Lighting device

Abstract

The application relates to a lighting device, which comprises a base, a reflector, an LED module, a support and an SMD laser module. The reflector is arranged on the base; part of the structure of the reflector is arranged in a spaced mode with the base to form a light propagation space between the two; the reflector has a reflection surface facing the light propagation space; and a wavelength conversion member is arranged in the light propagation space. The LED module is arranged on the base and used for emitting a first light beam towards the reflection surface. The support is connected to the base, and the SMD laser module is arranged on the support and located outside the light propagation space, and is used for emitting laser light towards the light propagation space. The wavelength conversion member is located on the light path of the laser light, and the laser light forms a second light beam propagating towards the reflection surface after passing through the wavelength conversion member; the first light beam and the second light beam are mixed after being reflected by the reflection surface to form the outgoing light of the lighting device. The lighting device adopts the SMD laser module as a light source, has a smaller size and a better heat dissipation effect.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of light sources, in particular to a lighting device. BACKGROUND

[0002] In the prior art, the light source for vehicle lamps is generally an LED (Light Emitting Diode) light source. The LED light source has the advantages of high luminous flux, large light spot, large irradiation area, and low cost. However, due to the low brightness and short irradiation distance, a laser is usually incident on the LED to increase the irradiation distance of the LED light source. However, the existing laser is generally a TO package (Transistor Outline package, also known as a butterfly package or coaxial package). However, the TO package makes the laser large in size and complex in structure, which is not conducive to the miniaturization of the product and the heat dissipation effect is also poor. CONTENT OF THE UTILITY MODEL

[0003] In view of the above technical problems, the embodiments of the present application provide a lighting device to improve the above technical problems.

[0004] The embodiments of the present application provide a lighting device, which comprises a base, a reflecting member, an LED module, a support member, and an SMD laser module. The reflecting member is arranged on the base. Part of the structure of the reflecting member is arranged in a spaced manner with the base to form a light propagation space between the two. The reflecting member has a reflecting surface facing the light propagation space. A wavelength conversion member is arranged in the light propagation space. The LED module is arranged on the base and is used to emit a first light beam towards the reflecting surface. The support member is connected to the base, and the SMD laser module is arranged on the support member and located outside the light propagation space. The SMD laser module is used to emit a laser towards the light propagation space. The wavelength conversion member is located on the light path of the laser. After the laser passes through the wavelength conversion member, a second light beam propagating towards the reflecting surface is formed. The first light beam and the second light beam are mixed by the reflecting surface to form an outgoing light of the lighting device.

[0005] In some optional embodiments, the LED module comprises a light source and a wavelength conversion member. The light source is arranged on the base, and the wavelength conversion member is located on the light path of the light emitted by the light source. The light emitted by the light source is converted by the wavelength conversion member to form the first light beam. The wavelength conversion member is also located on the light path of the laser. The laser is converted by the wavelength conversion member to form the second light beam.

[0006] In some optional embodiments, the wavelength conversion member has a first surface and a second surface opposite to each other. The first surface is opposite to the light emitting side of the light source, and the second surface faces the reflecting surface. The second surface is used to receive the laser.

[0007] In some optional embodiments, the reflecting member is a reflecting cup and has a light outlet communicating with the light propagation space, and the SMD laser module is arranged on the side of the reflecting member where the light outlet is located, and the laser is incident on the light propagation space through the light outlet.

[0008] In some optional embodiments, the support member is located on the side of the reflecting member where the light outlet is located, and the support member is provided with a light passage hole arranged opposite to the light outlet, and the emergent light is emitted through the light outlet and the light passage hole in sequence.

[0009] In some optional embodiments, the reflecting member is a reflecting cup and has a light outlet for the emergent light to be emitted, and the SMD laser module is arranged on the side of the reflecting member away from the reflecting surface, and the reflecting member is provided with a light transmission hole communicating with the light propagation space, and the laser is incident on the light propagation space through the light transmission hole.

[0010] In some optional embodiments, the SMD laser module comprises a substrate, a shell and a laser chip, the substrate is arranged on the support member, the shell is connected to the substrate, and the laser chip is arranged in the shell.

[0011] In some optional embodiments, the shell comprises a bottom plate, a dam and a light transmission cover plate, the bottom plate is connected to the substrate, and the dam is connected between the bottom plate and the light transmission cover plate; the SMD laser module further comprises a light guide member, the light guide member is arranged in the shell and located on the light path of the light emitted by the laser chip, and the light guide member is used to guide the light emitted by the laser chip to be emitted through the light transmission cover plate.

[0012] In some optional embodiments, the SMD laser module further comprises a light shaping element, and the light shaping element is arranged on the light path of the light emitted through the light transmission cover plate.

[0013] In some optional embodiments, the SMD laser module further comprises a heat dissipation member, the heat dissipation member is arranged between the substrate and the shell, and the surface of the side of the substrate away from the shell is attached to the surface of the support member.

[0014] Compared with the prior art, when the lighting device provided by the embodiments of the present application is used, the LED module emits a first light beam to the reflecting member; the SMD laser module emits a laser to the wavelength conversion member and forms a second light beam under the action of the wavelength conversion member, and the second light beam also propagates to the reflecting member. The first light beam and the second light beam are both reflected by the reflecting surface to be mixed into emergent light. The LED module and the SMD laser module work together to increase the intensity and irradiation distance of the emergent light. Compared with the TO package laser of the conventional technology, the SMD laser module has a smaller size and better heat dissipation effect. The lighting device of the embodiments of the present application uses the SMD laser module to cooperate with the LED module to emit light, which reduces the occupied space while ensuring the intensity of the emergent light, improves the heat dissipation effect, and has a simple overall structure and low cost. BRIEF DESCRIPTION OF DRAWINGS

[0015] In order to make the technical solution of the present application clearer, the following will briefly introduce the drawings needed in the embodiments. Obviously, the drawings described in the following description are only some of the embodiments of the present application, and all other drawings obtained by those skilled in the art without any creative effort based on the embodiments in the present application shall fall within the scope of protection of the present application.

[0016] Figure 1 is a simplified structural schematic diagram of a lighting device provided by an embodiment of the present application.

[0017] Figure 2 is Figure 1 is a simplified sectional structural schematic diagram of another embodiment of the lighting device shown in the figure.

[0018] Figure 3 is Figure 1 is a simplified sectional structural schematic diagram of an SMD laser module of the lighting device shown in the figure.

[0019] Figure 4 is Figure 3 is a simplified sectional structural schematic diagram of another embodiment of the SMD laser module shown in the figure. Label explanation: 100, lighting device; 10, base; 101, light propagation space; 30, reflecting member; 32, reflecting surface; 34, light outlet; 36, light transmission opening; 50, LED module; 52, light source; 54, wavelength conversion member; 541, first surface; 543, second surface; 70, SMD laser module; 72, substrate; 73, light guide member; 74, shell; 741, bottom plate; 743, dam; 745, light transmission cover plate; 75, light shaping element; 76, laser chip; 78, heat dissipation member; 90, support member; 92, light transmission opening; 94, connecting portion; 96, mounting portion. DETAILED DESCRIPTION

[0020] In order to make the technical solution of the present application clearer, the following will briefly introduce the drawings needed in the embodiments. Obviously, the drawings described in the following description are only some of the embodiments of the present application, and all other drawings obtained by those skilled in the art without any creative effort based on the embodiments in the present application shall fall within the scope of protection of the present application.

[0021] As used in the specification and claims, certain terminology used herein will be understood with reference to the following definitions. Unless otherwise indicated herein, definitions herein control in the event of any discrepancy.

[0022] Please refer to Figure 1 The embodiment of the present application provides a lighting device 100, which can be applied to a car lamp of a car, for example, a headlamp of a car, to provide low beam and high beam lighting for the car. Advantageously, the lighting device 100 of the embodiment of the present application can be conveniently replaced on the car and can be used for a rear-mounted car lamp.

[0023] In the embodiment, the lighting device 100 can include a base 10, a reflector 30, an LED module 50, a support 90, and an SMD (Surface Mounted Devices) laser module 70. The base 10 can be fixed to a vehicle body of a car. The reflector 30 is arranged on the base 10 and defines a light propagation space 101 in which a wavelength conversion member 54 is arranged. The reflector 30 has a reflecting surface 32 facing the light propagation space 101. The LED module 50 is arranged on the base 10 and is configured to emit a first light beam toward the reflecting surface 32. The support 90 is connected to the base 10, and the SMD laser module 70 is arranged on the support 90 and outside the light propagation space 101 and is configured to emit a laser P toward the light propagation space 101. The wavelength conversion member 54 is located in the light path of the laser P, and the laser is converted by the wavelength conversion member 54 to form a second light beam propagating toward the reflecting surface 32. The first light beam and the second light beam are mixed by the reflecting surface 32 to form an outgoing light C of the lighting device 100.

[0024] In use, the LED module 50 emits a first light beam to the reflector 30. The SMD laser module 70 emits a laser P to the wavelength conversion member 54 and forms a second light beam under the action of the wavelength conversion member 54, and the second light beam also propagates to the reflector 30. The first light beam and the second light beam are both reflected by the reflecting surface 32 to mix into the outgoing light C. The LED module 50 and the SMD laser module 70 work together to increase the intensity and irradiation distance of the outgoing light C. Compared with a TO package laser (Transistor Outline, also known as a butterfly package, coaxial package) of the prior art, the SMD laser module 70 has a smaller size and better heat dissipation effect. The lighting device 100 of the embodiment of the application uses the SMD laser module 70 to cooperate with the LED module 50 to emit light, which reduces the occupied space while ensuring the intensity of the outgoing light C, improves the heat dissipation effect, and has a simple overall structure and low cost.

[0025] In the embodiment, the base 10 can be connected to the vehicle body of a vehicle, which is used to install other structures of the lighting device 100. The base 10 is used to carry the LED module 50, and the specific type of the base 10 is not limited in the specification, for example, the base 10 can be made of metal with good heat conduction performance to play a role in dissipating heat and conducting heat to protect the LED module 50.

[0026] The reflector 30 is arranged on the base 10 and is used to reflect the first light beam and the second light beam. The specific type of the reflector 30 is not limited in the specification, for example, the reflector 30 can include at least one of a reflecting grating, a reflecting film, a reflecting mirror, and a reflecting cup. In the embodiment, the reflector 30 is a reflecting cup, which is a cup-shaped reflector. The specific structure of the reflector 30 is not limited in the specification, for example, the reflector 30 can be a complete reflecting cup. The reflector 30 is substantially a hollow cup body, one end of the reflector 30 is open, and the other end is closed. The cup body can be circular, elliptical, or of other shapes. The hollow space surrounded by the cup body of the reflector 30 is the light propagation space 101 defined by the reflector 30, and the base 10 can be fixedly connected to the inner wall of the reflector 30.

[0027] In some embodiments, the reflector 30 can also be a half-cup-shaped reflecting cup, which is substantially a hollow half-cup body. One end of the reflector 30 is open, and the other end is a closed curved surface. The open end and the closed end are spaced apart on one side. When the reflector 30 is cut along the plane where the axis is located, the cross-sectional profile of the reflector 30 can be parabolic or quarter-circular. The reflector 30 is fixedly connected to one side of the base 10, and the closed end of the half-cup body is connected to the base 10, and the open end is spaced apart from the base 10. The spacing space between the half-cup body and the base 10 is the light propagation space 101 defined by the reflector 30.

[0028] The reflector 30 has a light outlet 34 which communicates with the light propagation space 101. The light outlet 34 is the opening end of the aforementioned light cup. The laser P is incident to the light propagation space 101 through the light outlet 34, and the emergent light C is emitted through the light outlet 34. The surface of the reflector 30 facing the light propagation space 101 is a reflecting surface 32. The reflecting surface 32 reflects the light rays in the light propagation space 101 to the light outlet 34. The reflecting surface 32 can be a reflecting film, such as a metal reflecting film or a dielectric reflecting film, attached to the inner wall surface of the reflector 30. Alternatively, the reflecting surface 32 can be the inner wall surface of the reflector 30 made of a light-reflecting material. The reflecting surface 32 can be a curved surface, such as a parabolic surface or a spherical surface, which is attached to the inner wall surface of the reflector 32. The reflecting film 32 can have a light-converging effect based on its shape, thereby increasing the light intensity of the reflected light. The reflecting surface 32 can also be a planar surface attached to the inner wall surface of the reflector 30 by a support structure.

[0029] In some embodiments, the reflecting surface 32 can further be provided with a microstructure to mix the light rays while reflecting the light rays. Alternatively, the reflecting surface 32 can include a diffusion film and a reflection-enhancing film to achieve the effects of light mixing and light reflection. In other embodiments, to further improve the light utilization, the side surface of the base 10 facing the reflecting surface 32 can also be provided with a light-reflecting surface.

[0030] The LED module 50 is arranged on the base 10 and serves as the light source of the illumination device 100. In the present embodiment, the LED module 50 is located in the light propagation space 101, and the LED module 50 is configured to emit a first light beam, and the reflecting surface 32 is located in the light path of the first light beam. The LED module 50 can include a light source 52 and the aforementioned wavelength conversion member 54. The light source 52 is arranged on the base 10, and the wavelength conversion member 54 is located in the light path of the light emitted by the light source 52. The light emitted by the light source 52 is converted by the wavelength conversion member 54 to form the first light beam. The wavelength conversion member 54 is also located in the light path of the laser P, and the laser P is converted by the wavelength conversion member 54 to form the second light beam.

[0031] As an example, the light source 52 can include an LED circuit board and an LED chip arranged on the LED circuit board. The LED circuit board is electrically connected to an external power supply to enable the LED chip to emit a light beam. The light source 52 can be bonded to the base 10. The wavelength conversion member 54 is configured to convert the light emitted by the LED chip. The present specification does not limit the specific structure of the wavelength conversion member 54. The wavelength conversion member 54 can include any one of the following structures: a fluorescent glue layer, a fluorescent powder layer, a silica gel fluorescent film, a glass fluorescent sheet, and a ceramic fluorescent sheet. The wavelength conversion member 54 can be coated on the light emitting surface of the light source 52 (e.g., on the LED chip), or can be connected to the light emitting surface of the light source 52 by bonding or encapsulation.

[0032] The wavelength conversion member 54 absorbs the light beam emitted by the light source 52 and excites fluorescence. As an example, the light beam emitted by the light source 52 is a blue light beam, and the wavelength conversion member 54 can adopt a yellow fluorescent material. The wavelength conversion member 54 absorbs blue light with a lower wavelength and converts it into yellow fluorescence with a longer wavelength. The unexcited blue light and the yellow fluorescence are mixed to form white light. In other embodiments, the light beam emitted by the light source 52 can also be a green light beam, and the wavelength conversion member 54 can also adopt a red fluorescent material.

[0033] The wavelength conversion member 54 has a first surface 541 opposite the light-emitting side of the light source 52 and a second surface 543 facing the reflective surface 32. The light beam emitted by the light source 52 enters the wavelength conversion member 54 through the first surface 541 and is converted into a first light beam by excitation of the wavelength conversion member 54, and the first light beam irradiates the reflective surface 32. The SMD laser module 70 emits laser light P, which enters the wavelength conversion member 54 from the second surface 543 and is converted into a second light beam by excitation of the wavelength conversion member 54. The first light beam and the second light beam are both emitted from the wavelength conversion member 54 and mixed into the emitted light C. The light source 52 and the SMD laser module 70 excite the wavelength conversion member 54 from both sides, further improving the intensity of the emitted light C, which can be used for the high beam part of the vehicle lamp.

[0034] In some embodiments, the LED module 50 can also include a selective transmission film, which can be disposed on the first surface 541. The selective transmission film is used to transmit the light emitted by the light source 52 and reflect the fluorescent light excited by the wavelength conversion member 54, so that most of the excited fluorescent light is emitted from the second surface 543 to the reflective surface 32, effectively improving the light utilization and further improving the light intensity of the emitted light C. As an example, the selective transmission film can selectively transmit blue light and reflect yellow light based on wavelength, or the selective transmission film can also have angle-selective transmission of large-angle light and reflection of small-angle light.

[0035] In the present embodiment, the light source 52 and the wavelength conversion member 54 can be packaged together; in other embodiments, the wavelength conversion member 54 can also be a separate wavelength conversion device located outside the LED module 50, and the wavelength conversion member 54 is located in the light path of the laser light P emitted by the SMD laser module 70. The laser light P and the light beam emitted by the LED module 50 can both irradiate the wavelength conversion member 54.

[0036] Please refer to Figure 2The specific position of the SMD laser module 70 is not limited in the present specification. For example, the SMD laser module 70 can be arranged on the side of the reflector 30 where the light outlet 34 is located, and the laser P is incident on the wavelength conversion element 54 in the light propagation space 101 through the light outlet 34. Alternatively, the SMD laser module 70 can also be arranged on the side of the reflector 30 away from the reflecting surface 32. For example, the SMD laser module 70 can be located obliquely above the reflector 30, or can be located directly behind the reflector 30 (with the side of the reflector 30 close to the light outlet 34 being the front). The SMD laser module 70 can also be located on the optical axis of the reflector 30. In this embodiment, the reflector 30 can be provided with a light transmission port 36 that communicates the light propagation space 101 with the outside, and the laser P can be incident on the wavelength conversion element 54 through the light transmission port 36.

[0037] Please refer again to Figure 1 The support 90 is connected to the base 10 and is used to mount the SMD laser module 70. In this embodiment, the SMD laser module 70 is arranged on the side of the reflector 30 where the light outlet 34 is located, and the support 90 is also arranged on the side of the reflector 30 where the light outlet 34 is located. Since the support 90 is located on the side of the light outlet 34, in order to avoid blocking the emitted light C emitted through the light outlet 34, the support 90 can be provided with a light transmission port 92 opposite the light outlet 34. The emitted light C formed by reflection of the reflecting surface 32 is emitted in sequence through the light outlet 34 and the light transmission port 92. In other embodiments, if the SMD laser module 70 is arranged on the side of the reflector 30 away from the light outlet 34, the support 90 can also be arranged on the side of the reflector 30 away from the light outlet 34.

[0038] The specific connection mode between the support 90 and the base 10 is not limited in the present specification. The support 90 can be integrally connected with the base 10, or the support 90 can be fixedly connected to the base 10 by screws, bolts or other fasteners. The SMD laser module 70 is arranged on the side of the support 90 facing the reflector 30. In order to facilitate the laser P emitted by the SMD laser module 70 to be able to irradiate on the wavelength conversion element 54, the support 90 can include a relatively inclined structure to change the angle of the laser P. Specifically, in this embodiment, the support 90 can include a connecting portion 94 and a mounting portion 96. The connecting portion 94 is connected to the base 10 and can be arranged to extend substantially in a direction perpendicular to the base 10. One end of the mounting portion 96 is connected to the connecting portion 94, and the other end is arranged obliquely towards the reflector 30. The extension direction of the mounting portion 96 intersects the extension direction of the connecting portion 94.

[0039] The SMD laser module 70 is mounted on the mounting portion 96, and the mounting portion 96 is obliquely arranged so that the SMD laser module 70 is located obliquely above the reflecting member 30. The laser P emitted by the SMD laser module 70 can avoid the reflecting member 30 and irradiate the wavelength conversion member 54. The present specification does not limit the oblique angle of the mounting portion 96 relative to the connecting portion 94, which can be adaptively adjusted according to the actual use scenario.

[0040] In other embodiments, the SMD laser module 70 can also be arranged on the side of the support member 90 away from the reflecting member 30. The support member 90 can be provided with an opening for the laser P to pass through. The support member 90 can be made of a metal material, such as copper or aluminum, which can not only support the SMD laser module 70 but also improve the heat dissipation effect of the SMD laser module 70.

[0041] Please refer to Figure 1 and Figure 3 , the SMD laser module 70 can include a substrate 72, a housing 74, and a laser chip 76. The substrate 72 is arranged on the support member 90, the housing 74 is connected to the substrate 72, and the laser chip 76 is arranged in the housing 74. The substrate 72 is used to mount the housing 74 and the laser chip 76. The laser chip 76 is used to emit the laser P, and the housing 74 is used to protect the internal devices from the influence of environmental dust and water vapor.

[0042] As an example, the laser chip 76 is a blue laser chip, and the laser P emitted by the laser chip 76 is a blue laser beam. The wavelength conversion member 54 can be a yellow fluorescent sheet. The wavelength conversion member 54 absorbs the blue laser and converts it into yellow fluorescence. The yellow fluorescence and the blue laser are mixed to form a diffuse white light, which can make the outgoing light C of the lighting device 100 brighter and also protect the eyes. When the lighting device 100 is applied to a car light, the driving safety can be relatively improved.

[0043] The housing 74 can include a bottom plate 741, a dam 743, and a light-transmitting cover plate 745. The bottom plate 741 is connected to the substrate 72, and the dam 743 is connected between the bottom plate 741 and the light-transmitting cover plate 745. The laser chip 76 is arranged on the bottom plate 741, and the dam 743 surrounds the laser chip 76 along the circumference of the bottom plate 741. The dam 743 is fixedly connected to the bottom plate 741. The light-transmitting cover plate 745 is connected to the end of the dam 743 away from the bottom plate 741. The bottom plate 741, the dam 743, and the light-transmitting cover plate 745 define a sealed space to protect the laser chip 76. The light-transmitting cover plate 745 is a light-transmitting component, and the laser P emitted by the laser chip 76 can be emitted from the light-transmitting cover plate 745.

[0044] In the embodiment, the bottom plate 741 and the dam 743 can be made of glass, ceramic or other materials, and the light-transmitting cover plate 745 can be made of glass, sapphire or other light-transmitting materials. The light-transmitting cover plate 745 can be welded to the dam 743 to further improve the sealing of the shell 74.

[0045] The substrate 72 can be a ceramic substrate, a copper substrate or the like. In the embodiment, the substrate 72 is a copper substrate, and the bottom plate 741 can be welded to the substrate 72. The copper substrate has good heat conduction efficiency, which improves the heat dissipation efficiency of the SMD laser module 70. Please refer to Figure 4 In some embodiments, the SMD laser module 70 can further include a heat dissipation member 78, which is arranged between the substrate 72 and the shell 74, and the surface of the side of the substrate 72 away from the shell 74 is attached to the surface of the support member 90. Specifically, the heat dissipation member 78 can be arranged between the bottom plate 741 and the substrate 72, and the heat dissipation member 78 improves the heat dissipation efficiency of the laser chip 76. In the embodiment, the heat dissipation member 78 can be a heat sink, for example, the heat dissipation member 78 can include at least one of a micro heat dissipation fin, a device with a black paint on the inner surface of a liquid nitrogen wall plate, a copper column with high thermal conductivity or other heat dissipation structures. The surface of the side of the substrate 72 away from the laser chip 76 is the main heat dissipation surface of the SMD laser module 70, and the substrate 72 is connected to the mounting portion 96 and attached to the surface of the mounting portion 96, which further improves the heat dissipation efficiency.

[0046] The substrate 72 can be movably connected to the mounting portion 96, so that the substrate 72 moves relative to the mounting portion 96 to adjust the emission direction of the laser P. As an example, a plurality of mounting holes can be provided on the mounting portion 96, and the substrate 72 is selectively mounted in some of the mounting holes by screws.

[0047] In the embodiment, the SMD laser module 70 can further include a light guide member 73, which is arranged in the shell 74 and located on the light path of the light emitted by the laser chip 76. The light guide member 73 is used to guide the light emitted by the laser chip 76 to be emitted via the light-transmitting cover plate 745. The light guide member 73 can be located on the light-emitting side of the laser chip 76, which is used to change the propagation direction of the laser emitted by the laser chip 76, so that the laser P can be emitted from the light-transmitting cover plate 745. The light guide member 73 can be a mirror or a reflective film. In some embodiments, the light guide member 73 can also include a prism, an optical fiber or other structures.

[0048] In some embodiments, the SMD laser module 70 can further include a light shaping element 75 disposed in the light path of the light emitted by the light-transmissive cover 745. The light shaping element 75 collimates or converges the laser light P. The adjustment of the laser beam by the light shaping element 75 can reduce the size of the laser spot incident on the wavelength conversion element 54. As an example, the light shaping element 75 can include a collimating lens for shaping a divergent laser beam into a collimated beam. The light shaping element 75 can also include a converging lens for converging the laser beam.

[0049] The light shaping element 75 can be disposed on the housing 74, for example, on the light-transmissive cover 745. In other embodiments, the light shaping element 75 can also be disposed inside the housing 74, packaged together with the laser chip 76. Alternatively, the light shaping element 75 can also be disposed outside the housing 74 as a separate component relative to the SMD laser module 70, which is more convenient for maintenance and adjustment.

[0050] In use, the lighting device 100 provided by the embodiments of the present application uses the LED module 50 to emit a first light beam to the reflector 30. The SMD laser module 70 emits laser light P to the wavelength conversion element 54 and forms a second light beam under the action of the wavelength conversion element 54, which also propagates to the reflector 30. The first light beam and the second light beam are both reflected by the reflective surface 32 to mix into the emitted light C. The LED module 50 and the SMD laser module 70 work together to increase the intensity and irradiation distance of the emitted light C. Compared with the TO package laser of the prior art, the SMD laser module 70 has a smaller size and better heat dissipation effect. The lighting device 100 of the embodiments of the present application uses the SMD laser module 70 to cooperate with the LED module 50 to emit light, which reduces the occupied space while ensuring the intensity of the emitted light C, improves the heat dissipation effect, and has a simple overall structure and low cost.

[0051] In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any appropriate manner in any one or more embodiments or examples. In addition, the person skilled in the art can combine and combine the different embodiments or examples described in the present specification and the features of the different embodiments or examples without contradiction.

[0052] Finally, it should be noted that the above examples are only used to illustrate the technical solutions of the present application, and are not intended to limit the same; although the present application has been described in detail with reference to the foregoing examples, those of ordinary skill in the art will understand that they can still modify the technical solutions described in the foregoing examples, or make equivalent replacements for some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A lighting device, characterized in that, include: Base; A reflector is disposed on the base; The reflector defines a light propagation space, the reflector has a reflective surface facing the light propagation space, and a wavelength conversion element is provided within the light propagation space; An LED module is disposed on the base; the LED module is used to emit a first beam of light toward the reflective surface; Support member, connected to the base; And an SMD laser module, disposed on the support and located outside the light propagation space, the SMD laser module being used to emit laser towards the light propagation space; The wavelength conversion element is located in the optical path of the laser. After being acted upon by the wavelength conversion element, the laser forms a second beam that propagates toward the reflective surface. The first beam and the second beam are reflected and mixed by the reflective surface to form the emitted light of the lighting device.

2. The lighting device as claimed in claim 1, characterized in that, The LED module includes a light source and a wavelength conversion element. The light source is disposed on the base, and the wavelength conversion element is located in the optical path of the light emitted by the light source. The light emitted by the light source is converted by the wavelength conversion element to form the first light beam. The wavelength conversion element is also located in the optical path of the laser, and the laser is converted by the wavelength conversion element to form the second light beam.

3. The lighting device as described in claim 2, characterized in that, The wavelength conversion element has a first surface and a second surface facing away from each other. The first surface is opposite to the light-emitting side of the light source, and the second surface faces the reflective surface. The second surface is used to receive the laser light.

4. The lighting device as claimed in claim 1, characterized in that, The reflector is a reflective cup and has a light outlet that connects to the light propagation space. The SMD laser module is disposed on the side of the reflector where the light outlet is located, and the laser is incident into the light propagation space through the light outlet.

5. The lighting device as described in claim 4, characterized in that, The support member is located on the side of the reflector where the light outlet is located. The support member has a light transmission port that is opposite to the light outlet. The emitted light is emitted sequentially through the light outlet and the light transmission port.

6. The lighting device as claimed in claim 1, characterized in that, The reflector is a reflector cup and has a light outlet for the emitted light to be emitted. The SMD laser module is disposed on the side of the reflector away from the reflective surface. The reflector has a light-transmitting port that connects to the light propagation space. The laser is incident into the light propagation space through the light-transmitting port.

7. The lighting device according to any one of claims 1 to 6, characterized in that, The SMD laser module includes a substrate, a housing, and a laser chip. The substrate is disposed on the support member, the housing is connected to the substrate, and the laser chip is disposed inside the housing.

8. The lighting device as claimed in claim 7, characterized in that, The housing includes a base plate, a dam, and a light-transmitting cover plate. The base plate is connected to the substrate, and the dam is connected between the base plate and the light-transmitting cover plate. The SMD laser module also includes a light guide, which is disposed inside the housing and located in the optical path of the light emitted by the laser chip. The light guide is used to guide the light emitted by the laser chip to exit through the light-transmitting cover plate.

9. The lighting device as claimed in claim 8, characterized in that, The SMD laser module also includes a light shaping element, which is disposed on the optical path of the light emitted through the light-transmitting cover plate.

10. The lighting device as claimed in claim 7, characterized in that, The SMD laser module also includes a heat sink, which is disposed between the substrate and the housing, with the surface of the substrate facing away from the housing attached to the surface of the support.

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