Power amplifier module with waterproof structure

Abstract

The utility model relates to the technical field of electronic equipment, and discloses a power amplifier module with a waterproof structure, which comprises an upper cavity and a lower cavity, the upper cavity is separably mounted on the lower cavity, a cooling fan is mounted on the lower cavity and is used for air cooling of the lower cavity, an inner cavity of the upper cavity is composed of a cavity A and a cavity B which are communicated with each other, and the cavity A and the cavity B are communicated with each other. A cavity opening of the cavity A is closed through a lower cavity, a copper heat dissipation plate abutting against the lower cavity is installed in the cavity B, the copper heat dissipation plate is used for closing a communication channel between the cavity A and the cavity B, a power amplifier tube is installed on the copper heat dissipation plate, an upper cover plate is installed on the cavity opening of the cavity B, and sealing structures are arranged between the upper cover plate and the upper cavity and between the lower cavity and the upper cavity. The beneficial effects of the utility model are that the heat generated by the power amplifier tube can be rapidly and uniformly conducted into the lower cavity through the copper heat dissipation plate, and then the air circulation between the lower cavity and the external environment is accelerated through the heat dissipation fan, so that the heat dissipation is rapid, and the sealing structure can prevent water vapor from entering the upper cavity, thereby preventing moisture from corroding the power amplifier tube, and improving the service life of the power amplifier tube. And the use environment of the power amplifier module is expanded.

Description

TECHNICAL FIELD

[0001] The utility model relates to electronic equipment technical field, especially a waterproof structure power amplifier module. BACKGROUND

[0002] Power amplifier is abbreviated as power amplifier, generally refers to a kind of most basic equipment in sound system, commonly known as "amplifier", its task is to amplify weak electric signal from signal source to drive loudspeaker to emit sound.

[0003] Chinese utility model patent (authorization announcement number: CN213638207U name: a card type modular intelligent power amplifier) including host computer body, the inner of host computer body is provided with heat dissipation cavity, heat dissipation fan is installed in heat dissipation cavity, the front end surface of host computer body is provided with multiple installation blind hole, the left and right side walls of installation blind hole are respectively provided with limiting convex strip, power amplifier module is arranged in installation blind hole, limiting recess is arranged on the left and right side walls of power amplifier module, one end of power amplifier module is provided with hot plug head, the hole bottom bolt connection of installation blind hole and hot plug seat matched with hot plug head is inserted, the left and right ends of the front end surface of host computer body are respectively provided with L type sliding slot along vertical direction, two groups of L type sliding slot are slidably connected with sealing plate. The design of heat dissipation fan and air hole can improve the heat dissipation effect;In addition, the design of power amplifier module and installation blind hole can integrate multiple power amplifier modules in host computer body, and the volume is small;At the same time, the design of hot plug head and hot plug seat reduces the use of connecting line, and is convenient to maintain, but it does not have waterproof function, and is not suitable for use in humid environment. SUMMARY

[0004] The utility model aims at providing a waterproof structure power amplifier module to overcome the shortcomings of prior art.

[0005] The utility model discloses a waterproof structure power amplifier module, including upper cavity and lower cavity, the upper cavity can be separated installation on the lower cavity, install heat dissipation fan on the lower cavity, the heat dissipation fan is used to air cooling the lower cavity, the inner chamber of the upper cavity is composed of A chamber and B chamber that communicate with each other, the chamber mouth of the A chamber is closed through the lower cavity, install the copper heat dissipation plate that is close to the lower cavity in the B chamber, the copper heat dissipation plate is used to close the communication channel between the A chamber and the B chamber, install power amplifier pipe on the copper heat dissipation plate, install the upper cover plate on the chamber mouth of the B chamber, the upper cover plate and the upper cavity between the lower cavity and the upper cavity are all provided with sealing structure.

[0006] Preferably, a detachable lower cover plate is mounted on the cavity mouth of the lower cavity, and a plurality of partitions are arranged between the cavity bottom of the lower cavity and the lower cover plate, the partitions are used for separating the inner cavity of the lower cavity into a plurality of air ducts, the air ducts are open at the head and tail, and the heat dissipation fan is mounted at the air inlet end or the air outlet end of the air duct.

[0007] Preferably, a cavity partition is further mounted in the B chamber, and the cavity partition is used for separating the B chamber into a plurality of small cavities.

[0008] Preferably, the sealing structure is composed of a sealing groove and a rubber sealing ring, the sealing groove is used for mounting the rubber sealing ring, the sealing groove between the upper cover plate and the upper cavity is arranged on the cavity mouth of the B chamber, and the sealing groove between the lower cavity and the upper cavity is arranged on the outer cavity bottom of the lower cavity.

[0009] Preferably, a detachable aluminum alloy cover plate is mounted on the cavity partition, and the aluminum alloy cover plate is used for secondary waterproofing of the B chamber.

[0010] Compared with the prior art, the power amplifier module has the beneficial effects that:

[0011] The heat generated by the power amplifier tube can be quickly and uniformly conducted to the lower cavity through the copper heat dissipation plate, then the air circulation between the lower cavity and the external environment is accelerated through the heat dissipation fan, so that the heat is quickly dissipated, and the sealing structure can prevent water vapor from entering the upper cavity, thereby avoiding the corrosion of the power amplifier tube by moisture, and expanding the use environment of the power amplifier module. BRIEF DESCRIPTION OF DRAWINGS

[0012] Fig. 1 It is a structural schematic diagram of the utility model;

[0013] Fig. 2 It is an installation structure schematic diagram of the copper heat dissipation plate;

[0014] Fig. 3 It is an installation structure schematic diagram of the aluminum alloy plate;

[0015] In the drawings, 1 is an upper cavity, 2 is a lower cavity, 3 is a heat dissipation fan, 4 is a copper heat dissipation plate, 5 is an upper cover plate, 6 is a lower cover plate, 7 is a partition, 8 is a cavity partition, 9 is a sealing groove, and 10 is an aluminum alloy cover plate. DETAILED DESCRIPTION

[0016] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme of the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are some of the embodiments of the present application, rather than all the embodiments of the present application. The components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0017] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the present application.

[0018] It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict.

[0019] It should be noted that: similar reference numerals and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0020] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship commonly placed when the product of the present application is used, or the orientation or positional relationship commonly understood by those skilled in the art, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second" and the like are only used for differentiation in description, and cannot be understood as indicating or implying relative importance.

[0021] In the description of the present application, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set", "mount", "connected", "connected" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the communication inside two elements. For those of ordinary skill in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0022] As Figs. 1-3As shown, a waterproof power amplifier module includes an upper cavity 1 and a lower cavity 2. The upper cavity 1 is detachably mounted on the lower cavity 2. A cooling fan 3 is installed on the lower cavity 2 for air cooling. The inner cavity of the upper cavity 1 consists of two interconnected chambers, A and B. The opening of chamber A is closed by the lower cavity 2. A copper heat sink 4 is installed in chamber B, pressing against the lower cavity 2. The copper heat sink 4 closes the communication channel between chambers A and B. The power amplifier tube is installed in chamber B, and an upper cover plate 5 is installed on the opening of chamber B. There are sealing structures between the upper cover plate 5 and the upper chamber 1, and between the lower chamber 2 and the upper chamber 1. The heat generated by the power amplifier tube can be quickly and evenly conducted to the lower chamber 2 through the copper heat sink plate 4. Then, the cooling fan 3 accelerates the air circulation between the lower chamber 2 and the external environment, thereby quickly dissipating heat. The sealing structure can prevent moisture from entering the upper chamber 1, avoid moisture corrosion of the power amplifier tube, and expand the operating environment of the power amplifier module.

[0023] In this embodiment, as Figs. 1-3 As shown, a separable lower cover plate 6 is installed on the cavity opening of the lower cavity 2. Several partitions 7 are provided between the bottom of the lower cavity 2 and the lower cover plate 6. The partitions 7 are used to divide the inner cavity of the lower cavity 2 into several air ducts. The beginning and end of the air ducts are open. The cooling fan 3 is installed at the air inlet or air outlet of the air duct, turning a wide airflow channel into several narrow airflow channels. When the fan is working, the airflow speed in the narrow channels increases, which can carry away heat energy more quickly and improve the heat dissipation efficiency.

[0024] In this embodiment, as Figs. 1-3 As shown, cavity partition 8 is also installed in cavity B. Cavity partition 8 is used to divide cavity B into several small cavities, which can isolate each functional circuit area and prevent mutual interference.

[0025] In this embodiment, as Figs. 1-3 As shown, the sealing structure consists of a sealing groove 9 and a rubber sealing ring. The sealing groove 9 is used to install the rubber sealing ring. The sealing groove 9 between the upper cover plate 5 and the upper cavity 1 is opened on the cavity opening of the B chamber. The sealing groove 9 between the lower cavity 2 and the upper cavity 1 is opened on the outer bottom of the lower cavity 2. The structure is simple, has good waterproof effect and low cost of use.

[0026] In this embodiment, as Figs. 1-3 As shown, a detachable aluminum alloy cover plate 10 is installed on the cavity partition 8. The aluminum alloy cover plate 10 is used for secondary waterproofing of the B cavity, which further improves the waterproofing effect and is beneficial for working in harsh environments.

[0027] Although the utility model has been explained in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions recorded in the foregoing embodiments or make equivalent replacement to part of the technical features, and any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A waterproof structure power amplifier module, comprising an upper cavity (1) and a lower cavity (2), the upper cavity (1) is detachably mounted on the lower cavity (2), a heat dissipation fan (3) is mounted on the lower cavity (2), and the heat dissipation fan (3) is used for air cooling the lower cavity (2), characterized in that: The inner cavity of the upper cavity (1) is composed of A cavity and B cavity which are communicated with each other, the cavity mouth of the A cavity is closed by the lower cavity (2), the copper heat dissipation plate (4) which abuts against the lower cavity (2) is installed in the B cavity, the copper heat dissipation plate (4) is used to close the communication channel between the A cavity and the B cavity, the power amplifier tube is installed on the copper heat dissipation plate (4), the upper cover plate (5) is installed on the cavity mouth of the B cavity, and the sealing structure is arranged between the upper cover plate (5) and the upper cavity (1) and between the lower cavity (2) and the upper cavity (1). ​ 2. The waterproof power amplifier module of claim 1, wherein: The detachable lower cover plate (6) is installed on the cavity mouth of the lower cavity (2), the partition plate (7) is arranged between the cavity bottom of the lower cavity (2) and the lower cover plate (6), the partition plate (7) is used to separate the inner cavity of the lower cavity (2) into several air ducts, the head and tail of the air duct are open, and the heat dissipation fan (3) is installed at the air inlet end or the air outlet end of the air duct.

3. The waterproof power amplifier module of claim 1, wherein: The cavity partition rib (8) is further installed in the B cavity, and the cavity partition rib (8) is used to separate the B cavity into several small cavities.

4. The waterproof power amplifier module of claim 1, wherein: The sealing structure is composed of the sealing groove (9) and the rubber sealing ring, the sealing groove (9) is used to install the rubber sealing ring, the sealing groove (9) between the upper cover plate (5) and the upper cavity (1) is arranged on the cavity mouth of the B cavity, and the sealing groove (9) between the lower cavity (2) and the upper cavity (1) is arranged on the outer cavity bottom of the lower cavity (2).

5. The waterproof power amplifier module of claim 3, wherein: The detachable aluminum alloy cover plate (10) is installed on the cavity partition rib (8), and the aluminum alloy cover plate (10) is used for secondary waterproof of the B cavity.

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