Thermal management system of tower type liquid cooling server

The tower liquid-cooled server thermal management system, through modular design and intelligent airflow monitoring, solves the problem of complex maintenance in existing technologies, enabling easy disassembly and efficient maintenance, and improving the availability and reliability of the system.

CN223598195UActive Publication Date: 2025-11-25AMAX INFORMATION TECH (SUZHOU) CO LTD
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Patent Information

Application Number
CN202422960742.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-03
Publication Date
2025-11-25
Estimated Expiration
2034-12-03

AI Technical Summary

Technical Problem

The maintenance and repair of existing tower liquid-cooled servers require specialized tools and complex processes, which increases operation and maintenance costs and affects system availability and reliability.

Method used

The modular thermal management system includes detachable liquid cooling components and an intelligent airflow monitoring unit. The liquid cooling components can be easily disassembled by using a movable slider and a fixed guide rail. It integrates a radiator, water pump, flow meter, water tank and fan, and supports personalized panel disassembly and cleaning.

Benefits of technology

It simplifies the disassembly and installation process of liquid cooling components, reduces system downtime, improves maintenance efficiency and user experience, and ensures stable system operation and efficient management.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a thermal management system of a tower type liquid cooling server, which relates to the field of tower type liquid cooling servers, and comprises a case body, a mounting plate, a liquid cooling assembly and a liquid cooling HCDU suite, the bottom of the liquid cooling assembly is fixedly connected with a movable plate, the bottom side of the movable plate is fixedly connected with at least one movable sliding block, the movable sliding block corresponds to a fixed guide rail, and the fixed guide rail is fixedly connected with the mounting plate. According to the heat management system of the tower type liquid cooling server, the liquid cooling assembly can be disassembled by pulling the movable plate, a user can easily disassemble and assemble the liquid cooling assembly without professional skills or complex tools, inspection and maintenance are convenient, the use experience of the user is improved, and the heat management system of the tower type liquid cooling server is convenient to use through modular design and simple disassembly and replacement of modules. Maintenance personnel can quickly locate problems and repair the problems, so that the downtime of the system is remarkably shortened, efficient operation is ensured, the maintenance and management efficiency of the system is improved, and the use experience of a user is optimized.
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Description

TECHNICAL FIELD

[0001] The utility model relates to tower liquid cooling server field, concretely is a tower liquid cooling server's heat management system. BACKGROUND

[0002] Tower liquid cooling server is a kind of high-performance computing equipment using liquid cooling technology.Compared with traditional air-cooled server, liquid cooling technology uses liquid (such as water or special coolant) to absorb and carry away heat generated during server operation by direct or indirect means, so as to achieve more efficient and energy-saving heat dissipation effect.This design not only improves the work efficiency of server, but also reduces noise pollution, and in high-density computing environment, it can significantly reduce the energy consumption and operating cost of data center.

[0003] Most of the tower liquid cooling servers on the market currently use multiple accessories, including cooling row, water pump, flow meter, water tank and liquid level meter, etc.;When these accessories need to be maintained or overhauled, the disassembly of accessories may require professional tools and technology, and the process is often cumbersome during disassembly, and the complex maintenance process not only increases the operation and maintenance cost, but also affects the availability and reliability of the system, so that the application of liquid cooling system is limited.

[0004] To solve this problem, we propose a heat management system for tower liquid cooling server. CONTENT OF THE UTILITY MODEL

[0005] In view of the deficiencies of prior art, the utility model provides a heat management system for tower liquid cooling server, which can effectively solve the problems in the background art.

[0006] To achieve the above purpose, the technical scheme adopted by the utility model is as follows: a heat management system for tower liquid cooling server, comprising:

[0007] The cabinet body is surrounded by front built-in panel, top plate, rear built-in panel and bottom plate in turn, and a cavity is formed inside, and the bottom of the cavity is provided with a mounting bin for mounting hot plug hard disk module and power module;

[0008] The mounting plate is arranged in the middle of the cavity to divide the cavity into two chambers, a refrigeration module bin and a mainboard bin, and at least one fixed guide rail is fixedly connected to the bottom side of the mounting plate in the refrigeration module bin;

[0009] The liquid cooling assembly is fixedly connected with the movable plate at the bottom, and the bottom side of the movable plate is fixedly connected with at least one movable sliding block, and the number of movable sliding blocks corresponds to the fixed guide rail, and each movable sliding block can be slidably matched on the corresponding fixed guide rail, and the liquid cooling assembly is disassembled by pulling the movable plate to move along the straight line direction of the fixed guide rail;

[0010] The liquid cooling HCDU set is arranged on the front built-in panel in the mainboard compartment.

[0011] As preferred, the hot plug hard disk module is arranged at the front of the mounting compartment, and the power module is arranged at the rear of the mounting compartment.

[0012] As preferred, the liquid cooling assembly is integrated with a cooling row, a water pump, a flow meter, a water tank, a fan and a liquid level meter, and further comprises a dynamic air volume monitoring and control unit connected with the flow meter, the water pump, the fan and the cooling row to realize intelligent regulation and control of the cooling liquid flow and air volume.

[0013] As preferred, the mounting plate is arranged at one side of the mainboard compartment for mounting the mainboard.

[0014] As preferred, four light sound rollers are arranged at the four corners of the bottom side of the bottom plate.

[0015] As preferred, the left appearance panel, the right appearance panel and the front appearance panel are detachably connected to the left side, the right side and the front side of the case body respectively.

[0016] As preferred, a plurality of grooves are arranged on the top plate, a plurality of top heat dissipation holes are arranged in the grooves, and a dustproof plate with a size matching that of the grooves is arranged in the grooves.

[0017] As preferred, a plurality of through holes are arranged on the front built-in panel, and a strip-shaped heat dissipation hole is arranged on the front appearance panel and corresponds to the through holes.

[0018] As preferred, a honeycomb-shaped heat dissipation hole is arranged on the left appearance panel and the right appearance panel.

[0019] Compared with the prior art, the heat management system of the tower type liquid cooling server has the following beneficial effects:

[0020] The left side, the right side and the front side of the case body are detachably connected with a left appearance panel, a right appearance panel and a front appearance panel respectively, so that the user can customize and clean the appearance panel according to requirements; the liquid cooling assembly is integrated with a dynamic air volume monitoring and control unit, a cold row, a water pump, a flow meter, a water tank, a fan and a liquid level meter, the bottom of the liquid cooling assembly is fixedly connected with a movable plate, the bottom side of the movable plate is fixedly connected with at least one movable sliding block, the movable sliding block corresponds to the fixed guide rail, the liquid cooling assembly can be disassembled by pulling the movable plate, the user can easily disassemble and install the liquid cooling assembly without professional skills or complex tools, the user experience is improved; a plurality of grooves are formed in the top plate, a plurality of top heat dissipation holes are formed in the grooves, a dustproof plate is arranged in the groove to prevent dust from entering the case, the through holes and the strip-shaped heat dissipation holes on the front built-in panel and the front appearance panel, and the honeycomb-shaped heat dissipation holes on the left and right appearance panels, together enhance air circulation and improve heat dissipation effect; the thermal management system of the tower liquid cooling server is designed in a modular manner, so that maintenance personnel can quickly locate and repair problems by simply disassembling and replacing modules, thereby significantly reducing system downtime, ensuring efficient operation, improving system maintenance and management efficiency, and optimizing user experience. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 It is a whole structure schematic diagram of the thermal management system of the tower liquid cooling server of the utility model.

[0022] Figure 2 It is a whole structure split schematic diagram of the thermal management system of the tower liquid cooling server of the utility model.

[0023] Figure 3 It is a case body structure schematic diagram of the utility model.

[0024] Figure 4 It is a case body structure schematic diagram of the utility model from another angle.

[0025] Figure 5 It is a liquid cooling assembly and dynamic air volume monitoring and control unit structure schematic diagram of the utility model.

[0026] In the figure: 1, case body; 101, front built-in panel; 102, top plate; 103, rear built-in panel; 104, bottom plate; 105, mounting bin; 106, mounting plate; 107, refrigeration module bin; 108, mainboard bin;

[0027] 2, fixed guide rail; 3, movable plate; 4, movable slider; 5, liquid cooling HCDU kit; 6, hot plug hard disk module; 7, power module; 8, liquid cooling assembly; 9, dynamic air volume monitoring and control unit; 10, light sound roller; 11, left appearance panel; 12, right appearance panel; 13, front appearance panel; 14, top heat dissipation hole; 15, dustproof plate; 16, strip-shaped heat dissipation hole; 17, honeycomb heat dissipation hole. DETAILED DESCRIPTION

[0028] In order to make the technical means, creative features, purposes and effects of the utility model easy to understand, the utility model will be further described below in combination with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only a part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the protection scope of the utility model.

[0029] In order to solve the problems of the prior art, such as Figure 1 - Figure 5 The utility model provides a tower type liquid cooling server's heat management system, including:

[0030] The cabinet body 1 is surrounded by the front built-in panel 101, the top plate 102, the rear built-in panel 103 and the bottom plate 104 in turn, and a cavity is formed inside, and the bottom of the cavity is provided with a mounting bin 105 for mounting the hot plug hard disk module 6 and the power module 7;

[0031] The mounting plate 106 is arranged in the middle of the cavity to divide the cavity into a refrigeration module bin 107 and a mainboard bin 108, at least one fixed guide rail 2 is fixedly connected to the bottom side of the mounting plate 106 in the refrigeration module bin 107, and the mounting plate 106 is arranged on one side of the mainboard bin 108 for mounting the mainboard, and the mounting plate 106 separates the mainboard bin 108 from the refrigeration module bin 107, so that the functions of the two cavities are independent and interference is avoided;

[0032] The liquid cooling assembly 8 is fixedly connected to the bottom of the liquid cooling assembly 8, and the bottom side of the movable plate 3 is fixedly connected to at least one movable slider 4, and the number of the movable sliders 4 corresponds to the fixed guide rails 2, each movable slider 4 can be slidably connected to the corresponding fixed guide rail 2, and the liquid cooling assembly 8 is disassembled by pulling the movable plate 3 to move along the straight line direction of the fixed guide rail 2;

[0033] The liquid cooling HCDU kit 5 is arranged on the front built-in panel 101 in the mainboard bin 108;

[0034] It should be noted that the movable slider 4 and the fixed guide rail 2 are precisely matched to ensure that the liquid cooling assembly 8 is fixed firmly during operation, avoiding loosening or falling off due to vibration or movement, thereby improving the physical stability of the system; by pulling the movable plate 3, the liquid cooling assembly 8 can be easily taken out or installed from the case without the need for complex tools or steps. When the liquid cooling assembly 8 needs to be replaced or repaired, it can be quickly disassembled, saving time and labor costs.

[0035] Specifically, the hot plug hard disk module 6 is arranged at the front of the mounting compartment 105, and the power module 7 is arranged at the rear of the mounting compartment 105. The hot plug hard disk module 6 and the power module 7 can be independently designed and installed, thereby improving the modular degree of the system and facilitating expansion and upgrading.

[0036] Specifically, the liquid cooling assembly 8 is integrated with a cooling row, a water pump, a flow meter, a water tank, a fan, and a liquid level meter. The liquid cooling assembly 8 further includes a dynamic air volume monitoring and control unit 9. The dynamic air volume monitoring and control unit 9 is connected with the flow meter, the water pump, the fan, and the cooling row. The intelligent regulation and control of the cooling liquid flow and air volume are realized through sensors and controllers. The dynamic air volume monitoring and control unit 9 can intelligently adjust the fan speed according to the actual heat dissipation demand, thereby avoiding unnecessary high-speed operation and reducing energy consumption and noise.

[0037] Specifically, four light sound rollers 10 are arranged at the four corners of the bottom side of the bottom plate 104.

[0038] Specifically, the left side, the right side, and the front side of the case body 1 are detachably connected with a left appearance panel 11, a right appearance panel 12, and a front appearance panel 13, respectively.

[0039] It should be noted that the left appearance panel 11, the right appearance panel 12, and the front appearance panel 13 can all adopt a snap design, which is convenient for users to disassemble for cleaning and individual customization according to needs, thereby improving the user experience. When the snap design is adopted, the guide bars on the appearance panel are clamped into the clamping grooves formed on the case body 1, so as to ensure the accurate alignment of the panel. Then, the snap on the appearance panel is clamped into the hole positions formed on the case body 1, thereby realizing the fixation of the appearance panel and the case body 1.

[0040] Specifically, a plurality of recesses are formed on the top plate 102. A plurality of top heat dissipation holes 14 are formed in the recesses. A dustproof plate 15 with a size matching that of the recesses is placed in the recesses. This structure effectively discharges the hot air inside the case through the top heat dissipation holes 14, thereby improving the heat dissipation efficiency. Meanwhile, the dustproof plate 15 blocks dust from entering the inside of the case, thereby protecting the internal components from pollution and ensuring the stable operation and long-term reliability of the system.

[0041] Specifically, a plurality of through holes are formed on the front built-in panel 101, a strip-shaped heat dissipation hole 16 is formed on the front appearance panel 13, the strip-shaped heat dissipation hole 16 corresponds to the position of the through hole, a honeycomb-shaped heat dissipation hole 17 is formed on the left appearance panel 11 and the right appearance panel 12, the air in the cabinet is circulated through the heat dissipation hole, and the heat dissipation and stable operation of the system are ensured.

[0042] The heat management system of the tower type liquid cooling server can quickly locate problems and repair them through simple disassembly and replacement of modules, so that the system downtime is significantly reduced, efficient operation is ensured, the maintenance and management efficiency of the system is improved, and the use experience of users is optimized.

[0043] The basic principle and main features of the utility model and the advantages of the utility model are shown and described above. It should be understood by those skilled in the art that the utility model is not limited by the above-mentioned embodiments, and the above-mentioned embodiments and the description in the specification only illustrate the principle of the utility model, various changes and improvements of the utility model can be made without departing from the spirit and scope of the utility model, and these changes and improvements all fall within the scope of the utility model claimed.

Claims

1. A thermal management system for a tower liquid-cooled server, the system comprising: Include: The cabinet body (1) is surrounded by the front built-in panel (101), the top plate (102), the rear built-in panel (103) and the bottom plate (104) in turn, and the cavity is opened inside, and the bottom of the cavity is provided with a mounting bin (105) for mounting the hot plug hard disk module (6) and the power module (7); The mounting plate (106) is arranged in the middle of the cavity to divide the cavity into two chambers of the refrigeration module bin (107) and the mainboard bin (108), and at least one fixed guide rail (2) is fixedly connected to the bottom side of the mounting plate (106) in the refrigeration module bin (107); The liquid cooling assembly (8) is fixedly connected with the movable plate (3) at the bottom, and the bottom side of the movable plate (3) is fixedly connected with at least one movable sliding block (4), and the number of the movable sliding block (4) corresponds to the fixed guide rail (2), each movable sliding block (4) can be slidably connected to the corresponding fixed guide rail (2), and the liquid cooling assembly (8) is disassembled by pulling the movable plate (3) to move along the straight line direction of the fixed guide rail (2); The liquid cooling HCDU kit (5) is arranged on the front built-in panel (101) in the mainboard bin (108).

2. The thermal management system of a tower liquid-cooled server of claim 1, wherein: The hot plug hard disk module (6) is arranged at the front of the mounting bin (105), and the power module (7) is arranged at the rear of the mounting bin (105).

3. The thermal management system of a tower liquid-cooled server of claim 2, wherein: The liquid cooling assembly (8) is integrated with the cooling row, the water pump, the flowmeter, the water tank, the fan and the liquid level meter, and further comprises a dynamic air volume monitoring and control unit (9) in the liquid cooling assembly (8), which is connected with the flowmeter, the water pump, the fan and the cooling row to realize intelligent regulation and control of the cooling liquid flow and air volume.

4. The thermal management system of a tower liquid-cooled server of claim 3, wherein: The mounting plate (106) is arranged on one side of the mainboard bin (108) for mounting the mainboard.

5. The thermal management system of a tower liquid-cooled server of claim 4, wherein: Four light sound rollers (10) are arranged at the bottom side of the bottom plate (104).

6. The thermal management system of a tower liquid-cooled server of claim 5, wherein: The left side, the right side and the front side of the cabinet body (1) are respectively detachably connected with the left appearance panel (11), the right appearance panel (12) and the front appearance panel (13).

7. The thermal management system of a tower liquid-cooled server of claim 6, wherein: A plurality of grooves are formed in the top plate (102), a plurality of top heat dissipation holes (14) are formed in the grooves, and a dustproof plate (15) with a size matching that of the grooves is placed in the grooves.

8. The thermal management system of a tower liquid-cooled server of claim 7, wherein: A plurality of through holes are formed in the front built-in panel (101), and a strip-shaped heat dissipation hole (16) is formed in the front appearance panel (13), and the strip-shaped heat dissipation hole (16) corresponds in position to the through hole.

9. The thermal management system of a tower liquid-cooled server of claim 8, wherein: Honeycomb-shaped heat dissipation holes (17) are formed in the left appearance panel (11) and the right appearance panel (12).