Vehicle-mounted thermotank heat management system and vehicle
By combining a semiconductor cooler with an automotive thermal management module and using a flow channel to connect the coolant supply and return ends, the problems of cabin noise and heat load caused by fan cooling are solved, realizing a low-noise and low-heat-load vehicle-mounted thermostatic chamber thermal management system.
Patent Information
- Application Number
- CN202423301859.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-31
- Publication Date
- 2025-11-21
- Estimated Expiration
- 2034-12-31
AI Technical Summary
When existing vehicle-mounted thermostats use semiconductor coolers, they require fans for heat dissipation, which increases cabin noise and heat load.
By combining a semiconductor cooler with an automotive thermal management module, and connecting the coolant supply and return ends through a flow channel, the evaporator of the automotive thermal management module supplies coolant to the second heat exchanger, eliminating the need for a fan cooling structure and achieving both cooling and heating functions.
It reduces cabin noise and heat load, while also reducing system size and increasing the flexibility of installation location.
Smart Images
Figure CN223580274U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to vehicle-mounted thermostat technical field especially relates to a vehicle-mounted thermostat heat management system and vehicle. BACKGROUND
[0002] In prior art, vehicle-mounted thermostat often adopts semiconductor refrigerator to provide cold and heat for thermostat, utilizes peltier effect to convert electric energy into heat energy, reaches the purpose of thermostat refrigeration and heating.
[0003] When the semiconductor refrigerator provides cold for the thermostat, needs to adopt the fan to the heat dissipation end of semiconductor refrigerator and carries out heat dissipation, increases the compartment noise and compartment heat load.
[0004] Therefore, it is urgent to provide a vehicle-mounted thermostat heat management system and vehicle to solve the above technical problems. UTILITY MODEL CONTENTS
[0005] The first purpose of the utility model is to provide a vehicle-mounted thermostat heat management system, has the effect of reducing the compartment noise and compartment heat load.
[0006] In order to achieve this purpose, the utility model adopts the following technical scheme:
[0007] Vehicle-mounted thermostat heat management system, comprising:
[0008] Thermostat box;
[0009] Automobile heat management module, and the automobile heat management module includes evaporator, and the evaporator includes cooling liquid supply end and cooling liquid return end;
[0010] Semiconductor refrigerator, and the semiconductor refrigerator includes first heat exchange piece, second heat exchange piece, N type semiconductor and P type semiconductor, the first heat exchange piece is arranged in the thermostat box, the second heat exchange piece is located outside the thermostat box, the second heat exchange piece is equipped with flow channel, and both ends of the flow channel are communicated with the cooling liquid supply end and the cooling liquid return end respectively, both ends of the N type semiconductor are electrically connected with the first heat exchange piece and the second heat exchange piece respectively, and both ends of the P type semiconductor are electrically connected with the first heat exchange piece and the second heat exchange piece respectively.
[0011] Optionally, the vehicle-mounted thermostat heat management system further includes distribution module, and the automobile heat management module further includes condenser, and the condenser includes heating liquid supply end and heating liquid return end, both ends of the flow channel are first end and second end respectively, the first end is selectively communicated with the cooling liquid supply end and the heating liquid supply end through the distribution module, and the second end is selectively communicated with the cooling liquid return end and the heating liquid return end through the distribution module.
[0012] Optionally, the distribution module comprises a multi-way valve, the multi-way valve comprises a first interface, a second interface, a third interface, a fourth interface, a fifth interface and a sixth interface, the first interface and the second interface are selectively communicated with the third interface, the fourth interface and the fifth interface are selectively communicated with the sixth interface, the first interface is communicated with the heating liquid supply end, the second interface is communicated with the cooling liquid supply end, the third interface is communicated with the first end, the fourth interface is communicated with the heating liquid return end, the fifth interface is communicated with the cooling liquid return end, and the sixth interface is communicated with the second end.
[0013] Optionally, the distribution module comprises a first control valve and a second control valve, the first control valve comprises a seventh interface, an eighth interface and a ninth interface, the seventh interface and the eighth interface are selectively communicated with the ninth interface, the seventh interface is communicated with the heating liquid supply end, the eighth interface is communicated with the cooling liquid supply end, and the ninth interface is communicated with the first end, the second control valve comprises a tenth interface, an eleventh interface and a twelfth interface, the tenth interface and the eleventh interface are selectively communicated with the twelfth interface, the tenth interface is communicated with the heating liquid return end, the eleventh interface is communicated with the cooling liquid return end, and the twelfth interface is communicated with the second end.
[0014] Optionally, the vehicle-mounted thermostat hot management system further comprises a temperature sensor and a controller, the temperature sensor is arranged in the thermostat, and the temperature sensor is signal-connected with the controller.
[0015] Optionally, the inner wall of the flow channel is provided with a heat exchange reinforcing structure.
[0016] Optionally, the heat exchange reinforcing structure is a spiral structure extending along the axis direction of the flow channel.
[0017] Optionally, the heat exchange reinforcing structure is a groove.
[0018] Optionally, the heat exchange reinforcing structure is a convex part.
[0019] The second purpose of the utility model is to provide a vehicle, the vehicle has lower carriage noise and lower heat load.
[0020] In order to achieve the purpose, the utility model adopts the following technical scheme:
[0021] The vehicle comprises a vehicle body and the vehicle-mounted thermostat hot management system, and the thermostat, the automobile hot management module and the semiconductor refrigerator are arranged on the vehicle body.
[0022] The utility model has the advantages of:
[0023] The vehicle-mounted thermostat box heat management system provided by the utility model combines the semiconductor refrigerator with the automobile heat management module, sets flow channels on the second heat exchange parts, and makes the two ends of the flow channels communicate with the cooling liquid supply end and the cooling liquid return end of the evaporator of the automobile heat management module, in actual application, the N-type semiconductor and the P-type semiconductor are connected with the power supply, the first heat exchange part in the thermostat box absorbs the heat in the thermostat box, so that the temperature in the thermostat box is kept low, at the same time, the evaporator of the automobile heat management module supplies cooling liquid to the flow channels, the cooling liquid absorbs the heat of the second heat exchange parts, and the effect of heat dissipation of the second heat exchange parts is achieved, the vehicle-mounted thermostat box heat management system saves the structure of the fan for heat dissipation of the second heat exchange parts, the evaporator of the automobile heat management module is used for supplying cooling liquid to the second heat exchange parts, on the basis of ensuring normal use of the thermostat box, the carriage noise and the carriage heat load are reduced. BRIEF DESCRIPTION OF DRAWINGS
[0024] Figure 1 It is the principle of the vehicle-mounted thermostat box heat management system provided by example one Figure One ;
[0025] Figure 2 It is the principle of the vehicle-mounted thermostat box heat management system provided by example one Figure Two ;
[0026] Figure 3 It is the principle of the vehicle-mounted thermostat box heat management system provided by example two Figure One ;
[0027] Figure 4 It is the principle of the vehicle-mounted thermostat box heat management system provided by example two Figure Two .
[0028] In the drawings:
[0029] 100, thermostat box; 200, automobile heat management module; 210, evaporator; 211, cooling liquid supply end; 212, cooling liquid return end; 220, condenser; 221, heating liquid supply end; 222, heating liquid return end; 300, semiconductor refrigerator; 310, first heat exchange part; 320, second heat exchange part; 321, first end; 322, second end; 330, N-type semiconductor; 340, P-type semiconductor; 351, first metal conductor; 352, second metal conductor; 353, third metal conductor; 410, multi-way valve; 420, first control valve; 430, second control valve. DETAILED DESCRIPTION
[0030] The utility model will be made further detailed description in combination with the drawings and examples. It can be understood that the specific examples described here are only used to explain the utility model, and not limited to the utility model. In addition, it should be noted that, in order to facilitate the description, only the part related to the utility model is shown in the drawings, not all structures.
[0031] In the description of the utility model, unless otherwise explicitly specified and limited, the terms 'connected', 'connected', 'fixed' should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated, it can be mechanically connected, or it can be electrically connected, it can be directly connected, or it can be indirectly connected through an intermediate medium, it can be the internal communication of two elements or the interaction relationship of two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.
[0032] In the utility model, unless otherwise explicitly specified and limited, the first feature is 'on' or 'below' the second feature, which can include direct contact between the first and second features, or indirect contact between the first and second features through another feature between them. Moreover, the first feature 'on', 'above' and 'above' the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature 'below', 'below' and 'below' the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.
[0033] In the description of the embodiment, the terms 'up', 'down', 'right', etc. Orientation or position relationship is based on the orientation or position relationship shown in the drawings, only for the convenience of description and simplification of operation, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, therefore cannot be understood as a limitation on the utility model. In addition, the terms 'first','second' are only used to distinguish in the description, and have no special meaning.
[0034] Example one
[0035] The embodiment provides a vehicle-mounted thermostat heat management system, which has the effect of reducing the noise and heat load of the vehicle cabin.
[0036] Specifically, as Figure 1As shown, the vehicle-mounted incubator thermal management system comprises an incubator 100, an automobile thermal management module 200, and a semiconductor refrigerator 300, wherein the automobile thermal management module 200 comprises an evaporator 210, the evaporator 210 comprises a cooling liquid supply end 211 and a cooling liquid return end 212, the semiconductor refrigerator 300 comprises a first heat exchange member 310, a second heat exchange member 320, an N-type semiconductor 330, and a P-type semiconductor 340, the first heat exchange member 310 is arranged in the incubator 100, the second heat exchange member 320 is located outside the incubator 100, the second heat exchange member 320 is provided with a flow channel (not shown in the figure), two ends of the flow channel are respectively in communication with the cooling liquid supply end 211 and the cooling liquid return end 212, two ends of the N-type semiconductor 330 are respectively in conductive connection with the first heat exchange member 310 and the second heat exchange member 320, and two ends of the P-type semiconductor 340 are respectively in conductive connection with the first heat exchange member 310 and the second heat exchange member 320.
[0037] The vehicle-mounted incubator thermal management system combines the semiconductor refrigerator 300 and the automobile thermal management module 200, sets the flow channel on the second heat exchange member 320, and makes two ends of the flow channel respectively in communication with the cooling liquid supply end 211 and the cooling liquid return end 212 of the evaporator 210 of the automobile thermal management module 200. In actual application, the N-type semiconductor 330 and the P-type semiconductor 340 are connected with a power supply, the first heat exchange member 310 located in the incubator 100 absorbs heat in the incubator 100, so that the temperature in the incubator 100 is kept low, at the same time, the evaporator 210 of the automobile thermal management module 200 supplies cooling liquid to the flow channel, the cooling liquid absorbs heat of the second heat exchange member 320, and the effect of heat dissipation of the second heat exchange member 320 is achieved. The vehicle-mounted incubator thermal management system eliminates the structure of the fan for heat dissipation of the second heat exchange member 320, uses the evaporator 210 of the automobile thermal management module 200 to supply cooling liquid to the second heat exchange member 320, and reduces the noise and thermal load of the vehicle cabin on the basis of ensuring normal use of the incubator 100.
[0038] On the other hand, the vehicle-mounted incubator thermal management system combines the semiconductor refrigerator 300 and the automobile thermal management module 200, eliminates the structure of the fan for heat dissipation of the second heat exchange member 320, and achieves the effect of reducing the size of the vehicle-mounted incubator thermal management system, and further improves the flexibility of the installation position of the incubator 100 on the vehicle body.
[0039] In this embodiment, the cooling water flows in the flow channel of the second heat exchange member 320. Of course, in other embodiments, refrigerant can also flow in the flow channel.
[0040] Optionally, the semiconductor refrigerator 300 further comprises a first metal conductor 351, a second metal conductor 352 and a third metal conductor 353, wherein the first metal conductor 351 is arranged in the thermal insulation box 100 and is in thermal conductive connection with the first heat exchange member 310, one end of the N-type semiconductor 330 is arranged in the thermal insulation box 100 in thermal insulation and is in electrically conductive connection with the first metal conductor 351, and one end of the P-type semiconductor 340 is arranged in the thermal insulation box 100 in thermal insulation and is in electrically conductive connection with the first metal conductor 351. The second metal conductor 352 and the third metal conductor 353 are both in thermal conductive connection with the second heat exchange member 320, and the second metal conductor 352 is arranged in interval with the third metal conductor 353, the other end of the N-type semiconductor 330 is in electrically conductive connection with the second metal conductor 352, and the other end of the P-type semiconductor 340 is in electrically conductive connection with the third metal conductor 353. It should be noted that the specific action principle of the semiconductor refrigerator 300 is prior art, which will not be described here.
[0041] Optionally, the vehicle-mounted thermostat box thermal management system further comprises a distribution module, and the automobile thermal management module 200 further comprises a condenser 220, the condenser 220 comprises a heating liquid supply end 221 and a heating liquid return end 222, and the two ends of the flow channel are respectively a first end 321 and a second end 322, the first end 321 is selectively in communication with the cooling liquid supply end 211 and the heating liquid supply end 221 through the distribution module, and the second end 322 is selectively in communication with the cooling liquid return end 212 and the heating liquid return end 222 through the distribution module, so that the first heat exchange member 310 can not only absorb the heat in the thermal insulation box 100 to keep the temperature in the thermal insulation box 100 low, but also release heat to the thermal insulation box 100 to keep the temperature in the thermal insulation box 100 high. Specifically, when the first heat exchange member 310 needs to absorb the heat in the thermal insulation box 100, that is, the use requirement of the thermal insulation box 100 is refrigeration or freezing, the first end 321 is in communication with the cooling liquid supply end 211, the second end 322 is in communication with the cooling liquid return end 212, the semiconductor refrigerator 300 is connected with the power supply, the evaporator 210 supplies the cooling liquid into the flow channel of the second heat exchange member 320, the first heat exchange member 310 absorbs the heat in the thermal insulation box 100, and the cooling liquid absorbs the heat of the second heat exchange member 320, thereby realizing the effect that the semiconductor refrigerator 300 supplies cold to the thermal insulation box 100. When the first heat exchange member needs to release heat to the thermal insulation box 100, that is, the use requirement of the thermal insulation box 100 is heating or thermal insulation, the direction of the current is changed, the first end 321 is in communication with the heating liquid supply end 221, and the second end 322 is in communication with the heating liquid return end 222, the condenser 220 supplies the heating liquid into the flow channel of the second heat exchange member 320, the second heat exchange member 320 absorbs the heat of the heating liquid, and the first heat exchange member 310 releases heat to the thermal insulation box 100, thereby realizing the effect that the semiconductor refrigerator 300 supplies heat to the thermal insulation box 100.
[0042] Further, the distribution module comprises a multi-way valve 410, which comprises a first interface, a second interface, a third interface, a fourth interface, a fifth interface and a sixth interface. The first interface and the second interface are selectively communicated with the third interface, and the fourth interface and the fifth interface are selectively communicated with the sixth interface. The first interface is communicated with the heating liquid supply end 221, the second interface is communicated with the cooling liquid supply end 211, the third interface is communicated with the first end 321, the fourth interface is communicated with the heating liquid return end 222, the fifth interface is communicated with the cooling liquid return end 212, and the sixth interface is communicated with the second end 322. When the first heat exchange element 310 is required to absorb the heat in the heat preservation box 100, i.e. when the semiconductor refrigerator 300 is required to supply cold to the heat preservation box 100, the second interface is communicated with the third interface, and the fifth interface is communicated with the sixth interface (as shown in FIG. 6), and the cooling liquid supplied by the cooling liquid supply end is communicated with the second interface and the third interface of the multi-way valve 410, then enters the flow channel of the second heat exchange element 320 through the first end 321, absorbs the heat of the second heat exchange element 320 in the flow channel, and then is discharged from the flow channel through the second end 322, communicated with the sixth interface and the fifth interface of the multi-way valve 410, and then flows back to the evaporator 210 through the cooling liquid return end 212. Figure 1 When the first heat exchange element is required to release heat to the heat preservation box 100, i.e. when the semiconductor refrigerator 300 is required to supply heat to the heat preservation box 100, the first interface is communicated with the third interface, and the fourth interface is communicated with the sixth interface (as shown in FIG. 7), and the heating liquid supplied by the heating liquid supply end 221 is communicated with the first interface and the third interface of the multi-way valve 410, then enters the flow channel of the second heat exchange element 320 through the first end 321, transmits heat to the second heat exchange element 320 in the flow channel, and then is discharged from the flow channel through the second end 322, communicated with the sixth interface and the fourth interface of the multi-way valve 410, and then flows back to the condenser 220 through the heating liquid return end 222. Figure 2 When the first heat exchange element is required to release heat to the heat preservation box 100, i.e. when the semiconductor refrigerator 300 is required to supply heat to the heat preservation box 100, the first interface is communicated with the third interface, and the fourth interface is communicated with the sixth interface (as shown in FIG. 7), and the heating liquid supplied by the heating liquid supply end 221 is communicated with the first interface and the third interface of the multi-way valve 410, then enters the flow channel of the second heat exchange element 320 through the first end 321, transmits heat to the second heat exchange element 320 in the flow channel, and then is discharged from the flow channel through the second end 322, communicated with the sixth interface and the fourth interface of the multi-way valve 410, and then flows back to the condenser 220 through the heating liquid return end 222.
[0043] Optionally, the vehicle-mounted thermostat management system further comprises a temperature sensor and a controller (neither of which is shown in the figure), the temperature sensor is arranged in the thermostat 100, and the temperature sensor is in signal connection with the controller. The controller is used to control the flow of the cooling liquid flowing into the flow channel from the cooling liquid supply end 211, so as to realize the control of the internal temperature of the thermostat 100 when the thermostat 100 is refrigerated. Further, the controller is also used to control the flow of the heating liquid flowing into the flow channel from the heating liquid supply end 221, so as to realize the control of the internal temperature of the thermostat 100 when the thermostat 100 is heated. It should be pointed out that the above-mentioned method of controlling the cooling liquid and the heating liquid is prior art. For example, a first preset temperature and a second preset temperature are input in advance in the controller. When the thermostat 100 is refrigerated, the temperature sensor detects a first actual temperature inside the thermostat 100. If the first actual temperature is higher than the first preset temperature, the controller controls to increase the flow of the cooling liquid. If the first actual temperature is equal to or lower than the first preset temperature, the controller controls to decrease the flow of the cooling liquid, or keeps the flow of the cooling liquid unchanged. When the thermostat 100 is heated, the temperature sensor detects a second actual temperature inside the thermostat 100. If the second actual temperature is lower than the second preset temperature, the controller controls to increase the flow of the heating liquid. If the second actual temperature is equal to or higher than the second preset temperature, the controller controls to decrease the flow of the heating liquid, or keeps the flow of the heating liquid unchanged. It should be further pointed out that the above-mentioned controller can be a control module of the vehicle-mounted thermostat management system, or can not be a control module of the vehicle-mounted thermostat management system, which can be determined according to actual application requirements.
[0044] Optionally, the inner wall of the flow channel is provided with a heat exchange strengthening structure (not shown in the figure), so as to increase the heat exchange area of the second heat exchange element 320 and the cooling liquid and the heat exchange area of the second heat exchange element 320 and the heating liquid, improve the heat exchange effect, and increase the refrigerating capacity and the heating capacity of the first heat exchange element 310 to the thermostat 100.
[0045] Further, the heat exchange strengthening structure is a groove, and the inner wall and the groove bottom of the groove increase the heat exchange area of the second heat exchange element 320 and the cooling liquid and the heat exchange area of the second heat exchange element 320 and the heating liquid.
[0046] In another embodiment, the heat exchange strengthening structure is a protruding part, so as to increase the heat exchange area of the second heat exchange element 320 and the cooling liquid and the heat exchange area of the second heat exchange element 320 and the heating liquid. The protruding part can be a block, a sheet or a strip, and the like, which will not be listed one by one here.
[0047] Optionally, the heat exchange reinforcing structure is a spiral structure extending along the axis direction of the flow channel. The structure design can realize the disturbance effect on the cooling liquid and the heating liquid, thereby improving the heat exchange efficiency. In this embodiment, the heat exchange reinforcing structure is a groove, i.e., the heat exchange reinforcing structure is a spiral groove extending along the axis direction of the flow channel. The structure design is convenient for processing, and is conducive to improving the production efficiency and reducing the production cost. When the heat exchange reinforcing structure is a protruding part, the heat exchange reinforcing structure can be a spiral fin extending along the axis direction of the flow channel.
[0048] Optionally, the automobile thermal management module 200 further comprises a vehicle cabin cold core and a vehicle cabin warm core (neither of which is shown in the figure). The inlet of the vehicle cabin cold core is in communication with the cooling liquid supply end 211 of the evaporator 210, and the outlet of the vehicle cabin cold core is in communication with the cooling liquid return end 212 of the evaporator 210, so as to realize the cooling effect of the automobile thermal management module 200 on the vehicle cabin. The inlet of the vehicle cabin warm core is in communication with the heating liquid supply end 221 of the condenser 220, and the outlet of the vehicle cabin warm core is in communication with the heating liquid return end 222 of the condenser 220, so as to realize the heating effect of the automobile thermal management module 200 on the vehicle cabin.
[0049] Optionally, the automobile thermal management module 200 further comprises a motor cooler (not shown in the figure). The inlet of the motor cooler is in communication with the cooling liquid supply end 211 of the evaporator 210, and the outlet of the motor cooler is in communication with the cooling liquid return end 212 of the evaporator 210, so as to realize the cooling effect of the automobile thermal management module 200 on the motor.
[0050] Optionally, the automobile thermal management module 200 further comprises a battery cooler and a battery heater (neither of which is shown in the figure). The inlet of the battery cooler is in communication with the cooling liquid supply end 211 of the evaporator 210, and the outlet of the battery cooler is in communication with the cooling liquid return end 212 of the evaporator 210, so as to realize the cooling effect of the automobile thermal management module 200 on the battery. The inlet of the battery heater is in communication with the heating liquid supply end 221 of the condenser 220, and the outlet of the battery heater is in communication with the heating liquid return end 222 of the condenser 220, so as to realize the heating effect of the automobile thermal management module 200 on the battery.
[0051] The embodiment also provides a vehicle with low cabin noise and low thermal load.
[0052] Specifically, the vehicle comprises a vehicle body and the vehicle-mounted constant-temperature box thermal management system described above. The constant-temperature box 100, the automobile thermal management module 200, and the semiconductor refrigerator 300 are all arranged on the vehicle body. The vehicle adopts the vehicle-mounted constant-temperature box thermal management system described above, and the evaporator 210 of the automobile thermal management module 200 supplies the cooling liquid to the second heat exchange element 320. On the basis of ensuring the normal use of the constant-temperature box 100, the cabin noise and the cabin thermal load are reduced.
[0053] Example 2
[0054] This embodiment provides a vehicle-mounted constant temperature box thermal management system. The following mainly describes the differences between this embodiment and the previous embodiments, while the similarities will not be repeated.
[0055] like Figure 3 As shown, the distribution module includes a first control valve 420 and a second control valve 430. The first control valve 420 includes a seventh interface, an eighth interface, and a ninth interface. The seventh and eighth interfaces are selectively connected to the ninth interface. The seventh interface is connected to the heating liquid supply end 221, the eighth interface is connected to the cooling liquid supply end 211, and the ninth interface is connected to the first end 321. The second control valve 430 includes a tenth interface, an eleventh interface, and a twelfth interface. The tenth and eleventh interfaces are selectively connected to the twelfth interface. The tenth interface is connected to the heating liquid return end 222, the eleventh interface is connected to the cooling liquid return end 212, and the twelfth interface is connected to the second end 322. When the first heat exchanger 310 needs to absorb heat from the insulation box 100, that is, when the semiconductor cooler 300 needs to supply cooling to the insulation box 100, the eighth interface of the first control valve 420 is connected to the ninth interface, and the eleventh interface of the second control valve 430 is connected to the twelfth interface (e.g., ...). Figure 3 (As shown), the coolant supplied by the coolant supply end 211 passes through the eighth and ninth ports of the first control valve 420, then through the first end 321 into the flow channel of the second heat exchanger 320. In the flow channel, the coolant absorbs heat from the second heat exchanger 320, then exits the flow channel through the second end 322, passes through the twelfth and eleventh ports of the second control valve 430, and then flows back to the evaporator 210 through the coolant return end 212. When the first heat exchanger needs to release heat into the insulation box 100, i.e., when the semiconductor cooler 300 needs to supply heat to the insulation box 100, the seventh and ninth ports of the first control valve 420 are connected, and the tenth and twelfth ports of the second control valve 430 are connected (e.g., ...). Figure 4 As shown, the heating liquid supplied by the heating liquid supply end 221 passes through the seventh and ninth ports of the first control valve 420, and then enters the flow channel of the second heat exchanger 320 through the first end 321. In the flow channel, the heating liquid transfers heat to the second heat exchanger 320, and then exits the flow channel through the second end 322. After passing through the twelfth and tenth ports of the second control valve 430, it flows back to the condenser 220 through the heating liquid return end 222.
[0056] Obviously, the above embodiments of the present application are merely examples for clearly illustrating the present application, and are not intended to limit the implementation modes of the present application. For those skilled in the art, various obvious changes, re-adjustments and replacements can be made without departing from the protection scope of the present application. Here, it is not necessary and also impossible to enumerate all the implementation modes. Any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application claim.
Claims
1. An on-board oven thermal management system, characterized in that, The application relates to a vehicle-mounted constant-temperature box heat management system. The vehicle-mounted constant-temperature box heat management system comprises a constant-temperature box (100), a vehicle heat management module (200), a semiconductor refrigerator (300), and a distribution module. The vehicle heat management module (200) comprises an evaporator (210), the evaporator (210) comprises a cooling liquid supply end (211) and a cooling liquid return end (212), the semiconductor refrigerator (300) comprises a first heat exchange part (310), a second heat exchange part (320), an N-type semiconductor (330) and a P-type semiconductor (340), the first heat exchange part (310) is arranged in the constant-temperature box (100), the second heat exchange part (320) is arranged outside the constant-temperature box (100), the second heat exchange part (320) is provided with a flow channel, two ends of the flow channel are in communication with the cooling liquid supply end (211) and the cooling liquid return end (212) respectively, two ends of the N-type semiconductor (330) are in conductive connection with the first heat exchange part (310) and the second heat exchange part (320) respectively, and two ends of the P-type semiconductor (340) are in conductive connection with the first heat exchange part (310) and the second heat exchange part (320) respectively. The vehicle-mounted constant-temperature box heat management system further comprises a distribution module, the vehicle heat management module (200) further comprises a condenser (220), the condenser (220) comprises a heating liquid supply end (221) and a heating liquid return end (222), two ends of the flow channel are a first end (321) and a second end (322) respectively, the first end (321) is selectively in communication with the cooling liquid supply end (211) and the heating liquid supply end (221) through the distribution module, and the second end (322) is selectively in communication with the cooling liquid return end (212) and the heating liquid return end (222) through the distribution module.
2. The vehicle-mounted thermocabinet thermal management system of claim 1, wherein, The distribution module comprises a multi-way valve (410), the multi-way valve (410) comprises a first interface, a second interface, a third interface, a fourth interface, a fifth interface and a sixth interface, the first interface and the second interface are selectively in communication with the third interface, the fourth interface and the fifth interface are selectively in communication with the sixth interface, the first interface is in communication with the heating liquid supply end (221), the second interface is in communication with the cooling liquid supply end (211), the third interface is in communication with the first end (321), the fourth interface is in communication with the heating liquid return end (222), the fifth interface is in communication with the cooling liquid return end (212), and the sixth interface is in communication with the second end (322).
3. The vehicle-mounted thermocabinet thermal management system of claim 2, wherein, 4. The vehicle-mounted thermocabinet thermal management system of claim 2, wherein, The distribution module comprises a first control valve (420) and a second control valve (430), the first control valve (420) comprises a seventh interface, an eighth interface and a ninth interface, the seventh interface and the eighth interface selectively communicate with the ninth interface, the seventh interface communicates with the heating liquid supply end (221), the eighth interface communicates with the cooling liquid supply end (211), and the ninth interface communicates with the first end (321), the second control valve (430) comprises a tenth interface, an eleventh interface and a twelfth interface, the tenth interface and the eleventh interface selectively communicate with the twelfth interface, the tenth interface communicates with the heating liquid return end (222), the eleventh interface communicates with the cooling liquid return end (212), and the twelfth interface communicates with the second end (322).
5. The vehicle thermoblock thermal management system of any of claims 1-4, wherein, The vehicle-mounted thermostat heat management system further comprises a temperature sensor and a controller, the temperature sensor is arranged in the thermostat (100), the temperature sensor is signal connected with the controller, and the controller is used for controlling the flow of the cooling liquid flowing into the flow channel from the cooling liquid supply end (211).
6. The vehicle thermoblock thermal management system of any of claims 1-4, wherein, The inner wall of the flow channel is provided with a heat exchange reinforcing structure.
7. The vehicle thermoblock thermal management system of claim 6, wherein, The heat exchange reinforcing structure is a spiral structure extending along the axis direction of the flow channel.
8. The vehicle thermoblock thermal management system of claim 6, wherein, The heat exchange reinforcing structure is a groove.
9. The vehicle thermoblock thermal management system of claim 6, wherein, The heat exchange reinforcing structure is a convex part.
10. Vehicle, characterized in that The vehicle-mounted thermostat heat management system comprises a vehicle body and the thermostat (100), the automobile heat management module (200) and the semiconductor refrigerator (300) are arranged on the vehicle body.