Device for preparing solder balls by using low-temperature solder paste

Abstract

The device comprises a supporting frame, a heating chamber is arranged at the upper end of the supporting frame, a discharging opening is formed in the bottom in the heating chamber, a detachable forming net plate is arranged in the discharging opening, a hot air gun is arranged above the forming net plate, and an air uniformizing plate is arranged between the hot air gun and the forming net plate. A coating assembly is further arranged in the heating chamber and comprises an injector and a scraper, a discharging port of the injector is located above the forming net plate, the scraper can reciprocate along the upper side of the forming net plate, and a material collecting crucible is arranged below the discharging port. The device is simple in structure, low in manufacturing cost and convenient to operate integrally, low-temperature soldering paste can be conveniently added midway, and solder balls with required particle sizes can be conveniently and rapidly prepared.

Description

Technical Field

[0001] This utility model relates to the field of solder ball preparation technology, and in particular to an apparatus for preparing solder balls using low-temperature solder paste. Background Technology

[0002] In fields such as electronics manufacturing, solder balls are an important connecting material, and their quality and performance play a crucial role in the reliability and stability of products. Especially in laboratory environments, there is an urgent need for a device that can quickly prepare solder balls of the required particle size. Traditional solder ball preparation devices have many drawbacks: 1. They are not convenient for preparing solder balls of different particle sizes as needed; 2. The device structure is complex and the cost is high; 3. It is inconvenient to add low-temperature solder paste midway. Utility Model Content

[0003] This invention proposes an apparatus for preparing solder balls using low-temperature solder paste. It has a simple structure, low manufacturing cost, convenient overall operation, facilitates the addition of low-temperature solder paste midway, and facilitates the rapid preparation of solder balls with the required particle size.

[0004] The technical solution of this utility model is implemented as follows: A device for preparing solder balls using low-temperature solder paste includes a support frame, a heating chamber at the upper end of the support frame, a material discharge port at the bottom of the heating chamber, a detachable forming stencil plate inside the material discharge port, a hot air gun above the forming stencil plate, an air distribution plate between the hot air gun and the forming stencil plate, a coating component inside the heating chamber, the coating component including a syringe and a scraper, the discharge port of the syringe being located above the forming stencil plate, the scraper being able to reciprocate along the upper side of the forming stencil plate, and a collecting crucible below the material discharge port.

[0005] Furthermore, transverse chutes are provided on both sides of the heating chamber, and circular handles that move along the chutes are fixed to both ends of the scraper. The free ends of the circular handles pass through the chutes and are placed outside the heating chamber. Insulating strips are fixed to both the upper and lower sides of the chutes. With the combination of the above structures, it is convenient for manual operation to push the scraper back and forth through the chutes using the circular handles. The use of circular handles also makes it easy to rotate the scraper to move it over the accumulated solder paste, and then move it in the opposite direction to scrape the accumulated solder paste flat.

[0006] Furthermore, a discharge cylinder is installed between the discharge port and the collecting crucible. A cold air inlet is located at the lower part of the side wall of the discharge cylinder, and a hot air outlet is located at the upper part. A return pipe and a return air pipe are installed at the hot air outlet, and the return air pipe is connected to the air inlet of the hot air gun. This combination of structures facilitates the recovery of some heat for use in the hot air gun.

[0007] Furthermore, the upper end of the discharge cylinder is sealed and fixedly connected to the discharge port, and the lower end of the discharge cylinder is an open end with a detachable sealing plate. The collecting crucible is placed on the upper side of the sealing plate.

[0008] Furthermore, the side wall of the heating chamber is provided with positioning holes, and a heat insulation curtain is installed inside the positioning holes. The discharge port of the syringe slides through the heat insulation curtain and is positioned above the forming mesh plate.

[0009] Furthermore, a positioning groove is provided on the upper side around the material discharge port, and the edge of the forming mesh plate is placed in the positioning groove.

[0010] Furthermore, a filter screen is installed at the hot air outlet.

[0011] Furthermore, the heating chamber is equipped with an openable transparent door.

[0012] The beneficial effects of this utility model are:

[0013] This invention features a simple structure and low manufacturing cost. Low-temperature solder paste is added to a stencil using a syringe, then smoothed with a scraper, and finally heated with a hot air gun. A heat distribution plate ensures the hot air is evenly distributed across the stencil, causing the molten solder paste to shrink and fall into the stencil's holes. The coating component facilitates the addition of solder paste mid-process, and the detachable stencil allows for easy replacement with stencils of the desired aperture size. Overall, this invention is easy to operate and allows for the rapid preparation of solder balls of the desired particle size, suitable for applications where large equipment is inconvenient. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a schematic diagram of the structure of Embodiment 1 of the present utility model;

[0016] Figure 2 This is a schematic diagram of the internal structure of the heating chamber;

[0017] Figure 3 This is a schematic diagram of the positioning hole structure;

[0018] Figure 4 This is a schematic diagram of the syringe structure;

[0019] Figure 5 This is a structural schematic diagram of Embodiment 2 of the present invention.

[0020] Support frame 1, heating chamber 2, transparent door 3, material discharge port 4, forming mesh plate 5, positioning groove 6, hot air gun 7, air distribution plate 8, syringe 9, scraper 10, positioning hole 11, heat insulation curtain 12, slide 13, heat insulation strip 14, material collection crucible 15, material discharge cylinder 16, sealing plate 17, cold air inlet 18, hot air outlet 19, return pipe 20, return air pipe 21, filter screen 22, round handle 23. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Example 1

[0023] like Figure 1 As shown, an apparatus for preparing solder balls using low-temperature solder paste includes a support frame 1, a heating chamber 2 fixed to the upper end of the support frame 1, and a side wall of the heating chamber 2 that can be opened as a transparent door 3. One end of the transparent door 3 is hinged to the heating chamber 2, and the other end is magnetically connected to the heating chamber 2 or snap-fitted to it. The transparent door 3 allows for easy observation of the conditions inside the heating chamber 2. At the same time, the transparent door 3 can be opened to facilitate cleaning of the heating chamber 2 or replacement of the required forming stencil 5.

[0024] like Figure 2-4 As shown, a material discharge port 4 is provided at the bottom of the heating chamber 2. A detachable forming stencil plate 5 is provided inside the material discharge port 4. A positioning groove 6 is provided on the upper side of the periphery of the material discharge port 4. The edge of the forming stencil plate 5 is placed in the positioning groove 6. The forming stencil plate 5 is positioned by the positioning groove 6. The forming stencil plate 5 is only provided with forming holes at the corresponding positions of the material discharge port 4. If it is necessary to prepare solder balls of different particle sizes, the forming stencil plate 5 with the corresponding hole diameter can be replaced.

[0025] A hot air gun 7 is fixed in the heating chamber 2 above the forming stencil 5. A uniform air distribution plate 8 is fixed between the hot air gun 7 and the forming stencil 5. The uniform air distribution plate 8 has mesh evenly distributed to reduce the air velocity of the hot air gun 7 and to even out the temperature, so that the hot air blown out by the hot air gun 7 is evenly distributed on the forming stencil 5, while avoiding blowing out unformed solder balls due to high air velocity.

[0026] The heating chamber 2 is also equipped with a coating assembly, which includes a syringe 9 and a scraper 10. The side wall of the heating chamber 2 is provided with a positioning hole 11, and a heat insulation curtain 12 is fixed in the positioning hole 11. The heat insulation curtain 12 is a triangular rubber sheet evenly distributed around the circumference. The outlet of the syringe 9 slides through the heat insulation curtain 12 and is positioned above the forming stencil 5. Low-temperature solder paste is added to the forming stencil 5 through the syringe 9. This method of adding low-temperature solder paste is convenient for adding low-temperature solder paste during heating without interrupting the heating or opening the heating chamber 2. At the same time, the heat insulation curtain 12 also serves as a sealing and heat insulation function. After the material is added, part of the syringe 9 can be pulled out along the heat insulation curtain 12 to remove the syringe 9 from the range of the forming stencil 5 and avoid interfering with the heating.

[0027] Both sides of the heating chamber 2 are provided with transverse grooves 13. Both ends of the scraper 10 are fixed with circular handles 23 that move along the grooves 13. The free ends of the circular handles 23 pass through the grooves 13 and are positioned outside the heating chamber 2. Insulating strips 14 are fixed to the upper and lower sides of the grooves 13. By pushing the circular handles 23 along the grooves 13, the circular handles 23 drive the scraper 10 to reciprocate along the upper side of the forming stencil 5, applying the low-temperature solder paste from the forming stencil 5 onto it. The circular handles 23 facilitate rotating the scraper over the accumulated solder paste, and then scraping in the opposite direction to level the accumulated solder paste. A collecting crucible 15 is placed below the discharge port 4 to collect the formed solder balls.

[0028] The method of using the device is as follows: fill the syringe 9 with solder paste, then pass the discharge end of the syringe 9 through the heat insulation curtain 12 and place it above the forming stencil 5. Push the syringe 9 to make the solder paste fall onto the forming stencil 5. Then push the scraper 10 back and forth along the upper side of the forming stencil 5 to make the solder paste evenly spread on the forming stencil 5.

[0029] Turn on the hot air gun 7 to heat and melt the solder paste on the forming stencil 5, so that it has good fluidity and the solder paste in the holes shrinks and falls off; the fallen solder paste solidifies upon contact with cold air, forming solder balls, and is collected in the collecting crucible 15.

[0030] Example 2

[0031] This embodiment is basically the same as Embodiment 1, except that: to prevent oxidation during the heating and melting of the solder paste and the cooling of the solder balls, an inert gas environment is provided for the above process. Figure 5 As shown, a discharge cylinder 16 is provided between the discharge port 4 and the collecting crucible 15. The upper end of the discharge cylinder 16 is fixedly connected to the discharge port 4 by a flange seal. The lower end of the discharge cylinder 16 is an open end, and a sealing plate 17 is fixed to the open end by flange bolts. The collecting crucible 15 is placed on the upper side of the sealing plate 17. When the collecting crucible 15 needs to be removed, the sealing plate 17 can be removed.

[0032] A cold air inlet 18 is provided at the lower part of the side wall of the feeding cylinder 16, and a hot air outlet 19 is provided at the upper part. A return pipe 20 and a return air pipe 21 are provided at the hot air outlet 19. The return air pipe 21 is connected to the air inlet of the hot air gun 7. Low-temperature inert gas is introduced through the cold air inlet 18 to cool the falling solder balls. After absorbing heat, the low-temperature inert gas is discharged through the hot air outlet 19 and is divided into two parts. One part returns to the cooler through the return pipe 20 for cooling and reuse. The other part enters the hot air gun for heating, which also facilitates heat recovery and utilization. A filter screen 22 is fixed at the hot air outlet 19 to filter out particulate impurities.

[0033] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A device for preparing solder balls with low-temperature solder paste, comprising a support frame, the upper end of the support frame being provided with a heating chamber, characterized in that: The bottom of the heating chamber is provided with a blanking port, and a detachable forming screen is arranged in the blanking port. A hot air gun is arranged above the forming screen, and an air equalizing plate is arranged between the hot air gun and the forming screen. The heating chamber is further provided with a coating assembly, which comprises a syringe and a scraper. The discharge port of the syringe is located above the forming screen, and the scraper can reciprocate along the upper side of the forming screen. A material collecting crucible is arranged below the blanking port.

2. The apparatus for preparing solder balls using a low-temperature solder paste according to claim 1, wherein: The heating chamber is provided with transverse sliding grooves on both sides. The ends of the scraper are fixed with circular handles that move along the sliding grooves. The free ends of the circular handles pass through the sliding grooves and are located outside the heating chamber. Heat insulation rubber strips are fixed on the upper and lower sides of the sliding grooves.

3. A device for producing solder balls from a low-temperature solder paste according to claim 1 or 2, characterized in that: A blanking cylinder is arranged between the blanking port and the material collecting crucible. The lower part of the side wall of the blanking cylinder is provided with a cold air inlet, and the upper part is provided with a hot air outlet. A return pipeline and an air return pipeline are arranged at the hot air outlet. The air return pipeline is communicated with the air inlet of the hot air gun.

4. The apparatus for preparing solder balls using a low-temperature solder paste according to claim 3, wherein: The upper end of the blanking cylinder is sealingly and fixedly connected with the blanking port. The lower end of the blanking cylinder is an open end, which is provided with a detachable sealing plate. The material collecting crucible is located above the sealing plate.

5. The apparatus for preparing solder balls using a low-temperature solder paste according to claim 1, wherein: The side wall of the heating chamber is provided with positioning holes, and heat insulation curtains are arranged in the positioning holes. The discharge port of the syringe slides through the heat insulation curtains and is located above the forming screen.

6. The apparatus for preparing solder balls using a low-temperature solder paste according to claim 1, wherein: The upper side of the periphery of the blanking port is provided with a positioning groove, and the edge of the forming screen is located in the positioning groove.

7. The apparatus for preparing solder balls using a low-temperature solder paste according to claim 3, wherein: A filter screen is arranged at the hot air outlet.

8. The apparatus for preparing solder balls using a low-temperature solder paste according to claim 1, wherein: A transparent door that can be opened is arranged on the heating chamber.

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