Heat exchange device and electronic equipment

Abstract

The utility model provides a heat exchange device and electronic equipment, and relates to the technical field of heat dissipation equipment. The heat exchange device comprises a liquid cooling plate assembly, a heat dissipation piece and an elastic piece. The liquid cooling plate assembly is provided with a liquid cooling flow channel and a flow channel opening communicating with the liquid cooling flow channel, and the liquid cooling flow channel is used for being filled with cooling liquid. The heat dissipation piece is movably arranged at the flow channel opening, one side of the heat dissipation piece is used for being in contact with the cooling liquid, and the other side of the heat dissipation piece is used for being connected with the chip; the elastic piece is arranged between the heat dissipation piece and the liquid cooling plate assembly, so that under the condition that the heat exchange device is installed on the chip, the chip abuts against the heat dissipation piece, the elastic piece is in a compressed state, and at the moment, the heat dissipation piece tightly abuts against the chip under the action of elastic restoring force generated by the elastic piece; therefore, it is guaranteed that the temperature of the chip is maintained within a reasonable operating temperature range, the problem that heat resistance and even production cost are increased due to the fact that heat conduction pieces with different thicknesses are arranged on the surface of the heat dissipation piece is solved, and the heat dissipation effect of the heat exchange device is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to heat dissipation equipment technical field, specifically, relate to a heat exchange device and electronic equipment. BACKGROUND

[0002] With the intelligentization of electronic equipment higher and higher, the power consumption and heat of the chip for realizing the function of electronic equipment increase constantly, in order to the chip and other electronic devices in electronic equipment can work stably, must carry out effective heat dissipation to these electronic devices.

[0003] At present, the water-cooled heat dissipation scheme is usually adopted, however, the existing water-cooled radiator causes the heat dissipation piece between the radiator and the chip to be set up different thicknesses due to the different flatness, not only makes the heat dissipation piece become non-standard part, increases the process cost, but also increases the thermal resistance coefficient due to the thickness of the heat dissipation piece, which affects the heat dissipation of the chip. UTILITY MODEL CONTENTS

[0004] The utility model discloses a heat exchange device and electronic equipment, which can set up floating heat dissipation parts to ensure that the heat dissipation parts are in close contact with the chips, and ensure that the temperature of the chips is maintained within a reasonable operating temperature range.

[0005] The embodiment of the utility model is realized as follows:

[0006] In a first aspect, the utility model provides a heat exchange device, comprising:

[0007] Liquid cooling plate assembly, the liquid cooling plate assembly is provided with liquid cooling flow channel and the flow channel mouth that communicates with liquid cooling flow channel, and the liquid cooling flow channel is used for filling cooling liquid;

[0008] Heat dissipation part, the heat dissipation part is movably arranged in the flow channel mouth, and one side of the heat dissipation part is used for contacting the cooling liquid, and the other side is used for connecting the chip;

[0009] Elastic part, the elastic part is arranged between the heat dissipation part and the liquid cooling plate assembly.

[0010] In an optional implementation, the heat dissipation part includes a heat dissipation plate and a heat dissipation block, the heat dissipation block is arranged on the heat dissipation plate to form a stepped structure, the heat dissipation block is arranged in the flow channel mouth and used for contacting the cooling liquid, and the elastic part is arranged between the heat dissipation plate and the liquid cooling plate assembly.

[0011] In an optional implementation, the liquid cooling plate assembly is provided with a mounting portion, the flow channel mouth is arranged at the mounting portion, and the elastic part is arranged between the mounting portion and the heat dissipation plate.

[0012] Or, the liquid cooling plate assembly is recessed to form a mounting groove, and the heat dissipation block is mounted in the mounting groove.

[0013] Or, the liquid cooling plate assembly is provided with a protruding part and a mounting part, the mounting part is provided with a mounting groove, the protruding part is clamped into the mounting groove, and a sealing element is arranged between the protruding part and the mounting groove.

[0014] In an optional embodiment, the heat exchange device further comprises a fastener, the mounting part is provided with a first mounting hole, the heat dissipation plate is provided with a second mounting hole, the fastener is arranged in the first mounting hole and the second mounting hole, and the elastic element is sleeved on the fastener and located between the mounting part and the heat dissipation plate.

[0015] In an optional embodiment, a first abutting part in a stepped shape is arranged at the first mounting hole, a second abutting part is arranged at the second mounting hole, and the first abutting part abuts against the second abutting part.

[0016] In an optional embodiment, the heat exchange device further comprises a sealing element, an outer side wall of the heat dissipation block or an inner side wall forming a flow channel opening is provided with a groove, the sealing element is arranged in the groove, and the sealing element is located between the side wall for enclosing the flow channel opening and the outer side wall of the heat dissipation block.

[0017] In an optional embodiment, the heat exchange device further comprises a heat-conducting element, the heat-conducting element is arranged on a side wall of the heat dissipation element away from the liquid cooling plate assembly, and the heat-conducting element is attached to the chip.

[0018] In an optional embodiment, a plurality of turbulence parts in a sheet shape are protrudingly arranged on a bottom wall of the heat dissipation element, the plurality of turbulence parts are sequentially and spacedly arranged, and the plurality of turbulence parts all extend into the liquid cooling flow channel.

[0019] In an optional embodiment, a plurality of turbulence parts in a columnar shape are protrudingly arranged on a bottom wall of the heat dissipation element, the plurality of turbulence parts are arranged in an array, and the plurality of turbulence parts all extend into the liquid cooling flow channel.

[0020] In an optional embodiment, the elastic element is arranged on the bottom wall of the heat dissipation element, the number of the elastic elements is a plurality, the elastic elements are in a bent structure, and the plurality of elastic elements all extend into the liquid cooling flow channel.

[0021] The elastic elements are in a sheet shape, and the plurality of elastic elements are sequentially and spacedly arranged; or, the elastic elements are in a columnar shape, and the plurality of elastic elements are arranged in an array.

[0022] In a second aspect, the utility model provides a kind of electronic equipment, including chip and the heat exchange device of any one of the preceding embodiment, the chip is mounted to the heat exchange device.

[0023] In the uninstalled state, the distance between the surface of the heat dissipation piece in contact with the chip and the surface of the liquid cooling plate assembly is a first distance; in the installed state, the distance between the surface of the heat dissipation piece in contact with the chip and the surface of the liquid cooling plate assembly is a second distance, and the first distance is greater than or equal to the second distance.

[0024] The heat exchange device and the electronic equipment provided by the embodiment of the present application have the following beneficial effects: one side of the heat dissipation piece is in contact with the cooling liquid in the liquid cooling channel, and the other side is in contact with the chip, so that the heat of the chip is transmitted to the cooling liquid through the heat dissipation piece, thereby effectively dissipating the heat of the chip; in addition, the heat dissipation piece is movably arranged on the liquid cooling plate assembly, so that when the heat exchange device is installed on the chip, the chip abuts against the heat dissipation piece and the elastic piece is in a compressed state, at this time, the heat dissipation piece abuts against the chip tightly under the action of the elastic restoring force generated by the elastic piece, thereby maintaining the temperature of the chip in a reasonable operating temperature range, compensating for the installation gap error caused by the inconsistency of the flatness of the liquid cooling plate assembly, solving the problem of increasing the thermal resistance or even the production cost caused by the need to arrange heat conduction pieces with different thicknesses on the surface of the heat dissipation piece, and improving the heat dissipation effect of the heat exchange device. BRIEF DESCRIPTION OF DRAWINGS

[0025] In order to more clearly illustrate the technical scheme of the embodiment of the present application, the following will briefly introduce the drawings needed to be used in the embodiment, and it should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation on the scope, and for those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.

[0026] Figure 1 The electronic equipment structure schematic diagram provided by the embodiment of the present application is shown in the figure.

[0027] Figure 2 The electronic equipment structure schematic diagram provided by the embodiment of the present application is shown in the figure. Figure 1 The X part enlarged structure schematic diagram provided by the embodiment of the present application is shown in the figure.

[0028] Figure 3 The electronic equipment first cross-sectional view provided by the embodiment of the present application is shown in the figure.

[0029] Figure 4 The electronic equipment second cross-sectional view provided by the embodiment of the present application is shown in the figure.

[0030] Figure 5 The heat exchange device explosion view provided by the embodiment of the present application is shown in the figure.

[0031] Figure 6 The heat dissipation piece first embodiment structure schematic diagram provided by the embodiment of the present application is shown in the figure.

[0032] Figure 7 A structure schematic view of a second embodiment of the heat dissipation member provided by the embodiment of the utility model;

[0033] Figure 8 An installation schematic view of the second embodiment of the heat dissipation member provided by the embodiment of the utility model;

[0034] Figure 9 A structure schematic view of a third embodiment of the heat dissipation member provided by the embodiment of the utility model;

[0035] Figure 10 An installation schematic view of the third embodiment of the heat dissipation member provided by the embodiment of the utility model;

[0036] Figure 11 A structure schematic view of a fourth embodiment of the heat dissipation member provided by the embodiment of the utility model;

[0037] Figure 12 A structure schematic view of a fifth embodiment of the heat dissipation member provided by the embodiment of the utility model.

[0038] Icon: 10-electronic equipment;100-heat exchange device;110-liquid cooling plate assembly;111-liquid cooling flow channel;112-flow channel opening;113-mounting portion;114-first mounting hole;115-first abutting portion;120-heat dissipation member;121-heat dissipation plate;122-heat dissipation block;123-second mounting hole;124-groove;125-turbulence portion;126-second abutting portion;130-elastic member;140-fastener;150-sealing member;160-heat conduction member;200-chip. DETAILED DESCRIPTION

[0039] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be described clearly and completely below in combination with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, rather than all the embodiments. The components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.

[0040] Therefore, the following detailed description of the embodiments of the utility model provided in the drawings is not intended to limit the scope of the claimed utility model, but only represents selected embodiments of the utility model. Based on the embodiments in the utility model, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the utility model.

[0041] It should be noted that like reference numerals and letters refer to like items in the several views, and once an item is defined in one view, it should not be further defined and explained in subsequent views.

[0042] In the description of the utility model, it needs to be explained that the orientation or position relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like is based on the orientation or position relationship shown in the drawings, or is the orientation or position relationship commonly placed when the utility model product is used, which is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the utility model. In addition, the terms "first", "second", "third" and the like are only used for differentiation in description and cannot be understood as indicating or implying relative importance.

[0043] In addition, the terms "horizontal", "vertical" and the like do not mean that the components must be absolutely horizontal or hanging, but can be slightly inclined. For example, "horizontal" only means that its direction is relatively more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0044] In the description of the utility model, it also needs to be explained that, unless otherwise explicitly specified and limited, the terms "set", "mount", "connected", "connected" should be broadly understood, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication between two elements. For ordinary skilled persons in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0045] With the development of automobile intelligence, automatic driving gradually becomes the market mainstream, and with the continuous improvement of automatic driving level, the power consumption and heat dissipation of the chip used to realize automatic driving are increasing. In order to enable the chips and other electronic devices in the electronic equipment to work stably and normally, the electronic devices must be effectively cooled.

[0046] At present, the water-cooled cooling scheme is usually adopted, however, due to the different flatness of the existing water-cooled radiator, different thickness of the heat-conducting sheet needs to be set between the radiator and the chip 200, which not only makes the heat-conducting sheet a non-standard part, increases the process cost, but also increases the thermal resistance coefficient due to the increase of the thickness of the heat-conducting sheet, which affects the heat dissipation of the chip 200.

[0047] Based on the problems in the prior art, please refer to Figures 1 to 10The embodiment of the utility model provides a kind of electronic equipment 10, especially applicable to electronic equipment 10 in the field of automatic driving, and electronic equipment 10 includes chip 200 and heat exchange device 100, the temperature in the operation of chip 200 can be effectively guaranteed to maintain in reasonable temperature range by heat exchange device 100, ensure that chip 200 stable operation.

[0048] In detail, heat exchange device 100 includes liquid cooling plate assembly 110, heat dissipation piece 120 and elastic piece 130.

[0049] Wherein, liquid cooling plate assembly 110 is provided with liquid cooling flow channel 111 and flow channel mouth 112 communicated with liquid cooling flow channel 111, and liquid cooling flow channel 111 is used to fill cooling liquid;Heat dissipation piece 120 is movably arranged in flow channel mouth 112, and one side of heat dissipation piece 120 is used to contact with cooling liquid, and the other side is used to connect with chip 200;Elastic piece 130 is arranged between heat dissipation piece 120 and liquid cooling plate assembly 110, and elastic piece 130 is used to provide elastic restoring force for heat dissipation piece 120 to move away from liquid cooling plate assembly 110.

[0050] In the embodiment, one side of heat dissipation piece 120 contacts with cooling liquid in liquid cooling channel, and the other side contacts with chip 200, to transmit the heat of chip 200 to cooling liquid through heat dissipation piece 120, to effectively dissipate heat for chip 200;Moreover, heat dissipation piece 120 is movably arranged on liquid cooling plate assembly 110, so that, when heat exchange device 100 is installed on chip 200, chip 200 abuts against heat dissipation piece 120 and makes elastic piece 130 in compression state, at this time, heat dissipation piece 120 is tightly abutted against chip 200 under the action of elastic restoring force generated by elastic piece 130, to guarantee that the temperature of chip 200 is maintained in reasonable operating temperature range, can compensate the installation gap error generated due to the inconsistency of the flatness of liquid cooling plate assembly 110, solve the problem of increasing thermal resistance or even production cost by arranging heat dissipation piece 120 with different thickness heat conductors 160 on the surface, improve the heat dissipation effect of heat exchange device 100.

[0051] It should be noted that, in the uninstalled state, the distance between the surface of the heat dissipation piece 120 in contact with the chip 200 and the surface of the liquid cooling plate assembly 110 is a first distance; in the installed state, the distance between the surface of the chip 200 in contact with the heat dissipation piece 120 and the surface of the liquid cooling plate assembly 110 is a second distance, and the first distance is equal to the second distance, so as to ensure that the chip 200 is in close contact with the heat dissipation piece 120 when the chip 200 is installed on the heat exchange device 100, and even in the case that the first distance is greater than the second distance, the elastic piece 130 will be further in a compressed state, so as to further make the heat dissipation piece 120 in close contact with the chip 200. Further, the heat dissipation piece 120 comprises a heat dissipation plate 121 and a heat dissipation block 122, the heat dissipation block 122 is arranged on the heat dissipation plate 121 to form a stepped structure, the heat dissipation block 122 is arranged in the flow channel opening 112 and used for being in contact with the cooling liquid, and the elastic piece 130 is arranged between the heat dissipation plate 121 and the liquid cooling plate assembly 110.

[0052] In the embodiment, the heat dissipation plate 121 and the heat dissipation block 122 are made by an integral molding process, which is simple in process and low in cost, and the heat dissipation piece 120 made by the process has high structural strength, and the assembly process is reduced and the installation quality is improved.

[0053] And in some other embodiments of the utility model, the outer circumferential surface of the heat dissipation block 122 can be provided with a sliding groove, the outer edge of the heat dissipation plate 121 is clamped in the sliding groove, and the heat dissipation piece 120 can be driven to move up and down and abut against the chip 200 by the elastic piece 130.

[0054] In detail, the elastic piece 130 can be a spring, of course, not limited to this, in some other embodiments of the utility model, the elastic piece 130 can also be other components, for example, rubber, elastic plastic and the like, which are not limited here.

[0055] Therefore, the elastic piece 130 is arranged between the heat dissipation plate 121 and the liquid cooling plate assembly 110, so that the heat dissipation plate 121 has a movement trend of moving away from the liquid cooling plate assembly 110 by the elastic restoring force generated by the elastic piece 130 in the compressed state, so that the heat dissipation plate 121 can be in close contact with the chip 200, thereby ensuring that the heat dissipation piece 120 effectively dissipates heat for the chip 200.

[0056] Or in the installed state, that is, when the heat exchange device is in a natural state, the elastic piece 130 can just make the heat dissipation block 122 and the chip 200 contact by relying on the elastic force of the elastic piece 130.

[0057] Further, the liquid cooling plate assembly 110 is provided with a mounting portion 113, the flow channel opening 112 is arranged at the mounting portion 113, and the elastic piece 130 is arranged between the mounting portion 113 and the heat dissipation plate 121.

[0058] In the embodiment, in order to facilitate the installation and positioning of the heat dissipation member 120, the liquid cooling plate assembly 110 is provided with a protruding mounting portion 113, the heat dissipation plate 121 is mounted on the mounting portion 113, and the elastic member 130 is mounted between the mounting portion 113 and the heat dissipation plate 121, so as to ensure that the heat dissipation member 120 is in close contact with the chip 200.

[0059] Of course, in other embodiments of the present application, the liquid cooling plate assembly 110 can also be recessed to form a mounting groove, and the heat dissipation block 122 is mounted in the mounting groove. Furthermore, in some other embodiments of the present application, the liquid cooling plate assembly 110 can also be provided with a protruding portion and a mounting portion 113, the mounting portion is provided with a mounting groove, the protruding portion is clamped into the mounting groove, and a sealing member is arranged between the protruding portion and the mounting groove.

[0060] Further, the heat exchange device 100 further comprises a fastener 140, the mounting portion 113 is provided with a first mounting hole 114, the heat dissipation plate 121 is provided with a second mounting hole 123, the fastener 140 is arranged in the first mounting hole 114 and the second mounting hole 123, and the elastic member 130 is sleeved on the fastener 140 and located between the mounting portion 113 and the heat dissipation plate 121.

[0061] In the embodiment, the fastener 140 is fixedly arranged in the first mounting hole 114 and penetrates the second mounting hole 123, so that the heat dissipation plate 121 can be slidably connected with the fastener 140, and the heat dissipation plate 121 is ensured to move away from or close to the liquid cooling plate assembly 110 along the extension direction of the fastener 140. The elastic member 130 is arranged at the fastener 140, so that the elastic force of the elastic member 130 can better act on the heat dissipation plate 121.

[0062] Optionally, the fastener 140 is a positioning pin, and the number of the fastener 140, the first mounting hole 114 and the second mounting hole 123 is multiple, for example, in the embodiment, the number of the fastener 140, the first mounting hole 114 and the second mounting hole 123 is four, so as to improve the installation stability of the heat dissipation member 120.

[0063] It is worth mentioning that the top end of the fastener 140 can protrude from the heat dissipation plate 121, or can be arranged flush with the top surface of the heat dissipation plate 121 or lower than the top surface of the heat dissipation plate 121, which is not limited here.

[0064] Of course, in other embodiments of the present application, the fastener 140 can be a screw, a bolt, a threaded component or the like. Furthermore, sealing glue can be arranged between the fastener 140 and the heat dissipation plate 121, or the sealing glue can be arranged on the outer periphery of the fastener 140.

[0065] In some other embodiments of the present application, the fastener 140 can be made of a material with elasticity, so that the fastener 140 not only has elastic properties, but also has a sealing effect.

[0066] Further, the first installation hole 114 is provided with a first abutting portion 115 in a stepped shape, and the second installation hole 123 is provided with a second abutting portion 126, and the first abutting portion 115 abuts against the second abutting portion 126.

[0067] In the embodiment, through the abutment of the first abutting portion 115 and the second abutting portion 126, the heat dissipation piece 120 can be limited and fixed, and the heat dissipation piece 120 is ensured to be relatively stably installed on the liquid cooling plate assembly 110.

[0068] In detail, the second abutting portion 126 is also in a stepped shape, so that one end of the elastic piece 130 can abut against the stepped surface of the fastener 140 and the stepped surface of the second abutting portion 126, and the other end of the elastic piece 130 abuts against the stepped surface of the first abutting portion 115.

[0069] Further, the heat exchange device 100 further comprises a sealing piece 150, the outer side wall of the heat dissipation block 122 or the inner side wall forming the flow channel port is provided with a groove 124, the sealing piece 150 is arranged in the groove 124, and the sealing piece 150 is located between the side wall for surrounding the flow channel port 112 and the outer side wall of the heat dissipation block 122.

[0070] In the embodiment, since the heat dissipation block 122 extends into the flow channel port 112 and contacts the cooling liquid in the liquid cooling channel, in order to avoid leakage of the cooling liquid, the sealing piece 150 is further arranged between the flow channel port 112 and the heat dissipation block 122, so as to play a sealing role through the sealing piece 150.

[0071] Optionally, the sealing piece 150 can be, but is not limited to, a rubber ring; therefore, by arranging the groove 124 on the outer wall of the heat dissipation block 122, the sealing piece 150 can be stably installed at the groove 124, so as to improve the installation stability of the sealing piece 150 and avoid the sealing failure caused by the movement of the sealing piece 150 along with the heat dissipation block 122.

[0072] In other embodiments of the utility model, the sealing piece 150 can also be made of a material with elasticity, so that the sealing piece 150 has sealing performance and also has elastic performance.

[0073] Further, the heat exchange device 100 further comprises a heat conduction piece 160, the heat conduction piece 160 is arranged on the side wall of the heat dissipation piece 120 away from the liquid cooling plate assembly 110, and the heat conduction piece 160 is used for being attached to the chip 200.

[0074] In the embodiment, in order to further improve the heat conduction efficiency between the heat dissipation piece 120 and the chip 200, a heat conduction piece 160 is further arranged on the surface of the heat dissipation piece 120 away from the liquid cooling plate assembly 110, so that when the chip 200 is installed in the heat exchange device 100, the heat conduction piece 160 can be tightly attached to the chip 200, and the heat dissipation effect is effectively improved.

[0075] Optionally, the heat conduction piece 160 can be, but is not limited to, a heat-conducting silicone grease.

[0076] Further, as shown in Figure 7 and Figure 8 , the bottom wall of the heat dissipation piece 120 is provided with a plurality of turbulence portions 125, the turbulence portions 125 are in sheet shape, the plurality of turbulence portions 125 are arranged in sequence and are spaced apart, and the plurality of turbulence portions 125 all extend into the liquid cooling flow channel 111.

[0077] In the embodiment, the turbulence portions 125 are arranged on the bottom wall of the heat dissipation block 122 and are integrally formed with the heat dissipation block 122, a plurality of turbulence portions 125 in sheet shape are arranged, and the plurality of turbulence portions 125 are arranged in sequence and are spaced apart, so that the contact area of the heat dissipation piece 120 and the cooling liquid is increased, the heat exchange capacity of the heat dissipation piece 120 and the cooling liquid is significantly improved, and the heat dissipation effect on the chip 200 is further improved.

[0078] Of course, in other embodiments of the utility model, as shown in Figure 9 and Figure 10 , the turbulence portions 125 can also be in columnar shape, the plurality of turbulence portions 125 are arranged in an array, and the plurality of turbulence portions 125 all extend into the liquid cooling flow channel 111.

[0079] In the embodiment, the turbulence portions 125 are arranged in columnar shape, and the plurality of turbulence portions 125 are arranged in an array, so that the contact area of the turbulence portions 125 and the cooling liquid is increased, the heat exchange capacity of the heat dissipation piece 120 and the cooling liquid is significantly improved, and the heat dissipation effect on the chip 200 is further improved.

[0080] Finally, it should be noted that in other embodiments of the utility model, the elastic piece 130 can also be arranged on the bottom wall of the heat dissipation block 122 in the form of the turbulence portion 125, and the elastic piece 130 can also be regarded as being formed by using an elastic material to make the turbulence portion 125 into the elastic piece 130.

[0081] As shown in Figure 11 , the elastic piece 130 is arranged on the bottom wall of the heat dissipation piece 120, the number of the elastic piece 130 is a plurality, the elastic piece 130 is in sheet shape, and the elastic piece 130 is in a bent structure, that is, the two sheet structures of the elastic piece 130 are arranged at an included angle, the plurality of elastic pieces 130 are arranged in sequence and are spaced apart, and the plurality of elastic pieces 130 all extend into the liquid cooling flow channel 111.

[0082] As shown in Figure 12As shown, the bending structure of the elastic member 130 can also be a concave or convex sheet structure, that is, the elastic member 130 comprises a plurality of segments of sheet structures connected vertically in sequence to form a through groove structure or a convex rib structure on the surface of the elastic member 130, and a plurality of elastic members 130 are arranged in sequence and spaced apart, and the plurality of elastic members 130 all extend into the liquid cooling flow channel 111.

[0083] In the embodiment, the elastic member 130 and the heat dissipation block 122 are made by an integral molding process, and the elastic member 130 is in a bending structure, and the elastic member 130 is in abutment with the liquid cooling plate assembly 110, so that the bending structure of the elastic member 130 is compressed, so that the elastic member 130 generates an elastic force on the heat dissipation member 120 away from the liquid cooling plate assembly 110, so that the heat dissipation member 120 can be in abutment with the chip 200, so that the turbulence structure formed by the elastic member 130 has both the effect of enhancing the heat exchange effect and the elastic performance, and the number of parts of the heat exchange device 100 is reduced.

[0084] In summary, the heat exchange device 100 provided by the utility model is characterized in that one side of the heat dissipation member 120 is in contact with the cooling liquid in the liquid cooling channel, and the other side is in contact with the chip 200, so that the heat of the chip 200 is transmitted to the cooling liquid through the heat dissipation member 120, so that the chip 200 is effectively cooled; Furthermore, the heat dissipation member 120 is movably arranged on the liquid cooling plate assembly 110, so that when the heat exchange device 100 is installed on the chip 200, the chip 200 is in abutment with the heat dissipation member 120 and the elastic member 130 is in a compressed state, and at this time the heat dissipation member 120 is in abutment with the chip 200 under the action of the elastic restoring force generated by the elastic member 130, so as to maintain the temperature of the chip 200 within a reasonable operating temperature range, and to compensate for the installation gap error caused by the inconsistency of the flatness of the liquid cooling plate assembly 110, to solve the problem of increasing the thermal resistance or even the production cost caused by arranging heat dissipation members 120 with different thicknesses on the surface of the heat dissipation member 120, and to improve the heat dissipation effect of the heat exchange device 100.

[0085] The above only describes preferred embodiments of the utility model and is not intended to limit the utility model. Those skilled in the art can make various changes and modifications to the utility model. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the utility model shall be included in the protection scope of the utility model.

Claims

1. A heat exchange device, characterized by, The application relates to a heat exchange device. The heat exchange device comprises a liquid cooling plate assembly (110) provided with a liquid cooling flow channel (111) for filling cooling liquid and a flow channel opening (112) in communication with the liquid cooling flow channel (111); a heat dissipation piece (120) movably arranged in the flow channel opening (112), one side of the heat dissipation piece (120) being used for contacting the cooling liquid and the other side being used for connecting a chip (200); and an elastic piece (130) arranged between the heat dissipation piece (120) and the liquid cooling plate assembly (110). The heat dissipation piece (120) comprises a heat dissipation plate (121) and a heat dissipation block (122) arranged on the heat dissipation plate (121) to form a stepped structure, the heat dissipation block (122) being arranged in the flow channel opening (112) and used for contacting the cooling liquid, and the elastic piece (130) being arranged between the heat dissipation plate (121) and the liquid cooling plate assembly (110). The liquid cooling plate assembly (110) is provided with a mounting portion (113), the flow channel opening (112) is arranged at the mounting portion (113), and the elastic piece (130) is arranged between the mounting portion (113) and the heat dissipation plate (121).

2. The heat exchange device according to claim 1, wherein Alternatively, the liquid cooling plate assembly (110) is recessed to form a mounting groove, and the heat dissipation block (122) is arranged in the mounting groove.

3. The heat exchange device according to claim 2, wherein Alternatively, the liquid cooling plate assembly (110) is provided with a protruding portion and a mounting portion (113), the mounting portion is provided with a mounting groove, the protruding portion is clamped into the mounting groove, and a sealing piece is arranged between the protruding portion and the mounting groove. The heat exchange device further comprises a fastener (140), the mounting portion (113) is provided with a first mounting hole (114), the heat dissipation plate (121) is provided with a second mounting hole (123), the fastener (140) is arranged in the first mounting hole (114) and the second mounting hole (123), and the elastic piece (130) is sleeved on the fastener (140) and located between the mounting portion (113) and the heat dissipation plate (121). The first mounting hole (114) is provided with a first abutting portion (115) in a stepped shape, the second mounting hole (123) is provided with a second abutting portion (126), and the first abutting portion (115) and the second abutting portion (126) abut against each other.

4. The heat exchange device according to claim 3, wherein The heat exchange device further comprises a sealing piece (150), an outer side wall of the heat dissipation block (122) or an inner side wall forming the flow channel opening is provided with a groove (124), the sealing piece (150) is arranged in the groove (124), and the sealing piece (150) is located between the side wall used for enclosing the flow channel opening (112) and the outer side wall of the heat dissipation block (122).

5. The heat exchange device according to claim 4, wherein The heat exchange device further comprises a heat conduction piece (160) arranged on a side wall of the heat dissipation piece (120) away from the liquid cooling plate assembly (110), and the heat conduction piece (160) is attached to the chip (200).

6. The heat exchange device according to claim 2, wherein ​ 7. The heat exchange device according to claim 1, wherein ​ 8. The heat exchange device according to any one of claims 1 to 7, characterized in that The bottom wall of the heat dissipation piece (120) is provided with a plurality of spoiler portions (125), the spoiler portions (125) are in sheet shape, the plurality of spoiler portions (125) are sequentially and spacedly arranged, and the plurality of spoiler portions (125) all extend into the liquid cooling flow channel (111).

9. The heat exchange device according to any one of claims 1 to 7, characterized in that The bottom wall of the heat dissipation piece (120) is provided with a plurality of spoiler portions (125), the spoiler portions (125) are in columnar shape, the plurality of spoiler portions (125) are arranged in an array, and the plurality of spoiler portions (125) all extend into the liquid cooling flow channel (111).

10. The heat exchange device according to claim 1, wherein The elastic pieces (130) are arranged on the bottom wall of the heat dissipation piece (120), the number of the elastic pieces (130) is a plurality, the elastic pieces (130) are in a bent structure, and the plurality of elastic pieces (130) all extend into the liquid cooling flow channel (111). The elastic pieces (130) are in sheet shape, the plurality of elastic pieces (130) are sequentially and spacedly arranged, or the elastic pieces (130) are in columnar shape, and the plurality of elastic pieces (130) are arranged in an array.

11. An electronic device (10), characterized by The heat exchange device as claimed in any one of claims 1-10 is used for the chip (200). In the uninstalled state, the distance between the surface of the heat dissipation piece (120) for contacting the chip (200) and the surface of the liquid cooling plate assembly (110) is a first distance; in the installed state, the distance between the surface of the chip (200) for contacting the heat dissipation piece (120) and the surface of the liquid cooling plate assembly (110) is a second distance, and the first distance is greater than or equal to the second distance.

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