Electronic device and vehicle

Abstract

The utility model discloses an electronic device and a vehicle, and relates to the technical field of electronic devices. According to the electronic device, the reliability of the piezoelectric assembly can be improved, and the drawing force borne by the wire connected with the piezoelectric assembly can be reduced. The electronic device comprises a shell, a piezoelectric assembly and a circuit board. Wherein the shell is provided with an accommodating cavity; the piezoelectric assembly is arranged in the containing cavity, and under the condition that voltage is applied to the piezoelectric assembly, the piezoelectric assembly can deform to generate vibration; the circuit board is arranged on the shell and electrically connected with the piezoelectric assembly.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic devices, in particular to an electronic device and a vehicle. BACKGROUND

[0002] Piezoelectric ceramics is a kind of information functional ceramic material capable of converting mechanical energy and electrical energy based on piezoelectric effect. Piezoelectric ceramics has dielectricity and elasticity, and can deform under the action of voltage, so that piezoelectric ceramics can be used as a driving element. Piezoelectric ceramics is brittle and easy to break when it is hit during use. CONTENT OF THE INVENTION

[0003] One embodiment of the present application provides an electronic device, wherein the electronic device comprises a shell, a piezoelectric assembly and a circuit board, the shell has a receiving cavity, the piezoelectric assembly is arranged in the receiving cavity, and the circuit board is arranged on the shell and electrically connected with the piezoelectric assembly. The electronic device can improve the reliability of the piezoelectric assembly and reduce the pulling force on the wire connected with the piezoelectric assembly.

[0004] Another embodiment of the present application provides an electronic device, wherein the piezoelectric assembly is arranged in the second cavity and the circuit board is arranged in the first cavity, so that a certain gap is formed between the piezoelectric assembly and the circuit board, which is beneficial to reduce the mutual influence between the piezoelectric assembly and the circuit board.

[0005] Another embodiment of the present application provides an electronic device, wherein the second cavity in which the piezoelectric assembly is arranged is in communication with the opening of the shell, which is beneficial to reduce the influence of the sealed cavity on the sound production performance of the piezoelectric assembly and facilitate the connection of the piezoelectric assembly with a target device through the opening of the shell, so that the piezoelectric assembly connected with the target device can be shielded and covered by the shell, which is beneficial to reduce the risk of collision of the piezoelectric assembly.

[0006] Another embodiment of the present application provides an electronic device, wherein the first cavity and the second cavity are in communication, which facilitates the arrangement of the circuit board and the piezoelectric assembly in the shell in sequence. In addition, the first cavity is filled with a sealing member, which can not only fix the circuit board in the first cavity but also seal the circuit board, so as to realize the waterproof and dustproof of the circuit board, which is beneficial to reduce the influence of the external environment on the circuit board and improve the reliability of the circuit board.

[0007] Another embodiment of the present application provides an electronic device, wherein a gap between the piezoelectric assembly and the seal and / or the circuit board is set to be greater than or equal to the vibration amplitude of the piezoelectric assembly, so that the risk of interference between the piezoelectric assembly and the seal and / or the circuit board can be reduced when the piezoelectric assembly vibrates, and the stability of the piezoelectric assembly can be improved.

[0008] Another embodiment of the present application provides an electronic device, wherein the piezoelectric component is fixed to the second cavity wall by the substrate, and the normal projection of the piezoelectric component on the substrate does not overlap the bonding area of the substrate and the second cavity wall, so that the influence of the bonding area on the vibration amplitude of the piezoelectric assembly can be reduced when the piezoelectric component vibrates and drives the substrate to vibrate.

[0009] Another embodiment of the present application provides an electronic device, wherein the second bonding component is arranged on the side of the substrate away from the accommodating cavity, so that the electronic device can be bonded to a target device by the second bonding component, and at least part of the second bonding component is arranged outside the accommodating cavity, so that a gap can be formed between the shell and the target device after the second bonding component is bonded to the target device, and the influence of the shell on the vibration of the piezoelectric assembly can be reduced when the piezoelectric assembly vibrates.

[0010] Another embodiment of the present application provides an electronic device, wherein the normal projection of the second bonding component on the substrate does not overlap the normal projection of the piezoelectric component on the substrate, so that the influence of the bonding area on the vibration amplitude of the piezoelectric assembly can be reduced when the piezoelectric component vibrates and drives the substrate to vibrate.

[0011] Another embodiment of the present application provides an electronic device, wherein the cover is arranged in the electronic device, so that the opening of the shell can be shielded by the cover, and the piezoelectric assembly can be shielded and protected, and the risk of the piezoelectric assembly being bumped can be reduced.

[0012] Another embodiment of the present application provides an electronic device, wherein the accommodating cavity can be formed as a sealed cavity when the cover is sealingly connected to the shell, so that the piezoelectric assembly and the circuit board can be in a sealed environment, and the influence of dust, water, etc. on the piezoelectric assembly and the circuit board can be reduced.

[0013] Another embodiment of the present application provides an electronic device, wherein the substrate of the piezoelectric assembly is connected to the cover, and the cover can be connected to a target device, so that the vibration generated by the piezoelectric assembly can be transmitted to the target device through the cover.

[0014] Another embodiment of the present application provides an electronic device, wherein the substrate and the cover are bonded by a third bonding member, and a projection of the third bonding member on the substrate does not overlap a projection of the piezoelectric member on the substrate, so as to not only facilitate the connection of the piezoelectric assembly and the cover, but also reduce the influence of the bonding area on the vibration amplitude of the piezoelectric assembly.

[0015] Another embodiment of the present application provides an electronic device, wherein the fourth bonding member is arranged on the cover, so as to facilitate the bonding of the electronic device on a target device by the fourth bonding member. Moreover, a projection of the fourth bonding member on the substrate does not overlap a projection of the piezoelectric member on the substrate, so as to facilitate the reduction of the influence of the bonding area on the vibration amplitude of the piezoelectric assembly.

[0016] To achieve one or more of the above objects, the first aspect of the embodiments of the present application provides an electronic device, which comprises a shell, a piezoelectric assembly and a circuit board. The shell has a receiving cavity. The piezoelectric assembly is arranged in the receiving cavity and can be deformed to generate vibration when a voltage is applied to the piezoelectric assembly. The circuit board is arranged in the shell and electrically connected to the piezoelectric assembly.

[0017] The electronic device provided by the present application has the receiving cavity arranged in the shell, so that the piezoelectric assembly can be arranged in the receiving cavity to be shielded and protected by the shell, thereby reducing the risk of the piezoelectric assembly being damaged or broken and improving the reliability of the piezoelectric assembly. Moreover, the circuit board is arranged in the electronic device, so that the external connecting wire electrically connected to the target device can be electrically connected to the circuit board, for example, the external connecting wire and the circuit board are firmly connected by welding. The circuit board is arranged in the shell, so that the connection point between the external connecting wire and the circuit board and the external connecting wire and the circuit board can withstand a large pulling force. Compared with the external connecting wire being directly electrically connected to the piezoelectric assembly, the piezoelectric assembly can be electrically connected to the circuit board by other wires, so as to reduce or even block the transmission of the pulling force borne by the external connecting wire to the piezoelectric assembly through the circuit board. Therefore, the electronic device provided by the embodiments of the present application can improve the reliability of the piezoelectric assembly and reduce the pulling force borne by the wire connected to the piezoelectric assembly.

[0018] The second aspect of the embodiments of the present application provides a vehicle, which comprises a vehicle body and the electronic device provided by any one of the embodiments. The vehicle body comprises a plurality of vehicle body panels, a plurality of interior trim parts and a vehicle assembly connected to the vehicle body panels and / or the interior trim parts. The electronic device is arranged on at least one of the vehicle body panels, the interior trim parts and the vehicle assembly. BRIEF DESCRIPTION OF DRAWINGS

[0019] Various other advantages and benefits will become apparent to those of ordinary skill in the art, upon reading the following detailed description of the preferred embodiments. The accompanying drawings are included to provide a description of the preferred embodiments, and are not meant to limit the scope of the present application. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views. In the drawings:

[0020] Figure 1 Structure diagram of electronic device provided by the embodiment of the present application Figure 1 ;

[0021] Figure 2 Exploded structure diagram of electronic device provided by the embodiment of the present application Figure 1 ;

[0022] Figure 3 Structure diagram of part of electronic device provided by the embodiment of the present application

[0023] Figure 4 Structure diagram of shell in electronic device provided by the embodiment of the present application

[0024] Figure 5 Structure diagram of piezoelectric assembly and circuit board in electronic device provided by the embodiment of the present application

[0025] Figure 6 Structure diagram of electronic device provided by the embodiment of the present application Figure 2 ;

[0026] Figure 7 Exploded structure diagram of electronic device provided by the embodiment of the present application Figure 2 .

[0027] Explanation of reference numerals:

[0028] 1 - shell; 11 - accommodating cavity; 12 - first cavity wall; 13 - second cavity wall; 14 - limiting protrusion; 15 - threading hole; 2 - piezoelectric assembly; 21 - base plate; 22 - piezoelectric element; 3 - circuit board; 31 - limiting groove; 4 - sealing member; 51 - first adhesive member; 52 - second adhesive member; 53 - third adhesive member; 54 - fourth adhesive member; 6 - cover body; 7 - connecting assembly; 71 - external connecting lead wire; 72 - connector; 8 - warning member; Z - stacking direction. DETAILED DESCRIPTION

[0029] The embodiments of the technical solution of the present application will be described in detail below with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application, and therefore only serve as examples, and cannot limit the protection scope of the present application.

[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this application; the use of the terms "including," "comprising," or "having" and variations thereof herein is intended to be broad and encompass the terms "consisting of" and "consisting essentially of" and variations thereof. Unless otherwise noted, the terms "including" and "comprising" are open-ended and do not exclude the presence of unrecited elements or limitations.

[0031] In the description of the embodiments of the present application, the technical terms "first", "second", "third" and the like are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "a plurality of" is two or more, unless otherwise explicitly and specifically limited.

[0032] Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are they necessarily mutually exclusive or alternative embodiments. It is explicitly and implicitly understood that the embodiments described herein can be combined with other embodiments.

[0033] In the description of the embodiments of the present application, the term "and / or" is only a description of the association relationship of the associated objects, which means that there can be three relationships, for example, A and / or B, which can represent the three cases of A alone, A and B together, and B alone. In addition, the character " / " in this paper generally represents that the front and rear associated objects are "or" relationship.

[0034] In the description of the embodiments of the present application, the technical terms "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the embodiments of the present application and simplifying the description, and are not intended to indicate or imply that the indicated device or element must have a particular orientation, be constructed in a particular orientation, be operated or used, and therefore cannot be understood as a limitation on the embodiments of the present application.

[0035] In the description of the embodiments of the present application, unless specifically defined and limited otherwise, the technical terms "mounting", "connecting", "connecting", "fixing" and other terms should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0036] In the description of the embodiments of the present application, unless specifically defined and limited otherwise, the technical term "contact" should be understood in a broad sense, which can be direct contact or contact through an intermediate medium layer, which can be contact between two contacting objects without interaction force, or contact between two contacting objects with interaction force.

[0037] The piezoelectric effect includes the direct piezoelectric effect and the inverse piezoelectric effect. When some dielectrics are deformed by external force in a certain direction, polarization phenomenon occurs inside, and positive and negative charges appear on its two opposite surfaces. When the external force is removed, it returns to the uncharged state. This phenomenon is called direct piezoelectric effect. When the direction of the force changes, the polarity of the charge also changes. Conversely, when an electric field is applied in the polarization direction of the dielectric, the dielectric will also deform, and the deformation of the dielectric will disappear after the electric field is removed. This phenomenon is called inverse piezoelectric effect.

[0038] Piezoelectric ceramics are a kind of functional ceramic materials capable of converting mechanical energy and electrical energy based on piezoelectric effect. Piezoelectric ceramics have the common properties of ceramics, that is, piezoelectric ceramics are brittle and easy to break after being knocked, which will affect the use of piezoelectric ceramics and the reliability of devices using piezoelectric ceramics. In order to facilitate the application of voltage to piezoelectric ceramics, a wire is connected to each of the two poles of the piezoelectric ceramics, and the other end of the wire is electrically connected to a controller. In the process of installing and using piezoelectric ceramics, the wire electrically connected to the piezoelectric ceramics is easily pulled, so that the connection point between the wire and the piezoelectric ceramics is subjected to a large pulling force, thereby affecting the reliability of the electrical connection between the wire and the piezoelectric ceramics.

[0039] The embodiments of the present application provide an electronic device, referring to Figure 1 , Figure 2 , Figure 3 and Figure 4 , Figure 1 The structure of the electronic device provided by the embodiments of the present application is shown in Figure 1 , Figure 2 The exploded structure of the electronic device provided by the embodiments of the present application is shown in Figure 1 , Figure 3Part structure schematic diagram of an electronic device provided in an embodiment of the present application, Figure 4 Structure schematic diagram of a shell in an electronic device provided in an embodiment of the present application. The electronic device provided in the embodiment of the present application can improve the reliability of a piezoelectric component 2 and reduce the pulling force on a wire connected to the piezoelectric component 2. The electronic device comprises a shell 1, a piezoelectric component 2 and a circuit board 3. The shell 1 has a receiving cavity 11. The piezoelectric component 2 is arranged in the receiving cavity 11. The piezoelectric component 2 can deform to generate vibration when a voltage is applied to the piezoelectric component 2. The circuit board 3 is arranged in the shell 1 and electrically connected to the piezoelectric component 2.

[0040] In the embodiment of the present application, the shell 1 is used to provide mounting points and protection for other components in the electronic device. The shell 1 can be arranged as a box-shaped structure with a groove, and the groove in the shell 1 is used as the receiving cavity 11. For example, the shell 1 can be arranged as a box-shaped structure approximately in the shape of a cuboid, and the receiving cavity 11 in the shell 1 is arranged as a cavity approximately in the shape of a cuboid.

[0041] In the embodiment of the present application, the piezoelectric component 2 can be fixedly arranged in the receiving cavity 11. The piezoelectric component 2 can be mounted in the receiving cavity 11 by means of adhesion, compression and fixation, etc. The piezoelectric component 2 can be made based on the inverse piezoelectric effect. That is, the piezoelectric component 2 can deform when a voltage is applied to the piezoelectric component 2, and the piezoelectric component 2 can generate vibration by controlling the frequency and size of the applied voltage, etc.

[0042] In the embodiment of the present application, the circuit board 3 can be arranged in the electronic device. The circuit board 3 can be fixed in the receiving cavity 11 of the shell 1 or outside the shell 1. The piezoelectric component 2 and the circuit board 3 can be electrically connected by wires, that is, at least two wires are arranged between the piezoelectric component 2 and the circuit board 3, and two electrodes of a piezoelectric element 22 in the piezoelectric component 2 are electrically connected to the circuit board 3 by the two wires.

[0043] The electronic device provided in the embodiments of the present application can reduce the risk of damage or breakage of the piezoelectric assembly 2, and improve the reliability of the piezoelectric assembly 2. In addition, the electronic device is provided with the circuit board 3, and the external connecting wire electrically connected to the target device can be electrically connected to the circuit board 3, for example, the external connecting wire and the circuit board 3 are firmly connected by welding. The circuit board 3 is arranged in the shell 1, so that the connection point between the external connecting wire and the circuit board 3, the external connecting wire and the circuit board 3 can withstand a large pulling force. Compared with directly electrically connecting the external connecting wire to the piezoelectric assembly 2, the piezoelectric assembly 2 can be electrically connected to the circuit board 3 by other wires, which can reduce or even block the pulling force borne by the external connecting wire from being transmitted to the piezoelectric assembly 2. Therefore, the electronic device provided in the embodiments of the present application can improve the reliability of the piezoelectric assembly 2, and reduce the pulling force borne by the wire connected to the piezoelectric assembly 2.

[0044] In some possible embodiments of the present application, as shown in Figure 1 , Figure 2 and Figure 3 , the accommodating cavity 11 in the shell 1 includes adjacent first and second chambers, the first chamber is located in the region of the shell 1 away from the opening of the shell 1, and the second chamber is in communication with the opening; the piezoelectric assembly 2 is arranged in the second chamber, and the circuit board 3 is arranged in the first chamber.

[0045] In the embodiments of the present application, the size and shape of the corresponding accommodating cavity 11 can be set according to the size and shape of the circuit board 3 and the piezoelectric assembly 2. For example, the size of the second chamber provided with the piezoelectric assembly 2 can be greater than the size of the first chamber provided with the circuit board 3.

[0046] In some embodiments, the accommodating cavity 11 can be arranged as two parts of the adjacent first and second chambers.

[0047] For example, the region of the shell 1 away from the opening of the shell 1 can be used as the first chamber, and the size of the first chamber can be set according to the size of the circuit board 3, so that the circuit board 3 can be arranged inside the first chamber. The region of the shell 1 close to the opening of the shell 1 can be used as the second chamber, and the shape and size of the second chamber can be set according to the shape and size of the piezoelectric assembly 2, so that the piezoelectric assembly 2 can be arranged in the second chamber. In some embodiments, the first and second chambers can be two regions in communication. In other embodiments, the first and second chambers can also be two independent regions separated by a partition plate, and a wire passing hole for passing wires can be arranged on the partition plate between the first and second chambers.

[0048] In the above embodiment, since the accommodating cavity 11 is arranged as the adjacent first chamber and second chamber, the circuit board 3 can be arranged in the first chamber, and the piezoelectric assembly 2 can be arranged in the second chamber, so that a certain gap is formed between the piezoelectric assembly 2 and the circuit board 3, which is beneficial to reduce the mutual influence between the piezoelectric assembly 2 and the circuit board 3. In addition, the second chamber is in communication with the opening of the shell 1, which is beneficial to reduce the influence of the sealed chamber on the sound generation performance of the piezoelectric assembly 2, and the piezoelectric assembly 2 can be connected to the target device through the opening of the shell 1, so that the electronic device can be installed on the target device, and the piezoelectric assembly 2 connected to the target device can be shielded and covered by the shell 1, which is beneficial to reduce the risk of the piezoelectric assembly 2 being collided.

[0049] In some possible embodiments of the present application, as shown in Figure 3 and Figure 4 , one of the first cavity wall 12 of the first chamber and the circuit board 3 is provided with a limiting protrusion 14, and the other is provided with a limiting groove 31 matched with the limiting protrusion 14, and the limiting protrusion 14 is matched with the limiting groove 31 to limit the position of the circuit board 3 in the first chamber.

[0050] In the embodiments of the present application, a structure for limiting the movement of the circuit board 3 can be arranged on the cavity wall of the first chamber of the shell 1, so that the circuit board 3 can be placed in a determined position relative to the shell 1 after being placed in the first chamber.

[0051] For example, as shown in Figure 4 , the limiting protrusion 14 can be arranged on the first cavity wall 12 of the first chamber, and correspondingly, the limiting groove 31 matched with the limiting protrusion 14 can be arranged on the circuit board 3. The first cavity wall 12 can be a bottom wall surrounding the first chamber, or can be a side wall surrounding the first chamber. Alternatively, the limiting groove 31 can be arranged on the first cavity wall 12 of the first chamber, and correspondingly, the limiting protrusion 14 matched with the limiting groove 31 can be arranged on the circuit board 3. The embodiments of the present application do not limit the arrangement position of the limiting protrusion 14 and the limiting groove 31.

[0052] In the above embodiment, since the limiting protrusion 14 and the limiting groove 31 matched with each other are arranged on the first cavity wall 12 and the circuit board 3 respectively, the position of the circuit board 3 in the first chamber can be limited by the cooperation of the limiting protrusion 14 and the limiting groove 31, which is beneficial to reduce the displacement of the circuit board 3 when the sealing member 4 is filled into the first chamber. In addition, the sealing member 4 can enter the gap between the limiting protrusion 14 and the limiting groove 31, which is beneficial to increase the contact area between the circuit board 3 and the sealing member 4, so as to improve the reliability of fixing and protecting the circuit board 3.

[0053] In some possible embodiments of the present application, as shown inFigure 3 and Figure 4 As shown in the figure, the first chamber and the second chamber are communicated along the stacking direction Z of the piezoelectric assembly 2 and the circuit board 3; the electronic device further comprises a sealing member 4 filled in the first chamber and covering at least part of the circuit board 3 to fix the circuit board 3 in the first chamber, and the piezoelectric assembly 2 has a gap between the sealing member 4 and / or the circuit board 3 along the stacking direction Z of the piezoelectric assembly 2 and the circuit board 3, and the gap is greater than or equal to the vibration amplitude of the piezoelectric assembly 2.

[0054] In the embodiment, the accommodating cavity 11 in the shell 1 can be set as an integral chamber to communicate the first chamber and the second chamber. For example, the area of the first chamber can be set to be smaller than the area of the second chamber along the stacking direction Z of the piezoelectric assembly 2 and the circuit board 3, and after the circuit board 3 is arranged in the first chamber and the piezoelectric assembly 2 is arranged in the second chamber, the piezoelectric assembly 2 can cover the circuit board 3.

[0055] For example, the sealing member 4 can be made of epoxy resin, silicone sealant or other materials with adhesive properties. After the circuit board 3 is placed in the first chamber, the sealing member 4 can be poured into the first chamber to fill the gap between the circuit board 3 and the shell 1, so as to adhere and fix the circuit board 3 in the first chamber by the sealing member 4. The distribution area of the sealing member 4 on the surface of the circuit board 3 facing the second chamber can be determined according to the positions of the devices, solder joints and the like on the circuit board 3. For example, the sealing member 4 can cover the devices, solder joints and the like on the circuit board 3 to seal the parts of the circuit board 3 that need to be waterproof by the sealing member 4; or the sealing member 4 can cover the entire circuit board 3 to cover and seal the entire circuit board 3 by the sealing member 4. When the sealing member 4 and the circuit board 3 are arranged, a gap is needed to be reserved between the sealing member 4 and the piezoelectric assembly 2, and a gap is needed to be reserved between the circuit board 3 and the piezoelectric assembly 2. The gap between the piezoelectric assembly 2 and the sealing member 4 and the circuit board 3 can be determined according to the vibration amplitude of the piezoelectric assembly 2. For example, the gap can be set to be greater than or equal to the vibration amplitude of the piezoelectric assembly 2 along the stacking direction Z of the piezoelectric assembly 2 and the circuit board 3.

[0056] In the above embodiment, since the first chamber and the second chamber are communicated, the circuit board 3 and the piezoelectric assembly 2 can be sequentially placed into the shell 1. In addition, the first chamber is filled with the sealing member 4, and the circuit board 3 can be fixed in the first chamber and sealed by the sealing member 4, so that the waterproof and dustproof of the circuit board 3 can be realized, the influence of the external environment on the circuit board 3 can be reduced, and the working reliability of the circuit board 3 can be improved. Meanwhile, the gap between the piezoelectric assembly 2 and the sealing member 4 and / or the circuit board 3 is greater than or equal to the vibration amplitude of the piezoelectric assembly 2, so that the interference between the piezoelectric assembly 2 and the sealing member 4 and / or the circuit board 3 can be reduced when the piezoelectric assembly 2 vibrates, and the working stability of the piezoelectric assembly 2 can be improved.

[0057] In some possible embodiments of the present application, as shown in Figure 1 and Figure 2 , the electronic device further includes a connecting assembly 7, one end of the connecting assembly 7 is connected with the circuit board 3, and the other end of the connecting assembly 7 extends to the outside of the shell 1 through the shell wall of the shell 1, and the connecting assembly 7 is used for electrically connecting with the controller of the target device.

[0058] In the embodiments of the present application, the connecting assembly 7 can be arranged in the electronic device to electrically connect the electronic device with the controller of the target device through the connecting assembly 7. For example, a connector 72 and a flexible external lead wire 71 can be arranged in the connecting assembly 7. The connector 72 can be a plug with a protective sleeve, and the flexible external lead wire 71 can be a copper lead wire coated with an insulating layer, etc. As shown in Figure 4 , a threading hole 15 can be arranged on the first chamber wall 12 of the shell 1, the flexible external lead wire 71 is threaded through the threading hole 15, a part of the external lead wire 71 is located in the first chamber, and the external lead wire 71 is welded with the circuit board 3, and the part of the external lead wire 71 located outside the accommodating cavity 11 is connected with the plug. In this way, after the electronic device is installed on the target device, the connector 72 can be plugged with the socket of the controller of the target device to electrically connect the electronic device with the target device.

[0059] In the above embodiment, since the connecting assembly 7 electrically connected with the circuit board 3 is arranged in the electronic device, the electronic device can be electrically connected with the controller of the target device through the connecting assembly 7 after the electronic device is installed on the target device.

[0060] In some possible embodiments of the present application, referring to Figure 5 , Figure 5 , a structural schematic diagram of a piezoelectric assembly and a circuit board in the electronic device provided by the embodiments of the present application is shown. The piezoelectric assembly 2 includes a substrate 21 and a piezoelectric element 22, the piezoelectric element 22 is attached to the substrate 21, the substrate 21 is connected with the second chamber wall 13 of the second chamber, and the plane where the second chamber wall 13 is located satisfies a vertical relationship with the arrangement direction of the first chamber and the second chamber.

[0061] In this embodiment, a substrate 21 and a piezoelectric element 22 can be disposed in the piezoelectric assembly 2. The substrate 21 is used to dispose of and support the piezoelectric element 22, and the shape of the substrate 21 can be set according to the shape of the piezoelectric element 22. The substrate 21 can be made of metal materials such as stainless steel and aluminum, or it can be made of rigid plastics such as polycarbonate (PC), polystyrene (PS), and polyformaldehyde (POM). This embodiment does not limit the specific material of the substrate 21. The substrate 21 can be set as a sheet structure. The piezoelectric element 22 can be made of lead zirconate titanate (PZT) piezoelectric ceramic sheet. This embodiment does not limit the specific material of the piezoelectric element 22. The piezoelectric element 22 can be attached to the substrate 21. For example, the piezoelectric element 22 can be disposed on one side surface of the substrate 21, or it can be disposed on both opposite sides of the substrate 21. The two polarities of the piezoelectric element 22 can be electrically connected to two pads on the circuit board 3 through wires.

[0062] For example, such as Figure 4 As shown, the substrate 21 can be connected to the second cavity wall 13 of the housing 1 to fix the piezoelectric assembly 2 in the second cavity. The second cavity wall 13 is a wall in the housing 1 that is perpendicular or nearly perpendicular to the arrangement direction of the first and second cavities, and the second cavity wall 13 is also part of the bottom of the second cavity. Alternatively, cantilevers can be formed by extending from the inner wall of the housing 1 toward the receiving cavity 11 in a direction perpendicular to the arrangement direction of the first and second cavities, such as forming two opposing cantilevers from opposite sides of the housing 1, which divide the receiving cavity 11 in the housing 1 into the first and second cavities. The cantilevers can be located on the surface of the second cavity as the second cavity wall 13. The specific structure and position of the second cavity wall 13 within the housing 1 are not limited in the embodiments of this application.

[0063] In another example, a first adhesive 51 can be provided in the electronic device to bond the substrate 21 to the second cavity wall 13. For example, the first adhesive 51 can be made of a material with adhesive properties such as epoxy resin or silicone sealant.

[0064] In another example, the projection of the piezoelectric element 22 on the substrate 21 does not overlap the connection region of the substrate 21 and the second cavity wall 13. The area of the substrate 21 can be set to be larger than the area of the piezoelectric element 22. In this way, after the piezoelectric element 22 is bonded to the substrate 21, the surface of the substrate 21 on which the piezoelectric element 22 is arranged can still have a spare bonding region. Alternatively, in the case where the piezoelectric element 22 is arranged on one side surface of the substrate 21 and the other side surface of the substrate 21 is not arranged with the piezoelectric element 22, the projection of the piezoelectric element 22 on the other side surface of the substrate 21 which is not arranged with the piezoelectric element 22 can not completely cover the other side surface of the substrate 21, and the region of the other side surface of the substrate 21 which is not covered by the projection of the piezoelectric element 22 can be used as a bonding region. The first bonding member 51 can be bonded to the bonding region on the substrate 21, so that the substrate 21 is bonded to the second cavity wall 13 of the housing 1 by the first bonding member 51. In this way, the projection of the piezoelectric element 22 on the substrate 21 does not overlap the bonding region of the substrate 21 and the housing wall.

[0065] In the above examples, since the substrate 21 is arranged on the piezoelectric element 22, the piezoelectric element 22 can be carried by the substrate 21, and the piezoelectric element 22 can be fixed to the second cavity wall 13 by the substrate 21. Moreover, the projection of the piezoelectric element 22 on the substrate 21 does not overlap the bonding region of the substrate 21 and the second cavity wall 13, which is conducive to reducing the influence of the bonding region on the vibration amplitude and the like of the piezoelectric assembly 2 in the process of generating vibration of the piezoelectric element 22 and driving the substrate 21 to vibrate.

[0066] In some possible embodiments of the present application, as shown in Figure 1 and Figure 2 The electronic device further includes a second bonding member 52, the second bonding member 52 is bonded to the side of the substrate 21 away from the accommodation cavity 11, and at least a part of the second bonding member 52 extends from the opening of the housing 1 to the outside of the accommodation cavity 11, and the second bonding member 52 is used to bond the electronic device to a target device.

[0067] In the embodiments of the present application, the second bonding member 52 can be arranged in the electronic device, so that the piezoelectric assembly 2 is bonded to the target device by the second bonding member 52, so as to bond and install the electronic device on the target device.

[0068] For example, the second bonding member 52 can be arranged on the side surface of the substrate 21 away from the accommodation cavity 11, for example, the second bonding member 52 can be arranged on the region of the substrate 21 which is not arranged with the piezoelectric element 22. The second bonding member 52 can be double-sided adhesive tape or the like. In the stacking direction Z of the piezoelectric assembly 2 and the circuit board 3, the piezoelectric assembly 2 can be lower than the opening edge of the housing 1, and the second bonding member 52 can be higher than the opening edge of the housing 1, so that at least a part of the second bonding member 52 is located outside the accommodation cavity 11 of the housing 1.

[0069] In another example, as shown inFigure 2 As shown, the orthographic projection of the second adhesive member 52 on the substrate 21 does not coincide with the orthographic projection of the piezoelectric member 22 on the substrate 21. The area of the substrate 21 can be set to be larger than the area of the piezoelectric member 22, for example, the length of the substrate 21 can be set to be larger than the length of the piezoelectric member 22, and the piezoelectric member 22 is adhered to the substrate 21 near the center of the substrate 21, then one spare adhesive area can be reserved at each end of the substrate 21. In this way, two second adhesive members 52 can be adhered to the adhesive areas at both ends of the substrate 21, so that the orthographic projection of the second adhesive member 52 on the substrate 21 does not coincide with the orthographic projection of the piezoelectric member 22 on the substrate 21.

[0070] In the above embodiment, since the second adhesive member 52 is arranged on the side of the substrate 21 away from the accommodating cavity 11, the electronic device can be easily adhered to the target device through the second adhesive member 52. Moreover, at least part of the second adhesive member 52 is located outside the accommodating cavity 11, after the second adhesive member 52 is adhered to the target device, a gap can be formed between the shell 1 and the target device, which is conducive to reducing the influence of the shell 1 on the vibration in the process of vibration of the piezoelectric assembly 2. At the same time, the orthographic projection of the second adhesive member 52 on the substrate 21 does not coincide with the orthographic projection of the piezoelectric member 22 on the substrate 21, which is conducive to reducing the influence of the adhesive area on the vibration amplitude and the like of the piezoelectric assembly 2 in the process of vibration of the piezoelectric member 22 and driving the substrate 21 to vibrate.

[0071] In some possible embodiments of the present application, reference can be made to Figure 6 and Figure 7 , Figure 6 the structure of the electronic device provided in the embodiments of the present application Figure 2 , Figure 7 the exploded structure of the electronic device provided in the embodiments of the present application Figure 2 The electronic device further comprises a cover 6 matched with the shell 1, and the cover 6 covers the opening of the shell 1 to shield the accommodating cavity 11.

[0072] In the embodiments of the present application, the cover 6 can be arranged on the shell 1 to block and seal the accommodating cavity 11 of the shell 1 through the cover 6. For example, the cover 6 can be arranged in a structure similar to a plate, and the cover 6 and the opening edge of the shell 1 can be sealingly connected through adhesion, clamping, welding or the like. For example, the cover 6 and the shell 1 can be adhered by using epoxy resin, silicone sealant or the like.

[0073] For example, a ring of convex rings can be arranged on the opening edge of the shell 1, and correspondingly, an annular groove matched with the convex rings can be arranged on the cover 6, and the convex rings can be clamped into the annular groove to clamp the cover 6 and the shell 1. Moreover, an interference fit can be formed between the convex rings and the annular groove, or adhesive can be arranged between the convex rings and the annular groove to achieve the sealing connection of the cover 6 and the shell 1.

[0074] Another example, a gap can be provided on the cover 6 corresponding to the second adhesive 52, so that the second adhesive 52 extends to the side of the cover 6 away from the shell 1 through the gap. After the second adhesive 52 is adhered to the target device, a gap can be formed between the cover 6 and the target device. And a gap can be formed between the piezoelectric assembly 2 and the cover 6, which is greater than the vibration amplitude of the piezoelectric element 22.

[0075] In the above embodiment, since the cover 6 is provided in the electronic device, the opening of the shell 1 can be shielded by the cover 6, so that the piezoelectric assembly 2 can be shielded and protected, which is beneficial to reduce the risk of the piezoelectric assembly 2 being bumped. In the case of sealing connection between the cover 6 and the shell 1, the accommodation cavity 11 can be formed as a sealed cavity, so that the piezoelectric assembly 2 and the circuit board 3 and the like can be in a sealed environment, which is beneficial to reduce the influence of dust, water and the like on the piezoelectric assembly 2, the circuit board 3 and the like.

[0076] In some possible embodiments of the present application, as shown in Figure 7 The piezoelectric assembly 2 includes a substrate 21 and a piezoelectric element 22, the piezoelectric element 22 is attached to the substrate 21, and the substrate 21 is connected to the side of the cover 6 facing the accommodation cavity 11, so that the piezoelectric assembly 2 is located in the second chamber.

[0077] In the embodiment of the present application, the piezoelectric assembly 2 can be fixedly connected with the cover 6, and a gap is formed between the piezoelectric assembly 2 and the shell 1, so that the piezoelectric assembly 2 is located in the second chamber.

[0078] For example, a clamping groove matched with the substrate 21 can be provided on the cover 6, so that the substrate 21 is clamped on the cover 6.

[0079] Another example, as shown in Figure 7 A third adhesive 53 can be provided in the electronic device, and the substrate 21 and the cover 6 are adhered by the third adhesive 53. The third adhesive 53 can be made of double-sided adhesive tape or other materials with adhesive properties. One side of the third adhesive 53 is adhered to the surface of the cover 6 facing the shell 1, and the substrate 21 is adhered to the third adhesive 53.

[0080] In another example, the third adhesive 53 has a projection on the substrate 21 that does not overlap with the projection of the piezoelectric element 22 on the substrate 21. The area of the substrate 21 can be set to be larger than the area of the piezoelectric element 22, for example, the length of the substrate 21 can be set to be larger than the length of the piezoelectric element 22, and the piezoelectric element 22 is adhered to the substrate 21 near the center of the substrate 21, then one spare adhesive area can be reserved at each end of the substrate 21. In this way, two third adhesives 53 can be adhered to the adhesive areas at both ends of the substrate 21, so that the projection of the third adhesive 53 on the substrate 21 does not overlap with the projection of the piezoelectric element 22 on the substrate 21.

[0081] In the above embodiment, the substrate 21 of the piezoelectric assembly 2 is connected with the cover 6, so that the cover 6 can be connected with the target device, and the vibration generated by the piezoelectric assembly 2 can be transmitted to the target device through the cover 6. The substrate 21 is adhered to the cover 6 by the third adhesive 53, and the projection of the third adhesive 53 on the substrate 21 does not overlap with the projection of the piezoelectric element 22 on the substrate 21, which not only facilitates the connection of the piezoelectric assembly 2 and the cover 6, but also reduces the influence of the adhesive area on the vibration amplitude of the piezoelectric assembly 2.

[0082] In some possible embodiments of the present application, as shown in Figure 6 and Figure 7 , the electronic device further includes a fourth adhesive 54, which is arranged on the cover 6 away from the accommodating cavity 11, and the fourth adhesive 54 is used to adhere the electronic device to the target device.

[0083] In the embodiments of the present application, the fourth adhesive 54 can be arranged on the cover 6, so that the cover 6 is adhered to the target device through the fourth adhesive 54, and the electronic device is adhered and installed on the target device.

[0084] For example, the area of the surface of the cover 6 away from the accommodating cavity 11 can be set to be larger than the surface of the cover 6 toward the accommodating cavity 11, so that the fourth adhesive 54 with a larger area can be arranged on the cover 6. The fourth adhesive 54 can be double-sided tape or the like.

[0085] In another example, the fourth adhesive 54 has a projection on the substrate 21 that does not overlap with the projection of the piezoelectric element 22 on the substrate 21. As shown in Figure 7 , the fourth adhesive 54 can be arranged on the cover 6 corresponding to the third adhesive 53. Alternatively, the piezoelectric element 22 can be arranged on the substrate 21 near the center of the substrate 21, and the fourth adhesive 54 can be arranged on the cover 6 near both ends of the cover 6. In this way, the projection of the fourth adhesive 54 on the substrate 21 does not overlap with the projection of the piezoelectric element 22 on the substrate 21.

[0086] As shown in FIG. 8, the electronic device can be provided with a warning member 8 to reduce damage to the piezoelectric assembly 2 by the warning member 8. For example, the warning member 8 can be made of a thin film or paper, and can be attached to the second adhesive member 52 or the fourth adhesive member 54 away from the housing 1. A warning such as "Do not touch" can be provided on the warning member 8, or other signs or characters having a warning function can be provided on the warning member 8 to warn the user not to touch the piezoelectric assembly 2. Figure 6 Figure 7 As shown in FIG. 8, the electronic device can be provided with a warning member 8 to reduce damage to the piezoelectric assembly 2 by the warning member 8. For example, the warning member 8 can be made of a thin film or paper, and can be attached to the second adhesive member 52 or the fourth adhesive member 54 away from the housing 1. A warning such as "Do not touch" can be provided on the warning member 8, or other signs or characters having a warning function can be provided on the warning member 8 to warn the user not to touch the piezoelectric assembly 2.

[0087] In the above embodiments, the fourth adhesive member 54 is provided on the cover 6, which facilitates the attachment of the electronic device to the target equipment via the fourth adhesive member 54. Moreover, the orthographic projection of the fourth adhesive member 54 on the substrate 21 does not coincide with the orthographic projection of the piezoelectric member 22 on the substrate 21, which is conducive to reducing the influence of the adhesive area on the vibration amplitude of the piezoelectric assembly 2.

[0088] In addition, the embodiments of the present application also provide a vehicle, which comprises a vehicle body and the electronic device provided by any one of the above embodiments. The vehicle body comprises a plurality of vehicle body panels, a plurality of interior trim parts, and a vehicle assembly connected to the vehicle body panels and / or the interior trim parts; and at least one of the vehicle body panels, the interior trim parts, and the vehicle assembly is provided with the electronic device.

[0089] In some possible embodiments of the present application, the electronic device provided by the embodiments of the present application can be arranged on a vehicle. The term "vehicle" or other similar terms used in the embodiments of the present application include a broad sense of motor vehicles: for example, passenger / cargo vehicles including sport utility vehicles (SUVs), sedans, passenger cars, off-road vehicles, tractors, vans, special vehicles, buses, trucks, and various commercial vehicles; watercraft including various boats and ships, and aircraft; and hybrid vehicles, electric vehicles, hybrid electric vehicles, hydrogen-powered vehicles, and other alternative fuel vehicles (e.g., fuels derived from resources other than petroleum). The embodiments of the present application do not limit the type and structure of the vehicle.

[0090] ​Exemplarily, a vehicle generally comprises a frame, a body, a power system, an electrical system, etc. The body and the power system are fixed on the frame, and the electrical system is arranged on the body and the frame. The body generally comprises a plurality of body panels, a plurality of interior parts and a plurality of vehicle components. The plurality of body panels can enclose the overall structure of the body, such as a passenger compartment, a cargo compartment, etc. For example, the body panels include doors, windows, hoods, trunk lids, roofs, front bumpers, rear bumpers, fenders, etc. The interior parts are installed in the passenger compartment and the cargo compartment to improve the comfort of the vehicle, and can provide some operation interfaces and devices. The vehicle components are located in the passenger compartment and the cargo compartment, and the vehicle components include seats, steering wheels, instrument panels, center screens, armrest boxes, vehicle license plates, etc.

[0091] Another example, the electronic device can be arranged on at least any one of the body panels, the interior parts and the vehicle components in the vehicle, that is, the electronic device is fixed on the body by the second adhesive or the fourth adhesive. And the electronic device can be electrically connected with the vehicle controller, that is, the connector 72 is plugged with the socket of the vehicle controller, so as to apply a voltage signal to the piezoelectric element 22 in the electronic device through the vehicle controller. In this way, the piezoelectric element 22 in the electronic device can generate vibrations corresponding to the voltage signal, so as to drive the body panels, the interior parts or the vehicle components in the vehicle to vibrate, so as to make the vehicle emit sound.

[0092] The vehicle provided by the embodiments of the present application can drive the body panels, the interior parts or the vehicle components in the body to vibrate through the electronic device, so as to make the vehicle emit sound, because the electronic device is arranged on at least one of the body panels, the interior parts and the vehicle components. The shell can provide good protection for the piezoelectric component, so as to improve the reliability of the electronic device.

[0093] The above embodiments are only used to illustrate the technical solutions of the present application, but not limit the same. Although the technical solutions of the present application are described in detail with reference to the above embodiments, those skilled in the art should understand that the technical solutions recorded in the above embodiments can be modified, or some or all of the technical features can be replaced equivalently. The modification or replacement does not change the essence of the corresponding technical solutions, and should be covered in the scope of the present application. Especially, each technical feature mentioned in the embodiments can be combined in any way, as long as there is no structural conflict.

Claims

1. An electronic device, characterized by comprising: The electronic device comprises: a housing having a receiving cavity; a piezoelectric component arranged in the receiving cavity, the piezoelectric component being capable of deforming to generate vibration when a voltage is applied to the piezoelectric component; a circuit board arranged in the housing and electrically connected to the piezoelectric component.

2. Electronic device according to claim 1, wherein, The receiving cavity comprises a first chamber and a second chamber adjacent to each other, the first chamber being located in a region of the housing away from an opening of the housing, and the second chamber being in communication with the opening; the piezoelectric component is arranged in the second chamber, and the circuit board is arranged in the first chamber.

3. The electronic device of claim 2, wherein, The first chamber and the second chamber are in communication along a stacking direction of the piezoelectric component and the circuit board. The electronic device further comprises a sealing member filled in the first chamber and covering at least part of the circuit board to fix the circuit board in the first chamber; the piezoelectric component has a gap between the sealing member and / or the circuit board along the stacking direction of the piezoelectric component and the circuit board, and the gap is greater than or equal to a vibration amplitude of the piezoelectric component.

4. The electronic device of claim 2, wherein, The piezoelectric component comprises a substrate and a piezoelectric element attached to the substrate; the substrate is connected to a second chamber wall of the second chamber, and a plane in which the second chamber wall is located is perpendicular to an arrangement direction of the first chamber and the second chamber.

5. The electronic device of claim 4, wherein, The electronic device further comprises a first adhesive member, and the substrate is attached to the second chamber wall through the first adhesive member.

6. The electronic device of claim 5, wherein, A normal projection of the piezoelectric element on the substrate does not overlap with a connection region of the substrate and the second chamber wall.

7. The electronic device of claim 4, wherein, The electronic device further comprises a second adhesive member attached to a side of the substrate away from the receiving cavity, and at least part of the second adhesive member extends from the opening of the housing to an outside of the receiving cavity; the second adhesive member is used to attach the electronic device to a target device.

8. Electronic device according to claim 7, wherein A normal projection of the second adhesive member on the substrate does not coincide with a normal projection of the piezoelectric element on the substrate.

9. The electronic device of claim 2, wherein, The electronic device further comprises a cover body matched with the housing, and the cover body covers the opening of the housing to shield the receiving cavity.

10. The electronic device of claim 9, wherein, The piezoelectric component comprises a substrate and a piezoelectric element attached to the substrate; the substrate is connected to a side of the cover body facing the receiving cavity, so that the piezoelectric component is located in the second chamber.

11. The electronic device of claim 10, wherein, The electronic device further comprises a third adhesive member, and the substrate and the cover body are attached through the third adhesive member.

12. The electronic device of claim 11, wherein, A normal projection of the third adhesive member on the substrate does not coincide with a normal projection of the piezoelectric element on the substrate.

13. The electronic device of claim 10, wherein, The electronic device further comprises a fourth adhesive member arranged on a side of the cover body away from the receiving cavity, and the fourth adhesive member is used to attach the electronic device to a target device.

14. The electronic device of claim 13, wherein, A normal projection of the fourth adhesive member on the substrate does not coincide with a normal projection of the piezoelectric element on the substrate.

15. Electronic device according to any one of claims 2 to 14, wherein, One of the first cavity wall of the first cavity and the circuit board has a limiting protrusion, and the other has a limiting recess matched with the limiting protrusion, the limiting protrusion and the limiting recess are matched to limit the position of the circuit board in the first cavity.

16. Electronic device according to any one of claims 2 to 14, wherein The electronic device further comprises a connecting assembly, one end of the connecting assembly is connected with the circuit board, the other end of the connecting assembly extends to the outside of the shell through the shell wall of the shell, and the connecting assembly is used for electrically connecting with a controller of a target device.

17. A vehicle characterized by comprising: The electronic device comprises: a vehicle body comprising a plurality of body panels, a plurality of interior trim pieces, and a vehicle component connected with the body panels and / or the interior trim pieces; The electronic device is arranged on at least one of the body panels, the interior trim pieces, and the vehicle component.

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