Metal strip line of antenna
By setting solderable positions on the metal strip substrate and coating them with copper and tin solder coatings, the problems of material waste and pollution are solved, the bonding strength and production efficiency are improved, and it is suitable for mass production.
Patent Information
- Application Number
- CN202422019376.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-20
- Publication Date
- 2025-11-21
- Estimated Expiration
- 2034-08-20
AI Technical Summary
Existing antennas with metal strips suffer from problems such as high material waste, heavy pollution, low efficiency, and low bonding strength.
The method involves setting solderable positions on a metal strip substrate and applying a copper coating and a tin solder coating to the solderable positions using a cold spraying process to form a conductive solderable layer. This reduces the use of nickel metal layers, achieves a bonding strength of 15MPa-70MPa, improves material utilization, and is an environmentally friendly and pollution-free process.
It achieves improved material utilization, enhanced bonding strength, and environmentally friendly and efficient processes, making it suitable for mass production.
Smart Images
Figure CN223582700U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of communication, in particular to a metal strip line of an antenna. BACKGROUND
[0002] In the design of an antenna, in order to reduce signal transmission loss and reduce electromagnetic interference shielding, an aluminum metal strip line is usually used as a signal transmission medium. A traditional method for manufacturing a metal strip line is to electroplate a nickel layer, a copper layer and a tin layer on the surface of an aluminum alloy sheet as a whole, and the tin layer is used to ensure the bonding strength. However, this method has the problems of large material waste, heavy pollution, low efficiency and low bonding strength. Therefore, there is an urgent need to develop a metal strip line of an antenna which can improve the material utilization rate while ensuring excellent electrical conductivity and weldability of the metal strip line. CONTENT OF THE UTILITY MODEL
[0003] The main purpose of the present application is to provide a metal strip line of an antenna, which aims to solve the technical problems of large material waste, heavy pollution, low efficiency and low bonding strength of the existing metal strip line of an antenna.
[0004] To achieve the above-mentioned purpose, the present application provides a metal strip line of an antenna, which comprises:
[0005] a metal strip line base body provided with at least one weldable position;
[0006] at least one conductive weldable layer, the conductive weldable layer comprising a copper coating layer and a tin solder coating layer, the copper coating layer being arranged on the weldable position, and the tin solder coating layer being arranged on the copper coating layer, the conductive weldable layer being used for welding the antenna with an external communication component and for communication, wherein the bonding strength between the copper coating layer and the metal strip line base body is 15 MPa-70 MPa.
[0007] Further, in an embodiment, the copper powder particle size of the copper coating layer is 1-53 pm, and the tin solder powder particle size of the tin solder coating layer is 1-53 pm.
[0008] Further, in an embodiment, the copper coating layer is arranged on the weldable position by a cold spraying process, and the tin solder coating layer is arranged on the copper coating layer by a cold spraying process.
[0009] Further, in an embodiment, the material of the copper coating layer is pure copper or copper alloy, and the thickness of the copper coating layer is 5-100 pm.
[0010] Further, in an embodiment, the tin solder coating layer is a tin alloy coating layer, and the thickness of the tin solder coating layer is 5-100 pm.
[0011] Further, in an embodiment, the plurality of solderable sites are provided, and the plurality of conductive solderable layers are correspondingly provided, each of the conductive solderable layers is correspondingly provided on each of the solderable sites.
[0012] Further, in an embodiment, the material of the metal strip substrate is aluminum alloy, and the forming process of the metal strip substrate is one of stamping process, wire cutting process or etching process.
[0013] Further, in an embodiment, the solderable sites are formed by pretreatment to have an adhesion surface for enhancing the combination with the copper coating.
[0014] Further, in an embodiment, the metal strip substrate is a wave-shaped structure in a strip shape with alternating connection of troughs in a U shape and peaks in an inverted U shape.
[0015] In the technical scheme provided in the present application, at least one solderable site is provided on the metal strip substrate, and a conductive solderable layer is correspondingly provided on the solderable site, wherein the conductive solderable layer comprises a copper coating and a tin solder coating, the copper coating is provided on the solderable site, and the tin solder coating is provided on the copper coating, the conductive solderable layer is composed of the copper coating and the tin solder coating, the adhesion process of one layer of nickel metal layer is reduced, the material consumption is reduced by more than 80%, and only the position requiring conductive welding needs to be provided with the conductive solderable layer, without the need for overall coverage of the conductive solderable layer, thereby providing material utilization rate; and the conductive solderable layer is combined with the metal strip substrate through cold spraying process, the combination strength between the copper coating and the metal strip substrate is 15 MPa-70 MPa, the combination force between the two is strong, the interface is tightly combined, the thickness is uniform, and the solderability is good; the cold spraying process is a pure physical processing process without chemical reaction, and no waste gas and waste water are generated, which is friendly to the environment, and the raw material powder can be recycled, thereby truly realizing green manufacturing; the cold spraying process combines through plastic deformation of the metal strip substrate caused by high pressure acceleration of the powder, the process is simple, time is saved, efficiency is high, and it is suitable for mass production. BRIEF DESCRIPTION OF DRAWINGS
[0016] One or more embodiments are illustrated by way of example with reference to the accompanying drawings, which are schematic and not intended to be limiting of the embodiments, and in which like reference numerals designate similar items in the figures, in which the use of "embodiment" or "exemplary embodiment" signifies that a particular feature is included in at least one embodiment, but not necessarily every embodiment, of the application, and in which:
[0017] Figure 1 Structure schematic diagram of the metal strip line of one embodiment of the present application;
[0018] Figure 2 Structure schematic diagram of the metal strip line of one embodiment of the present application; Figure 1 Enlarged view of part A in FIG. 4;
[0019] Figure 3A sectional view of a metal strip line according to an embodiment of the present application.
[0020] Wherein, 100, metal strip line; 10, metal strip line substrate; 101, solderable site; 20, conductive solderable layer; 201, copper coating layer; 202, tin solder coating layer. DETAILED DESCRIPTION
[0021] For the purpose of clarity, the present application will be described in more detail in connection with the drawings and specific embodiments. It should be noted that when an element is referred to as being "on" another element, it can be directly on the other element or one or more intervening elements can be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or one or more intervening elements can be present. The terms "vertical", "horizontal", "left", "right", "inner", "outer", and similar terms as used in this specification are for the purpose of illustration only. The terms "first", "second", etc. are used herein only to describe one or more features as distinguished from one another. Unless otherwise specified, the use of the terms "first", "second", etc. implies more than one of a respective feature is present. The term "plurality" means two or more. The term "including" and variations thereof, as used in this specification, mean "comprising" and is not limited to the listed items or integers, but can include additional one or more items, integers, steps, operations, elements, components, and / or combinations thereof.
[0022] In addition, unless otherwise clearly specified and limited, the terms "mounting", "connecting", and "connecting" should be interpreted broadly, for example, it can be fixed connection, or detachable connection, or integral connection; it can be mechanical connection, or electrical connection; it can be direct connection, or indirect connection through intermediate medium, or internal connection of two elements. All technical and scientific terms used in this specification have the same meaning as understood by those skilled in the art to which the present application belongs. The terms used in the specification of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application. The term "and / or" used in this specification includes any and all combinations of one or more related listed items.
[0023] In addition, the technical features involved in the different embodiments of the present application described below can be combined with each other as long as there is no conflict.
[0024] Please refer to Figures 1-3 An embodiment of the present application discloses a metal strip line 100 of an antenna.
[0025] In an embodiment, as shown in Figures 1-3As shown, the metal strip line 100 of the antenna comprises a metal strip line base body 10 and at least one conductive solderable layer 20, the metal strip line base body 10 is provided with at least one solderable site 101, the solderable site 101 is a partial area of the surface of the metal strip line base body 10, rather than the entire surface of the metal strip line base body 10; the conductive solderable layer 20 is arranged on the solderable site 101, and the conductive solderable layer 20 is used for welding the antenna and the external communication component and for mutual communication, so the conductive solderable layer 20 has both conductive performance and solderable performance, the conductive solderable layer 20 comprises a copper coating layer 201 and a tin solder coating layer 202, the copper coating layer 201 is formed by spraying copper powder with a particle size of 1-53 μm on the solderable site 101 through a cold spraying process, and the tin solder coating layer 202 is formed by spraying tin solder powder with a particle size of 1-53 μm on the copper coating layer 201 through a cold spraying process. The conductive solderable layer 20 is sprayed on the local position of the metal strip line base body 10 through the cold spraying process, without electroplating the conductive solderable layer 20 on the entire surface of the metal strip line base body 10, so as to avoid material waste, improve material utilization, and the processing mode of the cold spraying makes the binding force between the conductive solderable layer 20 and the metal strip line base body 10 stronger, the conductive solderable layer 20 is a pure physical process during spraying, without chemical reaction, without waste gas and waste water, the powder can be recycled, is very environmentally friendly, and the local processing mode saves time and improves efficiency.
[0026] In an embodiment, the solderable site 101 can be formed by pretreatment according to actual needs to have an adhesion surface for enhancing the combination with the copper coating layer 201.
[0027] For example, the pretreatment comprises a series of processes such as degreasing, grinding, pickling and the like on the selected area of the metal strip line base body 10, so as to remove the impurities and oil stains on the surface of the metal strip line base body 10 and form a rough microstructure, so as to increase the combination area between the metal strip line base body 10 and the copper coating layer 201 and improve the combination effect between the metal strip line base body 10 and the copper coating layer 201 while ensuring cleanliness. And the combination strength between the metal strip line base body 10 and the copper coating layer 201 can be measured by a tensile testing machine.
[0028] In an embodiment, the material of the metal strip line base body 10 is aluminum alloy, and the metal strip line base body 10 is processed by a stamping process, a wire cutting process or an etching process, wherein the metal strip line base body 10 can be processed into a strip-shaped wave structure formed by alternately connecting wave troughs in a U shape and wave peaks in an inverted U shape, and of course the metal strip line base body 10 can also be processed into a specific shape according to actual needs. The stamping process and the wire cutting process are preferred, and the two processes are pure physical processes without chemical reaction and pollution.
[0029] In an embodiment, the copper coating 201 is made of pure copper or copper alloy, and the content of copper in the copper coating 201 is 80% to 99.9% to ensure the performance of the copper coating 201, preferably the content of copper is 99.9%. The particle size of the copper powder of the copper coating 201 is 1 μm to 53 μm. The copper coating 201 with a thickness of 5 μm to 100 μm is sprayed on the solderable site 101 by a cold spraying process. In the cold spraying process, the raw material powder particles of the copper coating 201 are not heated or are heated only to make the particles plastically soften. A high-pressure gas is used to accelerate the powder particles to a high speed to collide with the metal ribbon substrate 10. The energy related to the collision event causes a high degree of plastic deformation, which makes the particles combine with the metal ribbon substrate 10, thereby establishing a layered structure to obtain the copper coating 201. The bonding strength between the copper coating 201 and the metal ribbon substrate 10 is 15 MPa to 70 MPa. The bonding strength is large, so that an additional nickel layer between the metal ribbon substrate 10 and the copper coating 201 is not needed to ensure the bonding force, the use of a layer of nickel is reduced, and the process is simple. The cold spraying process establishes a layered structure by high-speed collision of particles with the metal ribbon substrate 10 under high gas pressure to produce plastic deformation. The whole process is a pure physical process without chemical reaction, waste gas and waste water, and the powder can be recycled, which is very environmentally friendly and has little pollution.
[0030] In an embodiment, the tin solder coating 202 is a tin alloy coating. The tin alloy is a non-ferrous alloy composed of tin and other alloy elements such as copper, silver, bronze, etc. To ensure the performance of the tin solder coating 202, the content of tin in the tin solder coating 202 is 80% to 99.99%. The particle size of the tin solder powder of the tin solder coating 202 is 1 μm to 53 μm. The tin solder coating 202 with a thickness of 5 μm to 100 μm is sprayed on the solderable site 101 by a cold spraying process. In the cold spraying process, the raw material powder particles of the tin solder coating 202 are not heated or are heated only to make the particles plastically soften. A high-pressure gas is used to accelerate the powder particles to a high speed to collide with the copper coating 201. The energy related to the collision event causes a high degree of plastic deformation, which makes the particles combine with the copper coating 201, thereby establishing a layered structure to obtain the tin solder coating 202. The bonding strength between the tin solder coating 202 and the copper coating 201 is 15 MPa to 70 MPa. The cold spraying process establishes a layered structure by high-speed collision of particles with the copper coating 201 under high gas pressure to produce plastic deformation. The whole process is a pure physical process without chemical reaction, waste gas and waste water, and the powder can be recycled, which is very environmentally friendly and has little pollution.
[0031] In one embodiment, multiple solderable positions 101 are provided, and multiple conductive solderable layers 20 are provided accordingly. Each conductive solderable layer 20 is provided on each solderable position 101, so that multiple solderable positions 101 can be pre-processed on the metal strip substrate 10 according to the actual needs of the antenna, and then the conductive solderable layer 20 is sprayed on the solderable positions 101, so that the antenna can be soldered with external communication components and communicate with each other. According to the actual spraying of the conductive solderable layer 20, it is not necessary to electroplate the conductive solderable layer 20 on the entire surface of the metal strip 100. Electroplating the conductive solderable layer 20 on the entire surface is not only time-consuming and inefficient, but also wastes a lot of materials.
[0032] In one specific embodiment, the process of preparing the metal strip 100 includes:
[0033] 1) Provide aluminum alloy blanks;
[0034] 2) The metal strip substrate 10 is processed into the required shape through processes such as stamping, wire cutting, and etching;
[0035] 3) The surface of the metal strip substrate 10, except for the solderable position 101, is masked with a jig, wherein the jig can be made of stainless steel or aluminum alloy.
[0036] 4) Using a pulsed fiber laser with a wavelength of 1064nm, the focused spot diameter is adjusted to 1mm, the pulse width is 10ms, and the frequency is 20Hz. The surface of the solderable position 101 is scanned and heated point by point. The scanning speed is 10mm / s, and the heating time for each point is 1s, so that the surface temperature of the solderable position 101 reaches 150~250℃.
[0037] 5) A copper coating 201 with a thickness of 30 μm was prepared by spraying atomized copper powder with an average particle size of 15 μm and a purity of 99.95% onto the solderable position 101 using a cold spraying process.
[0038] 6) A tin solder composed of tin and bronze with an average particle size of 5 μm was sprayed onto the copper coating 201 using a cold spraying process to prepare a tin solder coating 202 with a thickness of 15 μm.
[0039] 7) Remove the shielding fixture to obtain a metal strip 100 consisting of an aluminum substrate, a copper intermediate layer and a tin solder layer.
[0040] The metal strip wire of the present application is composed of a copper coating and a tin solder coating to form a conductive solderable layer, and the attachment process of a layer of nickel metal is reduced, and the material consumption is reduced by more than 80%, and only the position requiring conductive welding needs to be provided with the conductive solderable layer, without the need for overall coverage of the conductive solderable layer, thereby providing material utilization; and the conductive solderable layer is combined with the metal strip wire substrate through a cold spraying process, the combination of the two is strong, the interface is tightly combined, the thickness is uniform, and the solderability is good; the cold spraying process is a pure physical processing process without chemical reaction, and no waste gas and waste water are generated, which is friendly to the environment, and the raw material powder can be recycled, and truly realizes green manufacturing; the cold spraying process combines the powder with the metal strip wire substrate by high pressure acceleration impact to produce plastic deformation, and the process is simple, time-saving, efficient, and suitable for mass production.
[0041] The above examples are only used to illustrate the technical solutions of the present application, but not to limit them; under the idea of the present application, the technical features in the above examples or different examples can also be combined, the steps can be implemented in any order, and there are many other changes of different aspects of the present application as described above, which are not provided in details for simplicity; although the present application has been described in detail with reference to the foregoing examples, those skilled in the art should understand that the technical solutions recorded in the foregoing examples can still be modified, or some technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.
Claims
1. A metal strip line of an antenna, characterized by The metal strip line comprises: a metal strip line base body provided with at least one solderable site; at least one conductive solderable layer, which comprises a copper coating and a tin solder coating, the copper coating being arranged on the solderable site, and the tin solder coating being arranged on the copper coating, the conductive solderable layer being used for soldering the antenna with a communication component outside and for communication, wherein the bonding strength between the copper coating and the metal strip line base body is 15 MPa-70 MPa.
2. The metal strip line according to claim 1, characterized in that The copper powder particle size of the copper coating is 1-53 μm, and the tin solder powder particle size of the tin solder coating is 1-53 μm.
3. The metal strip line of claim 1, wherein, The copper coating is arranged on the solderable site by a cold spraying process, and the tin solder coating is arranged on the copper coating by a cold spraying process.
4. The metal strip line of claim 1, wherein, The material of the copper coating is pure copper or copper alloy, and the thickness of the copper coating is 5-100 μm.
5. The metal strip line of claim 1, wherein, The tin solder coating is a tin alloy coating, and the thickness of the tin solder coating is 5-100 μm.
6. The metal strip line of claim 1, wherein, The solderable sites are arranged in multiple, and the conductive solderable layers are correspondingly arranged in multiple, each of the conductive solderable layers being arranged on each of the solderable sites.
7. The metal strip line of claim 1, wherein The material of the metal strip line base body is aluminum alloy, and the forming process of the metal strip line base body is one of stamping process, wire cutting process or etching process.
8. The metal strip line of claim 1, wherein, The solderable sites are formed by pretreatment to have an adhesion surface for enhancing the bonding with the copper coating.
9. The metal strip line of claim 1, wherein, The metal strip line base body is a wave-shaped structure in a strip shape, which is alternately connected by a U-shaped wave trough and an inverted U-shaped wave peak.