Micro-channel refrigeration and heat dissipation device

Abstract

The utility model relates to a micro-channel refrigeration and heat dissipation device which comprises a heat dissipation base with a plurality of micro-channels and an installation cover arranged above the heat dissipation base. The installation cover comprises a cover body, a containing groove formed in the bottom of the cover body, a medium input cavity formed by sinking upwards from the side edge of the top face of the side, where a medium inlet is located, of the containing groove, and a medium output cavity formed by sinking upwards from the side edge of the top face of the side, where a medium outlet is located, of the containing groove. The input port and the output port are formed in the side portion of the cover body and communicate with the medium input cavity and the medium output cavity correspondingly, the sizes of the medium input cavity and the medium output cavity in the direction perpendicular to the length direction of the micro-channel are gradually reduced from bottom to top, and the input port and the output port communicate with the tops of the medium input cavity and the medium output cavity correspondingly. According to the utility model, the flow of media in the plurality of micro-channels is uniform and consistent, the media in each micro-channel are ensured to flow smoothly, the heat dissipation efficiency of each area on the heat dissipation surface of the heat dissipation device is ensured, and the heat dissipation effect is further ensured.

Description

TECHNICAL FIELD

[0001] The utility model relates to a microchannel refrigeration heat dissipation device, be applicable to microchannel heat exchange technical field. BACKGROUND

[0002] The microchannel refrigeration heat dissipation device is the heat dissipation device that channel equivalent diameter is at 10-1000 mu m, and there are dozens of fine flow channel for heat exchange medium flow in this kind of device, and it has the advantages of compact structure, light and handy, high efficiency. The microchannel refrigeration heat dissipation device is mainly applied in electronic industry, for example TEC chip test etc. The structure of the existing heat dissipation device is mostly by setting an input pipeline and an output pipeline to be communicated with the medium inlet and the medium outlet of several microchannels respectively, and the medium inlet and the medium outlet of each microchannel are located on a straight line, and the pipe diameter of the input pipeline and the output pipeline is usually less than the length of the straight line formed by the medium inlet or the medium outlet, and this kind of structure is relatively simple, but on the one hand, after the heat exchange medium flows out from the input pipeline, a part directly enters the microchannel close to the input pipeline port, and the other part flows to both sides and sequentially flows into the microchannel away from the input pipeline port, which leads to the difference in the flow of the medium flowing from the microchannel close to the input pipeline and the microchannel away from the input pipeline. On the other hand, after the heat exchange medium flows out from the medium outlet of the microchannel, it will gather to the output pipeline instantaneously, and the medium in the microchannel close to the output pipeline can quickly pass through and discharge, and the medium in the microchannel away from the output pipeline will form a jam between the output pipeline port and the medium outlet of the microchannel, thereby greatly reducing the flow of the medium in the microchannel away from the output pipeline. The flow difference of the medium in each microchannel will make the heat dissipation efficiency of the heat dissipation surface of the heat dissipation device uneven, thereby greatly affecting the heat dissipation effect of the heat dissipation device. CONTENT OF THE UTILITY MODEL

[0003] In order to solve the defects existing in the prior art, the utility model provides a microchannel refrigeration heat dissipation device.

[0004] The technical scheme adopted by the utility model is a microchannel refrigeration heat dissipation device, comprising:

[0005] The heat dissipation seat has a plurality of microchannels parallel to each other and for heat exchange medium to flow through on the upper part, and the two ends of each microchannel are the medium inlet and the medium outlet of the microchannel.

[0006] The mounting cover is arranged above the heat dissipation base, and comprises a cover body, a receiving groove arranged at the bottom of the cover body and used for embedding the heat dissipation base, a medium input cavity formed by recessing the top side edge of the receiving groove from the side where the medium inlet is located, a medium output cavity formed by recessing the top side edge of the receiving groove from the side where the medium outlet is located, an input port and an output port arranged at the side of the cover body and respectively connected with the medium input cavity and the medium output cavity, and the dimensions of the medium input cavity and the medium output cavity gradually decrease from bottom to top in the direction perpendicular to the length direction of the microchannel, and the input port and the output port are respectively connected to the top of the medium input cavity and the medium output cavity. By arranging the medium input cavity and the medium output cavity in the receiving groove, the medium input cavity is connected with the medium inlet of the microchannel, and the medium output cavity is connected with the medium outlet of the microchannel, and the medium input cavity and the medium output cavity are both arranged in the structure of gradually increasing from bottom to top, so that the heat exchange medium flows into the medium input cavity from the input port and flows downward, and the heat exchange medium is diffused along with the increase of the size of the medium input cavity, so that the heat exchange medium is uniformly dispersed in each medium inlet when the heat exchange medium flows into the medium inlets of the microchannels, and the flow of the medium in each microchannel is relatively uniform; and when the heat exchange medium flows out of the medium outlets of the microchannels, the medium output cavity can guide and buffer the medium, so that the medium flowing out of each microchannel gradually converges along the medium output cavity, the flow is prevented, and the medium in each microchannel flows smoothly, so that the heat dissipation efficiency of each area on the heat dissipation surface of the heat dissipation device is ensured, and the heat dissipation effect is further ensured.

[0007] Further, the projections of the medium input cavity and the medium output cavity on the plane perpendicular to the length direction of the microchannel are both triangular, the medium inlets of the microchannels are arranged along one bottom edge of the medium input cavity, and the input port is located at the top corner opposite to the bottom edge; the medium outlets of the microchannels are arranged along one bottom edge of the medium output cavity, and the output port is located at the top corner opposite to the bottom edge, and the above structure realizes the diffusion of the medium in the medium input cavity and the guidance and buffering of the medium in the medium output cavity.

[0008] Further, the size of the medium input cavity in the length direction of the microchannel is greater than the size of the medium output cavity in the length direction of the microchannel, and specifically, the size of the medium input cavity in the length direction of the microchannel is twice the size of the medium output cavity in the length direction of the microchannel, by setting the size difference between the medium input cavity and the medium output cavity, the flow space of the heat exchange medium is compressed when the heat exchange medium flows out, the flow rate of the medium is increased, and the heat exchange effect is improved.

[0009] Further, the diameter of the input port is greater than the diameter of the output port, by setting the diameter difference between the input port and the output port, the medium cross-sectional area of the input port is greater than the medium cross-sectional area of the output port, so that the flow speed of the medium in the heat dissipation device is increased, and the heat exchange effect is improved.

[0010] Furthermore, the heat sink includes a heat exchange base plate and several vertically arranged, parallel heat dissipation fins on the heat exchange base plate. The tops of the heat dissipation fins abut against the top surface of the receiving groove, and the gaps between every two adjacent heat dissipation fins form microchannels. By forming microchannels on the heat dissipation fins, the heat exchange efficiency of the heat exchange medium flowing through the microchannels is improved. Furthermore, the abutment between the tops of the heat dissipation fins and the top surface of the receiving groove ensures that all the incoming heat exchange medium can flow through the microchannels between the heat dissipation fins, thus ensuring heat exchange efficiency.

[0011] Furthermore, the inlet and outlet are located on the same side of the cover body, which facilitates the organization and collection of the inlet and outlet pipes through corrugated pipes or other pipes, avoiding cluttered pipe fittings.

[0012] Furthermore, the projections of the medium input cavity and the medium output cavity on a plane perpendicular to the length direction of the microchannel have the same shape and are mirror symmetrical. The output port extends from the top of the medium output cavity through the cover body to the side where the input port is located.

[0013] Furthermore, the outer wall of the cover body is provided with at least one pair of mounting portions, and the at least one pair of mounting portions are respectively located on opposite side walls of the cover body, so as to facilitate assembly with other equipment through the mounting portions.

[0014] Due to the application of the above technical solution, this utility model has the following advantages compared with the prior art:

[0015] The microchannel cooling and heat dissipation device of this utility model, by setting up a medium input cavity and a medium output cavity with a structure that is smaller at the top and larger at the bottom, allows the heat exchange medium to be evenly dispersed when flowing into the microchannel and gradually converged when flowing out of the microchannel. This makes the flow rate of the medium in several microchannels uniform and consistent, ensuring that the medium in each microchannel flows smoothly, ensuring the heat dissipation efficiency of each area on the heat dissipation surface of the heat dissipation device, and thus ensuring the heat dissipation effect. Attached Figure Description

[0016] The following sections will describe some specific embodiments of the present invention in a detailed manner by way of example and not limitation, with reference to the accompanying drawings. The same reference numerals in the drawings denote the same or similar mechanisms or parts. Those skilled in the art should understand that these drawings are not necessarily drawn to scale. In the drawings:

[0017] Figure 1 This is a structural schematic diagram of one embodiment of the present invention;

[0018] Figure 2 yes Figure 1 The schematic diagram of the mounting cover in the embodiment shown;

[0019] Figure 3 yes Figure 1 A perspective view of the mounting cover in the illustrated embodiment;

[0020] Figure 4 is Figure 1 a structure diagram of the heat dissipation seat in the embodiment shown in the figure;

[0021] Figure 5 is Figure 4 a structure enlarged view of the A area in the embodiment shown in the figure;

[0022] The reference signs are explained as follows:

[0023] 1, heat dissipation seat; 11, microchannel; 12, heat exchange bottom plate; 13, heat dissipation fin; 2, mounting cover; 21, cover body; 211, mounting portion; 22, accommodating groove; 23, medium input cavity; 24, medium output cavity; 25, input port; 26, output port. DETAILED DESCRIPTION

[0024] The technical scheme of the present application will be described clearly and completely in combination with the drawings. Obviously, the described embodiments are some embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the present application.

[0025] In the description of the present application, it should be noted that the terms "upper" and "lower" related to the direction are defined according to the structure direction of the heat dissipation device, specifically, the direction towards which the heat exchange surface of the heat dissipation device faces is "lower", and vice versa is "upper". In addition, the technical features involved in different embodiments of the present application described below can be combined with each other as long as they do not conflict with each other.

[0026] Referring to the drawings, Figures 1-5 The microchannel refrigeration heat dissipation device in the embodiment includes:

[0027] The heat dissipation seat 1 has a plurality of microchannels 11 parallel to each other and used for flowing through the heat exchange medium on the upper portion, and the two ends of each microchannel 11 are the medium inlet and the medium outlet of the microchannel 11, respectively.

[0028] The installation cover 2 is arranged above the heat dissipation base 1, and the installation cover 2 comprises a cover body 21, a containing groove 22 arranged at the bottom of the cover body 21 and used for embedding the heat dissipation base 1, a medium input cavity 23 formed by recessing the top side edge of the containing groove 22 from the side where the medium inlet is located, a medium output cavity 24 formed by recessing the top side edge of the containing groove 22 from the side where the medium outlet is located, an input port 25 and an output port 26 arranged at the side of the cover body 21 and respectively connected with the medium input cavity 23 and the medium output cavity 24, and the size of the medium input cavity 23 and the medium output cavity 24 gradually decreases from bottom to top in the direction perpendicular to the length direction of the microchannel 11, and the input port 25 and the output port 26 are respectively connected to the top of the medium input cavity 23 and the medium output cavity 24. By arranging the medium input cavity 23 and the medium output cavity 24 to be connected with the medium inlet and the output port 26 of the microchannel 11 respectively, and arranging the medium input cavity 23 and the medium output cavity 24 to be gradually reduced from bottom to top in the direction perpendicular to the length direction of the microchannel 11, the heat exchange medium flows into the medium input cavity 23 from the input port 25 and flows downward, and the heat exchange medium is diffused along with the increase of the size of the medium input cavity 23, so that the heat exchange medium is uniformly dispersed in each medium inlet when the heat exchange medium flows into the medium inlets of the microchannels 11, and the flow of the medium in each microchannel 11 is relatively uniform. When the heat exchange medium flows out of the microchannels 11, the medium output cavity 24 can guide and buffer the medium, so that the medium flowing out of the microchannels 11 gradually converges along the medium output cavity 24, the flow is not blocked, the medium in each microchannel 11 flows smoothly, and the heat dissipation efficiency of each area on the heat dissipation surface of the heat dissipation device is ensured, thereby ensuring the heat dissipation effect.

[0029] In a more preferred embodiment, the projections of the medium input cavity 23 and the medium output cavity 24 on the plane perpendicular to the length direction of the microchannel 11 are all triangular, the medium inlets of the microchannels 11 are arranged along one bottom edge of the medium input cavity 23, and the input port 25 is located at the top corner opposite to the bottom edge; the medium outlets of the microchannels 11 are arranged along one bottom edge of the medium output cavity 24, and the output port 26 is located at the top corner opposite to the bottom edge, and the above structure realizes the diffusion of the medium in the medium input cavity 23 and the guidance and buffering of the medium in the medium output cavity 24.

[0030] In a more preferred embodiment, the size of the medium input cavity 23 in the length direction of the microchannel 11 is greater than the size of the medium output cavity 24 in the length direction of the microchannel 11, and specifically, the size of the medium input cavity 23 in the length direction of the microchannel 11 is twice the size of the medium output cavity 24. By arranging the size difference between the medium input cavity 23 and the medium output cavity 24, the flow space of the heat exchange medium is compressed when the heat exchange medium flows out, the flow rate of the medium is increased, and the heat exchange effect is improved.

[0031] In a more preferable embodiment, the diameter of the input port 25 is larger than the diameter of the output port 26, and the diameter difference between the input port 25 and the output port 26 makes the medium cross-sectional area of the input port 25 larger than that of the output port 26, so that the flow speed of the medium inside the heat dissipation device is increased, and the heat exchange effect is improved.

[0032] In a more preferable embodiment, the heat dissipation seat 1 comprises a heat exchange bottom plate 12 and a plurality of heat dissipation fins 13 vertically arranged on the heat exchange bottom plate 12 and parallel to each other, the top of each of the plurality of heat dissipation fins 13 abuts against the top surface of the accommodating groove 22, and the gap between every two adjacent heat dissipation fins 13 forms a microchannel 11. By arranging the heat dissipation fins 13 to form the microchannel 11, the heat exchange efficiency of the heat exchange medium flowing through the microchannel 11 is improved, and the top of the heat dissipation fin 13 abuts against the top surface of the accommodating groove 22, so that the flowing heat exchange medium can flow through the microchannel 11 between the heat dissipation fins 13, and the heat exchange efficiency is ensured.

[0033] In a more preferable embodiment, the input port 25 and the output port 26 are arranged on the same side of the cover body 21, so that the input pipeline and the output pipeline can be arranged together through a pipeline such as a bellows, and the pipeline is prevented from being disordered. Specifically, the projections of the medium input cavity 23 and the medium output cavity 24 formed on the plane perpendicular to the length direction of the microchannel 11 are of the same shape and are mirror-symmetric, and the output port 26 extends from the top of the medium output cavity 24 to the side where the input port 25 is located through the cover body 21.

[0034] In a more preferable embodiment, at least one pair of mounting portions 211 are arranged on the outer wall of the cover body 21, and the at least one pair of mounting portions 211 are respectively arranged on the opposite side walls of the cover body 21, so that the cover body 21 can be assembled with other devices through the mounting portions.

[0035] Thanks to the above technical scheme, the microchannel refrigeration heat dissipation device has the following advantages compared with the prior art:

[0036] The microchannel refrigeration heat dissipation device has the following advantages compared with the prior art:

[0037] The above embodiments are only for illustrating the technical concept and characteristics of the present application, and the purpose is to enable those skilled in the art to understand the content of the present application and implement it, and cannot limit the protection scope of the present application. Any equivalent changes or modifications made according to the spirit and essence of the present application shall be covered within the protection scope of the present application.

Claims

1. A microchannel refrigeration heat dissipating device, characterized by comprising: The application relates to a heat dissipation seat (1) having a plurality of micro-channels (11) parallel to each other and used for flowing through heat exchange medium, and a mounting cover (2) arranged above the heat dissipation seat (1). The mounting cover (2) comprises a cover body (21), a containing groove (22) arranged at the bottom of the cover body (21) and used for embedding the heat dissipation seat (1), a medium input cavity (23) formed by recessing the top side edge of the containing groove (22) on the side where the medium inlet is arranged, a medium output cavity (24) formed by recessing the top side edge of the containing groove (22) on the side where the medium outlet is arranged, an input port (25) and an output port (26) arranged at the side of the cover body (21) and connected with the medium input cavity (23) and the medium output cavity (24) respectively, and the size of the medium input cavity (23) and the medium output cavity (24) in the direction perpendicular to the length direction of the micro-channels (11) gradually decreases from bottom to top, and the input port (25) and the output port (26) are connected with the top of the medium input cavity (23) and the medium output cavity (24) respectively. The projections of the medium input cavity (23) and the medium output cavity (24) in the plane perpendicular to the length direction of the micro-channels (11) are all triangular, the medium inlets of the micro-channels (11) are arranged along one bottom edge of the medium input cavity (23), and the input port (25) is arranged at the top corner opposite to the bottom edge; the medium outlets of the micro-channels (11) are arranged along one bottom edge of the medium output cavity (24), and the output port (26) is arranged at the top corner opposite to the bottom edge.

2. The microchannel refrigeration heat rejection device of claim 1, wherein: The size of the medium input cavity (23) in the length direction of the micro-channels (11) is larger than the size of the medium output cavity (24) in the length direction of the micro-channels (11).

3. The microchannel refrigeration heat rejecting device of claim 1, wherein: The diameter of the input port (25) is larger than the diameter of the output port (26).

4. The microchannel refrigeration heat rejecting device of claim 1, wherein: The heat dissipation seat (1) comprises a heat exchange bottom plate (12) and a plurality of heat dissipation fins (13) vertically arranged on the heat exchange bottom plate (12) and parallel to each other, the top of each of the heat dissipation fins (13) abuts against the top surface of the containing groove (22), and the gap between every two adjacent heat dissipation fins (13) constitutes the micro-channel (11).

5. The microchannel refrigeration heat rejecting device of claim 1, wherein: The input port (25) and the output port (26) are arranged at the same side of the cover body (21).

6. The microchannel refrigeration heat rejecting unit of claim 1 wherein: The projections of the medium input cavity (23) and the medium output cavity (24) in the plane perpendicular to the length direction of the micro-channels (11) are the same in shape and mirror-symmetrical, the output port (26) extends to the side where the input port (25) is arranged through the cover body (21) from the top of the medium output cavity (24).

7. The microchannel refrigeration heat rejecting unit of claim 6 wherein: At least one pair of mounting portions (211) are arranged on the outer wall of the cover body (21), and the at least one pair of mounting portions (211) are arranged on the opposite side walls of the cover body (21) respectively.

8. The microchannel refrigeration heat rejecting unit of claim 1 wherein: ​

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