital signal corresponding to the second temperature signal. The control component further includes a control device connected to the conversion device and the fan respectively, for determining a PWM signal based on the first digital signal and / or the second digital signal; and controlling the operating state of the fan according to the PWM signal to stabilize the temperature inside the reaction tube.

2. The apparatus according to claim 1, characterized in that, The control device includes: An MCU for determining a first temperature value based on the first digital signal and a second temperature value based on the second digital signal, and for determining the PWM signal based on the first temperature value and / or the second temperature value; A drive circuit for determining the voltage or current parameters of the fan based on the PWM signal; the voltage or current parameters are used to control the operating state of the fan; the drive circuit is connected to the MCU and the fan respectively.

3. The apparatus according to claim 2, characterized in that, The voltage parameters include a first voltage parameter and a second voltage parameter; the current parameters include a first current parameter and a second current parameter. The MCU is also used to determine whether the first temperature value is greater than a preset target temperature; When the first temperature value is greater than the target temperature, the PWM signal with the first duty cycle is determined; If the first temperature value is less than or equal to the target temperature, the PWM signal with a second duty cycle is determined; The first duty cycle and the second duty cycle are different; The driving circuit is further configured to determine the first voltage parameter or the first current parameter based on the PWM signal with the first duty cycle and to determine the second voltage parameter or the second current parameter based on the PWM signal with the second duty cycle; the first voltage parameter or the first current parameter is used to control the working state of the fan to the maximum airflow level; the second voltage parameter or the second current parameter is used to control the working state of the fan to stop working.

4. The apparatus according to claim 2, characterized in that, The voltage parameters include a third voltage parameter, a fourth voltage parameter, and a fifth voltage parameter; the current parameters include a third current parameter, a fourth current parameter, and a fifth current parameter. The MCU is further configured to determine whether the second temperature value is greater than a first threshold or less than a second threshold; the second threshold is greater than the first threshold; both the first threshold and the second threshold are related to the volume of the heat dissipation component; and when the second temperature value is less than or equal to the first threshold, determine the PWM signal with a third duty cycle. If the second temperature value is greater than the first threshold or less than the second threshold, the PWM signal with the fourth duty cycle is determined; If the second temperature value is greater than or equal to the second threshold, the PWM signal with the fifth duty cycle is determined; The third duty cycle, the fourth duty cycle, and the fifth duty cycle are different; The driving circuit is also used to determine the third voltage parameter or the third current parameter based on the PWM signal with the third duty cycle. And the fourth voltage parameter or the fourth current parameter is determined based on the PWM signal with the fourth duty cycle; The fifth voltage parameter or the fifth current parameter is determined based on the PWM signal with the fifth duty cycle; the third voltage parameter or the third current parameter is used to control the working state of the fan to be stopped; the fourth voltage parameter or the fourth current parameter is used to control the working state of the fan to be at minimum airflow; and the fifth voltage parameter or the fifth current parameter is used to control the working state of the fan to be at maximum airflow.

5. The apparatus according to any one of claims 2-4, characterized in that, The at least one heating component includes a first heating component and a second heating component; the at least one first sensor includes a first temperature sensor and a second temperature sensor; the first temperature sensor is connected to the first heating component; the second temperature sensor is connected to the second heating component; the first temperature signal includes a first temperature sub-signal and a second temperature sub-signal; The first temperature sensor is used to collect the first temperature sub-signal of the first heating component; The second temperature sensor is used to acquire the second temperature sub-signal of the second heating component.

6. The apparatus according to claim 5, characterized in that, The at least one heat dissipation component includes a first heat dissipation component and a second heat dissipation component; the at least one second sensor includes a third temperature sensor and a fourth temperature sensor; the third temperature sensor is connected to the first heat dissipation component; the fourth temperature sensor is connected to the second heat dissipation component; the second temperature signal includes a third temperature sub-signal and a fourth temperature sub-signal; The third temperature sensor is used to collect the third temperature sub-signal of the first heat dissipation component; The fourth temperature sensor is used to collect the fourth temperature sub-signal of the second heat dissipation component.

7. The apparatus according to claim 6, characterized in that, Both the first heating component and the second heating component include a semiconductor cooler (TEC); both the first heat dissipation component and the second heat dissipation component include a heat sink; wherein, The control component is also used to control the operating state of the fan based on the first temperature sub-signal, the second temperature sub-signal, the third temperature sub-signal and / or the fourth temperature sub-signal.

8. The apparatus according to claim 7, characterized in that, The first temperature sub-signal corresponds to a first digital sub-signal; the second temperature sub-signal corresponds to a second digital sub-signal; the third temperature sub-signal corresponds to a third digital sub-signal; the fourth temperature sub-signal corresponds to a fourth digital sub-signal; the conversion device includes an ADC; The ADC is used to perform conversion processing on the first temperature sub-signal, the second temperature sub-signal, the third temperature sub-signal and / or the fourth temperature sub-signal to obtain a first digital sub-signal corresponding to the first temperature sub-signal, a second digital sub-signal corresponding to the second temperature sub-signal, a third digital sub-signal corresponding to the third temperature sub-signal and / or a fourth digital sub-signal corresponding to the fourth temperature sub-signal; The MCU is further configured to determine the first temperature value based on the first digital signal and / or the second digital signal, and to determine the second temperature value based on the third digital signal and / or the fourth digital signal.

9. The apparatus according to claim 8, characterized in that, The ADC includes: A processor for determining the first digital signal and / or the second digital signal based on the first temperature signal and / or the second temperature signal.

10. The apparatus according to claim 2, characterized in that, The MCU includes: A controller for controlling the PWM signal based on the first temperature value and / or the second temperature value.

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