Vacuum adsorption fixed type wafer carrying platform

Abstract

The utility model discloses a vacuum adsorption fixed type wafer carrying platform comprising a pedestal which is provided with an annular air groove; the disc is adsorbed on the base in a vacuum mode through an annular air groove formed in the base; a base; the jacking mechanism can absorb the wafer in a vacuum manner, and drives the wafer to move up and down through a motor driving device; the position coordinates of a wafer exposure light path can be obtained through the alignment module; and the calibration ruler module can determine the coordinates of the wafer carrying platform and the wafer. According to the utility model, a mechanical fixation mode of a wafer contact surface on a traditional wafer carrying platform is changed, a vacuum adsorption mode is adopted to fix the disc, stress caused by mechanical fixation is removed, the flatness of the wafer carrying platform is improved, the jacking mechanism is driven by the motor, and the carrying platform is provided with the alignment module and the calibration ruler module, so that the wafer carrying platform is convenient to use. The operation stability of the wafer carrying table can be effectively improved, and the wafer carrying table can be accurately positioned, so that the exposure precision of the wafer is ensured.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer fixing device technical field, concretely relates to a vacuum adsorption fixed wafer carrier. BACKGROUND

[0002] At present, most wafer carriers usually adopt screw to fix, this kind of fixing mode can introduce local stress to wafer carrier, causes wafer carrier surface deformation, thereby influence wafer carrier upper surface flatness, the jacking mechanism of existing wafer carrier adopts cylinder drive mostly, and running stability is poor, part adopts motor drive's jacking mechanism, structure is not enough compact, anti -interference ability is poor, and the height of wafer carrier has been increased, and when motor load is bigger, heat is also easy to produce, influence wafer carrier's positioning accuracy. SUMMARY

[0003] The utility model discloses a vacuum adsorption fixed wafer carrier to solve the problem in the above background.

[0004] To achieve the above object, the utility model provides the following technical scheme:

[0005] A vacuum adsorption fixed wafer carrier, comprising:

[0006] Base (2), the base (2) is provided with annular air groove (21);

[0007] Disc (1) is vacuum adsorbed on the base (2) through annular air groove (21), and the disc (1) is provided with concentric annular groove (11) and sealing groove (12), and the disc (1) is internally provided with air channel (13), and the air channel (13) is provided with air hole (14), and the air hole (14) is communicated with annular groove (11);

[0008] Base (3);

[0009] Jacking mechanism (4) can vacuum adsorb wafer and drive wafer up and down movement through motor drive;

[0010] Alignment module (5) is installed on the base (3), and is used to determine the position coordinates of wafer exposure light path;

[0011] And calibration ruler module (6) is installed on the base (2), and is used to determine the coordinates of wafer carrier and wafer.

[0012] As a further scheme of the utility model, the disc (1) is divided into zones through sealing groove (12), and the disc (1) can adsorb wafers of different sizes and warping deformation.

[0013] As a further scheme of the utility model, the base (2) is equipped with annular air groove (21), annular air groove (21) vacuum adsorbs the disc (1) on base (2), and annular air groove (21) is equipped with air hole (22), and air hole (22) is connected vacuum device through vacuum air pipe under air hole (22), and the inner ring and the outer ring close to annular air groove (21) are each equipped with annular sealing groove (23), and the annular sealing groove (23) is used to place O ring (71), and base (2) is equipped with air hole (24), and air hole (24) communicates with the air passage (13) on the disc (1), and air hole (24) is connected with vacuum air pipe.

[0014] As a further scheme of the utility model, the jacking mechanism (4) includes motor module (41), jacking rod (42), jacking support (43), suction nozzle (44) and jacking rod joint (45), the jacking rod (42) is installed on the jacking support (43), the jacking support (43) is installed on the motor module (41), the suction nozzle (44) is installed on the upper end of the jacking rod (42), the jacking rod joint (45) is installed on the lower part of the jacking support (43) and is coaxial with the jacking rod (42), the jacking rod (42) is internally provided with an air passage, the suction nozzle (44) communicates with the jacking rod joint (45), the vacuum device is connected with the jacking rod joint (45) through the vacuum air pipe, so that the suction nozzle (44) can adsorb the wafer, and the motor module (41) can drive the jacking rod (42), the suction nozzle (44) and the wafer adsorbed by the suction nozzle (44) to move up and down.

[0015] As a further scheme of the utility model, the alignment module (5) includes a camera (51), an objective lens (52), a lens module (53) and an alignment base plate (54).

[0016] As a further scheme of the utility model, the calibration ruler module (6) includes quartz glass (61), a calibration ruler support (62), a jackscrew (63) and a spring piece (64), the quartz glass (61) is installed on the calibration ruler support (62), the jackscrew (63) is arranged on the side surface of the calibration ruler support (62), the jackscrew (63) is used for adjusting the angle and position of the quartz glass (61), and the spring piece (64) is used for tightly fixing the quartz glass (61), marks are made on the quartz glass (61), and the camera (51) above the calibration ruler module (6) identifies the marks on the quartz glass (61) to calculate the angle and position coordinates of the wafer carrier.

[0017] As a further scheme of the utility model, the vacuum adsorption fixed wafer carrier further includes an energy probe (8) arranged on the base (2), and the energy probe is used for detecting the energy of the exposed wafer.

[0018] As a further scheme of the utility model, the vacuum adsorption fixed wafer carrier still includes the optical fiber sensor (9) arranged below the disc (1), the optical fiber sensor (9) is used with the optical fiber amplifier (91), and the optical fiber sensor (9) is used for detecting whether there is wafer on the disc (1).

[0019] As a further scheme of the utility model, the base (2) is fixed with the support block (10), the support block (10) side is equipped with screw hole, is built-in spring, and the screw is pushed spring compression through the screw hole, to give the lateral thrust of the disc (1), prevents the lateral sliding of disc (1).

[0020] Compared with the prior art, the utility model has the beneficial effects that: the utility model changes the mechanical fixed mode of wafer contact surface on traditional wafer carrier, adopts vacuum adsorption mode to fix disc, removes the stress caused by mechanical fixation, improves the flatness of wafer carrier, and the jacking mechanism adopts motor drive, and the carrier is equipped with alignment module and calibration ruler module, can effectively improve the operation stability of wafer carrier, is convenient for accurate positioning of wafer carrier, thereby ensure the exposure precision of wafer. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 It is a vacuum adsorption fixed wafer carrier axial side view;

[0022] Figure 2 It is a vacuum adsorption fixed wafer carrier plan view;

[0023] Figure 3 It is a vacuum adsorption fixed wafer carrier front view;

[0024] Figure 4 It is a vacuum adsorption fixed wafer carrier cross section view;

[0025] Figure 5 It is a vacuum adsorption fixed wafer carrier cross section partial enlarged view;

[0026] Figure 6 It is a vacuum adsorption fixed wafer carrier base plan view;

[0027] Figure 7 It is a vacuum adsorption fixed wafer carrier disc cross section view;

[0028] Figure 8 It is a vacuum adsorption fixed wafer carrier jacking mechanism axial side view;

[0029] Figure 9 It is a vacuum adsorption fixed wafer carrier alignment module front view. DETAILED DESCRIPTION

[0030] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0031] This invention provides a vacuum adsorption fixed wafer stage, such as... Figure 1 As shown, the wafer stage includes a disk 1, a base 2, and a base 3. Figure 5 As shown, the disk 1 is vacuum-adsorbed onto the base 2. The disk 1 has several concentric annular grooves similar to the annular groove 11 and two sealing grooves, such as sealing groove 12. These sealing grooves divide the disk 1 into sections, each section cooperating with air channels of different lengths and corresponding air vents to achieve the adsorption of wafers of different sizes or with warping deformation, such as… Figure 7 As shown, the disk 1 has a long air channel 13 and two short air channels symmetrically arranged on the left and right. The long air channel 13 has an air hole 14, which is connected to the annular groove 11 to adsorb relatively small wafers. When the short air channels and the long air channels are opened at the same time, larger wafers can be adsorbed. In addition, each air channel is connected to the corresponding air hole to form an independent air path. Each air path is equipped with a solenoid valve to control the opening and closing of the air path, thereby controlling the start and stop of the adsorption force in different areas of the wafer stage.

[0032] like Figure 2 , 4 As shown in Figure 6, the base 2 is provided with an annular air groove 21, which can vacuum adsorb the disc 1. Compared with the traditional screw fixation, the vacuum adsorption fixing method can effectively reduce the deformation of the disc 1 and improve the flatness of the disc 1. The annular air groove 21 is provided with air holes 22, which are connected to the vacuum from below through air pipes. To prevent air leakage, annular sealing grooves 23 are provided on the inner and outer rings near the annular air groove 21 to place O-rings 71 and ensure the internal area is sealed. The base 2 is provided with pins, and the disc 1 is provided with pin holes to ensure the positioning of the disc 1 on the base 2. A support block 10 is fixed on the base 2. The support block 10 is provided with threaded holes on its side and has a spring inside. The screw pushes the spring through the threaded holes to compress it, thereby giving the disc 1 a lateral thrust and preventing the disc 1 from sliding laterally.

[0033] like Figure 8As shown, the utility model also includes jacking mechanism 4, jacking mechanism 4 includes motor module 41, top rod 42, jacking support 43, suction nozzle 44, top rod joint 45. Top rod 42 is installed on jacking support 43, jacking support 43 is installed on motor module 41, suction nozzle 44 is installed top rod 42 upper end, top rod joint 45 is installed below jacking support 43, with top rod 42 coaxial, top rod 42 inside is equipped with air passage, suction nozzle 44 is communicated with top rod joint 45, and negative pressure is connected with top rod joint 45 through air pipe, to realize the adsorption of suction nozzle 44 to wafer, and motor module 41 can drive top rod 42 to move up and down, wherein motor module 41 is built-in air cylinder 411, for offsetting the load on motor module 41.

[0034] As Figure 9 As shown, the utility model also includes alignment module 5, alignment module 5 includes camera 51, objective lens 52, lens module 53 and alignment base plate 54. The alignment module is installed on the base 3, and the alignment module 5 moves to the lower side of the wafer exposure light path, receives the projection of the light path, and calculates the position coordinates of the wafer exposure light path.

[0035] As Figure 2 As shown, the utility model also includes calibration ruler module 6, and calibration ruler module 6 includes quartz glass 61, calibration ruler support 62, top wire 63 and elastic sheet 64. Among them, the quartz glass 61 is installed on the calibration ruler support 62, the top wire 63 is arranged on the side surface of the calibration ruler support 62, the top wire 3 is used for adjusting the angle and position of the quartz glass 61, and the elastic sheet 64 is used for tightly fixing the quartz glass 61. Mark on the quartz glass 61, the camera 51 above the calibration ruler module 6 identifies the mark on the quartz glass 61 to calculate the angle and position coordinates of the wafer stage.

[0036] As Figure 5 As shown, the utility model also includes the sealing ring 7 arranged in the annular sealing groove 12 of the disc 1, the sealing ring 7 is fluorine rubber material, the sealing ring 7 protrudes the wafer stage main body upper surface, the sealing ring 7 design height contacts the wafer warping position, can make the internal area of sealing ring 7 sealed.

[0037] As Figure 2 And Figure 4 As shown, the utility model also includes the energy probe 8 arranged on the base 2, and the energy probe 8 is used with the controller 81, for detecting the energy size of the exposure wafer.

[0038] As Figure 3 As shown, the utility model also includes the optical fiber sensor 9 arranged below the disc 1, and the optical fiber sensor 9 is used with the optical fiber amplifier 91, and the optical fiber sensor 9 is used for detecting whether there is wafer on the disc 1.

[0039] The utility model discloses novel structure, stable operation, the utility model discloses when using, wafer carrier vacuum adsorption disc 1, mechanical hand transports wafer to wafer carrier and disc 1 top, wafer and wafer carrier concentric, jacking mechanism 4 upward movement, hold wafer, the vacuum on the air path of jacking mechanism 4 opens, and wafer is tightly adsorbed on suction nozzle 44.

[0040] After exposure, disc 1 vacuum closes, and jacking mechanism 4 vacuum opens, and jacking mechanism 4 rises, and wafer is lifted to the highest place, and mechanical hand moves to wafer below, and jacking mechanism 4 vacuum closes, and jacking mechanism 4 drops, and wafer is placed on mechanical hand and is transported, and this completes the whole process of accurate exposure to wafer.

[0041] For those skilled in the art, it is obvious that the utility model is not limited to the details of the above exemplary embodiments, and the utility model can be realized in other specific forms without departing from the spirit or basic characteristics of the utility model. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting, and the scope of the utility model is defined by the appended claims rather than the above description, and therefore all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the utility model. Any reference signs in the claims should not be regarded as limiting the claims involved.

[0042] In addition, it should be understood that, although the present specification is described in terms of embodiments, not every embodiment contains only one independent technical solution, and the description of the specification is only for the sake of clarity, and those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can be properly combined to form other embodiments that those skilled in the art can understand.

Claims

1. A vacuum chucking fixed type wafer stage, characterized by, The utility model relates to a wafer exposure device, including: Base (2) is provided with annular air groove (21), Disc (1) is adsorbed on base (2) by annular air groove (21), disc (1) is provided with concentric annular groove (11) and sealing groove (12), and disc (1) is provided with air channel (13) inside, air channel (13) is provided with air hole (14), air hole (14) is communicated with annular groove (11), Base (3), Jacking mechanism (4) can adsorb wafer and drive wafer up and down by motor, Alignment module (5) is installed on base (3) and is used for determining the position coordinates of wafer exposure light path, And calibration ruler module (6) is installed on base (2) and is used for determining the coordinates of wafer platform and wafer.

2. The vacuum-adsorbed stationary wafer table of claim 1, wherein, Disc (1) is divided into different areas by sealing groove (12), and disc (1) can adsorb wafer of different sizes and warping deformation.

3. The vacuum-attached wafer table according to claim 1, wherein Base (2) is provided with annular air groove (21), annular air groove (21) adsorbs disc (1) on base (2), annular air groove (21) is provided with air hole (22), air hole (22) is connected with vacuum device through vacuum air pipe, and the inner ring and the outer ring close to annular air groove (21) are each provided with annular sealing groove (23), annular sealing groove (23) is used for placing O-shaped ring (71), base (2) is provided with air hole (24), air hole (24) is communicated with air channel (13) on disc (1), and air hole (24) is connected with vacuum air pipe.

4. The vacuum-attached wafer table according to claim 1, wherein Jacking mechanism (4) includes motor module (41), jacking rod (42), jacking support (43), suction nozzle (44) and jacking rod joint (45), jacking rod (42) is installed on jacking support (43), jacking support (43) is installed on motor module (41), suction nozzle (44) is installed on the upper end of jacking rod (42), jacking rod joint (45) is installed on the lower part of jacking support (43) and is coaxial with jacking rod (42), jacking rod (42) is provided with air channel inside, suction nozzle (44) is communicated with jacking rod joint (45), vacuum device is connected with jacking rod joint (45) through vacuum air pipe, so that suction nozzle (44) can adsorb wafer, and motor module (41) can drive jacking rod (42), suction nozzle (44) and wafer adsorbed by suction nozzle (44) to move up and down.

5. The vacuum-attached wafer table according to claim 1, wherein Alignment module (5) includes camera (51), objective (52), lens module (53) and alignment base plate (54).

6. The vacuum-attached wafer table according to claim 1, wherein Calibration ruler module (6) includes quartz glass (61), calibration ruler support (62), jackscrew (63) and elastic sheet (64), quartz glass (61) is installed on calibration ruler support (62), jackscrew (63) is arranged on the side of calibration ruler support (62), jackscrew (63) is used for adjusting the angle and position of quartz glass (61), elastic sheet (64) is used for tightly fixing quartz glass (61), marks are made on quartz glass (61), and the camera (51) above calibration ruler module (6) identifies the marks on quartz glass (61) to calculate the angle and position coordinates of wafer platform.

7. The vacuum-attached wafer table according to claim 1, wherein Further comprising an energy probe (8) arranged on the base (2), which is used to detect the energy of the exposed wafer.

8. The vacuum-attached wafer table according to claim 1, wherein Further comprising a fiber sensor (9) arranged below the disc (1), which is used in conjunction with a fiber amplifier (91), and is used to detect whether there is a wafer on the disc (1).

9. The vacuum-attached wafer table according to claim 3, wherein, The base (2) is fixed with a support block (10), the side of the support block (10) is provided with a threaded hole, and a spring is built-in, and a screw pushes the spring to compress through the threaded hole, so as to give the disc (1) a lateral thrust force, preventing the disc (1) from sliding laterally.

Images