Heat dissipation structure
The heat dissipation structure, which is achieved by welding insulating components and metal heat sinks, solves the problem of low thermal conductivity of thermal grease and thermal pads, and achieves efficient heat dissipation, making it suitable for applications with high heat generation.
Patent Information
- Application Number
- CN202422881023.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-25
- Publication Date
- 2025-11-21
- Estimated Expiration
- 2034-11-25
AI Technical Summary
In existing technologies, thermal grease and thermal pads have low thermal conductivity, resulting in poor heat dissipation capacity of heat sinks, making it difficult to meet the needs of high heat generation applications and resulting in poor overall heat dissipation performance.
The heat dissipation structure adopts a welding of insulating and metal heat sink components. The metal heat sink component is directly welded to the metal layer of the insulating component, which increases the thermal conductivity and reduces the thermal resistance. The heat dissipation part is connected to the metal layer through line contact, which reduces the difference in thermal strain and avoids cracking of the insulating component.
It improves heat dissipation, increases thermal conductivity, reduces thermal resistance, solves welding problems due to material limitations, avoids cracking of insulating parts, and is suitable for high heat generation applications.
Smart Images
Figure CN223582984U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of chip heat dissipation, in particular to a heat dissipation structure. BACKGROUND
[0002] Since ceramics such as aluminum oxide have good insulation and heat conduction performance, they are increasingly used in emerging industries such as new energy vehicles and energy storage. The current main application forms are: the heat source (such as IGBT chip) is tightly attached to the ceramic insulating plate through the heat-conducting silicone grease, heat-conducting pad, etc., and the ceramic insulating plate is tightly attached to the heat dissipation plate through the heat-conducting silicone grease, heat-conducting pad, etc. In this way, heat is transferred from the heat source to the ceramic insulating plate through the heat-conducting silicone grease, heat-conducting pad, etc., and then to the heat dissipation plate through the heat-conducting silicone grease, heat-conducting pad, etc., and finally to the air or other liquid medium through the heat dissipation plate. However, due to the small thermal conductivity coefficient of the heat-conducting silicone grease and heat-conducting pad, the heat transfer capacity is poor, which leads to poor heat dissipation capacity of the heat dissipation plate, making it difficult to match the application scenarios with large heat generation, and the overall heat dissipation effect is poor. CONTENT OF THE INVENTION
[0003] Therefore, it is necessary to provide a heat dissipation structure with good heat dissipation effect.
[0004] A heat dissipation structure comprises:
[0005] An insulating part comprises a body and a metal layer, a heat source is fixedly connected to the body, and the metal layer is arranged on the side of the body away from the heat source;
[0006] A metal heat dissipation part is fixedly connected to the metal layer.
[0007] In one embodiment, the metal heat dissipation part has a plurality of heat dissipation parts, and the plurality of heat dissipation parts are spaced apart and fixedly connected to the metal layer.
[0008] Understandably, since the metal heat dissipation part and the insulating part are different in material, their thermal expansion coefficients are different, and during the welding process or the cooling process, due to the difference in thermal strain, the insulating part is prone to cracking. However, the contact surface between the heat dissipation part and the metal layer is a line contact, which is smaller than the surface contact of the heat dissipation plate, and the area of the thermal strain difference is also reduced, so that the insulating part is not prone to cracking.
[0009] In one embodiment, the metal heat dissipation part has a plurality of heat dissipation parts, and the plurality of heat dissipation parts are spaced apart and fixedly connected to the metal layer.
[0010] In one embodiment, the metal heat dissipation part has a plurality of heat dissipation parts, and the plurality of heat dissipation parts are spaced apart and fixedly connected to the metal layer.
[0011] In one of the embodiments, the insulating member has a length direction and a width direction, and the plurality of heat dissipation portions are arranged along the length direction of the insulating member and extend along the width direction of the insulating member.
[0012] In one of the embodiments, the length of the insulating member is L1, the width of the insulating member is D1, the length of the metal layer is L2, and the width of the metal layer is D2; L1 and L2 satisfy the relationship: L1≥L2; and D1 and D2 satisfy the relationship: D1≥D2.
[0013] In one of the embodiments, the projection length of the metal heat dissipation member on the metal layer is L3, and the projection width of the metal heat dissipation member on the metal layer is D3; L2 and L3 satisfy the relationship: L2≥L3; and D2 and D3 satisfy the relationship: D2≥D3.
[0014] In one of the embodiments, the thickness of the metal layer is H, and 0.1mm≥H≥0.03mm.
[0015] In one of the embodiments, the metal heat dissipation member is one of an aluminum heat dissipation member, a copper heat dissipation member, and a stainless steel heat dissipation member.
[0016] In one of the embodiments, the metal layer is one of an aluminum layer, a nickel layer, a copper layer, and a steel layer.
[0017] Compared with the prior art, the connection between the insulating member and the metal heat dissipation member in the heat dissipation structure is arranged as welding, the heat transferred to the insulating member can be directly transferred to the metal heat dissipation member, compared with the heat conduction mode of silica gel, the heat conduction coefficient is increased, the thermal resistance is reduced, and good heat dissipation effect is achieved. Secondly, the insulating member is provided with a metal layer, and the metal heat dissipation member is welded with the metal layer, which solves the problem that the insulating member and the metal heat dissipation member cannot be directly welded due to material limitation. BRIEF DESCRIPTION OF DRAWINGS
[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.
[0019] Figure 1 The structural schematic diagram of the heat dissipation structure provided by the present application.
[0020] Figure 2 The front view schematic diagram of the heat dissipation structure provided by the present application.
[0021] Figure 3 The structural schematic diagram of the heat dissipation structure provided by the present application. Figure 2An enlarged view of the middle A.
[0022] Figure 4 A top view of the heat dissipation structure provided in the present application.
[0023] Reference numerals: 1, insulating member; 11, body; 12, metal layer; 2, metal heat dissipation member; 21, heat dissipation portion; 100, heat source. DETAILED DESCRIPTION
[0024] In order to make the above objectives, features and advantages of the present application more apparent, specific embodiments of the present application will be described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. It will be apparent, however, to one skilled in the art, that the present application can be practiced without using some or all of these specific details, and that the present application is not limited to the specific embodiments disclosed below.
[0025] It is to be noted that when an element or layer is referred to as being "on" or "connected to" another element or layer, it can be directly on or connected to the other element or layer, or intervening elements or layers can be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements or layers present. The use of the term "connected" includes the presence of a wired or wireless connection. The use of the term "on" includes the presence of an element on another element, either directly or indirectly, and the use of the term "on" includes the presence of an element directly on another element.
[0026] In addition, the terms "first", "second", etc. are used herein only to describe various elements, and are not to be construed as indicating or implying relative importance or a quantity of the indicated elements. Thus, the features with "first", "second", etc. can include at least one of the features, explicitly or implicitly. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically limited.
[0027] In the present application, unless otherwise explicitly specified and limited, "on", "under", or "below" of a first feature to a second feature can be that the first feature is directly in contact with the second feature, or the first feature is indirectly in contact with the second feature through an intermediate medium. Moreover, "above", "over", and "on" of the first feature to the second feature can be that the first feature is directly above or obliquely above the second feature, or only means that the first feature is horizontally higher than the second feature. "Below", "under", and "under" of the first feature to the second feature can be that the first feature is directly below or obliquely below the second feature, or only means that the first feature is horizontally lower than the second feature.
[0028] Unless otherwise defined, all technical and scientific terms used in the application's specification have the same meaning as commonly understood by one of ordinary skill in the art to which the application belongs. The terminology used in the application's specification is for describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" includes any and all combinations of one or more of the associated listed items.
[0029] The heat source (such as an IGBT chip or the like) is tightly attached to the ceramic insulating plate through thermal conductive silicone grease, thermal conductive pads, or the like, and the ceramic insulating plate is tightly attached to the heat dissipation plate through thermal conductive silicone grease, thermal conductive pads, or the like. In this way, heat is transferred from the heat source to the ceramic insulating plate through thermal conductive silicone grease, thermal conductive pads, or the like, and then transferred to the heat dissipation plate through thermal conductive silicone grease, thermal conductive pads, or the like, and finally dissipated to the air or other liquid medium through the heat dissipation plate. However, due to the relatively small thermal conductivity coefficient of the thermal conductive silicone grease and thermal conductive pads, the heat transfer capacity is poor, resulting in poor heat dissipation capacity of the heat dissipation plate, which is difficult to match the application scenario with relatively large heat generation, and the overall heat dissipation effect is poor.
[0030] Please refer to Figures 1 to 4 The application provides a heat dissipation structure, which comprises an insulating piece 1 and a metal heat dissipation piece 2. The insulating piece 1 comprises a body 11 and a metal layer 12. The heat source 100 is fixedly connected to the body 11, the metal layer 12 is arranged on the side of the body 11 away from the heat source 100, and the metal heat dissipation piece 2 is fixedly connected with the metal layer 12.
[0031] It can be understood that the metal heat dissipation piece 2 is directly welded with the metal layer 12 of the insulating piece 1, the heat source 100 is transferred to the insulating piece 1, and then transferred to the metal heat dissipation piece 2 through the metal layer 12, and the metal heat dissipation piece 2 is heat dissipated to the air or other liquid medium. Compared with the heat transfer mode through silicone, the thermal conductivity coefficient is increased, the thermal resistance is reduced, and good heat dissipation effect is achieved. Moreover, by welding the metal heat dissipation piece 2 with the metal layer 12, the problem that the insulating piece 1 and the metal heat dissipation piece 2 cannot be directly welded due to material limitation is solved.
[0032] Preferably, the metal heat dissipation piece 2 and the metal layer 12 are fixedly connected by welding.
[0033] Exemplarily, the body 11 adopts a ceramic plate, and the heat source 100 is a chip, which is fixedly connected to the body 11 by thermal conductive silicone or thermal conductive pads.
[0034] Further, the metal heat dissipation piece 2 has a plurality of heat dissipation portions 21, and each heat dissipation portion 21 is fixedly connected with the metal layer 12 by welding. That is, the metal heat dissipation piece 2 is fixedly connected with the metal layer 12 by welding through the plurality of heat dissipation portions 21.
[0035] Understandably, since the metal heat sink 2 and the insulating member 1 are made of different materials, their thermal expansion coefficients are different, and during the welding process or the cooling process, due to the difference in thermal strain, the insulating member 1 is prone to cracking. However, through the line contact between the heat dissipation part 21 and the metal layer 12, compared with the surface contact of the heat dissipation plate, the contact area is reduced, and the thermal strain difference area is also reduced, so that the insulating member 1 is not prone to cracking.
[0036] In an embodiment, the insulating member 1 has a length direction and a width direction. The plurality of heat dissipation parts 21 are distributed along the length direction of the insulating member 1 and are arranged along the width direction of the insulating member 1.
[0037] Understandably, the heat dissipation part 21 is arranged along the width direction of the insulating member 1, that is, the welding line during welding is also arranged along the width direction of the insulating member 1 and is distributed along the length direction of the insulating member 1. Therefore, the maximum length of the welding line is the width of the insulating member 1, which is shorter than the length direction, the welding time required by a single welding line is shorter, and the temperature of the welding line is relatively low, which can further reduce the thermal strain difference and avoid cracking of the insulating member 1.
[0038] Of course, in other embodiments, the plurality of heat dissipation parts 21 can also be distributed along the width direction of the insulating member 1 and arranged along the length direction of the insulating member 1.
[0039] Further, the metal heat sink 2 is in a strip structure. The thickness of the strip-shaped heat sink is small, thereby having a certain deformation or stretching ability, and during the welding or cooling process, the deformation or stretching of the strip-shaped heat sink structure can adapt to the thermal strain difference of the insulating member 1, thereby avoiding the cracking phenomenon of the insulating member 1.
[0040] As a preferred embodiment, the metal heat sink 2 is in a wave structure, and the heat dissipation part 21 is located at the wave peak position of the metal heat sink 2. Each wave of the wave structure is in a V shape or a U shape, which ensures the linear contact between the wave peak and the metal layer 12.
[0041] Understandably, in the wave structure, the line welding can be realized by welding the bending part (i.e., the wave peak) and the metal layer 12, and the length of the metal heat sink 2 as a whole is usually several times the projected area, thereby greatly increasing the heat dissipation area and enhancing the heat dissipation effect.
[0042] Of course, not limited to this, in other embodiments, the metal heat sink 2 can also be arranged in a louver shape or a zigzag shape. In other embodiments, the heat dissipation part 21 can also be in a planar structure or a curved surface structure.
[0043] In an embodiment, the length of the insulating piece 1 is L1, and the width of the insulating piece 1 is D1. The length of the metal layer 12 is L2, and the length-width of the metal layer 12 is L2. Wherein, L1, L2 satisfy the relationship: L1≥L2; D1, D2 satisfy the relationship: D1≥D2. That is, the metal layer 12 can not completely cover the insulating piece 1, and the metal layer 12 can be covered only at the position where welding is required, which is more material-saving and reduces the cost.
[0044] Preferably, L1, L2 satisfy the relationship: L1=L2, and D1, D2 satisfy the relationship: D1=D2. That is, the metal layer 12 completely covers the insulating piece 1, increases the heat conduction area, maximizes the heat transfer of the heat on the insulating piece 1, and enhances the heat dissipation effect.
[0045] Further, in the height direction, the projection length of the metal heat dissipation piece 2 on the metal layer 12 is L3, and the projection width of the metal heat dissipation piece 2 on the metal layer 12 is D3. L2, L3 satisfy the relationship: L2≥L3; D2, D3 satisfy the relationship: D2≥D3.
[0046] Preferably, L2, L3 satisfy the relationship: L2=L3. D2, D3 satisfy the relationship: D2=D3. That is, each part of the metal heat dissipation piece 2 can be welded with the metal layer 12, which increases the heat conduction area, maximizes the heat transfer of the heat on the insulating piece 1, and enhances the heat dissipation effect.
[0047] Further, the thickness of the metal layer 12 is H, and 0.1mm≥H≥0.03mm. The metal layer 12 with such thickness will not be too thick to cause material waste, nor too thin to affect the welding effect.
[0048] Illustratively, the value of H can be 0.03mm, 0.05mm, 0.07mm, 0.09mm, 0.1mm, etc., of course, not limited to this, other values can also be selected according to actual needs.
[0049] Illustratively, the metal heat dissipation piece 2 is one of an aluminum heat dissipation piece, a copper heat dissipation piece, and a stainless steel heat dissipation piece. That is, the material of the metal heat dissipation piece 2 is aluminum, copper, stainless steel, etc. Of course, not limited to this, other materials can also be selected according to actual needs.
[0050] Illustratively, the metal layer 12 is one of an aluminum layer, a nickel layer, a copper layer, and a steel layer. That is, the material of the metal layer 12 is aluminum, nickel, copper, steel, etc. Of course, not limited to this, other materials can also be selected according to actual needs.
[0051] Illustratively, the metal layer 12 can be formed on the body 11 by cold spraying, hot spraying, chemical plating, printing, etc.
[0052] Any combination of the technical features in the above-described embodiments can be made, and for the sake of brevity, not all possible combinations are described, however, as long as there is no conflict, any combination of the technical features should be considered within the scope of the present disclosure.
[0053] The above-described embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed, but it should not be understood as a limitation on the patent scope of the application. It should be pointed out that for ordinary skilled persons in the art, several modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the patent protection scope of the present application should be subject to the appended claims.
Claims
1. A heat dissipation structure, characterized in that, include: An insulating component (1) includes a body (11) and a metal layer (12), a heat source (100) is fixedly connected to the body (11), and the metal layer (12) is disposed on the side of the body (11) away from the heat source (100); Metal heat sink (2), which is fixedly connected to the metal layer (12); The body (11) is a ceramic plate; The metal heat sink (2) has a wave-like structure, each wave of the wave-like structure is V-shaped or U-shaped, and the wave crests of the metal heat sink (2) are linearly welded to the metal layer (12).
2. The heat dissipation structure according to claim 1, characterized in that, The metal heat sink (2) has a plurality of heat dissipation parts (21), which are spaced apart and are welded and fixed to the metal layer (12) respectively.
3. The heat dissipation structure according to claim 2, characterized in that, The metal heat sink (2) has a strip structure, and the heat dissipation part (21) is linear.
4. The heat dissipation structure according to claim 2, characterized in that, The insulating member (1) has a length direction and a width direction, and a plurality of heat dissipation parts (21) are distributed at intervals along the length direction of the insulating member (1) and extend along the width direction of the insulating member (1).
5. The heat dissipation structure according to any one of claims 1-4, characterized in that, The length of the insulating element (1) is L1, and the width of the insulating element (1) is D1; the length of the metal layer (12) is L2, and the length and width of the metal layer (12) are L2; L1 and L2 satisfy the relationship: L1≥L2; D1 and D2 satisfy the relationship: D1≥D2.
6. The heat dissipation structure according to claim 5, characterized in that, The projected length of the metal heat sink (2) on the metal layer (12) is L3, and the projected width of the metal heat sink (2) on the metal layer (12) is D3; L2 and L3 satisfy the relationship: L2≥L3; D2 and D3 satisfy the relationship: D2≥D3.
7. The heat dissipation structure according to claim 1, characterized in that, The thickness of the metal layer (12) is H, 0.1mm≥H≥0.03mm.
8. The heat dissipation structure according to claim 1, characterized in that, The metal heat sink (2) is one of aluminum heat sink, copper heat sink, or stainless steel heat sink.
9. The heat dissipation structure according to claim 1 or 8, characterized in that, The metal layer (12) is one of aluminum, nickel, copper, or steel.