Heat dissipation device and electronic equipment
By combining heat-conducting components and driving assemblies with a cooling module, the problem of complex and costly external water-cooling circulation systems is solved, achieving efficient and low-cost heat dissipation inside electronic devices.
Patent Information
- Application Number
- CN202422409355.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-30
- Publication Date
- 2025-11-21
- Estimated Expiration
- 2034-09-30
AI Technical Summary
Existing electronic devices suffer from problems such as complex external water cooling circulation systems, large space requirements, and high costs. Furthermore, the cooling path of external water cooling circulation equipment is relatively long, resulting in poor heat dissipation efficiency.
The heat dissipation device combines heat-conducting components and drive components with a cooling module. By achieving self-cooling of the fluid within the drive component, it avoids the need for external water-cooled circulation pipes and pump structures. By using partitions to form flow channels, it ensures efficient circulation of the fluid within the device.
It reduces the space occupied and cost of heat dissipation devices while improving heat dissipation efficiency. The fluid circulates efficiently inside the device, avoiding the temperature influence of hotter fluid on colder fluid, and achieving efficient internal heat dissipation.
Smart Images
Figure CN223584538U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of electronic equipment, in particular to a heat dissipation device and electronic equipment. BACKGROUND
[0002] With the increasing demand for electronic equipment such as mobile phones and computers in people's work and life, the functions of electronic equipment are gradually diversified, and the heat dissipation design is followed to ensure the operation of electronic equipment. CONTENT OF THE UTILITY MODEL
[0003] The first aspect of the present application provides a heat dissipation device, which comprises:
[0004] A heat conduction member is provided with a flow channel, and a first inlet and a first outlet are provided on the heat conduction member and are in communication with the flow channel, and the heat conduction member is used to absorb heat of a heating element of an electronic device;
[0005] A driving assembly is provided with a containing space, and a second inlet and a second outlet are provided on the driving assembly and are in communication with the containing space, the second inlet is in communication with the first outlet, and the second outlet is in communication with the first inlet;
[0006] A partition is provided in the containing space, and the partition divides the containing space into a first space and a second space, the second inlet is in communication with the first space, and the second outlet is in communication with the second space;
[0007] The driving assembly further comprises a refrigeration module, and the refrigeration module is arranged corresponding to the first space, so that the fluid flowing through the second inlet can be cooled in the first space;
[0008] Wherein, a flow guide channel is formed between the first space and the second space to guide the cooled fluid into the second space and flow out through the second outlet.
[0009] In some modified embodiments of the first aspect of the present application, the heat dissipation device described above, wherein the refrigeration module comprises a refrigeration plate;
[0010] The refrigeration plate comprises opposite refrigeration faces and heat dissipation faces, the refrigeration faces face the containing space, and the heat dissipation faces are away from the first space;
[0011] Wherein, when the refrigeration plate is powered on, the refrigeration faces refrigerate and the heat dissipation faces dissipate heat.
[0012] In some modified embodiments of the first aspect of the present application, the heat dissipation device described above, wherein the refrigeration module further comprises a heat dissipation member;
[0013] The heat dissipation member is arranged in the first space, and the heat dissipation member is capable of transferring the temperature of the refrigeration surface to the first space.
[0014] In some modified embodiments of the first aspect of the present application, the heat dissipation device further comprises a temperature sensor.
[0015] The temperature sensor is arranged on the heat conduction member and / or the second inlet, and the temperature sensor is used to detect a temperature signal to form a starting signal of the refrigeration module.
[0016] In some modified embodiments of the first aspect of the present application, the heat dissipation device, wherein the driving assembly comprises a driving part.
[0017] The driving part is arranged in the second space and rotates to provide power to make the cooled fluid enter the second space from the flow channel and flow out through the second outlet.
[0018] The second space is capable of guiding the cooled fluid around the axis of the driving part.
[0019] In some modified embodiments of the first aspect of the present application, the heat dissipation device, wherein the second space is provided with a spiral flow channel around the axis of the driving part, and the spiral flow channel is in communication with the second outlet.
[0020] In some modified embodiments of the first aspect of the present application, the heat dissipation device, wherein the inner wall of the second space is circular.
[0021] The second space is provided with an arc-shaped flow guide plate, one end of the arc-shaped flow guide plate is tangent to the driving part, the other end of the arc-shaped flow guide plate extends around the axis of the driving part and is connected to the inner wall of the second space, and the arc-shaped flow guide plate cooperates with the inner wall of the second space to form the spiral flow channel.
[0022] In some modified embodiments of the first aspect of the present application, the heat dissipation device, wherein the second inlet and the second outlet are oriented differently.
[0023] In some modified embodiments of the first aspect of the present application, the heat dissipation device, wherein
[0024] The partition plate is provided with a through hole to communicate the first space and the second space;
[0025] The heat dissipation member completely covers the through hole in the projection along the first direction;
[0026] The first direction is the direction in which the first space points to the second space.
[0027] The second aspect of the present application provides an electronic device, comprising
[0028] a heat generating element;
[0029] a heat dissipation device arranged inside the electronic device, the heat dissipation device comprising a heat conducting element and a driving assembly;
[0030] the heat conducting element is provided with a flow channel, and the heat conducting element is provided with a first inlet and a first outlet which are in communication with the flow channel, the heat conducting element being used to absorb heat of the heat generating element;
[0031] the driving assembly is provided with a containing space, and the driving assembly is provided with a second inlet and a second outlet which are in communication with the containing space, the second inlet being in communication with the first outlet, and the second outlet being in communication with the first inlet;
[0032] the containing space is provided with a partition plate, the partition plate separating the containing space into a first space and a second space, the second inlet being in communication with the first space, and the second outlet being in communication with the second space;
[0033] the driving assembly further comprises a refrigeration module, the refrigeration module being arranged corresponding to the first space so that fluid flowing through the second inlet can be cooled in the first space;
[0034] wherein a flow channel is formed between the first space and the second space to guide the cooled fluid into the second space and out of the second outlet. BRIEF DESCRIPTION OF DRAWINGS
[0035] The above and other objects, features and advantages of the example embodiments of the present application will be more apparent from the following detailed description read in conjunction with the accompanying drawings, in which several embodiments of the present application are shown by way of example, and wherein like or corresponding elements refer to like or corresponding parts throughout the several drawings, in which:
[0036] Figure 1 a structure schematic diagram of the heat conducting element in the heat dissipation device provided by the present embodiment is schematically shown;
[0037] Figure 2 a structure schematic diagram of the driving assembly in the heat dissipation device provided by the present embodiment is schematically shown;
[0038] Figure 3 a cross-sectional schematic diagram of Figure 2 is schematically shown;
[0039] Figure 4 a structure schematic diagram of the first space in the heat dissipation device provided by the present embodiment is schematically shown;
[0040] Figure 5 A structure diagram of the second space in the heat dissipation device provided by the embodiment is schematically shown;
[0041] Figure 6 A structure diagram of the spiral flow channel in the heat dissipation device provided by the embodiment is schematically shown;
[0042] Figure 7 An exploded structure diagram of the heat dissipation device provided by the embodiment is schematically shown;
[0043] The reference signs are explained as follows: heat conduction member 1, flow channel 11, first inlet 12, first outlet 13, heat conduction sheet 14, heat dissipation fin 15, driving assembly 2, second inlet 21, second outlet 22, first space 23, second space 24, shell 25, spiral flow channel 26, partition plate 3, through hole 31, second through hole 32, refrigeration module 4, refrigeration plate 41, driving part 5, circuit board 51, stator ring 52, rotor 53, rotor barrier 54, rotating shaft 55, blade 56, arc-shaped flow guide plate 6, arc-shaped flow guide surface 61, limiting frame 62. DETAILED DESCRIPTION
[0044] Exemplary embodiments of the present disclosure will be described in detail with reference to the drawings. Although exemplary embodiments of the present disclosure are shown in the drawings, it is understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided so that the present disclosure can be more thoroughly understood and the scope of the present disclosure can be accurately conveyed to those skilled in the art.
[0045] It should be noted that, unless otherwise specified, the technical terms or scientific terms used in the present application should be understood as the general meanings understood by those skilled in the art to which the present application belongs.
[0046] With the diversification of the functions of electronic devices, their heat dissipation performance is also required to be improved accordingly. Some designers may circulate water cooling for the space or heat generating elements inside the device through external water pumps and water pipes, but the cooling path of the external water cooling device fluid is relatively long, resulting in a complex overall structure, a large required space and a high cost. The heat dissipation device provided in the embodiment can realize self-refrigeration of the driving assembly without a long fluid cooling path and without occupying a large space by cooperation of the partition plate and the refrigeration module in the driving assembly, and can realize circulating cooling by being directly applied in the interior of the electronic device. The partitioning effect of the partition plate allows the fluid entering the first space to enter the second space after being cooled and to flow out, and can flow along the path, i.e., the relatively hot fluid in the first space does not cause excessive temperature influence on the relatively cold fluid in the second space, thereby improving the heat dissipation efficiency.
[0047] The technical solutions of the embodiments of the present application can solve the above technical problems, and the embodiments of the present application can refer to the accompanying Figure 1 and the accompanying Figure 2 The heat dissipation device provided by the embodiments of the present application comprises a heat conduction member 1 and a driving assembly 2; the heat conduction member 1 is internally provided with a flow channel 11, the heat conduction member 1 is provided with a first inlet 12 and a first outlet 13 which are in communication with the flow channel 11, and the heat conduction member 1 is used for absorbing heat of a heat generating element (not shown in the figure) of an electronic device; the driving assembly 2 has an accommodation space, the driving assembly 2 is provided with a second inlet 21 and a second outlet 22 which are in communication with the accommodation space, the second inlet 21 is in communication with the first outlet 13, and the second outlet 22 is in communication with the first inlet 12; the accommodation space is internally provided with a partition plate 3, the partition plate 3 divides the accommodation space into a first space 23 and a second space 24 in the accommodation space, the second inlet 21 is in communication with the first space 23, and the second outlet 22 is in communication with the second space 24; the driving assembly 2 further comprises a refrigeration module 4, the refrigeration module 4 is arranged corresponding to the first space 23, so that fluid passing through the second inlet 21 can be cooled in the first space 23.
[0048] The first space 23 and the second space 24 are formed with a flow guide channel, so that the cooled fluid is guided into the second space 24 and flows out through the second outlet 22.
[0049] It can be understood that, in order to solve the problems that the heat dissipation cost of the external water cooling circulation pipe is high, the space required by the external water cooling circulation device is large, and the effect is poor, the embodiments of the present application provide a heat dissipation device which comprises a heat conduction member 1 used for absorbing heat of a heat generating element and a driving assembly 2 used for automatically cooling circulation fluid, the refrigeration module 4 in the driving assembly 2 can complete refrigeration and cooling of the fluid inside the driving assembly 2, without a long fluid cooling path, and the heat dissipation device occupies a small space, can be placed inside an electronic device as a whole, does not need an external water cooling circulation pipe and a pump structure, greatly reduces the required space and the heat dissipation cost. The partitioning effect of the partition plate 3 enables the fluid entering the first space 23 to enter the second space 24 after being cooled and to flow out, and the fluid can flow along the path, that is, the relatively hot fluid in the first space does not cause too much temperature influence on the relatively cold fluid in the second space, and the heat dissipation efficiency is improved.
[0050] The heat dissipation device provided by the embodiments of the present application is placed inside an electronic device when cooperating with the electronic device.
[0051] The heat conduction member 1 can have high thermal conductivity, for example, copper material, and can be in a plate structure or a block structure. The shape, size and arrangement of the flow channel 11 inside the heat conduction member 1 are not limited and can be designed and adjusted as needed, for example, in a straight line, a curve, a snake shape, a grid shape, etc. The heat conduction member 1 can have a heat absorbing surface, which can be a plane or an arc surface, etc. The shape and area are not limited as long as the heat of the heat generating element can be absorbed. In the embodiment, the flow channel 11 can cover part of the surface area of the heat absorbing surface or the entire surface area of the heat absorbing surface, so that the fluid in the flow channel 11 can quickly absorb heat when the heat absorbing surface is attached to the heat generating element. The first inlet 12 and the first outlet 13 can be arranged at both ends of the flow channel 11 to ensure that the fluid has a long flow path after absorbing heat to improve the heat dissipation rate. The size and shape of the first inlet 12 and the first outlet 13 are not limited as long as they are compatible with the second inlet 21 and the second outlet 22. It can be understood that the heat conduction member 1 in the embodiment is used to attach the heat generating element to absorb heat, and the heat conduction member 1 in the embodiment can further be provided with a heat conduction sheet 14 and a heat dissipation fin 15. The number and arrangement position of the heat conduction sheet 14 can be designed and adjusted as needed, for example: Figure 1 As shown, two heat conduction sheets 14 are arranged oppositely, and one heat dissipation fin 15 is arranged for each heat conduction sheet 14, so that heat dissipation can be performed through the heat conduction sheet 14 and the heat dissipation fin 15 at any time to ensure the basic heat dissipation of the heat dissipation device, and even if the driving assembly 2 is not started, a certain heat dissipation effect can be ensured.
[0052] The driving assembly 2 can provide driving force, which can introduce the fluid in the flow channel 11 after absorbing heat into the first space 23 for cooling and then introduce the cooled fluid back into the flow channel 11. The driving assembly 2 in the embodiment can have a housing 25, which is a rigid structure. The shape and size are not limited as long as the housing 25 can provide mounting space for the partition plate 3 and the refrigeration module 4. Of course, it can be understood that the second inlet 21 and the second outlet 22 can be arranged on the housing 25.
[0053] The partition plate 3 can be a rigid plate structure, which can be a flat plate or a special-shaped plate, etc. For example, refer to the drawings Figure 2 and the drawings Figure 3The partition plate 3 is a flat plate structure, which can be arranged at the middle of the height direction of the shell 25, and the side wall in the circumferential direction of the partition plate 3 is connected with the inner wall of the shell 25 to separate the first space 23 above and the second space 24 below; the second inlet 21 is communicated with the first space 23, and can be directly opened on the shell 25 corresponding to the first space 23; the second outlet 22 is communicated with the second space 24, and can be directly opened on the shell 25 corresponding to the second space 24; the fluid direction formed by the second inlet 21 and the second outlet 22 can be parallel or non-parallel, for example, referring to the accompanying drawings Figure 1 The second inlet 21 and the second outlet 22 are parallel or opposite, and the fluid flow direction is parallel and opposite. In the embodiment, a through hole 31 can be formed on the partition plate 3 to communicate the first space 23 and the second space 24, and form a flow guide channel between the first space 23 and the second space 24; the shape, size and position of the through hole 31 are not limited, and can be designed and adjusted according to actual needs.
[0054] The refrigeration module 4 has a refrigeration function, which can be a semiconductor refrigeration module, a fan or the like, and can cool the fluid with high temperature entering the first space 23. The refrigeration module 4 can be arranged in the first space 23 or outside the first space 23, as long as the refrigeration part or surface can act on the first space 23.
[0055] According to the above, the refrigeration module 4 in the driving assembly 2 can complete the refrigeration and cooling of the fluid inside the driving assembly 2, without a long fluid cooling path, so that the heat dissipation device can be placed inside the electronic equipment for heat dissipation, without external water cooling circulation pipe and pump structure, greatly reducing the required space and heat dissipation cost; the partition plate 3 separates the fluid entering the first space 23 after cooling into the second space 24 and flows out, and can flow along the path, that is, the relatively hot fluid in the first space does not have too much temperature influence on the relatively cold fluid in the second space, improving the heat dissipation efficiency.
[0056] The term "and / or" in this paper is only to describe the association relationship of the associated objects, which means that there can be three relationships, for example, A and / or B, which can be understood as: A and B can exist at the same time, A can exist alone, B can exist alone, and any one of the above three cases can exist.
[0057] Further, the heat dissipation device provided by the embodiment, in one embodiment, the refrigeration module 4 comprises a refrigeration plate 41; the refrigeration plate 41 comprises opposite refrigeration surfaces and heat dissipation surfaces, the refrigeration surfaces face the containing space, and the heat dissipation surfaces face away from the first space 23; wherein, when the refrigeration plate 41 is powered, the refrigeration surfaces refrigerate, and the heat dissipation surfaces dissipate heat.
[0058] It can be understood that, in order to realize automatic heat absorption and heat dissipation of the refrigeration module 4, the refrigeration module 4 is arranged in the form of comprising the refrigeration plate 41 in the embodiment, the refrigeration plate 41 is a semiconductor refrigeration structure (TEC, Thermo Electric Cooler), N-type semiconductor ions and P-type semiconductor ions are arranged alternately and are connected in series with each other to form an electrically conductive component, and one heat conduction plate is arranged at each end of the electrically conductive component, when the electrically conductive component is powered with direct current, the two heat conduction plates form refrigeration surfaces and heat dissipation surfaces respectively, the refrigeration surfaces can transmit the heat absorbed to the heat dissipation surfaces to dissipate heat; the refrigeration surfaces are arranged in the first space 23 or are attached to the outer wall of the first space 23 to cool the fluid in the first space 23, and the heat dissipation surfaces face outward to dissipate heat outward.
[0059] Further, referring to the accompanying drawings, Figure 2 and the accompanying drawings, Figure 7 the heat dissipation device provided by the embodiment, in one embodiment, the refrigeration module 4 further comprises a heat dissipation piece 42; the heat dissipation piece 42 is arranged in the first space 23, and the heat dissipation piece 42 can transmit the temperature of the refrigeration surface to the first space 23.
[0060] It can be understood that, in order to improve the heat absorption rate of the refrigeration surface, the heat dissipation piece 42 is arranged in the embodiment, the heat dissipation piece 42 can have good thermal conductivity, for example, copper material or aluminum material; the heat dissipation piece 42 is arranged in the first space 23 and is attached to the refrigeration surface to increase the refrigeration area of the refrigeration surface; the heat dissipation piece 42 can be a plate structure, a block structure, a grid structure or the like. In the embodiment, the heat dissipation piece 42 can be arranged in the form of covering at least the through hole 31 in the first direction, that is, perpendicular to the normal projection of the partition plate 3, so that the fluid entering the first space 23 will contact the heat dissipation piece 42 before flowing into the through hole 31, thereby improving the cooling degree of the fluid in the first space 23. It can be understood that the heat dissipation piece 42 is spaced from the partition plate 3.
[0061] Further, the heat dissipation device provided by the embodiment, in one embodiment, further comprises a temperature sensor (not shown in the drawings); the temperature sensor is arranged on the heat conduction piece 1 and / or the second inlet 21, and the temperature sensor is used to detect a temperature signal to form a starting signal of the refrigeration module 4.
[0062] It can be understood that, in order to realize the automatic starting of the heat dissipation device and improve the heat dissipation efficiency, a temperature sensor can be arranged in the embodiment, which can be automatically controlled by the CPU on the mainboard together with the refrigeration module 4, or a controller of the heat dissipation device can be separately arranged. When the temperature detected by the temperature sensor exceeds a threshold value, the controller controls the refrigeration module 4 and the driving part 5 to start, and the fluid in the flow channel 11 is cooled and cooled. The above threshold value can be designed and adjusted according to actual needs, and will not be described here. The temperature sensor can be arranged on the heat conduction piece 1, or arranged at the second inlet 21, or arranged on the heat conduction piece 1 and the second inlet 21. The temperature sensor arranged on the heat conduction piece 1 can detect the temperature of the heat conduction piece 1, and the temperature sensor arranged at the second inlet 21 can detect the temperature of the fluid in the flow channel 11.
[0063] Further, with reference to the accompanying Figure 2 and accompanying Figure 5 , in one embodiment, the driving assembly 2 includes a driving part 5; the driving part 5 is rotationally arranged in the second space 24, and the driving part 5 rotates to provide power to make the cooled fluid enter the second space 24 from the flow channel and flow out from the second outlet 22.
[0064] Among them, the second space 24 can guide the cooled fluid around the axis of the driving part 5.
[0065] It can be understood that, in order to realize the flow guiding for the fluid entering the first space 23, the driving part 5 can be arranged in the second space 24 in the embodiment, which can quickly introduce the fluid in the first space 23 into the second space 24 by rotating, and also can guide the fluid in the second space 24 to the second outlet 22 by rotating. With reference to the accompanying Figure 7The driving part 5 can include a circuit board 51, a stator ring 52, a rotor 53 and a rotor baffle 54. The circuit board 51 is electrically connected with the stator ring 52. The rotor 53 is coaxially arranged with the stator ring 52 through a rotating shaft 55. A plurality of blades 56 are distributed on the side of the rotor 53 away from the circuit board 51 and spaced apart around the axis of the rotor 53. The blades 56 are arranged along the axial direction of the rotor 53. When the circuit board 51 supplies electricity to the stator ring 52, the stator ring 52 generates a magnetic field. The permanent magnet on the rotor 53 rotates around the rotating shaft 55 under the action of the magnetic field. The blades 56 drive the fluid entering the second space 54 during the rotation of the rotor 53. The fluid in the first space 53 can be not only attracted but also driven to flow out of the second outlet 22. It can be understood that the rotation direction of the driving part 5 can be designed according to the position of the second outlet 22. For example, the driving part rotates towards the second outlet 22, thereby driving a large amount of cooled fluid to flow out of the second outlet 22. At the same time, the inner wall of the second space 24 can be used to guide the fluid in the embodiment, so that the fluid can quickly and smoothly move to the second outlet 22.
[0066] Further, with reference to the accompanying drawings Figure 6 In an embodiment, the second space 24 is provided with a spiral flow channel 26 around the driving part 5 in the axial direction. The spiral flow channel 26 is in communication with the second outlet 22.
[0067] It can be understood that, in order to realize the fluid guiding of the second space 24, the spiral flow channel 26 is arranged in the second space 24 in the embodiment, so that the driving part 5 can cooperate with the spiral flow channel 26 to quickly and smoothly move the fluid to the second outlet 22 when the driving part 5 rotates. For example, with reference to the accompanying drawings Figure 6The inner wall of the second space 24 in the embodiment can be circular; an arc-shaped flow guide plate 6 can be arranged in the second space 24, and the arc-shaped flow guide plate 6 is a rigid structure and can be integrally formed with the shell 25 or can be subsequently welded or bonded. One end of the arc-shaped flow guide plate 6 is tangent to the driving part 5 but maintains a certain interval with the driving part 5 to form an entrance or passage with a small size, and the other end of the arc-shaped flow guide plate 6 extends around the axial direction of the driving part 5 and is connected to the inner wall of the second space 24 to form a passage with an increased size, and the arc-shaped flow guide plate 6 cooperates with the inner wall of the second space 24 to enclose the spiral flow channel 26; in the embodiment, the end of the arc-shaped flow guide plate 6 tangent to the driving part 5 can be adjacent to the second outlet 22, so that the movement path of the fluid in the spiral passage 26 is approximately one turn, and the potential energy of the fluid flowing out of the second outlet 22 is large. Correspondingly, the side of the end of the arc-shaped flow guide plate 6 tangent to the driving part 5 towards the second outlet 22 is provided with an arc-shaped flow surface 61 opposite to the spiral flow channel 26, which improves the smoothness of the fluid entering the second outlet 22, buffers the impact force of the fluid on the arc-shaped flow guide plate 6, and improves the overall strength and service life of the arc-shaped flow guide plate 6 and the driving assembly 2.
[0068] Further, the heat dissipation device provided in the embodiment has different directions of the second inlet 21 and the second outlet 22 in one embodiment.
[0069] It can be understood that, in order to improve the cooling effect of the fluid, the second inlet 21 and the second outlet 22 can be arranged in different directions in the embodiment, the second inlet 21 flows through the fluid that absorbs the heat of the heating element, and the second outlet 22 flows through the fluid cooled by the refrigeration module 4, so that the mutual influence of the two can be avoided, thereby ensuring the cooling degree of the fluid flowing out of the second outlet 22 and improving the heat dissipation efficiency of the fluid entering the heat conduction piece 1. Of course, in order to reduce the volume of the heat dissipation device and simplify the preparation process of the shell 25, the second inlet 21 and the second outlet 22 can also be arranged in parallel and adjacent to each other in the embodiment, so that the hole opening process on the shell 25 is relatively simple. In this arrangement, the movement path of the fluid entering the second space 24 in the second space 24 is long, which can generate a large potential energy and flow rate, and the speed of the fluid flowing out of the second outlet 22 is large, which can quickly enter the first inlet to replace the fluid in the heat conduction piece 1 that absorbs the heat of the heating element, thereby improving the heat dissipation efficiency. When the second inlet 21 and the second outlet 22 are arranged adjacent to each other on the cavity wall of the second space 24, a limiting frame 62 can be arranged in the second space 24 corresponding to the position of the second inlet 21 in the embodiment, and the limiting frame 62 can be arranged on the arc-shaped flow guide plate 6 synchronously, such as Figure 5The limiting frame 62 is arranged around the second inlet 21, and the two ends of the limiting frame 62 along the height direction of the shell 25 abut against the inner wall of the second space 24 and the side surface of the partition plate 3 facing the second space 24 respectively, so as to separate a third space in the second space 24. Figure 4 As shown in the figure, the partition plate 3 is provided with a second through hole 32 at the position corresponding to the third space, so as to communicate the third space and the first space 23, thereby realizing that the fluid entering through the second inlet 21 passes through the third space, the second through hole 32 and enters the first space 23, contacts the refrigeration module 4 in the first space 23 and is cooled, then passes through the through hole 31 and enters the second space 24, and flows out to the heat conduction member 1 through the second outlet 22 under the action of the driving part 5.
[0070] The electronic device provided in the embodiment includes a heat generating element (not shown in the figure) and a heat dissipation device, the heat dissipation device is arranged inside the electronic device, and the heat dissipation device includes a heat conduction member 1 and a driving assembly 2.
[0071] The heat conduction member 1 is provided with a flow channel 11, a first inlet 12 and a first outlet 13 which are in communication with the flow channel 11, and the heat conduction member 1 is used for absorbing the heat of the heat generating element; the driving assembly 2 has an accommodating space, and the driving assembly 2 is provided with a second inlet 21 and a second outlet 22 which are in communication with the accommodating space, the second inlet 21 is in communication with the first outlet 13, and the second outlet 22 is in communication with the first inlet 12; the accommodating space is provided with a partition plate 3, the partition plate 3 separates the accommodating space into a first space 23 and a second space 24 in the accommodating space, the second inlet 21 is in communication with the first space 23, and the second outlet 22 is in communication with the second space 24; the driving assembly 2 further includes a refrigeration module 4, the refrigeration module 4 is arranged corresponding to the first space 23, so that the fluid entering through the second inlet 21 can be cooled in the first space 23; wherein a flow guide channel is formed between the first space 23 and the second space 24, so as to guide the cooled fluid into the second space 24 and flow out through the second outlet 22.
[0072] It can be understood that the electronic device provided by the embodiment can be but is not limited to a mobile phone, a tablet computer, a notebook computer, a display, and the like. The heat generating element can be but is not limited to a CPU, a GPU, and the like. The heat dissipation device in the embodiment is the heat dissipation device described in Embodiment 1, and the specific structure and working principle thereof are referred to the detailed description of Embodiment 1, which will not be described in detail here. In the embodiment, the heat dissipation device is in the inside of the electronic device, the flow channel 11 is arranged in the heat conducting member 1, and the circulation flow of the cooling fluid in the flow channel 11 is realized by cooperating with the driving assembly 2 with the refrigeration module 4. The refrigeration module 4 in the driving assembly 2 can complete the refrigeration cooling of the fluid in the inside of the driving assembly 2, without a long fluid cooling path, and the required space is small, so that the heat dissipation device can be in the inside of the electronic device for heat dissipation, without an external water cooling circulation pipe and a pump structure, greatly reducing the required space and the heat dissipation cost. The separation effect of the partition plate 3 makes the fluid entering the first space 23 flow into the second space 24 after being cooled and then flow out, and can flow according to the path, that is, the relatively hot fluid in the first space will not cause too much temperature influence on the relatively cold fluid in the second space, improving the heat dissipation efficiency.
[0073] The above is only a specific embodiment of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of changes or replacements within the technical range disclosed by the present application, which should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.
Claims
1. A heat dissipating device, characterized by, It includes: A heat conduction member, which is provided with a flow channel, and is provided with a first inlet and a first outlet connected with the flow channel, and is used to absorb heat of a heat generating element of an electronic device; A driving assembly, which is provided with a containing space, and is provided with a second inlet and a second outlet connected with the containing space, the second inlet is connected with the first outlet, and the second outlet is connected with the first inlet; The containing space is provided with a partition plate, which divides the containing space into a first space and a second space, the second inlet is connected with the first space, and the second outlet is connected with the second space; The driving assembly further includes a refrigeration module, which is arranged corresponding to the first space, so that the fluid flowing through the second inlet can be cooled in the first space; Wherein, a flow guide channel is formed between the first space and the second space, so as to guide the cooled fluid into the second space and flow out through the second outlet.
2. The heat dissipation device according to claim 1, wherein: The refrigeration module includes a refrigeration plate; The refrigeration plate includes opposite refrigeration surface and heat dissipation surface, the refrigeration surface faces the containing space, and the heat dissipation surface faces away from the first space; Wherein, when the refrigeration plate is powered on, the refrigeration surface refrigerates, and the heat dissipation surface dissipates heat.
3. The heat dissipation device according to claim 2, wherein: The refrigeration module further includes a heat dissipation member; The heat dissipation member is arranged in the first space, and the heat dissipation member can transfer the temperature of the refrigeration surface to the first space.
4. The heat dissipation device according to claim 1, further comprising a temperature sensor; The temperature sensor is arranged on the heat conduction member and / or the second inlet, and is used to detect temperature signal to form start signal of the refrigeration module.
5. The heat dissipation device according to claim 1, wherein: The driving assembly includes a driving part; The driving part is rotationally arranged in the second space, and rotates to provide power to make the cooled fluid enter the second space through the flow guide channel and flow out through the second outlet; Wherein, the second space can guide the cooled fluid around the axis of the driving part.
6. The heat dissipation device according to claim 5, wherein: The second space is provided with a spiral flow channel around the axis of the driving part, and the spiral flow channel is connected with the second outlet.
7. The heat dissipation device according to claim 6, wherein: The inner wall of the second space is circular; The second space is provided with an arc-shaped flow guide plate, one end of the arc-shaped flow guide plate is tangent to the driving part, the other end of the arc-shaped flow guide plate extends around the axis of the driving part and is connected to the inner wall of the second space, and the arc-shaped flow guide plate cooperates with the inner wall of the second space to form the spiral flow channel.
8. The heat dissipation device according to claim 1, wherein: The second inlet and the second outlet are different in direction. 9. The heat dissipation device according to claim 3, characterized in that: a through hole is provided on the partition plate to connect the first space and the second space; a normal projection of the heat dissipation member along a first direction at least completely covers the through hole; wherein the first direction is a direction in which the first space points to the second space.
10. An electronic device, comprising: It comprises: a heat generating element; a heat dissipation device arranged inside the electronic device, the heat dissipation device comprising a heat conducting member and a driving assembly; a flow channel is provided in the heat conducting member, a first inlet and a first outlet are provided on the heat conducting member and are connected to the flow channel, the heat conducting member is used to absorb heat of the heat generating element; the driving assembly has a containing space, a second inlet and a second outlet are provided on the driving assembly and are connected to the containing space, the second inlet is connected to the first outlet, and the second outlet is connected to the first inlet; a partition plate is provided in the containing space, the partition plate divides the containing space into a first space and a second space, the second inlet is connected to the first space, and the second outlet is connected to the second space; the driving assembly further comprises a refrigeration module, the refrigeration module is arranged corresponding to the first space, so that the fluid entering through the second inlet can be cooled in the first space; wherein a flow guide channel is formed between the first space and the second space to guide the cooled fluid into the second space and out through the second outlet.