Semiconductor chip turnover device

Abstract

The utility model provides a semiconductor chip turnover device, and belongs to the technical field of semiconductor chip packaging. Comprising a rack and three groups of clamping and overturning mechanisms, unified processing of a plurality of semiconductor chips can be realized by arranging the three or more groups of clamping and overturning mechanisms, and the three groups of clamping and overturning mechanisms are mainly formed by rotatably connecting overturning plates to the rack. The two groups of air cylinders are driven to synchronously contract, and the distance between the supporting plates mounted in the mounting blocks on the two supporting plate connecting rods can be accurately controlled through sliding adjustment, so that the semiconductor chips with different sizes can be adapted. After the semiconductor chip is clamped by the two supporting plates, the servo motor is started, and the servo motor drives the turnover plate to rotate / turn over, so that punched waste plastic fragments fall off from the runner, accumulation of waste plastic in the semiconductor runner is effectively avoided, cleanliness of the runner is kept, processing efficiency is improved, and the service life of the semiconductor chip is prolonged. And a tidier working environment is provided for subsequent processing steps.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor chip packaging technology, and in particular to a semiconductor chip strip flipping device for AUTO-MGP packaging equipment. Background Technology

[0002] Currently, the transfer platform used in AUTO-MGP packaging equipment does not have a semiconductor chip flipping device. As a result, when producing injection molded strips with the front side facing up, waste plastic from the runner is easily left on the strip surface after punching the runner, affecting its entry into the next process.

[0003] Therefore, this application provides a strip flipping device for use in a semiconductor chip strip AUTO-MGP packaging apparatus. Utility Model Content

[0004] The technical problem to be solved by this utility model is to provide a semiconductor chip flipping device. By adding a strip semiconductor chip flipping device to the transfer platform, the injection molding strip facing upward can be flipped so that it is still facing downward in the flow channel, so that the waste plastic from the flow channel after punching will not remain on the surface of the strip.

[0005] To solve the above-mentioned technical problems, this utility model provides the following technical solution:

[0006] A semiconductor chip flipping device, comprising:

[0007] frame;

[0008] Multiple clamping and flipping mechanisms are mounted on a frame for flipping semiconductor chips. Each clamping and flipping mechanism includes a flipping plate rotatably connected to the frame. Two sets of cylinders with opposite and staggered telescopic ends are installed at the bottom of the flipping plate. Push blocks are provided on the telescopic ends of the two sets of cylinders. A tray connecting rod is provided on the push block. Slider blocks are provided on both sides of the tray connecting rod. Slide rails are provided on both sides of the bottom of the flipping plate, and the sliders are slidably connected to the slide rails. An mounting block is also installed on the tray connecting rod, and a tray for clamping semiconductor chips is detachably mounted on the mounting block.

[0009] The driving unit is used to drive the clamping and flipping mechanism to flip. The driving unit includes a servo motor, which is connected to the clamping and flipping mechanism in a transmission manner.

[0010] Optionally, the flipping plate is provided with flipping linkages on both sides. One side of the flipping linkage is rotatably connected to a rotating shaft, and the rotating shaft is connected to the frame. The other side of the flipping linkage is provided with a first drive wheel, and the first drive wheel is connected to a servo motor. The other side of the flipping linkage is rotatably connected to the frame. The servo motor drives the first drive wheel to rotate, thereby realizing the flipping motion of the flipping plate.

[0011] Optionally, the servo motor is mounted on the flipping link of one set of clamping and flipping mechanisms via a coupling, and a second drive wheel is mounted on the flipping link of another set of clamping and flipping mechanisms. The first drive wheel between multiple sets of clamping and flipping mechanisms is connected to the second drive wheel via a transmission component. The transmission between three or more sets of clamping and flipping mechanisms is achieved by adding a second drive wheel and a transmission component.

[0012] Optionally, one set of cylinders is mounted at the bottom of the flipping plate via a heightening bracket, and the pallet connecting rod on the push block in the telescopic end of the other set of cylinders passes through the heightening bracket. The heightening bracket provides the other set of pallet connecting rods with a movement trajectory, so that the pallet connecting rod on one set of cylinders will not collide with the other set of cylinders.

[0013] Optionally, the frame is also equipped with a limit cylinder, and the telescopic end of the limit cylinder is connected to the flip plate. When the flip plate flips at a certain angle, the telescopic end of the limit cylinder extends out of the flip plate and the flip plate flips through the telescopic end of the limit cylinder to limit the flipping to continue flipping, so as to prevent excessive flipping and thus prevent the flip plate from being unable to keep horizontal.

[0014] Optionally, the length of the push block, slider, and mounting block on one set of cylinders is greater than that on the other set of cylinders, and the push blocks, sliders, and mounting blocks on both sets of cylinders are arranged in parallel. By lengthening the push block, slider, and mounting block on the corresponding set of cylinders, the push blocks, sliders, and mounting blocks on both sets of cylinders are arranged horizontally, thereby ensuring that the semiconductor chip clamped on the tray is horizontal, which facilitates the punching of the flow channel.

[0015] Optionally, the tray is fixed to the mounting block by bolts. The tray is fixed to the mounting block by bolts, and the tray is installed on the mounting block by bolts. So when it is necessary to replace the tray of different specifications, it is only necessary to unscrew the bolts to replace it, and then fix it with bolts to realize the replacement of the tray of different specifications.

[0016] Compared with the prior art, this utility model has at least the following beneficial effects:

[0017] By driving two sets of cylinders to retract synchronously, during the retraction process, the extension and retraction ends of the two sets of cylinders respectively drive two push blocks to move in a predetermined direction. The pallet connecting rods connected to the two push blocks are driven as the push blocks move, and respectively drive the sliders installed at their ends to move on the slide rails. By sliding adjustment, the distance between the pallets installed in the mounting blocks on the two pallet connecting rods can be precisely controlled, thus accommodating semiconductor chips of different sizes. After the two pallets clamp the semiconductor chip, the servo motor is activated. The servo motor drives the flipping plate to rotate / flip, causing the waste plastic fragments that have been punched off to fall from the flow channel. This effectively avoids the accumulation of waste plastic in the semiconductor flow channel, maintains the cleanliness of the flow channel, improves processing efficiency, and provides a cleaner working environment for subsequent processing steps. Attached Figure Description

[0018] The accompanying drawings, which are incorporated herein and form part of the specification, illustrate embodiments of the present invention and, together with the specification, further serve to explain the principles of the present invention and enable those skilled in the art to implement and use the present invention.

[0019] Figure 1 This is a schematic diagram of a semiconductor chip flipping device.

[0020] Figure 2 A three-dimensional structural diagram of the clamping and flipping mechanism;

[0021] Figure 3 A top view of the clamping and flipping mechanism;

[0022] Figure 4 This is a schematic diagram of the tray structure.

[0023] [Figure Labels]

[0024] 1. Frame; 2. Tilting plate; 3. Tilting linkage; 4. Rotating shaft; 5. First drive wheel; 6. Cylinder; 7. Push block; 8. Support plate linkage; 9. Slider; 10. Slide rail; 11. Mounting block; 12. Support plate; 13. Heightening bracket; 14. Servo motor; 15. Coupling; 16. Second drive wheel; 17. Limit cylinder.

[0025] As shown in the figure, specific structures and devices are marked in the figure to clearly illustrate the structure of the embodiment of this utility model. However, this is only for illustrative purposes and is not intended to limit this utility model to this specific structure, device and environment. Those skilled in the art can adjust or modify these devices and environments according to specific needs. Detailed Implementation

[0026] The semiconductor chip flipping device provided by this utility model will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, to make the embodiments more detailed, the following embodiments are the best and preferred embodiments, and those skilled in the art can use other alternative methods to implement some known technologies; moreover, the accompanying drawings are only for more specific description of the embodiments and are not intended to specifically limit this utility model.

[0027] It should be noted that the use of terms such as "an embodiment," "an embodiment," "an exemplary embodiment," and "some embodiments" in the specification indicates that the described embodiment may include a specific feature, structure, or characteristic, but not every embodiment necessarily includes that specific feature, structure, or characteristic. Furthermore, when a specific feature, structure, or characteristic is described in connection with an embodiment, implementing such a feature, structure, or characteristic in conjunction with other embodiments (whether explicitly described or not) should be within the knowledge of those skilled in the art.

[0028] Generally, terms can be understood at least partly from their use in context. For example, depending at least partly on the context, the term "one or more" as used herein can be used to describe any feature, structure, or characteristic in a singular sense, or a combination of features, structures, or characteristics in a plural sense. Additionally, the term "based on" can be understood not necessarily to convey an exclusive set of factors, but rather, alternatively, depending at least partly on the context, to allow for the presence of other factors that are not necessarily explicitly described.

[0029] It is understood that the meanings of “on”, “above”, and “above” in this utility model should be interpreted in the broadest manner, such that “on” not only means “directly on” something, but also includes the meaning of being “on” something with an intervening feature or layer, and that “above” or “above” not only means “on” something, but also includes the meaning of being “on” something without an intervening feature or layer.

[0030] Furthermore, spatially related terms such as “below,” “under,” “lower,” “above,” and “upper” are used herein for convenience to describe the relationship of one element or feature to one or more other elements or features, as illustrated in the accompanying drawings. Spatially related terms are intended to cover different orientations in the use or operation of the device other than those depicted in the accompanying drawings. The device may be oriented in other ways, and the spatially related descriptive terms used herein can be interpreted similarly.

[0031] like Figure 1 - Figure 4As shown, an embodiment of this utility model provides a semiconductor chip flipping device, including a frame 1 and a clamping flipping mechanism. The clamping flipping mechanism is provided in three sets. By providing three or more sets, multiple semiconductor chips can be processed in a unified manner. The three sets of clamping flipping mechanisms are mainly composed of flipping plates 2 rotatably connected to the frame 1. The bottom of each of the three sets of clamping flipping mechanisms is provided with two sets of cylinders 6. The extension and retraction ends of the two sets of cylinders 6 are opposite to each other and the two sets of cylinders 6 are staggered. Specifically, the extension and retraction end of one set of cylinders 6 faces the extension and retraction end of the other set of cylinders 6, and one set of cylinders 6 is opposite to the other set of cylinders 6 and is located on its side.

[0032] Both sets of cylinders 6 have push blocks 7 fixed to their telescopic ends. Each push block 7 on both sets of cylinders 6 has a support plate connecting rod 8 fixed to it. Each end of each support plate connecting rod 8 has a slider 9 fixed to it. Slide rails 10 are provided on both sides of the bottom of each of the three sets of flip plates 2, and the sliders 9 on each of the three sets of flip plates 2 are slidably mounted on their respective slide rails 10. Each support plate connecting rod 8 also has a mounting block 11, on which a support plate 12 is detachably mounted, holding the processed semiconductor chip.

[0033] The specific method of detachable installation is as follows: the tray 12 is fixed to the mounting block 11 by bolts. The tray 12 is installed on the mounting block 11 by bolts. So when it is necessary to replace the tray 12 of different specifications, simply unscrew the bolts to replace it, and fix it with bolts to achieve the replacement of the tray 12 of different specifications.

[0034] It also includes a servo motor 14 for driving the clamping and flipping mechanism, and the servo motor 14 is connected to the flipping plate 2 for transmission, and the clamping and flipping mechanism is driven to rotate by the servo motor 14.

[0035] Specifically, by driving two sets of cylinders 6 to retract synchronously, during the retraction process, the extension and retraction ends of the two sets of cylinders 6 respectively drive two push blocks 7 to move in a predetermined direction. The pallet connecting rods 8 connected to the two push blocks 7 are driven as the push blocks 7 move, and respectively drive the sliders 9 installed at their ends to move on the slide rails 10. By sliding adjustment, the distance between the pallets 12 installed in the mounting blocks 11 on the two pallet connecting rods 8 can be precisely controlled, thereby accommodating semiconductor chips of different sizes. After the two pallets 12 clamp the semiconductor chip, the servo motor 14 is started. The servo motor 14 drives the flipping plate 2 to rotate / flip, causing the waste plastic fragments that have been punched off to fall from the flow channel, effectively avoiding the accumulation of waste plastic in the semiconductor flow channel, maintaining the cleanliness of the flow channel, improving processing efficiency, and providing a cleaner working environment for subsequent processing steps.

[0036] like Figure 1 - Figure 3As shown, the specific way in which the flip plate 2 is rotatably connected to the frame 1 is as follows: flipping connecting rods 3 are fixed on both sides of the flip plate 2, and a rotating shaft 4 is rotatably connected to one side of the flipping connecting rod 3. The rotating shaft 4 is installed on the frame 1. A first drive wheel 5 is installed on the other side of the flipping connecting rod 3. The other side of the flipping connecting rod 3 is rotatably connected to the frame 1 through the rotating shaft. The servo motor 14 is connected to the first drive wheel 5 through transmission. The servo motor 14 drives the first drive wheel 5 to rotate, thereby realizing the flipping motion of the flip plate 2.

[0037] like Figure 1 As shown, the transmission connection between the three or more sets of clamping and flipping mechanisms is as follows: the servo motor 14 is installed at the end of the flipping link 3 on the first drive wheel 5 through the coupling 15. The flipping link 3 on the first drive wheel 5 is also equipped with a second drive wheel 16. The first drive wheel 5 is connected to the second drive wheel 16 through a transmission component. The transmission between the three or more sets of clamping and flipping mechanisms is achieved by adding the second drive wheel 16 and the transmission component.

[0038] The first drive wheel 5 and the second drive wheel 16 are either pulleys or gears, and the transmission component is either a belt or a chain.

[0039] like Figure 2 - Figure 4 As shown, the plate connecting rods 8 on the two sets of cylinders 6 that are opposite and staggered at the telescopic ends will come into contact with one of the sets of cylinders 6 when they move, thus preventing them from moving. By adding a heightening bracket 13 to one set of cylinders 6 and installing it at the bottom of the flip plate 2, the plate connecting rods 8 on the push block 7 at the telescopic end of the other set of cylinders 6 are installed through the heightening bracket 13. The heightening bracket 13 gives the other set of plate connecting rods 8 a movement trajectory, so that the plate connecting rods 8 on one set of cylinders 6 will not come into contact with the other set of cylinders 6.

[0040] like Figure 3 - Figure 4 As shown, when the heightening bracket 13 is added, the position of one set of cylinders 6 changes, and the horizontal level of the push block 7, slider 9 and mounting block 11 cannot be kept consistent. By lengthening the push block 7, slider 9 and mounting block 11 on the corresponding set of cylinders 6, the push block 7, slider 9 and mounting block 11 on both sets of cylinders 6 are kept horizontally arranged, thereby ensuring that the semiconductor chip clamped on the tray 12 is horizontal, which facilitates the punching of the flow channel.

[0041] like Figure 1As shown, a limit cylinder 17 is also provided on the frame 1, and the telescopic end of the limit cylinder 17 is connected to the flip plate 2. By adding the limit cylinder 17, when the flip plate 2 flips at a certain angle, the telescopic end of the limit cylinder 17 extends out of the flip plate 2 and continues to flip after the flip plate 2 flips, preventing excessive flipping and thus causing the flip plate 2 to be unable to keep horizontal (the movement trajectory is large when using the motor drive method, and it is impossible to accurately locate the hovering position).

[0042] The working principle provided by this utility model is to drive two sets of cylinders 6 to retract synchronously. During the retraction process, the extension and retraction ends of the two sets of cylinders 6 respectively drive two push blocks 7 to move in a predetermined direction. Each of the two push blocks 7 is connected to a tray connecting rod 8. One set of cylinders 6 is equipped with a heightening bracket 13 and installed at the bottom of the flip plate 2. The tray connecting rod 8 on the push block 7 in the extension and retraction end of the other set of cylinders 6 is installed through the heightening bracket 13. The heightening bracket 13 gives the other set of tray connecting rods 8 a movement trajectory, so that the tray connecting rod 8 on one set of cylinders 6 will not collide with the other set of cylinders 6. As the push block 7 moves, it is driven and drives the slider 9 installed at its end to move on the slide rail 10. By sliding adjustment, the distance between the trays 12 installed in the mounting blocks 11 on the two tray connecting rods 8 can be precisely controlled, thereby adapting to semiconductor chips of different sizes.

[0043] After the two trays 12 clamp the semiconductor chip, the servo motor 14 is started. The servo motor 14 drives the flip plate 2 to rotate / flip. (The servo motor 14 is set at the end of one set of flipping linkage 3 on the first drive wheel 5 through a coupling 15. The other set of flipping linkage 3 on the first drive wheel 5 is also equipped with a second drive wheel 16. The first drive wheel 5 is connected to the second drive wheel 16 through a transmission component. The transmission between three or more sets of clamping and flipping mechanisms is realized by adding the second drive wheel 16 and the transmission component.)

[0044] This utility model encompasses any substitutions, modifications, equivalent methods, and solutions made within the spirit and scope of this utility model. To provide the public with a thorough understanding of this utility model, specific details are described in detail in the following preferred embodiments; however, those skilled in the art will fully understand this utility model even without these detailed descriptions. Furthermore, to avoid unnecessary confusion regarding the essence of this utility model, well-known methods, processes, procedures, components, and circuits are not described in detail.

[0045] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A semiconductor chip flipping device, characterized in that, include: Rack (1); Multiple sets of clamping and flipping mechanisms are placed on the frame (1) for the flipping operation of semiconductor chips; Multiple clamping and flipping mechanisms include a flipping plate (2) rotatably connected to the frame (1). Two sets of cylinders (6) with opposite and staggered telescopic ends are installed at the bottom of the flipping plate (2). Push blocks (7) are provided on the telescopic ends of the two sets of cylinders (6). A tray connecting rod (8) is provided on the push block (7). Slider blocks (9) are provided on both sides of the tray connecting rod (8). Slide rails (10) are provided on both sides of the bottom of the flipping plate (2). The sliders (9) are slidably connected to the slide rails (10). An mounting block (11) is also installed on the tray connecting rod (8). A tray (12) for clamping semiconductor chips is detachably installed on the mounting block (11). The driving unit is used to drive the clamping and flipping mechanism to flip. The driving unit includes a servo motor (14) which is connected to the clamping and flipping mechanism in a transmission connection.

2. The semiconductor chip flipping device according to claim 1, characterized in that, The flip plate (2) is provided with flip rods (3) on both sides. A rotating shaft (4) is rotatably connected to one side of the flip rod (3), and the rotating shaft (4) is connected to the frame (1). A first drive wheel (5) is provided on the other side of the flip rod (3), and the first drive wheel (5) is connected to the servo motor (14). The flip rod (3) on the other side is rotatably connected to the frame (1).

3. The semiconductor chip flipping device according to claim 2, characterized in that, The servo motor (14) is mounted on the flipping link (3) of one set of clamping and flipping mechanisms via a coupling (15), and a second drive wheel (16) is mounted on the flipping link (3) of another set of clamping and flipping mechanisms. The first drive wheel (5) between multiple sets of clamping and flipping mechanisms is connected to the second drive wheel (16) via a transmission component.

4. The semiconductor chip flipping device according to claim 1, characterized in that, One set of cylinders (6) is set at the bottom of the flip plate (2) via a heightening bracket (13), and the support plate connecting rod (8) on the push block (7) at the telescopic end of the other set of cylinders (6) is inserted between the heightening brackets (13).

5. The semiconductor chip flipping device according to claim 1, characterized in that, The frame (1) is also provided with a limit cylinder (17), and the telescopic end of the limit cylinder (17) is connected to the flip plate (2).

6. The semiconductor chip flipping device according to claim 4, characterized in that, The length of the push block (7), slider (9) and mounting block (11) on one set of cylinders (6) is greater than that on the other set of cylinders (6), and the push block (7), slider (9) and mounting block (11) on both sets of cylinders (6) are arranged in parallel.

7. The semiconductor chip flipping device according to claim 1, characterized in that, The tray (12) is fixed to the mounting block (11) by bolts.

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