Heat dissipation device and server

Abstract

The utility model relates to the technical field of server heat dissipation, in particular to a heat dissipation device and a server. The heat dissipation device is used for heat dissipation of a server and comprises a heat dissipation unit and a pipeline assembly, the heat dissipation unit comprises a plurality of cold plates, the cold plates are independently arranged, each cold plate inwards forms a liquid cooling flow channel, and each liquid cooling flow channel is provided with an inlet and an outlet; the pipeline assembly comprises a liquid inlet pipe and a backflow pipe, the liquid inlet pipe is communicated with the multiple inlets in a parallel connection mode, and the backflow pipe is communicated with the multiple outlets in a parallel connection mode. The cold plates are arranged in parallel, so that the temperature of the cooling liquid entering each cold plate is closer, and each cold plate can effectively absorb and dissipate heat. Besides, the configuration of the parallel cold plates can be adjusted according to actual requirements, and the number of the cold plates can be increased or decreased according to heat dissipation requirements, so that different heat dissipation scenes can be flexibly adapted.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of server heat dissipation, in particular to a heat dissipation device and a server. BACKGROUND

[0002] In the process of server running, with the continuous improvement of its performance, the heat generated is also increasing. Effective heat dissipation is crucial for the stable operation and performance of the server. The traditional server cooling method, such as fan cooling, often has poor cooling effect when facing high-power and high-density server chips, and it is difficult to meet the cooling demand.

[0003] Liquid cooling as a kind of efficient cooling method has gradually attracted attention. However, the existing liquid cooling devices all adopt single cold plate system or series cold plate system. Single cold plate system uses a single cold plate to cool the GPU module of the server. When applied to multi-GPU module server cooling, the single cold plate requires a large number of quick connections and pipelines, which requires a higher internal space and a corresponding higher cost. The series cold plate system uses multiple cold plates in series to cool the GPU module of the server. The series of multiple cold plates will cause large internal liquid resistance, and the requirement for the circulating water pump will also be higher. In addition, the cooling liquid of the series cold plate flows through the front and rear chips in turn, resulting in a large temperature difference of the cooling liquid entering the front and rear chip cold plates, which will cause uneven cooling effect. CONTENT OF THE INVENTION

[0004] Therefore, it is necessary to provide a heat dissipation device that can have uniform cooling effect and reduce the internal flow resistance of the system.

[0005] To solve the above technical problems, the present application provides the following technical solutions:

[0006] A heat dissipation device for cooling a server, comprising:

[0007] A heat dissipation unit comprising a plurality of cold plates, the plurality of cold plates being independently arranged, wherein each cold plate is formed with a liquid cooling flow channel inwardly, and the liquid cooling flow channel has an inlet and an outlet;

[0008] A pipeline assembly comprising an inlet pipe and a return pipe, the inlet pipe being in parallel communication with the plurality of inlets, and the return pipe being in parallel communication with the plurality of outlets.

[0009] It can be understood that by arranging the cold plates in parallel, when dissipating heat, the cooling liquid enters the heat dissipation parts of different cold plates through the parallelly connected liquid inlet pipes respectively, and after cooling is completed, the cooling liquid returns through the parallelly connected return pipes. The parallelly arranged cold plates can distribute the cooling liquid flow among multiple cold plates, and the temperature of the cooling liquid entering each cold plate is the same, which can ensure that each cold plate can effectively absorb and dissipate heat, thereby improving the heat dissipation uniformity and heat dissipation effect of the heat dissipation device when dissipating heat for the server. In addition, the configuration of the parallel cold plates can be adjusted according to actual needs, and the number of cold plates can be increased or decreased according to heat dissipation needs, thereby being able to flexibly adapt to different heat dissipation scenes.

[0010] In one of the embodiments, the cold plate comprises:

[0011] a cold plate lower cover comprising a heat dissipation main plate and a heat dissipation fin group arranged on one side of the heat dissipation main plate and connected with the heat dissipation main plate;

[0012] a cold plate upper cover connected with the heat dissipation main plate, and a liquid cooling flow channel being formed between the cold plate upper cover and the heat dissipation main plate, an inlet flow channel and a return flow channel being formed on the cold plate upper cover and being independently arranged between the inlet flow channel and the return flow channel and respectively communicating with the heat dissipation fin group;

[0013] wherein the inlet is arranged on the cold plate upper cover and communicates with the inlet flow channel, and the outlet is arranged on the cold plate upper cover and communicates with the return flow channel.

[0014] It can be understood that by independently arranging the inlet flow channel and the return flow channel and respectively connecting the inlet flow channel and the return flow channel with the inlet and the outlet, the cooling liquid enters the heat dissipation fin group through the inlet after entering the inlet flow channel, and flows out through the outlet after entering the return flow channel through the heat dissipation fin group, which can prolong the residence time of the cooling liquid when flowing in the liquid cooling flow channel, and make the heat dissipation effect of the heat dissipation device better.

[0015] In one of the embodiments, the heat dissipation fin group comprises a first heat dissipation fin group and a second heat dissipation fin group, the height of the heat dissipation fins in the first heat dissipation fin group is greater than the height of the heat dissipation fins in the second heat dissipation fin group;

[0016] wherein the flow channel aperture of the part of the inlet flow channel for communicating with the first heat dissipation fin group is greater than the flow channel aperture of the part of the inlet flow channel for communicating with the second heat dissipation fin group.

[0017] It can be understood that by setting the height of the first heat dissipation fin group to be greater than the second heat dissipation fin group, and the flow channel aperture of the part of the cooling liquid communicated with the first heat dissipation fin group being greater than the flow channel aperture of the part of the cooling liquid communicated with the second heat dissipation fin group, the flow of the cooling liquid flowing in the first heat dissipation fin group is greater than the flow of the cooling liquid flowing in the second heat dissipation fin group, so that the heat dissipation effect of the corresponding part of the lower cover of the cold plate corresponding to the first heat dissipation fin group is greater than the heat dissipation effect of the corresponding part of the lower cover of the cold plate corresponding to the second heat dissipation fin group, and the partitioned heat dissipation of the lower cover of the cold plate is realized to meet different heat dissipation requirements.

[0018] In one of the embodiments, the first heat dissipation fin group is capable of being inserted and fitted with the upper cover of the cold plate.

[0019] It can be understood that by using the inserted and fitted connection between the first heat dissipation fin group and the upper cover of the cold plate, the assembly of the lower cover of the cold plate on the upper cover of the cold plate can be guided, so that the accuracy of the assembly position between the lower cover of the cold plate and the upper cover of the cold plate can be ensured, and the lower cover of the cold plate can be easily assembled on the upper cover of the cold plate.

[0020] In one of the embodiments, the upper cover of the cold plate comprises a first plate body and a second plate body, the first plate body, the second plate body and the heat dissipation main plate are arranged in layers and connected.

[0021] Among them, the inlet flow channel and the return flow channel are arranged through the second plate body, and the inlet and the outlet are arranged on the first plate body.

[0022] In one of the embodiments, one of the first plate body and the second plate body is provided with a positioning hole, and the other is provided with a protruding positioning column, and the positioning column is capable of being inserted and fitted with the positioning hole.

[0023] It can be understood that by setting the positioning hole and the positioning column, the first plate body and the second plate body can be guided during assembly, and the accuracy of the assembly position between the first plate body and the second plate body can be ensured.

[0024] In one of the embodiments, a detection sensor is mounted on the cold plate, and the detection sensor is capable of detecting whether the liquid cooling flow channel leaks and generating a feedback signal.

[0025] In one of the embodiments, two of the plurality of cold plates form a group, each group of cold plates is used to match a circuit board in the server, and each of the two cold plates in each group of cold plates is used to dissipate heat from two chips in the circuit board.

[0026] It can be understood that by setting two cold plates corresponding to one server circuit board, the cold plate and the chip can be more closely attached, so that better heat dissipation effect can be achieved.

[0027] In one of the embodiments, the heat dissipation unit is combined with the pipeline assembly to form a heat dissipation module.

[0028] The heat dissipation modules are arranged in multiple numbers and are arranged in sequence along a first direction.

[0029] The application also provides the following technical solutions.

[0030] A server comprising the heat dissipation device according to any one of the above embodiments.

[0031] Compared with the prior art, the heat dissipation device is provided with cold plates in parallel, and when dissipating heat, the cooling liquid enters the heat dissipation parts of different cold plates through the parallelly connected liquid inlet pipes, and after cooling, the cooling liquid returns through the parallelly connected return pipes. The parallelly arranged cold plates can distribute the cooling liquid flow among the multiple cold plates, and the temperature of the cooling liquid entering each cold plate is the same, which can ensure that each cold plate can effectively absorb and dissipate heat, thereby improving the heat dissipation uniformity and heat dissipation effect of the heat dissipation device when dissipating heat for the server. In addition, the configuration of the parallel cold plates can be adjusted according to actual needs, and the number of cold plates can be increased or decreased according to the heat dissipation needs, so as to be flexibly adapted to different heat dissipation scenes. BRIEF DESCRIPTION OF DRAWINGS

[0032] In order to more clearly illustrate the technical solutions in the embodiments of the application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative labor.

[0033] Figure 1 A structural schematic view of the heat dissipation device provided by the application from one perspective.

[0034] Figure 2 An enlarged view of position A in the application. Figure 1

[0035] Figure 3 An exploded view of the cold plate provided by the application from one perspective.

[0036] Figure 4 A structural schematic view of the heat dissipation device provided by the application from another perspective.

[0037] Figure 5 An exploded view of the cold plate provided by the application from another perspective.

[0038] The element reference numbers are as follows:

[0039] ​100, heat dissipation device; 10, heat dissipation unit; 11, cold plate; 111, lower cover of cold plate; 1111, heat dissipation main plate; 1112, heat dissipation fin group; 11121, first heat dissipation fin group; 11122, second heat dissipation fin group; 1113, heat conductive pad; 112, upper cover of cold plate; 1121, liquid inlet channel; 1122, backflow channel; 1123, first plate body; 11231, positioning hole; 1124, second plate body; 11241, positioning column; 12, liquid cooling channel; 121, inlet; 122, outlet; 20, pipeline assembly; 21, liquid inlet pipe; 22, backflow pipe; 23, water nozzle; 231, T-shaped water nozzle; 232, L-shaped water nozzle; 30, detection sensor; 31, liquid leakage detection line; 40, connecting support; 41, fixing cover; 42, structural frame; 43, spring screw; 50, handle. DETAILED DESCRIPTION

[0040] To make the above objectives, features and advantages of the present application more clear and easily understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. In the following description, a lot of specific details are set forth in order to provide a thorough understanding of the present application. However, the present application can be implemented in many different ways other than the embodiments described herein, and those skilled in the art can make similar improvements without departing from the spirit of the present application, so the present application is not limited to the specific embodiments disclosed below.

[0041] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it can be directly on the other component or there can be a middle component. When a component is referred to as being "connected to" another component, it can be directly connected to the other component or there can be a middle component. The terms "vertical", "horizontal", "upper", "lower", "left", "right", and similar expressions used in the description of the present application are for the purpose of illustration only and do not indicate the only implementation.

[0042] In addition, the terms "first", "second", etc. are used only for the purpose of description and should not be understood as indicating or implying relative importance or implying the number of the technical features indicated. Therefore, the features defined as "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically limited.

[0043] In the present application, unless specifically defined and limited otherwise, a first feature "on", "under", or "below" a second feature can mean that the first feature is in direct contact with the second feature, or the first feature is in indirect contact with the second feature through an intermediate medium. Moreover, the first feature "above", "over", and "on top of" the second feature can mean that the first feature is directly above or obliquely above the second feature, or only means that the first feature is horizontally higher than the second feature. The first feature "below", "under", and "underneath" the second feature can mean that the first feature is directly below or obliquely below the second feature, or only means that the first feature is horizontally lower than the second feature.

[0044] Unless otherwise defined, all technical and scientific terms used in the present application have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs. The terminology used in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the present application. The use of the terms "and / or" in the description of the present application includes any and all combinations of one or more of the associated listed items.

[0045] The present application provides a heat dissipation device 100 for dissipating heat from a server.

[0046] Please refer to Figures 1 to 3 The present application provides a heat dissipation device 100, which comprises a heat dissipation unit 10 and a pipeline assembly 20. The heat dissipation unit 10 comprises a plurality of cold plates 11, which are independently arranged between each other. Each cold plate 11 is formed inwardly with a liquid cooling flow channel 12 having an inlet 121 and an outlet 122. The pipeline assembly 20 comprises an inlet pipe 21 and a return pipe 22. The inlet pipe 21 is connected in parallel with the plurality of inlets 121, and the return pipe 22 is connected in parallel with the plurality of outlets 122. In this way, by arranging the cold plates 11 in parallel, when dissipating heat, the cooling liquid enters the heat dissipation parts of different cold plates 11 through the parallelly connected inlet pipes 21, and after cooling, the cooling liquid returns from the cold plates 11 through the also parallelly connected return pipes 22. The parallelly arranged cold plates 11 can distribute the cooling liquid flow among the plurality of cold plates 11, and the temperature of the cooling liquid entering each cold plate 11 is the same, which can ensure that each cold plate 11 can effectively absorb and dissipate heat, thereby improving the heat dissipation uniformity and heat dissipation effect of the heat dissipation device when dissipating heat from the server. In addition, the configuration of the parallel cold plates 11 can be adjusted according to actual needs, and the number of cold plates 11 can be increased or decreased according to heat dissipation needs, thereby being able to flexibly adapt to different heat dissipation scenarios.

[0047] As Figure 1 shown, the pipeline assembly 20 further comprises a water nozzle 23, which is welded with the cold plate upper cover 112. The inlet pipe 21 and the return pipe 22 are connected with the cold plate upper cover 112 through the water nozzle 23 to realize the parallel connection between the liquid cooling flow channels 12 of the cold plates 11.

[0048] Here, the water nozzle 23 includes a T-shaped water nozzle 231 and an L-shaped water nozzle 232. The cooling water enters the T-shaped water nozzle 231 through the inlet pipe 21, is branched through the T-shaped water nozzle 231, and part of the cooling water enters the first cold plate 11, flows in the first cold plate 11, and dissipates heat for the front chip. Another part of the cooling water flows to the L-shaped water nozzle 232 of the second cold plate 11 through the inlet pipe 21, enters the second cold plate 11 through the L-shaped water nozzle 232, and then flows out from the L-shaped water nozzle 232 of the second cold plate 11, flows to the T-shaped water nozzle 231 of the first cold plate through the return pipe 22, and flows out after being combined with the cooling water that comes out of the first cold plate 11, thereby taking away the heat of the chip.

[0049] In an embodiment, as shown in FIG. 1, the cooling device 100 includes a heat dissipation device 100 and a plurality of chips 10. The heat dissipation device 100 includes a plurality of cold plates 11 and a plurality of inlet pipes 21 and return pipes 22. The plurality of cold plates 11 are arranged in parallel and are connected to the plurality of inlet pipes 21 and return pipes 22. The plurality of inlet pipes 21 and return pipes 22 are connected to the plurality of cold plates 11 and are arranged in parallel. The plurality of chips 10 are arranged on the plurality of cold plates 11. Figure 3 In an embodiment, as shown in FIG. 1, the cooling device 100 includes a heat dissipation device 100 and a plurality of chips 10. The heat dissipation device 100 includes a plurality of cold plates 11 and a plurality of inlet pipes 21 and return pipes 22. The plurality of cold plates 11 are arranged in parallel and are connected to the plurality of inlet pipes 21 and return pipes 22. The plurality of inlet pipes 21 and return pipes 22 are connected to the plurality of cold plates 11 and are arranged in parallel. The plurality of chips 10 are arranged on the plurality of cold plates 11.

[0050] In an embodiment, the heat dissipation fin group 1112 includes a first heat dissipation fin group 11121 and a second heat dissipation fin group 11122. The height of the heat dissipation fins in the first heat dissipation fin group 11121 is greater than the height of the heat dissipation fins in the second heat dissipation fin group 11122. The flow channel aperture in the portion of the inlet flow channel 1121 that is used to communicate with the first heat dissipation fin group 11121 is greater than the flow channel aperture in the portion of the inlet flow channel 1121 that is used to communicate with the second heat dissipation fin group 11122.

[0051] As can be seen from the above, by making the height of the first heat dissipation fin group 11121 greater than the second heat dissipation fin group 11122, and the flow channel aperture of the part of the first heat dissipation fin group 11121 communicated with the cooling liquid greater than the flow channel aperture of the part of the second heat dissipation fin group 11122, the flow of the cooling liquid flowing through the first heat dissipation fin group 11121 is more than that flowing through the second heat dissipation fin group 11122. In this way, the heat dissipation effect of the part of the lower cover 111 of the cold plate corresponding to the first heat dissipation fin group 11121 is greater than that of the part of the lower cover 111 of the cold plate corresponding to the second heat dissipation fin group 11122, and the zoned heat dissipation of the lower cover 111 of the cold plate is realized to meet different heat dissipation requirements.

[0052] Here, the first heat dissipation fin group 11121 can be inserted and fitted with the upper cover 112 of the cold plate. In this way, by using the insertion and fitting between the first heat dissipation fin group 11121 and the upper cover 112 of the cold plate, the assembly of the lower cover 111 of the cold plate on the upper cover 112 of the cold plate can be guided, so as to ensure the accuracy of the assembly position between the lower cover 111 of the cold plate and the upper cover 112 of the cold plate, and facilitate the assembly of the lower cover 111 of the cold plate to the upper cover 112 of the cold plate.

[0053] In the embodiment, the number of the first heat dissipation fin group 11121 is configured as one, and the first heat dissipation fin group 11121 is located in the middle of the main heat dissipation plate 1111, and the number of the second heat dissipation fin group 11122 is configured as two, and the second heat dissipation fin group 11122 is located on both sides of the main heat dissipation plate 1111 in the first direction x.

[0054] In an embodiment, the lower cover 111 of the cold plate is attached with a heat conduction pad 1113, and the lower cover 111 of the cold plate can dissipate heat from the chip through the heat conduction pad 1113.

[0055] As shown in Figure 3 and Figure 5 The cold plate 11 further comprises an upper cover 112 of the cold plate, the upper cover 112 of the cold plate comprises a first plate body 1123 and a second plate body 1124, the first plate body 1123, the second plate body 1124 and the main heat dissipation plate 1111 are arranged in layers and connected; wherein the inlet flow channel 1121 and the return flow channel 1122 are arranged through the second plate body 1124, and the inlet 121 and the outlet 122 are arranged on the first plate body 1123.

[0056] Further, one of the first plate body 1123 and the second plate body 1124 is provided with a positioning hole 11231, and the other is provided with a protruding positioning column 11241 which can be inserted into the positioning hole 11231. It can be understood that the positioning hole 11231 and the positioning column 11241 can guide the first plate body 1123 and the second plate body 1124 during assembly, and ensure the accuracy of the assembly position between the first plate body 1123 and the second plate body 1124. Here, the number of the positioning hole 11231 and the positioning column 11241 can be two, four, six, etc., and the number of the positioning hole 11231 and the positioning column 11241 corresponds one by one.

[0057] In the embodiment, the first plate body is provided with the positioning hole 11231, and the second plate body 1124 is provided with the protruding positioning column 11241. The number of the positioning hole 11231 and the positioning column 11241 is four.

[0058] In an embodiment, the cold plate 11 is provided with a detection sensor 30 which can detect whether the liquid cooling channel 12 leaks and generate a feedback signal.

[0059] As shown in Figure 1 and Figure 4 Two of the plurality of cold plates 11 form a group, each group of cold plates 11 is used to match a circuit board in the server, and each group of cold plates 11 is used to dissipate heat from two chips in the circuit board. By arranging two cold plates 11 to match one server circuit board, on the one hand, the cold plate 11 can be more closely attached to the chip, thereby achieving better heat dissipation effect, on the other hand, this arrangement method allows individual maintenance when a cold plate 11 fails.

[0060] As shown in Figure 1 The heat dissipation unit 10 and the pipeline assembly 20 are combined to form a heat dissipation module; the number of heat dissipation modules is configured to be multiple, for example, three, four, five, etc., and the plurality of heat dissipation modules are arranged along the first direction x in sequence.

[0061] In the embodiment, the number of heat dissipation modules is four.

[0062] In an embodiment, the cold plate 11 is provided with a detection sensor 30 which can detect whether the liquid cooling channel 12 leaks and generate a feedback signal. By arranging the detection sensor 30, the cold plate 11 has a leakage detection function, which can achieve the purpose of monitoring the working of the heat dissipation device 100.

[0063] In the embodiment, the detection sensor 30 is configured as a leakage detection line 31 of an external circuit, and the leakage detection line 31 is arranged at a position where the pipeline is prone to leakage. When there is leakage of the cooling liquid, the leakage detection line 31 is wetted by the cooling liquid to form a short circuit, and the external circuit sends a reminder.

[0064] As shown in Figure 1 and Figure 2 The heat dissipation device 100 further comprises a connecting bracket 40, and the plurality of cold plates 11 are mounted on the connecting bracket 40. The cold plate 11 can be adjusted in position relative to the connecting bracket 40 in the thickness direction of the cold plate 11.

[0065] Further, the connecting bracket 40 comprises a fixing cover 41 and a structure frame 42, and the cold plate 11 is fixed on the fixing cover 41. When the cold plate 11 is thin, the fixing cover 41 is additionally arranged to increase the bending and torsion resistance of the structure. The structure frame 42 is connected to the fixing cover 41 to fix a plurality of cold plates, so that the plurality of cold plates can be mounted on the server together.

[0066] In the embodiment, the fixing cover 41 is mounted on the server by a spring screw 43.

[0067] In an embodiment, the heat dissipation device 100 further comprises a handle 50, so that the user can hold the heat dissipation device 100 through the handle 50, which makes it more convenient to hold the cold plate type heat dissipation device 100 when installing.

[0068] The application also provides a server comprising the heat dissipation device 100 of any one of the above embodiments.

[0069] The technical features of the above embodiments can be combined in any manner. To make the description concise, all possible combinations of the technical features in the above embodiments are not described, but as long as the combinations of the technical features do not exist contradictory, they should be considered as the scope of the present application.

[0070] The above embodiments only express several implementation manners of the present application, and the description is more specific and detailed, but it should not be understood as a limitation on the patent application scope. It should be pointed out that for ordinary skilled in the art, without departing from the concept of the present application, several modifications and improvements can be made, which are all within the protection scope of the present application. Therefore, the patent protection scope of the present application should be subject to the appended claims.

Claims

1. A heat dissipation device for cooling a server, characterized in that, The heat dissipation device (100) comprises: a heat dissipation unit (10) comprising a plurality of cold plates (11) which are independently arranged with each other, wherein each of the cold plates (11) is formed with a liquid cooling flow channel (12) inwards, and the liquid cooling flow channel (12) has an inlet (121) and an outlet (122); a pipeline assembly (20) comprising a liquid inlet pipe (21) and a return pipe (22), wherein the liquid inlet pipe (21) is in parallel communication with a plurality of the inlets (121), and the return pipe (22) is in parallel communication with a plurality of the outlets (122).

2. The heat dissipating device according to claim 1, wherein The cold plate (11) comprises: a cold plate lower cover (111) comprising a heat dissipation main plate (1111) and a heat dissipation fin group (1112), wherein the heat dissipation fin group (1112) is arranged on one side of the heat dissipation main plate (1111) and connected with the heat dissipation main plate (1111); a cold plate upper cover (112) connected with the heat dissipation main plate (1111), and a liquid cooling flow channel (12) is formed between the cold plate upper cover (112) and the heat dissipation main plate (1111), wherein the cold plate upper cover (112) is formed with a liquid inlet flow channel (1121) and a return flow channel (1122), and the liquid inlet flow channel (1121) and the return flow channel (1122) are independently arranged and respectively in communication with the heat dissipation fin group (1112); wherein the inlet (121) is arranged on the cold plate upper cover (112) and in communication with the liquid inlet flow channel (1121), and the outlet (122) is arranged on the cold plate upper cover (112) and in communication with the return flow channel (1122).

3. The heat dissipating device of claim 2, wherein The heat dissipation fin group (1112) comprises a first heat dissipation fin group (11121) and a second heat dissipation fin group (11122), wherein the height of the heat dissipation fins in the first heat dissipation fin group (11121) is greater than the height of the heat dissipation fins in the second heat dissipation fin group (11122); wherein the flow channel aperture of the liquid inlet flow channel (1121) for communication with the first heat dissipation fin group (11121) is greater than the flow channel aperture of the liquid inlet flow channel (1121) for communication with the second heat dissipation fin group (11122).

4. The heat dissipating device according to claim 3, wherein The first heat dissipation fin group (11121) can be inserted and matched with the cold plate upper cover (112).

5. The heat dissipating device of claim 2, wherein The cold plate upper cover (112) comprises a first plate body (1123) and a second plate body (1124), wherein the first plate body (1123), the second plate body (1124) and the heat dissipation main plate (1111) are arranged in layers and connected; wherein the liquid inlet flow channel (1121) and the return flow channel (1122) are arranged through the second plate body (1124), and the inlet (121) and the outlet (122) are arranged on the first plate body (1123).

6. The heat dissipating device according to claim 5, wherein One of the first plate body (1123) and the second plate body (1124) is provided with a positioning hole (11231), and the other is provided with a protruding positioning column (11241) capable of being inserted into the positioning hole (11231).

7. The heat dissipating device of claim 1, wherein A detection sensor (30) is installed on the cold plate (11), which can detect whether the liquid cooling channel (12) leaks and generate a feedback signal.

8. The heat dissipating device of claim 2, wherein, Two of the plurality of cold plates (11) form a group, each group of cold plates (11) is used to match a line board in the server, and each group of cold plates (11) is used to dissipate heat from two chips in the line board.

9. The heat dissipating device of claim 1, wherein, The heat dissipation unit (10) and the pipeline assembly (20) are combined to form a heat dissipation module. The number of the heat dissipation modules is configured to be multiple, and the multiple heat dissipation modules are arranged in sequence along a first direction.

10. A server, characterized by The heat dissipation device (100) of any one of claims 1-9 is included.

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