Wet cleaning equipment for semiconductor manufacturing

Abstract

The utility model discloses wet cleaning equipment for semiconductor manufacturing, which relates to the technical field of semiconductors and comprises a workbench, a groove body is arranged at the upper end of the workbench, and mounting frames are fixedly connected to the upper end of the workbench and are positioned on two sides of the groove body. A first lifting shaft and a second lifting shaft are rotationally installed in the first lifting seat and the second lifting seat correspondingly, a pulley is fixedly connected to the outer side wall of the first lifting shaft, a winding wheel is fixedly connected to the outer side wall of the second lifting shaft, a lifting rope is wound around the outer side wall of the winding wheel, and a containing fence is arranged above the groove body. A filtering assembly is arranged at the lower end of the workbench. By arranging the filtering assembly, cleaning liquid can be filtered, the cleaning liquid can be recycled, and the cleaning effect is guaranteed; and a mounting frame, a lifting shaft I, a lifting shaft II and a lifting rope are arranged, so that the accommodating fence can do lifting motion on the tank body, and the cleaning efficiency of the semiconductor is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a wet cleaning device for semiconductor manufacturing. Background Technology

[0002] After semiconductor manufacturing is completed, wet cleaning is required. The main purpose of this process is to remove impurities and residues from the surface of the semiconductor material to ensure the quality and performance of the semiconductor product.

[0003] Existing semiconductor cleaning processes often result in incomplete cleaning, with impurities from the cleaning solution remaining on the semiconductor surface after cleaning, affecting the cleaning effect and even the quality of semiconductor manufacturing. Furthermore, the semiconductors need to be manually removed from the cleaning tank after cleaning, which is time-consuming and labor-intensive, ultimately leading to low cleaning efficiency. Utility Model Content

[0004] To address the shortcomings of existing technologies, this utility model provides a wet cleaning device for semiconductor manufacturing. By incorporating a filter assembly, the cleaning solution can be filtered and recycled, ensuring effective cleaning. Furthermore, the device includes a mounting frame, a first lifting shaft, a second lifting shaft, and a lifting rope, enabling the container to move up and down within the tank, thereby improving the cleaning efficiency of the semiconductor.

[0005] This utility model also provides a wet cleaning device for semiconductor manufacturing, comprising: a workbench, a tank at the upper end of the workbench, mounting brackets fixedly connected to the upper end of the workbench and on both sides of the tank, a guide groove on one side of the mounting brackets, lifting seat one and lifting seat two fixedly connected above the mounting brackets respectively, lifting shaft one and lifting shaft two rotatably mounted inside lifting seat one and lifting seat two respectively, a pulley fixedly connected to the outer wall of lifting shaft one, a winding wheel fixedly connected to the outer wall of lifting shaft two, a lifting rope wound around the outer wall of the winding wheel, a motor fixedly connected to the upper end of the mounting brackets, the output end of the motor connected to lifting shaft two, a receiving rail provided above the tank, and a filter assembly provided at the lower end of the workbench.

[0006] According to the aforementioned wet cleaning equipment for semiconductor manufacturing, the filter assembly is fixedly connected to a filter box at the bottom of the workbench. Filter plates and activated carbon plates are fixedly connected to the inner walls of the filter box. A pump body is fixedly connected to one side of the filter box, and a return pipe is fixedly connected to the output end of the pump body.

[0007] According to the aforementioned wet cleaning equipment for semiconductor manufacturing, the end of the return pipe away from the pump body is located on the upper side of the tank.

[0008] According to the aforementioned wet cleaning equipment for semiconductor manufacturing, a drain pipe is provided at the bottom of the tank, and a drain valve is provided on one side of the drain pipe, with the end of the drain pipe away from the tank connected to a filter box.

[0009] According to the aforementioned wet cleaning equipment for semiconductor manufacturing, a guide rod is slidably connected to the inner wall of the guide groove, one end of the lifting rope passes through a pulley and is connected to the top of the guide rod, and one end of the guide rod is fixedly connected to the receiving rail.

[0010] According to the aforementioned wet cleaning equipment for semiconductor manufacturing, a plurality of ultrasonic generators are provided at the bottom of the tank, and the plurality of ultrasonic generators are arranged symmetrically.

[0011] According to the aforementioned wet cleaning equipment for semiconductor manufacturing, the surface of the receiving rail is provided with a plurality of filter holes, and the height of the receiving rail is lower than the depth of the tank.

[0012] According to the aforementioned wet cleaning equipment for semiconductor manufacturing, the bottom of the worktable is fixedly connected to four support columns, and each of the four support columns is fixedly connected to a cross-shaped reinforcing frame.

[0013] This utility model has the following beneficial effects:

[0014] 1. In this utility model, by setting up an installation frame, lifting shaft one, lifting shaft two, lifting rope and ultrasonic generator, the cleaning of semiconductor materials is realized, and the cleaning quality and efficiency are improved.

[0015] 2. In this utility model, by setting up a filter component, the cleaning liquid can be recycled, which saves resources and reduces waste liquid discharge.

[0016] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0017] The present invention will be further described below with reference to the accompanying drawings and embodiments;

[0018] Figure 1 This is a top-view perspective view of a wet cleaning apparatus for semiconductor manufacturing according to the present invention.

[0019] Figure 2 This is a perspective view from below of a wet cleaning apparatus for semiconductor manufacturing according to the present invention.

[0020] Figure 3 This is an enlarged perspective view of the mounting bracket of a wet cleaning equipment for semiconductor manufacturing according to this utility model;

[0021] Figure 4 This is a side view structural diagram of a wet cleaning device for semiconductor manufacturing according to this utility model.

[0022] Legend:

[0023] 1. Workbench; 2. Tank; 3. Mounting frame; 4. Guide groove; 5. Lifting seat one; 6. Lifting seat two; 7. Lifting shaft one; 8. Lifting shaft two; 9. Pulley; 10. Winding reel; 11. Lifting rope; 12. Motor; 13. Holding rack; 14. Filter assembly; 141. Filter box; 142. Filter plate; 143. Activated carbon plate; 144. Pump body; 145. Return pipe; 201. Drain pipe; 202. Drain valve; 203. Ultrasonic generator; 401. Guide rod; 101. Support column; 102. Reinforcing frame. Detailed Implementation

[0024] This section will describe in detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present utility model, but they should not be construed as limiting the scope of protection of the present utility model.

[0025] Reference Figure 1-4 This utility model discloses a wet cleaning device for semiconductor manufacturing, comprising: a workbench 1, a tank 2 at the upper end of the workbench 1, mounting brackets 3 fixedly connected to the upper end of the workbench 1 and on both sides of the tank 2, a guide groove 4 on one side of the mounting brackets 3, lifting seats 5 and 6 fixedly connected above the mounting brackets 3 respectively, lifting shafts 7 and 8 rotatably mounted inside the lifting seats 5 and 6 respectively, a pulley 9 fixedly connected to the outer wall of the lifting shaft 7, a winding wheel 10 fixedly connected to the outer wall of the lifting shaft 8, a lifting rope 11 wound around the outer wall of the winding wheel 10, a motor 12 fixedly connected to the upper end of the mounting brackets 3, the output end of the motor 12 connected to the lifting shaft 8, a receiving rail 13 above the tank 2, and a filter assembly 14 at the lower end of the workbench 1.

[0026] The filter assembly 14 is fixedly connected to the filter box 141 at the bottom of the workbench 1. Filter plates 142 and activated carbon plates 143 are fixedly connected to the inner walls of the filter box 141. A pump body 144 is fixedly connected to one side of the filter box 141, and a return pipe 145 is fixedly connected to the output end of the pump body 144. The filter assembly 14 can filter the cleaning solution containing impurities in the tank 2.

[0027] The end of the return pipe 145 away from the pump body 144 is located on the upper side of the tank 2. The return pipe 145 facilitates the delivery of the cleaning solution filtered in the filter box 141 to the tank 2 for secondary use.

[0028] A drain pipe 201 is provided at the bottom of the tank 2, and a drain valve 202 is provided on one side of the drain pipe 201. The end of the drain pipe 201 away from the tank 2 is connected to the filter box 141. The drain valve 202 and the drain pipe 201 facilitate the discharge of the cleaning liquid in the tank 2 into the filter box 141.

[0029] A guide rod 401 is slidably connected to the inner wall of the guide groove 4. One end of the lifting rope 11 passes through the pulley 9 and is connected to the top of the guide rod 401, and one end of the guide rod 401 is fixedly connected to the receiving rail 13. The guide groove 4 improves the stability of the guide rod 401 during lifting, thereby keeping the receiving rail 13 stable during lifting.

[0030] Multiple ultrasonic generators 203 are installed at the bottom of the tank 2, and the multiple ultrasonic generators 203 are arranged symmetrically. The ultrasonic generators 203 further enhance the cleaning effect of the semiconductor.

[0031] The surface of the receiving chamber 13 is provided with multiple filter holes, and the height of the receiving chamber 13 is less than the depth of the tank 2. The receiving chamber 13 facilitates the placement of semiconductors into the tank 2 for cleaning.

[0032] The bottom of the workbench 1 is fixedly connected to four support columns 101, and each of the four support columns 101 is fixedly connected to a cross-shaped reinforcing frame 102. The stability of the workbench 1 is improved by the support columns 101 and the reinforcing frames 102.

[0033] Working principle: During use, the semiconductor to be cleaned is placed in the receiving compartment 13, and the motor 12 is started to output the lifting shaft 8 to drive the winding wheel 10 to rotate. The rotation of the winding wheel 10 causes the lifting rope 11 to pull the guide rod 401 to move up and down in conjunction with the pulley 9. The guide rod 401 moves up and down, causing the receiving compartment 13 to enter into the tank 2 or rise from the tank 2, thereby completing the placement and retrieval of the semiconductor. When the semiconductor is placed in the tank 2, the ultrasonic generator 203 can be started to enhance the cleaning effect. After each semiconductor is cleaned, the drain valve 202 can be opened to discharge the cleaning liquid in the tank 2 into the filter box 141 through the drain pipe 201. The filter plate 142 and activated carbon plate 143 in the filter box 141 filter the cleaning liquid to ensure the purity of the cleaning liquid. After filtration, the cleaning liquid can be sent back to the tank 2 through the return pipe 145 by the pump body 144 to achieve recycling.

[0034] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. A wet cleaning apparatus for semiconductor manufacturing, comprising: A workbench (1), characterized in that a groove (2) is provided at the upper end of the workbench (1), and mounting brackets (3) are fixedly connected to the upper end of the workbench (1) and to both sides of the groove (2). A guide groove (4) is provided on one side of the mounting brackets (3), and lifting seats one (5) and two (6) are fixedly connected above the mounting brackets (3). Lifting shaft one (7) and lifting shaft two (8) are rotatably installed in lifting seats one (5) and lifting seats two (6) respectively. A pulley (9) is fixedly connected to the outer wall of the first lifting shaft (7), a winding wheel (10) is fixedly connected to the outer wall of the second lifting shaft (8), a lifting rope (11) is wound around the outer wall of the winding wheel (10), a motor (12) is fixedly connected to the upper end of the mounting frame (3), the output end of the motor (12) is connected to the second lifting shaft (8), a receiving rail (13) is provided above the trough (2), and a filter assembly (14) is provided at the lower end of the workbench (1).

2. The wet cleaning equipment for semiconductor manufacturing according to claim 1, characterized in that, The filter assembly (14) is fixedly connected to the filter box (141) at the bottom of the workbench (1). The inner wall of the filter box (141) is fixedly connected to the filter plate (142) and the activated carbon plate (143). A pump body (144) is fixedly connected to one side of the filter box (141). A return pipe (145) is fixedly connected to the output end of the pump body (144).

3. The wet cleaning equipment for semiconductor manufacturing according to claim 2, characterized in that, The end of the return pipe (145) away from the pump body (144) is located on the upper side of the tank (2).

4. The wet cleaning equipment for semiconductor manufacturing according to claim 1, characterized in that, The bottom of the tank (2) is provided with a drain pipe (201), and a drain valve (202) is provided on one side of the drain pipe (201). The end of the drain pipe (201) away from the tank (2) is connected to the filter box (141).

5. The wet cleaning equipment for semiconductor manufacturing according to claim 1, characterized in that, The inner wall of the guide groove (4) is slidably connected to a guide rod (401). One end of the lifting rope (11) passes through the pulley (9) and is connected to the top of the guide rod (401). One end of the guide rod (401) is fixedly connected to the receiving rail (13).

6. The wet cleaning equipment for semiconductor manufacturing according to claim 1, characterized in that, The bottom of the tank (2) is provided with multiple ultrasonic generators (203), and the multiple ultrasonic generators (203) are arranged symmetrically.

7. The wet cleaning equipment for semiconductor manufacturing according to claim 1, characterized in that, The surface of the container (13) is provided with multiple filter holes, and the height of the container (13) is lower than the depth of the tank (2).

8. The wet cleaning equipment for semiconductor manufacturing according to claim 1, characterized in that, The bottom of the workbench (1) is fixedly connected to four support columns (101), and each of the four support columns (101) is fixedly connected to a reinforcing frame (102) that crosses each other.

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