Automatic grinding and cleaning device for wafer processing

Abstract

The utility model relates to and discloses an automatic grinding and cleaning device for wafer processing, which comprises a workbench, a drainage tank is arranged on the workbench, a cleaning type support table for placing a wafer is arranged on the inner bottom surface of the drainage tank, the cleaning type support table comprises a disc, a cleaning cloth II is arranged on the upper surface of the disc in an attached manner, and a water inlet hole is formed in the center of the disc. An upper surface cleaning mechanism is arranged over the cleaning type supporting table in a lifting mode. According to the automatic grinding and cleaning device for wafer processing, when the first cleaning cloth below the fan-shaped cleaning brush descends through the lifting hydraulic cylinder to be in contact with and attached to a wafer, the lower surface of the wafer is attached to the second cleaning cloth at the moment, and then a cleaning agent or ultrapure water is pumped through the water pump; the cleaning cloth I and the cleaning cloth II can simultaneously and reversely rotate to clean and wipe the surfaces of the upper side and the lower side of the wafer in cooperation with the rotation of the main shaft motor and the output shaft of the micro waterproof gear motor, so that the cleaning cloth I and the cleaning cloth II can simultaneously and reversely rotate to clean and wipe the surfaces of the upper side and the lower side of the wafer.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer grinding cleaning technical field, specifically is a kind of automatic grinding cleaning device for wafer processing. BACKGROUND

[0002] Automatic grinding cleaning device for wafer processing is widely used in the fields of semiconductor manufacturing, integrated circuit production, optoelectronic device manufacturing, etc., which provides efficient, accurate and reliable solutions for wafer processing in these fields, and is of great significance to improve product quality and production efficiency.

[0003] At present, the wafer is usually cleaned by spraying, soaking and ultrasonic wave, but when the wafer is cleaned by spraying, it needs to be placed on a flat surface, so that only the upper surface of the wafer can be cleaned by spraying, and the wafer cannot be cleaned by spraying on both sides simultaneously. UTILITY MODEL CONTENT

[0004] The utility model discloses a kind of automatic grinding cleaning devices for wafer processing, to solve the problem that when wafer is cleaned by spraying in prior art, wafer needs to be placed on a flat surface, so that only the upper surface of the wafer can be cleaned by spraying, and the wafer cannot be cleaned by spraying on both sides simultaneously.

[0005] To achieve the above purpose, the utility model adopts the following technical scheme:

[0006] An automatic grinding cleaning device for wafer processing includes a workbench, a drain groove is provided on the workbench, a cleaning support table for placing wafers is installed on the inner bottom surface of the drain groove, the cleaning support table includes a disc, a cleaning cloth II is installed on the upper surface of the disc, and a water inlet hole is provided at the center;

[0007] An upper surface cleaning mechanism is provided above the cleaning support table, the upper surface cleaning mechanism includes a fan-shaped cleaning brush and a spray head, and the spray head and the water inlet hole are connected by a water pump to clean the agent or ultrapure water.

[0008] Preferably, a lifting hydraulic cylinder is fixedly installed on one side of the workbench, a main shaft motor is fixedly connected to the top end of the piston rod in the lifting hydraulic cylinder through a support, and the output shaft of the main shaft motor is vertically downward, and is coaxially fixedly connected with the upper side of the fan-shaped cleaning brush.

[0009] Preferably, the cleaning type support table further comprises a circular frame, a conical connecting shell, a multi-way rotary joint and a base arranged coaxially from top to bottom, the base is fixedly connected with the workbench, the upper and lower ends of the multi-way rotary joint are fixedly connected with the lower end of the conical connecting shell and the upper end of the base respectively, the circular frame is fixedly installed on the upper end of the conical connecting shell, and the disc is arranged in the circular frame.

[0010] Preferably, the mini hydraulic machine is connected between the lower end of the disc and the inner wall of the lower end of the conical connecting shell through the connecting frame, and the outer wall of the disc is connected with the inner wall of the circular frame in a lifting mode.

[0011] Preferably, the outer periphery of the mini hydraulic machine is provided with a waterproof rubber sleeve, and a plurality of drainage holes are arranged on the outer wall of the circular frame, and the inner wall is attached with a cleaning cloth three.

[0012] Preferably, the inner wall of the drainage groove is further fixedly installed with a micro waterproof reduction motor, the output shaft of the micro waterproof reduction motor is fixedly installed with a pinion through a shaft coupling, and the pinion and the outer gear ring arranged on the lower end of the conical connecting shell are meshed with each other.

[0013] Compared with the prior art, the automatic grinding and cleaning device for wafer processing has the following beneficial effects:

[0014] The automatic grinding and cleaning device for wafer processing lowers the cleaning cloth one under the fan-shaped cleaning brush through the lifting hydraulic cylinder, and when the wafer placed on the disc is in contact with the cleaning cloth two, the lower surface of the wafer is attached to the cleaning cloth two, then the water pump extracts the cleaning agent or ultrapure water and respectively delivers the cleaning agent or ultrapure water to the spray head and the water inlet hole to spray the upper surface and the lower surface of the wafer at the same time, then the output shaft of the main shaft motor drives the cleaning cloth one under the fan-shaped cleaning brush to rotate and wipe the upper surface of the wafer, and the output shaft of the micro waterproof reduction motor drives the wafer on the disc to rotate through the meshing pinion and the outer gear ring, and the direction in which the wafer on the disc rotates is opposite to the direction in which the wafer is driven to rotate by the fan-shaped cleaning brush, so that the cleaning cloth one and the cleaning cloth two can simultaneously rotate in opposite directions to clean and wipe the upper and lower surfaces of the wafer. BRIEF DESCRIPTION OF DRAWINGS

[0015] Fig. 1 A structure schematic view of the automatic grinding and cleaning device for wafer processing is provided for the utility model.

[0016] Fig. 2 A structure schematic view of the cleaning type support table in the automatic grinding and cleaning device for wafer processing is provided for the utility model.

[0017] Fig. 3The utility model provides an automatic grinding and cleaning device for wafer processing.

[0018] In the figure: 1, workbench; 2, drain groove; 3, lifting hydraulic cylinder; 4, support; 5, main shaft motor; 6, spray head; 7, fan-shaped framework; 8, cleaning cloth one; 9, cleaning type support table; 901, base; 902, multi-way rotary joint; 903, miniature waterproof reduction motor; 904, pinion; 905, outer gear ring; 906, conical connecting shell; 907, round frame; 908, waterproof rubber sleeve; 909, water guide groove; 910, cleaning cloth two; 911, water inlet hole; 912, disc; 913, cleaning cloth three. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments.

[0020] In the description of the utility model, it needs to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the utility model and simplifying the description, and therefore cannot be understood as limiting the utility model to having a specific orientation, being constructed and operated in a specific orientation, and therefore cannot be understood as limiting the utility model.

[0021] Referring to the drawings Figs. 1-3 An automatic grinding and cleaning device for wafer processing includes a workbench 1, the workbench 1 is provided with a drain groove 2, the inner bottom surface of the drain groove 2 is provided with a cleaning type support table 9 for placing a wafer, the round frame 907 in the cleaning type support table 9 is lower than the upper end edge of the drain groove 2, the cleaning type support table 9 includes a disc 912 for horizontally placing a wafer, the round frame 907 is fixedly installed at the upper end of the conical connecting shell 906, a plurality of drain holes are formed in the outer wall of the round frame 907, and the cleaning cloth three 913 is fixedly and tightly installed on the inner wall.

[0022] In the embodiment, the upper surface cleaning mechanism is arranged above the disc 912 and can be lifted, the upper surface cleaning mechanism includes a fan-shaped cleaning brush and a spray head 6, the fan-shaped cleaning brush is composed of a fan-shaped framework 7 and a cleaning cloth one 8, the upper surface of the cleaning cloth one 8 is arranged on the lower surface of the fan-shaped framework 7, a lifting hydraulic cylinder 3 is fixedly installed on one side of the workbench 1, a main shaft motor 5 is fixedly connected to the top end of the piston rod in the lifting hydraulic cylinder 3 through a support 4, the spray head 6 is vertically arranged downward, is fixedly installed on one side of the support 4 and located above the disc 912, and the output shaft of the main shaft motor 5 is vertically arranged downward and is fixedly connected to the upper portion of the fan-shaped cleaning brush in a coaxial mode.

[0023] It should be noted that the cleaning cloth 8 is made of polyamide material, and the following cleaning cloth 910 and cleaning cloth 913 are also made of polyamide material, which has high wear resistance and flexibility, and can adapt to the surface of wafers of different shapes. When the cleaning cloth 8 under the fan-shaped cleaning brush is lowered by the lifting hydraulic cylinder 3 and the wafer placed on the disc 912 is in contact with each other, the circuit in the main shaft motor 5 is connected, so that the output shaft of the main shaft motor 5 drives the cleaning cloth 8 under the fan-shaped cleaning brush to rotate and wipe the upper surface of the wafer, that is, the diameter of the fan-shaped cleaning brush is greater than the diameter of the wafer.

[0024] In this embodiment, the cleaning support table 9 further comprises a conical connecting shell 906, a multi-way rotary joint 902 and a base 901 coaxially arranged from top to bottom. The base 901 is fixedly connected with the workbench 1, and the upper and lower ends of the multi-way rotary joint 902 are fixedly connected with the lower end of the conical connecting shell 906 and the upper end of the base 901 respectively, that is, the lower end of the conical connecting shell 906 and the base 901 are rotatably connected.

[0025] In this embodiment, a micro waterproof reduction motor 903 is further fixedly installed on the inner wall of the drainage groove 2. The output shaft of the micro waterproof reduction motor 903 is fixedly installed with a pinion 904 through a shaft coupling. The pinion 904 and an outer gear ring 905 fixedly arranged on the lower end of the conical connecting shell 906 are in meshing engagement. The micro waterproof reduction motor 903, the pinion 904 and the outer gear ring 905 can be sealingly and waterproofly installed in the workbench 1 below the drainage groove 2. When the micro waterproof reduction motor 903 is powered, the output shaft of the micro waterproof reduction motor 903 can drive the wafer on the disc 912 to rotate through the pinion 904 and the outer gear ring 905 in meshing engagement.

[0026] It should be noted that the direction in which the disc 912 drives the wafer to rotate is opposite to the direction in which the fan-shaped cleaning brush drives the wafer to rotate.

[0027] In this embodiment, the upper surface of the disc 912 is attached with the cleaning cloth 910, and the center is provided with a water inlet hole 911. The spray head 6 and the water inlet hole 911 are communicated with the cleaning agent or ultrapure water through a water pump. The outlet of the water pump is communicated with a three-way pipe. One outlet of the three-way pipe is directly connected with the water inlet of the spray head 6 through a conduit. Another outlet of the three-way pipe is connected with one inlet at the lower end of the multi-way rotary joint 902 through a conduit. The corresponding outlet above the multi-way rotary joint 902 is connected with the water inlet hole 911 below through a conduit, so as to realize the automatic output of the cleaning agent or ultrapure water from the water inlet hole 911 and the spray head 6. The lower surface and the upper surface of the wafer on the disc 912 are sprayed and cleaned. The upper end surface of the disc 912 is provided with a plurality of water guide grooves 909 which are communicated with the water inlet hole 911. The plurality of water guide grooves 909 are used to guide the cleaning agent or ultrapure water entering the water inlet hole 911 to diffuse and wet the cleaning cloth 910, wipe the wafer, and guide the impurities generated by wiping into the water guide grooves 909 through the rotation and friction between the disc 912 and the wafer.

[0028] In this embodiment, the disc 912 is arranged in the circular frame 907. The lower end of the disc 912 and the inner wall of the lower end of the conical connecting shell 906 are connected with a mini hydraulic machine through a connecting frame. The outer wall of the disc 912 and the inner wall of the circular frame 907 are connected in a lifting manner. The outer periphery of the mini hydraulic machine is provided with a waterproof rubber sleeve 908. The shell in the mini hydraulic machine is fixedly connected with the conical connecting shell 906. The top end of the piston rod of the mini hydraulic machine is fixedly connected with the disc 912.

[0029] In this application, the mini hydraulic machine can be lifted to drive the disc 912 to rise above the upper end edge of the drain groove 2, so that the wafer can be placed on the disc 912. When the wafer is cleaned, the mini hydraulic machine can be lowered to drive the disc 912 to descend and be arranged in the circular frame 907, so as to avoid the wafer from being separated outwardly during cleaning and to protect the outer wall of the wafer by the cleaning cloth 913 on the inner wall of the circular frame 907.

[0030] The utility model discloses, through the hydraulic lift cylinder 3 will fan -shaped cleaning brush below the cleaning cloth no. 8 drop, and the wafer that is placed on the disc 912 adheres each other contact when, the lower surface of wafer adheres on cleaning cloth no. 2 910, again by water pump extraction cleaning agent or ultrapure water, respectively transport to the shower nozzle 6 and water inlet hole 911, the upper surface and lower surface of wafer are injected cleaning agent or ultrapure water simultaneously, again by the output shaft of main shaft motor 5 drive fan -shaped cleaning brush below the cleaning cloth no. 8 rotation wipe the upper surface of wafer, and the output shaft of micro -water -proof reduction motor 903 can drive the wafer on disc 912 rotate through the intermeshing pinion 904 and outer ring gear 905, and the direction that disc 912 drives wafer rotates and the direction that fan -shaped cleaning brush drives wafer rotates are opposite, so that cleaning cloth no. 8 and cleaning cloth no. 2 910 can rotate and clean wipe the upper and lower two lateral surface of wafer simultaneously, comprehensively, the wafer cleaning of the present application, realized the purpose that the upper and lower two sides of wafer can be sprayed and cleaned simultaneously.

[0031] The above, only for the preferable specific implementation mode of the utility model, but the protection scope of the utility model does not limit to this, any skilled in the art technical personnel in the utility model discloses the technical range, according to the utility model technical scheme and the utility model concept of the utility model, equivalent replacement or change, all should cover in the protection scope of the utility model.

Claims

1. A kind of automatic polishing cleaning device for wafer processing, including workbench (1), the workbench (1) is provided with drain groove (2), it is characterized by: The inner bottom surface of the drain groove (2) is provided with a cleaning support table (9) for placing a wafer, the cleaning support table (9) comprises a disc (912), a cleaning cloth (910) is attached to the upper surface of the disc (912), and a water inlet hole (911) is arranged at the center; An upper surface cleaning mechanism is arranged above the cleaning support table (9) in a lifting manner, the upper surface cleaning mechanism comprises a fan-shaped cleaning brush and a spray head (6), and the spray head (6) and the water inlet hole (911) are communicated with a cleaning agent or ultrapure water through a water pump.

2. The automatic polishing and cleaning apparatus for wafer processing according to claim 1, characterized by: One side of the workbench (1) is fixedly provided with a lifting hydraulic cylinder (3), the top end of the piston rod in the lifting hydraulic cylinder (3) is fixedly connected with a main shaft motor (5) through a support (4), and the output shaft of the main shaft motor (5) is vertically arranged downward and coaxially fixedly connected with the upper side of the fan-shaped cleaning brush.

3. The automatic polishing and cleaning apparatus for wafer processing according to claim 1, characterized by: The cleaning support table (9) further comprises a circular frame (907), a conical connecting shell (906), a multi-way rotary joint (902) and a base (901) arranged coaxially from top to bottom, the base (901) is fixedly connected with the workbench (1), the upper and lower ends of the multi-way rotary joint (902) are fixedly communicated with the lower end of the conical connecting shell (906) and the upper end of the base (901) respectively, the circular frame (907) is fixedly installed on the upper end of the conical connecting shell (906), and the disc (912) is arranged in the circular frame (907).

4. The automatic polishing and cleaning apparatus for wafer processing according to claim 3, wherein: A mini hydraulic machine is connected between the lower end of the disc (912) and the inner wall of the lower end of the conical connecting shell (906) through a connecting frame, and the outer wall of the disc (912) and the inner wall of the circular frame (907) are connected in a lifting mode.

5. The automatic polishing and cleaning apparatus for wafer processing according to claim 4, wherein: A waterproof rubber sleeve (908) is arranged on the periphery of the mini hydraulic machine, a plurality of drain holes are arranged on the outer wall of the circular frame (907), and a cleaning cloth (913) is attached to the inner wall.

6. The automatic polishing and cleaning apparatus for wafer processing according to claim 3, wherein: A miniature waterproof reduction motor (903) is further fixedly installed on the inner wall of the drain groove (2), an output shaft of the miniature waterproof reduction motor (903) is fixedly provided with a pinion (904) through a shaft coupling, and the pinion (904) and an external gear ring (905) arranged on the periphery of the lower end of the conical connecting shell (906) are meshed with each other.

Images