Thermal radiation control device of photoetching hot plate device

Abstract

The utility model discloses a thermal radiation control device of a photoetching hot plate device, which comprises a heating seat, a controller, a temperature controller, a hot plate, a resistance wire and an auxiliary heating component, the controller is fixedly mounted on the heating seat, the temperature controller is positioned inside the heating seat, and the bottom of the hot plate is fixedly mounted at the top of the temperature controller. According to the utility model, the temperature controller is used for controlling the resistance wire to heat, the heat of the resistance wire is transmitted to the heat-conducting gel layer, the heat-conducting gel layer has better heat conductivity and flowability, the heat-conducting gel layer is integrally heated more uniformly, the heat-conducting gel layer is more uniform in conduction temperature, the top of the hot plate is heated uniformly, and a semiconductor wafer is heated uniformly; the air extracting pump and the electric heating pipe are started, the air extracting pump extracts outside air through the air inlet pipe, the outside air needs to be filtered through the filter and then enters the air outlet pipe, the heating cylinder, the extension pipe, the heat pipe and the hot air opening to be sprayed out, and the sprayed hot air is used for preventing the outside air from making contact with the top coating glue of the semiconductor wafer.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of photoetching hot plate, especially relates to a heat radiation control device of photoetching hot plate device. BACKGROUND

[0002] In modern semiconductor manufacturing processes, photolithography technology as the core link of integrated circuit production has extremely high requirements for precision and stability. In the photolithography process, the wafer needs to be exposed at a precisely controlled temperature to ensure the accuracy and consistency of pattern transfer. Therefore, the performance of the photoetching hot plate as the key equipment for wafer heating directly affects the quality of the final product. However, the existing photoetching hot plate device has some significant technical defects when using electric heating wires as heating elements, especially in terms of heat radiation control.

[0003] Traditional photoetching hot plate devices mostly use electric heating wires as heating sources. Although this method meets the heating requirements to some extent, there are inevitable gaps between the electric heating wires. These gaps lead to uneven heat distribution, which in turn affects the consistency of wafer surface temperature. Specifically, when the electric heating wires are heated, the heat they generate is mainly transferred through radiation. In the gap area between the electric heating wires, the heat density is low due to the lack of direct heat source, which causes uneven distribution of wafer surface temperature. This temperature difference directly affects the curing degree of photoresist and exposure precision, and in turn affects the yield and performance of the final product.

[0004] Due to the limitations of electric heating wire heating method, the overall temperature uniformity of the hot plate is difficult to reach a higher standard. Especially in application scenarios that require precise control of temperature difference, such as advanced process node photolithography process, the temperature fluctuations caused by electric heating wire heating may become a bottleneck limiting further improvement of chip performance and reliability. Temperature fluctuations may also cause uneven heating of the wafer, resulting in stress, affecting the flatness and parallelism of the wafer, which will cause trouble to subsequent processing steps.

[0005] Another issue worth noting is the high energy consumption of electric heating wire heating. Due to the discontinuity of electric heating wire distribution, the heat utilization rate is not high, and a lot of energy is lost in the transmission process. This not only increases energy consumption, but also brings additional cost burden, and is also not conducive to the green and environmentally friendly production concept.

[0006] The existing electric heating wire heating system also has some inconvenience in maintenance and operation. Electric heating wires may age, break and other problems after long-term use, which need to be checked and replaced regularly. The layout of electric heating wires is complex, and once damaged, the repair and replacement work is very tedious, not only increases the downtime, but also may cause greater loss due to improper repair.

[0007] Therefore, how to provide a heat radiation control device of a photolithography hot plate device is a problem that those skilled in the art need to solve urgently. Utility model content

[0008] One purpose of the present utility model is to provide a heat radiation control device of a photolithography hot plate device, the present utility model heats through a temperature controller controlling a resistance wire, the heat of the resistance wire is transmitted to a heat-conducting gel layer, the heat-conducting gel layer has good heat conductivity and fluidity, the whole of the heat-conducting gel layer is heated relatively uniformly, the heat-conducting gel layer has relatively uniform conduction temperature, the top of the hot plate is heated uniformly, and the semiconductor wafer is heated uniformly better; then through starting an air suction pump and an electric heating tube, the air suction pump extracts external air through an air inlet pipe, the external air needs to pass through a filter to enter an air outlet pipe, a heating cylinder, an extension pipe and a hot air outlet to be sprayed out, and the sprayed hot air is used for preventing the external air from contacting the top of the semiconductor wafer coated with glue.

[0009] According to the heat radiation control device of the photolithography hot plate device provided by the embodiment of the present utility model, the controller is fixedly installed on the heating seat, the temperature controller is located in the inside of the heating seat, the bottom of the hot plate is fixedly installed on the top of the temperature controller, the resistance wire is fixedly installed on the hot plate, and the auxiliary heating assembly is fixedly installed in the inside of the heating seat.

[0010] The inside of the hot plate is provided with a heating cavity, and the inside of the heating cavity is fixedly provided with a heat-conducting gel layer.

[0011] Further, the resistance wire is fixedly installed in the wire slot, and the bottom of the heat-conducting gel layer covers the resistance wire.

[0012] Further, the outer surface of the controller is fixedly provided with a display screen, and the outer surface of the controller is fixedly provided with a key group.

[0013] Further, the auxiliary heating assembly comprises an air suction pump, an air inlet pipe and an air outlet pipe, wherein the bottom of the air suction pump is fixedly installed on the inner bottom of the heating seat, one end of the air inlet pipe is fixedly installed on the air suction pump, the other end of the air inlet pipe extends out of the heating seat, and the air outlet pipe is fixedly installed on the air suction pump.

[0014] Further, the outer surface of the air inlet pipe is fixedly provided with a filter.

[0015] Further, the auxiliary heating assembly further comprises a heating cylinder, an electric heating tube and an extension pipe, wherein one end of the heating cylinder is fixedly installed on the air outlet pipe, the electric heating tube is fixedly installed on the inner wall of the heating cylinder, and the bottom of the extension pipe is fixedly installed on the other end of the heating cylinder.

[0016] Further, the electric heating pipes are six, and the six electric heating pipes are arranged at equal angles in the heating cylinder.

[0017] Further, the auxiliary heating assembly further comprises a ring heat pipe and a hot air outlet, the bottom of the ring heat pipe is fixedly installed on the top of the extension pipe, and the bottom of the hot air outlet is fixedly installed on the ring heat pipe.

[0018] The photolithography hot plate device has the advantages that:

[0019] The electric resistance wire is heated by the temperature controller, the heat of the electric resistance wire is transmitted to the heat-conducting gel layer, the heat-conducting gel layer has good heat conductivity and fluidity, the whole heat-conducting gel layer is heated uniformly, the heat-conducting gel layer has uniform conduction temperature, the top of the hot plate is uniformly heated, and the semiconductor wafer is uniformly heated better. BRIEF DESCRIPTION OF DRAWINGS

[0020] The accompanying drawings are used to provide a further understanding of the present application, and constitute a part of the specification, and are used to explain the present application together with embodiments of the present application, and do not constitute a limitation to the present application. In the drawings:

[0021] Figure 1 The present application provides a heat radiation control device of a photolithography hot plate device.

[0022] Figure 2 The present application provides a heat radiation control device of a photolithography hot plate device.

[0023] Figure 3 The present application provides a heat radiation control device of a photolithography hot plate device. Figure 2 The present application provides a heat radiation control device of a photolithography hot plate device.

[0024] In the drawings: 1, heating seat; 2, controller; 3, temperature controller; 4, hot plate; 4.1, heating cavity; 4.2, heat-conducting gel layer; 4.3, wire slot; 5, electric resistance wire; 6, auxiliary heating assembly; 6.1, air suction pump; 6.2, air inlet pipe; 6.3, air outlet pipe; 6.4, filter; 6.5, heating cylinder; 6.6, electric heating pipe; 6.7, extension pipe; 6.8, ring heat pipe; 6.9, hot air outlet. DETAILED DESCRIPTION

[0025] The utility model will be further explained in detail in connection with the drawings. These drawings are all simplified schematic diagrams, and only schematically show the basic structure of the utility model, so they only show the relevant components of the utility model.

[0026] The traditional photoetching hot plate device usually uses electric heating wires as the heating source. Although this method meets the heating requirement to a certain extent, there are inevitable gaps between the electric heating wires. These gaps result in uneven heat distribution, which further affects the consistency of the wafer surface temperature. Specifically, when the electric heating wires are heated, the heat generated by the electric heating wires is mainly transmitted through radiation. In the gap area between the electric heating wires, the heat density is low due to the lack of direct heat source, which causes uneven distribution of the wafer surface temperature. This temperature difference directly affects the curing degree of the photoresist and the exposure accuracy, and further affects the yield and performance of the final product.

[0027] Due to the limitations of the electric heating wire heating method, the temperature uniformity of the hot plate as a whole is difficult to reach a higher standard. In particular, in application scenarios that require precise control of temperature difference, such as advanced process node photoetching technology, the temperature fluctuation caused by electric heating wire heating may become a bottleneck that limits the further improvement of chip performance and reliability. Temperature fluctuation may also cause uneven heating of the wafer, thereby generating stress and affecting the flatness and parallelism of the wafer. These problems will cause trouble to subsequent processing steps.

[0028] To solve the above problems, the following technical solutions are proposed:

[0029] Please refer to Figures 1 to 3 The utility model provides a kind of heat radiation control device of photoetching hot plate device, including heating seat 1, controller 2, temperature controller 3, hot plate 4, resistance wire 5 and auxiliary heating component 6, wherein, controller 2 is fixedly installed on heating seat 1, temperature controller 3 is located in the inside of heating seat 1, the bottom of hot plate 4 is fixedly installed on the top of temperature controller 3, resistance wire 5 is fixedly installed on hot plate 4, auxiliary heating component 6 is fixedly installed in the inside of heating seat 1;Heating cavity 4.1 is set in the inside of hot plate 4, heat-conducting gel layer 4.2 is fixedly arranged in the inside of heating cavity 4.1, resistance wire 5 heats heat-conducting gel layer 4.2 with fluidity, more uniform in heat conduction, wire slot 4.3 is set in the inner bottom of heating cavity 4.1.

[0030] Specifically, resistance wire 5 is fixedly installed in wire slot 4.3, the bottom of heat-conducting gel layer 4.2 covers resistance wire 5, the outer surface of controller 2 is fixedly provided with display screen, the outer surface of the controller 2 is fixedly provided with key group.

[0031] More specifically, the auxiliary heating assembly 6 comprises an air suction pump 6.1, an air inlet pipe 6.2 and an air outlet pipe 6.3, wherein the bottom of the air suction pump 6.1 is fixedly installed on the inner bottom of the heating seat 1, one end of the air inlet pipe 6.2 is fixedly installed on the air suction pump 6.1, the other end of the air inlet pipe 6.2 extends out of the heating seat 1, the air outlet pipe 6.3 is fixedly installed on the air suction pump 6.1, and a filter 6.4 is fixedly arranged on the outer surface of the air inlet pipe 6.2; the auxiliary heating assembly 6 further comprises a heating cylinder 6.5, an electric heating pipe 6.6 and an extension pipe 6.7, wherein one end of the heating cylinder 6.5 is fixedly installed on the air outlet pipe 6.3, the electric heating pipe 6.6 is fixedly installed on the inner wall of the heating cylinder 6.5, the electric heating pipe 6.6 heats the inside of the heating cylinder 6.5, so that the temperature of the air is increased, and the bottom of the extension pipe 6.7 is fixedly installed on the other end of the heating cylinder 6.5; the electric heating pipe 6.6 is provided with six, and the six electric heating pipes 6.6 are arranged at equal angles in the heating cylinder 6.5; the auxiliary heating assembly 6 further comprises a ring heating pipe 6.8 and a hot air outlet 6.9, the bottom of the ring heating pipe 6.8 is fixedly installed on the top of the extension pipe 6.7, and the bottom of the hot air outlet 6.9 is fixedly installed on the ring heating pipe 6.8; the hot air outlet 6.9 is provided with a plurality of hot air outlets 6.9, and the plurality of hot air outlets 6.9 are arranged at equal angles on the ring heating pipe 6.8; the hot air outlet 6.9 prevents the outside air from contacting the top of the semiconductor wafer.

[0032] Further, the temperature controller 3 controls the electric resistance wire 5 to heat, there is a gap between the electric resistance wires 5, the heat of the electric resistance wire 5 is radiated, which causes the heat transfer to be uneven, resulting in uneven heating of the semiconductor wafer, the heat of the electric resistance wire 5 is transferred to the heat-conducting gel layer 4.2, the heat-conducting gel layer 4.2 has good heat conductivity and fluidity, the whole of the heat-conducting gel layer 4.2 is heated more uniformly, the heat-conducting gel layer 4.2 conducts the temperature more uniformly, the top of the hot plate 4 is heated uniformly, and the semiconductor wafer is heated more uniformly.

[0033] The air suction pump 6.1 and the electric heating pipe 6.6 are started, the air suction pump 6.1 sucks the outside air through the air inlet pipe 6.2, the outside air needs to be filtered through the filter 6.4 before entering the air outlet pipe 6.3 and the heating cylinder 6.5, the air is heated by the electric heating pipe 6.6, and then is sprayed out through the extension pipe 6.7, the ring heating pipe 6.8 and the hot air outlet 6.9, and the sprayed hot air is used to prevent the outside air from contacting the top of the semiconductor wafer.

[0034] The above is only a preferred specific implementation manner of the present application, but the protection scope of the present application is not limited to this, any skilled person in the art can make equivalent replacement or change according to the technical scheme and the inventive concept of the present application within the technical range disclosed by the present application, which should be covered in the protection scope of the present application.

Claims

1. A thermal radiation control device for a photolithography hot plate apparatus, characterized in that, The utility model provides a heating seat (1), controller (2), temperature controller (3), hot plate (4), resistance wire (5) and auxiliary heating assembly (6) including, wherein, controller (2) fixed mounting is in heating seat (1), temperature controller (3) is located inside heating seat (1), the bottom fixed mounting of hot plate (4) is in temperature controller (3) top, resistance wire (5) fixed mounting is in hot plate (4), auxiliary heating assembly (6) fixed mounting is inside heating seat (1), The inside of the hot plate (4) is provided with a heating cavity (4.1), and the inside of the heating cavity (4.1) is fixedly provided with a heat-conducting gel layer (4.2). The inner bottom of the heating cavity (4.1) is provided with a wire slot (4.3).

2. A heat radiation control device for a hot plate device for photolithography according to claim 1, wherein The resistance wire (5) is fixedly installed in the wire slot (4.3), and the bottom of the heat-conducting gel layer (4.2) covers the resistance wire (5).

3. The heat radiation control device of a hot plate photolithography apparatus according to claim 1, wherein The outer surface of the controller (2) is fixedly provided with a display screen, and the outer surface of the controller (2) is fixedly provided with a key group.

4. The heat radiation control device of a hot plate photolithography apparatus according to claim 1, wherein The auxiliary heating assembly (6) includes an air suction pump (6.1), an air inlet pipe (6.2), and an air outlet pipe (6.3). The bottom of the air suction pump (6.1) is fixedly installed on the inner bottom of the heating seat (1). One end of the air inlet pipe (6.2) is fixedly installed on the air suction pump (6.1). The other end of the air inlet pipe (6.2) extends out of the heating seat (1). The air outlet pipe (6.3) is fixedly installed on the air suction pump (6.1).

5. A heat radiation control device for a hot plate device according to claim 4, wherein The outer surface of the air inlet pipe (6.2) is fixedly provided with a filter (6.4).

6. A heat radiation control device for a hot plate device for photolithography according to claim 5, wherein The auxiliary heating assembly (6) further includes a heating cylinder (6.5), an electric heating pipe (6.6), and an extension pipe (6.7). One end of the heating cylinder (6.5) is fixedly installed on the air outlet pipe (6.3). The electric heating pipe (6.6) is fixedly installed on the inner wall of the heating cylinder (6.5). The bottom of the extension pipe (6.7) is fixedly installed on the other end of the heating cylinder (6.5).

7. A heat radiation control device for a hot plate device according to claim 6, wherein The electric heating pipe (6.6) is provided with six, and the six electric heating pipes (6.6) are arranged at equal angles in the heating cylinder (6.5).

8. The heat radiation control device of a hot plate photolithography apparatus according to claim 6, wherein The auxiliary heating assembly (6) further includes a ring heat pipe (6.8) and a hot air outlet (6.9). The bottom of the ring heat pipe (6.8) is fixedly installed on the top of the extension pipe (6.7). The bottom of the hot air outlet (6.9) is fixedly installed on the ring heat pipe (6.8). The hot air outlet (6.9) is provided with a plurality of hot air outlets (6.9), and the plurality of hot air outlets (6.9) are arranged at equal angles on the ring heat pipe (6.8).

Images