Solder patch and circuit board structure

Abstract

The utility model provides a solder patch and a circuit board structure, and relates to the technical field of printed circuit board welding. The welding flux patch comprises a body, the body is in a sheet shape, the sheet-shaped body comprises preformed solidified soldering flux and a welding flux structural body, a containing space is formed in the solidified soldering flux, the welding flux structural body is correspondingly arranged in the containing space, and the welding flux structural body can be melted at a first preset temperature to form a welding spot.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of printed circuit board welding, and in particular to a solder patch and a circuit board structure. BACKGROUND

[0002] With the increasing trend of miniaturization and high performance of electronic devices, higher and higher requirements are put forward for the design of printed circuit boards. Not only is it necessary to simplify the process flow of the printed circuit board, but also it is necessary to realize high-density pad layout in a limited area to carry more electronic components to meet the functional requirements of electronic devices, which undoubtedly puts higher requirements on the welding process of the printed circuit board. CONTENT OF THE INVENTION

[0003] The purpose of the embodiments of the present application is to provide a solder patch and a circuit board structure, and the technical solutions are as follows:

[0004] The present application provides a solder patch in the first aspect, comprising:

[0005] The body is in the form of a sheet, the sheet-shaped body includes a pre-formed solidified flux and a solder structure, a containing space is formed in the solidified flux, and the solder structure is correspondingly arranged in the containing space. The solder structure can be melted at a first preset temperature to form a solder joint.

[0006] In some embodiments, the solder patch described above, wherein the containing space includes a first subspace, the solder structure includes a first structure body adapted to the shape of the first subspace, and the first structure body is correspondingly arranged in the first subspace.

[0007] In some embodiments, the solder patch described above, wherein the first structure body is in the form of a sphere, and the outer edge of the spherical first structure body is tangent to the two side surfaces in the thickness direction of the sheet-shaped body.

[0008] In some embodiments, the solder patch described above, wherein the containing space further includes a second subspace, the solder structure includes a second structure body adapted to the shape of the second subspace, and the second structure body is correspondingly arranged in the second subspace, wherein the melting point of the second structure body is higher than that of the first structure body, the first preset temperature includes a first temperature and a second temperature, the second temperature is greater than the first temperature, the solder joint includes a first solder joint and a second solder joint, the first structure body can be melted at the first temperature to form the first solder joint, and the second structure body can be melted at the second temperature to form the second solder joint.

[0009] In some embodiments, the solder patch described above, wherein the second structure body is in the form of a cylinder, and the cylindrical second structure body has a preset interval from the two side surfaces in the thickness direction of the sheet-shaped body.

[0010] In some embodiments, the solder patch as described above, wherein the accommodation space comprises a plurality of first subspaces and a plurality of second subspaces, the plurality of second subspaces are distributed on the peripheral side of the plurality of first subspaces, and the first structure and the second structure are both plural and correspondingly arranged in the plurality of first subspaces and the plurality of second subspaces, respectively.

[0011] In some embodiments, the solder patch as described above, wherein the second structure is a high-temperature alloy solder, and the first structure is a low-temperature alloy solder; or, the second structure is a high-temperature alloy solder, and the first structure is a medium-temperature alloy solder; or, the second structure is a medium-temperature alloy solder, and the first structure is a low-temperature alloy solder.

[0012] In some embodiments, the solder patch as described above, wherein the accommodation space further comprises a third subspace, the sheet-shaped body further comprises a filler matching the shape of the third subspace, and the filler is correspondingly arranged in the third subspace; wherein, at a second preset temperature, the filler can wrap the solder structure in the process of solidifying flux volatilization, and the second preset temperature is lower than the first preset temperature.

[0013] The second aspect of the present application provides a circuit board structure, comprising:

[0014] a first layer of circuit board;

[0015] a second layer of circuit board;

[0016] a solder patch, the solder patch is arranged between the first layer of circuit board and the second layer of circuit board, and the solder patch comprises: a body, the body is sheet-shaped, the sheet-shaped body comprises a preformed solidifying flux and a solder structure, an accommodation space is formed in the solidifying flux, and the solder structure is correspondingly arranged in the accommodation space; the solder structure can be melted at a first preset temperature to form a solder joint for signal communication between the first layer of circuit board and the second layer of circuit board.

[0017] In some embodiments, the circuit board structure as described above, wherein the opposite side surfaces of the first layer of circuit board and the second layer of circuit board respectively have at least one first soldering area and at least one second soldering area corresponding, and the solder patch is at least one and correspondingly arranged between the first soldering area and the second soldering area, respectively.

[0018] The above description is only a summary of the technical solutions of the present application. In order to more clearly understand the technical means of the present application, and to implement the content of the description, the following will be described in detail with the preferred embodiments of the present application and with the help of the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only some embodiments of the present disclosure, and for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 A first solder patch according to an embodiment of the present application is schematically shown in an isometric view;

[0021] Figure 2 A second solder patch according to an embodiment of the present application is schematically shown in an isometric view;

[0022] Figure 3 A first solder patch according to an embodiment of the present application is schematically shown in a side view;

[0023] Figure 4 A third solder patch according to an embodiment of the present application is schematically shown in an isometric view;

[0024] Figure 5 A circuit board structure according to an embodiment of the present application is schematically shown in an isometric view;

[0025] Figure 6 A circuit board structure according to an embodiment of the present application is schematically shown in an exploded view.

[0026] Explanation of reference signs:

[0027] 1, circuit board structure; 11, first layer circuit board; 12, second layer circuit board; 13, solder patch; 111, first soldering area; 121, second soldering area; 131, body; 1311, solidified flux; 1312, solder structure; 1313, filler; 13121, first structure; 13122, second structure. DETAILED DESCRIPTION

[0028] The embodiments of the present disclosure will be described in further detail below with reference to the drawings and embodiments. The detailed description and drawings of the following embodiments are used to exemplarily illustrate the principles of the present disclosure, but cannot be used to limit the scope of the present disclosure, and the present disclosure can be implemented in many different forms, and is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

[0029] The present disclosure provides these examples to make the present disclosure thorough and complete, and to fully convey the scope of the present disclosure to those skilled in the art. It should be noted that: unless otherwise specified, the relative arrangement of components and steps, the components of materials, numerical expressions and numerical values set forth in these examples should be interpreted as merely exemplary, not as a limitation.

[0030] It should be noted that, in the description of the present disclosure, unless otherwise specified, the meaning of "a plurality of" is greater than or equal to two; The orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", "inner", "outer" and the like is only for the purpose of facilitating the description of the present disclosure and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore it cannot be understood as a limitation to the present disclosure. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0031] In addition, "first", "second", and similar words used in the present disclosure do not mean any order, number or importance, but are only used to distinguish different parts. "Vertical" is not strictly vertical, but within the allowable range of error. "Parallel" is not strictly parallel, but within the allowable range of error. "Include" or "contain" and similar words mean that the elements before the word cover the elements listed after the word, and do not exclude the possibility of also covering other elements.

[0032] It should also be noted that, in the description of the present disclosure, unless otherwise specifically specified and limited, the terms "mounting", "connecting", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; It can be directly connected, or indirectly connected through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in the present disclosure can be understood according to the specific circumstances. When it is described that a specific device is located between the first device and the second device, there can be an intermediate device between the specific device and the first device or the second device, or there can be no intermediate device.

[0033] All terms used in the present disclosure have the same meaning as understood by those skilled in the art to which the present disclosure belongs, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries should be interpreted to have meanings consistent with their meanings in the context of the relevant art, and should not be interpreted in an idealized or excessively formalized sense, unless specifically defined here.

[0034] Techniques, methods and equipment known to those skilled in the relevant art may not be discussed in detail, but where appropriate, the techniques, methods and equipment should be considered as part of the specification.

[0035] Example one

[0036] As shown in Figure 1 The first aspect of the present application provides a solder patch 13, comprising: a body 131, the body 131 being in a sheet shape, the sheet-shaped body 131 comprising a pre-formed solidified flux 1311 and a solder structure 1312, the solidified flux 1311 forming a containing space, and the solder structure 1312 being arranged in the containing space, the solder structure 1312 being capable of melting at a first preset temperature to form a solder joint.

[0037] Specifically, the solder patch 13 comprises a sheet-shaped body 131, which can be arranged between two layers of circuit boards stacked in a circuit board structure during a soldering operation, so as to complete the soldering operation of the two adjacent layers of circuit boards at one time, thereby simplifying the process flow and improving the soldering efficiency. The thickness of the sheet-shaped body 131 can be adjusted adaptively according to the amount of solder required for soldering and the thickness of the formed solder joint as needed.

[0038] The sheet-shaped body 131 comprises a pre-formed solidified flux 1311 and a solder structure 1312, and the shell of the solidified flux 1311 and the solder structure 1312 can be pre-formed into the sheet-shaped body 131 by processes such as two-component injection molding, co-extrusion molding, hot pressing, and double-material 3D printing, and the specific process is not limited. The position of the solder structure 1312 is accurately set by the containing space formed in the solidified flux 1311, so as to realize accurate positioning of the solder joint. In addition, compared with the size limitation of printing equipment or ball placement equipment, the arrangement interval of the solder structure 1312 in the solder patch 13 is not limited, and high-density arrangement can be realized in a limited pad area.

[0039] The material selection of the solidified flux 1311 is set according to the melting point adaptability of the solder structure 1312, for example, when the solder structure 1312 is selected as a low-temperature alloy solder such as a tin-bismuth alloy or a tin-bismuth-silver alloy, the solidified flux 1311 can be selected as a material such as polyurethane or polyester resin, so that the solidified flux 1311 is gasified due to its low gasification temperature before the solder structure 1312 is melted at the first preset temperature under the temperature curve, which is beneficial to the subsequent formation of a high-density solder joint with accurate positioning of the solder structure 1312; when the solder structure 1312 is selected as a medium-temperature alloy solder such as a tin-indium alloy or a tin-indium-silver alloy, the solidified flux 1311 can be selected as a material such as phenolic resin, polyurethane, or polyester resin, and the selection principle is the same as when the solder structure 1312 is a low-temperature alloy solder; when the solder structure is selected as a high-temperature alloy solder such as SAC (tin-silver-copper) 105, SAC305, or SAC405, the solidified flux 1311 can be selected as a material such as silicone resin, phenolic resin, polyurethane, or polyester resin, and the selection principle is the same as when the solder structure 1312 is a low-temperature or medium-temperature alloy solder, which is to gasify the solidified flux 1311 due to its low gasification temperature before the solder structure 1312 is melted at the first preset temperature under the temperature curve, which is beneficial to the subsequent formation of a high-density solder joint with accurate positioning of the solder structure 1312.

[0040] The solder structure 1312 is arranged in the accommodation space formed by the solidified flux 1311, and the solder structure 1312 can be of the same material with the same melting point, or different materials with different melting points can be arranged at the same time. In some embodiments, the solder structure 1312 can be all low-temperature alloy solder of any one of a tin-bismuth alloy or a tin-bismuth-silver alloy, or all medium-temperature alloy solder of any one of a tin-indium alloy or a tin-indium-silver alloy, or all high-temperature alloy solder of any one of SAC (tin-silver-copper) 105, SAC305, or SAC405, so that the solder structure can be uniformly melted at the first preset temperature corresponding to the material melting point under the temperature curve, ensuring the quality of the formed solder joint. In some embodiments, the solder structure 1312 can also simultaneously contain low-temperature alloy solder and medium-temperature alloy solder, or low-temperature alloy solder and high-temperature alloy solder, or medium-temperature alloy solder and high-temperature alloy solder, so that the solder with a lower melting point is melted first to form a solder joint, and the solder with a higher melting point provides support between adjacent circuit boards when it is not melted, and can form a solder joint at a higher temperature, and the solder structure 1312 containing two or more solders can make the solder patch 13 compatible with different welding temperature curves, realize stage-by-stage melting welding, and adapt to different welding scenes, improving process flexibility.

[0041] The first aspect of this application provides a solder patch 13, comprising: a body 131, the body 131 being sheet-shaped, the sheet-shaped body 131 including a pre-formed cured flux 1311 and a solder structure 1312, the cured flux 1311 forming an accommodating space, the solder structure 1312 being correspondingly disposed within the accommodating space, and the solder structure 1312 being capable of melting at a first preset temperature to form solder joints. The solder patch 13 provided by this application, including the sheet-shaped body 131, enables the soldering of two adjacent circuit boards in a single operation by placing it between stacked circuit boards in a circuit board structure, thereby simplifying the process flow and improving soldering efficiency. The sheet-like body 131 includes a pre-formed cured flux 1311 and solder structures 1312. The solder structures 1312 are precisely positioned within the accommodating space formed by the cured flux 1311, achieving accurate positioning of the solder joints. Furthermore, compared to the size limitations of printing or ball-mounting equipment, the spacing of the solder structures 1312 in the solder patch 13 is unrestricted, allowing for high-density placement within a limited pad area. This enables the soldered circuit board to accommodate more electronic components to meet the functional requirements of electronic devices. During the soldering process, the cured flux 1311 vaporizes under a temperature profile, and the solder structures 1312 melt at a first preset temperature, forming precisely positioned, high-density solder joints, achieving precise, high-density soldering of the circuit board structure.

[0042] like Figure 2 As shown, in some embodiments, the accommodating space includes a first subspace, and the solder structure 1312 includes a first structure 13121 adapted to the shape of the first subspace, and the first structure 13121 is correspondingly disposed in the first subspace.

[0043] Specifically, the accommodating space of this application includes a first subspace, and the solder structure 1312 includes a first structure 13121 adapted to the shape of the first subspace. The first structure 13121 is correspondingly disposed in the first subspace to achieve shape and structure adaptation, ensuring that the position of the first structure 13121 in the first space is accurate, thereby making the formed solder joints accurately positioned and improving welding efficiency and quality. The first structure 13121 can be entirely made of any one of the following low-temperature alloy solders: tin-bismuth alloy or tin-bismuth-silver alloy; or entirely made of any one of the following medium-temperature alloy solders: tin-indium alloy or tin-indium-silver alloy; or entirely made of any one of the following high-temperature alloy solders: SAC (tin-silver-copper) 105, SAC305, or SAC405. Different temperature curves can be designed according to the different melting points of the solder, so that the solder structure can melt uniformly at a first preset temperature corresponding to the melting point of the material, ensuring the quality of the formed solder joints.

[0044] like Figure 2As shown in some embodiments, the first structure 13121 is spherical, and the outer edge of the spherical first structure 13121 is tangent to the two side surfaces in the thickness direction of the sheet-shaped body 131.

[0045] Specifically, the first structure 13121 is designed to be spherical in the present application, so as to utilize the symmetry of the spherical structure in all directions to enable the first structure 13121 to uniformly expand when melted, while the surface tension of the spherical structure enables the first structure 13121 to naturally form a uniform solder joint during melting, thereby effectively avoiding welding defects such as bridging, voids, and false welding, and ensuring welding quality and reliability. At the same time, the symmetry and surface tension of the spherical structure can also improve the wettability of the liquid solder after melting, so that the solder can better cover the pads between the circuit boards to form a uniform and stable solder joint.

[0046] The outer edge of the spherical first structure 13121 is tangent to the two side surfaces in the thickness direction of the sheet-shaped body 131, so that the first structure 13121 can make full use of the thickness of the sheet-shaped body 131 while ensuring the required amount of tin for welding. Since the solidifying flux 1311 is transparent in the solder patch 13, and the first structure 13121 is non-transparent, the tangent of the outer edge of the first structure 13121 to the two side surfaces in the thickness direction of the sheet-shaped body 131 also enables better identification of the position of the first structure 13121, improves the accuracy of positioning, and thus ensures the welding quality.

[0047] As shown in some embodiments, the solder structure 1312 includes a second structure 13122 adapted to the shape of the second sub-space, and the second structure 13122 is correspondingly arranged in the second sub-space. Figure 1 and Figure 3 As shown in some embodiments, the accommodation space further includes a second sub-space, and the solder structure 1312 includes a second structure 13122 adapted to the shape of the second sub-space, and the second structure 13122 is correspondingly arranged in the second sub-space, wherein the melting point of the second structure 13122 is higher than that of the first structure 13121, the first preset temperature includes a first temperature and a second temperature, the second temperature is higher than the first temperature, the solder joint includes a first solder joint and a second solder joint, the first structure 13121 can be melted at the first temperature to form the first solder joint, and the second structure 13122 can be melted at the second temperature to form the second solder joint.

[0048] Specifically, the solder structure 1312 in the solder patch 13 of the present application further includes a second structure 13122, and the accommodation space includes a second sub-space adapted to the second structure 13122. By arranging the second structure 13122 with a higher melting point than the first structure 13121, the solder structure 1312 containing two types of solder can make the solder patch 13 of the present application compatible with different welding temperature curves, realize staged melting welding, and adapt to different welding scenarios, thereby improving process flexibility.

[0049] The first preset temperature includes a first temperature and a second temperature, the second temperature is greater than the first temperature, the solder joint includes a first solder joint and a second solder joint, in the welding process, if a lower temperature welding temperature curve is used, the first structure 13121 with a lower melting point melts first at the first temperature to form the first solder joint, the second structure 13122 with a higher melting point is in a non-melted state when the first structure 13121 melts, thereby providing a supporting effect between adjacent circuit boards; if a higher temperature welding temperature curve is used, because the second temperature is greater than the first temperature, the first structure 13121 melts to form the first solder joint, and the second structure 13122 can also melt at the second temperature to form the second solder joint.

[0050] As shown in Figure 1 and Figure 3 In some embodiments, the second structure 13122 is in a cylindrical shape, and the two side surfaces of the cylindrical second structure 13122 in the thickness direction of the sheet-shaped body 131 have a preset interval with the two side surfaces.

[0051] Specifically, in order to enable the non-melted second structure 13122 to provide a stable supporting effect when the first structure 13121 melts at the first temperature, the second structure 13122 is provided in a cylindrical shape to form a certain contact area with the adjacent circuit boards through the two side surfaces of the cylindrical second structure 13122 in the thickness direction of the sheet-shaped body 131, thereby enhancing the stability of the support, and at the same time, the higher mechanical strength provided by the cylindrical second structure 13122 enhances the reliability of the support. The two side surfaces of the cylindrical second structure 13122 in the thickness direction of the sheet-shaped body 131 have a preset interval with the two side surfaces, which is considered that, under the thickness limitation of the solder patch 13, the preset interval is reserved to ensure that the amount of tin of the second structure 13122 is at a suitable value, so as to avoid that too much tin affects the welding flatness and the solder joint formation effect, and the application can set the height of the cylindrical second structure 13122 in the thickness direction of the body 131 to be adapted to the height of the solder joint formed after the first structure 13121 melts, so as to provide a stable and reliable supporting effect for the solder joint formed by the first structure 13121.

[0052] As shown in Figure 1 and Figure 3 In some embodiments, the accommodation space includes a plurality of first subspaces and a plurality of second subspaces, the plurality of second subspaces are distributed on the circumferential side of the plurality of first subspaces, and the first structure 13121 and the second structure 13122 are both multiple and correspondingly arranged in the plurality of first subspaces and the plurality of second subspaces.

[0053] Specifically, the accommodation space of the present application includes a plurality of first subspaces and a plurality of second subspaces, and the first structure 13121 and the second structure 13122 are both multiple and are respectively arranged in the plurality of first subspaces and the plurality of second subspaces to form a corresponding total number of two spaces corresponding to the pad area of the adjacent circuit board. In order to improve the supporting effect of the second structure 13122 when the first structure 13121 melts at the first temperature, the present application is arranged to distribute the plurality of second subspaces on the side of the plurality of first subspaces, so that the plurality of second structures 13122 forms a supporting structure around the first structure 13121, so that the stress borne by the solder joint formed by the first structure 13121 is dispersed to the corresponding plurality of supporting points of the second structure 13122, while avoiding stress concentration at the supporting points, and improving the stability of the solder patch 13 during the formation of the solder joint under the temperature curve.

[0054] In some embodiments, the second structure 13122 is a high-temperature alloy solder, and the first structure 13121 is a low-temperature alloy solder; or, the second structure 13122 is a high-temperature alloy solder, and the first structure 13121 is a medium-temperature alloy solder; or, the second structure 13122 is a medium-temperature alloy solder, and the first structure 13121 is a low-temperature alloy solder.

[0055] Specifically, the solder patch 13 of the present application can be compatible with two different soldering temperature curves, and can be soldered in stages to adapt to different soldering scenes and improve process flexibility. Correspondingly, in one embodiment, the second structure 13122 can be selected as a high-temperature alloy solder of any one of SAC (tin-silver-copper) 105, SAC305 or SAC405, and the first structure 13121 can be selected as a low-temperature alloy solder of any one of tin-bismuth alloy or tin-bismuth-silver alloy, so that the solder patch 13 can be compatible with both low-temperature reflow curve and high-temperature reflow curve to form solder joints. Under the low-temperature reflow curve, the first structure 13121 with a lower melting point melts at the first temperature to form a first solder joint, and the second structure 13122 with a higher melting point is in a non-melting state when the first structure 13121 melts, thereby providing a supporting effect between adjacent circuit boards. Under the high-temperature reflow curve, the second structure 13122 can melt at the second temperature to form a second solder joint. During the soldering process, the setting mode of switching from the low-temperature reflow curve to the high-temperature reflow curve can be used, or only the low-temperature reflow curve can be used to form the first solder joint while utilizing the supporting effect of the second structure 13122, or only the high-temperature reflow curve can be used to form the first solder joint and the second solder joint at the same time. The specific mode is not limited, and the circuit board can be completely soldered according to the needs.

[0056] In one embodiment, the second structure 13122 can be selected as a high-temperature alloy solder of SAC (tin-silver-copper) 105, SAC305 or SAC405, and the first structure 13121 can be a medium-temperature alloy solder of tin-indium alloy or tin-indium-silver alloy. In this case, the solder patch 13 can generate solder joints simultaneously using both medium-temperature reflow curves and high-temperature reflow curves. Under the medium-temperature reflow curve, the first structure 13121 with a lower melting point melts first at the first temperature to form the first solder joint, while the second structure 13122 with a higher melting point remains unmelted when the first structure 13121 melts, thus providing support between adjacent circuit boards. Under the high-temperature reflow curve, the second structure 13122 can melt at the second temperature to form the second solder joint. During the soldering process, you can switch from a medium-temperature reflow curve to a high-temperature reflow curve, or you can use only a medium-temperature reflow curve to form the first solder joint while utilizing the supporting effect of the second structure 13122, or you can use only a high-temperature reflow curve to form the first solder joint and the second solder joint simultaneously. The specific method is not limited, as long as it can complete the soldering operation between circuit boards as needed.

[0057] In one embodiment, the second structure 13122 can be selected as a medium-temperature alloy solder of either tin-indium alloy or tin-indium-silver alloy, and the first structure 13121 can be selected as a low-temperature alloy solder of either tin-bismuth alloy or tin-bismuth-silver alloy. In this case, the solder patch 13 can simultaneously generate solder joints using both low-temperature reflow curves and medium-temperature reflow curves. Under the low-temperature reflow curve, the first structure 13121 with a lower melting point melts first at the first temperature to form the first solder joint, while the second structure 13122 with a higher melting point remains unmelted when the first structure 13121 melts, thereby providing support between adjacent circuit boards. Under the medium-temperature reflow curve, the second structure 13122 can melt at the second temperature to form the second solder joint. During the soldering process, you can switch from a low-temperature reflow curve to a medium-temperature reflow curve, or you can use only a low-temperature reflow curve to form the first solder joint while utilizing the supporting effect of the second structure 13122, or you can use only a medium-temperature reflow curve to form the first solder joint and the second solder joint simultaneously. The specific method is not limited, as long as it can complete the soldering operation between circuit boards as needed.

[0058] like Figure 4 As shown, in some embodiments, the accommodating space further includes a third subspace, and the sheet-like body 131 further includes a filler 1313 adapted to the shape of the third subspace, with the filler 1313 correspondingly disposed within the third subspace; wherein, at a second preset temperature, the filler 1313 can encapsulate the solder structure 1312 during the evaporation of the curing flux 1311, and the second preset temperature is lower than the first preset temperature.

[0059] Specifically, in order to improve the quality of the formed solder joint and improve the welding efficiency, the solder patch 13 of the present application is further provided with a filler 1313, and the accommodation space formed in the solidified flux 1311 in the sheet-shaped body 131 further includes a third sub-space, and the filler 1313 is correspondingly arranged in the third sub-space. The filler 1313 can be pre-formed into a sheet-shaped body 131 together with the solidified flux 1311 and the solder structure 1312 shell by a process such as two-component injection molding, co-extrusion molding, hot pressing, and double-material 3D printing. Since the second preset temperature is lower than the first preset temperature, before the solder structure 1312 forms a solder joint, the filler 1313 can be in a fluid state to wrap the solder structure 1312 during the volatilization and gasification of the solidified flux 1311, so as to form a protective film on the surface of the solder structure 1312. Then, during the thermal expansion of the first structure 13121 and the second structure 13122 under high temperature, the protective film formed by the filler 1313 can absorb and disperse thermal stress, reduce the damage of the formed solder joint under thermal shock, and at the same time, the protective film formed by the filler 1313 can provide a buffering effect when the solder joint falls on the pad of the circuit board during the formation of the solder joint, thereby improving the drop reliability of the solder joint. The filler 1313 can be made of epoxy resin, polyimide, etc., and the specific material is not limited. The filler 1313 can be in a fluid state to wrap the solder structure 1312 to form a protective film during the volatilization and gasification of the solidified flux 1311 at a second preset temperature lower than the first preset temperature.

[0060] Embodiment Two

[0061] As shown in Figure 5 In some embodiments, the second aspect of the present application provides a circuit board structure 1, which comprises: a first layer of circuit board 11, a second layer of circuit board 12, and a solder patch 13; the solder patch 13 is arranged between the first layer of circuit board 11 and the second layer of circuit board 12, and the solder patch 13 comprises: a body 131, which is in a sheet shape, and the sheet-shaped body 131 comprises a pre-formed solidified flux 1311 and a solder structure 1312, an accommodation space is formed in the solidified flux 1311, and the solder structure 1312 is correspondingly arranged in the accommodation space. The solder structure 1312 can be melted at a first preset temperature to form a solder joint for signal communication between the first layer of circuit board 11 and the second layer of circuit board 12.

[0062] Specifically, the second aspect of the present application provides a circuit board structure 1, which realizes the welding operation between the first layer of circuit board 11 and the second layer of circuit board 12 through the solder patch 13. By arranging the solder patch 13 between the first layer of circuit board 11 and the second layer of circuit board 12 in the circuit board structure 1, a solder joint is formed at one time to realize the signal communication between the first layer of circuit board 11 and the second layer of circuit board 12, thereby simplifying the process flow and improving the welding efficiency.

[0063] In one embodiment of the circuit board structure 1 of this application, the positions of multiple solder structures 1312 in the solder patch 13 are aligned with the pads of the second circuit board 12 by a pick-and-place machine, and then the first circuit board 11 is mounted. After that, reflow soldering is performed according to a preset temperature profile, so that the solder structures 1312 melt at a first preset temperature to form solder joints, thereby realizing signal communication between the first circuit board 11 and the second circuit board 12.

[0064] A second aspect of this application provides a circuit board structure 1, including: a first circuit board 11, a second circuit board 12, and a solder patch 13; the solder patch 13 is disposed between the first circuit board 11 and the second circuit board 12, and the solder patch 13 includes: a body 131, the body 131 being sheet-shaped, the sheet-shaped body 131 including pre-formed cured flux 1311 and a solder structure 1312, a receiving space being formed within the cured flux 1311, and the solder structure 1312 being correspondingly disposed within the receiving space, the solder structure 1312 being capable of melting at a first preset temperature to form solder joints for signal communication between the first circuit board 11 and the second circuit board 12. The solder patch 13 provided by this application includes a sheet-shaped body 131, which enables signal communication between the first circuit board 11 and the second circuit board 12 in a single step by being placed between the first circuit board 11 and the second circuit board 12 in the circuit board structure 1 during the soldering operation, thereby simplifying the process flow and improving soldering efficiency. The sheet-like body 131 includes a pre-formed cured flux 1311 and solder structures 1312. The solder structures 1312 are precisely positioned within the accommodating space formed by the cured flux 1311, achieving accurate positioning of the solder joints. Furthermore, compared to the size limitations of printing or ball-mounting equipment, the spacing of the solder structures 1312 in the solder patch 13 is unrestricted, allowing for high-density placement within a limited pad area. This enables the soldered circuit board to accommodate more electronic components to meet the functional requirements of electronic devices. During the soldering process, the cured flux 1311 vaporizes under a temperature profile, and the solder structures 1312 melt at a first preset temperature to form precisely positioned, high-density solder joints, achieving precise, high-density soldering of the circuit board structure 1.

[0065] like Figure 6 As shown, in some embodiments, the opposite side surfaces of the first circuit board 11 and the second circuit board 12 have at least one first welding area 111 and at least one second welding area 121, respectively, and the solder patch 13 is at least one and is respectively disposed between the first welding area 111 and the second welding area 121.

[0066] Specifically, the application sets the corresponding first soldering area 111 and second soldering area 121 for the first layer circuit board 11 and the second layer circuit board 12, so as to guarantee that the solder patch 13 is accurately aligned between the first layer circuit board 11 and the second layer circuit board 12, to form a position-accurate solder joint, and to improve the soldering accuracy. The first soldering area 111 and the second soldering area 121 are both at least one corresponding one, and the area distribution and quantity of the first soldering area 111 and the second soldering area 121 can be adaptively adjusted according to the electronic component layout on the first layer circuit board 11 and the second layer circuit board 12, and the solder patch 13 can be adaptively set, and the specific limitation is not limited. Through the setting of the solder patch 13, the circuit board design process can be carried out without being limited by the soldering difficulty, and the design form of the circuit structure is flexibly provided, and the design flexibility of the circuit board structure 1 is provided.

[0067] So far, the embodiments of the present disclosure have been described in detail. In order to avoid obscuring the concept of the present disclosure, some details known in the art are not described. Those skilled in the art can fully understand how to implement the technical solutions disclosed herein according to the above description.

[0068] Although some specific embodiments of the present disclosure have been described in detail through examples, those skilled in the art should understand that the above examples are only for illustration, and are not intended to limit the scope of the present disclosure. Those skilled in the art should understand that the above embodiments can be modified or some technical features can be replaced equivalently without departing from the scope and spirit of the present disclosure. In particular, as long as there is no structural conflict, the technical features mentioned in each embodiment can be combined in any way.

Claims

1. A solder paste characterized by, The soldering paste comprises: a body in a sheet shape, the sheet-shaped body comprising a pre-formed solidified flux and a solder structure, a receiving space being formed in the solidified flux, the solder structure being correspondingly arranged in the receiving space, the solder structure being capable of being melted at a first preset temperature to form a solder joint.

2. The soldering paste according to claim 1, wherein the receiving space comprises a first subspace, the solder structure comprises a first structure body adapted to the shape of the first subspace, and the first structure body is correspondingly arranged in the first subspace.

3. The soldering paste according to claim 2, wherein the first structure body is in a spherical shape, and the outer edge of the spherical first structure body is tangent to the two side surfaces of the sheet-shaped body in the thickness direction.

4. The soldering paste according to claim 2, wherein the receiving space further comprises a second subspace, the solder structure comprises a second structure body adapted to the shape of the second subspace, and the second structure body is correspondingly arranged in the second subspace; wherein the melting point of the second structure body is higher than that of the first structure body, the first preset temperature comprises a first temperature and a second temperature, the second temperature is higher than the first temperature, the solder joint comprises a first solder joint and a second solder joint, the first structure body is capable of being melted at the first temperature to form the first solder joint, and the second structure body is capable of being melted at the second temperature to form the second solder joint.

5. The soldering paste according to claim 4, wherein the second structure body is in a cylindrical shape, and the cylindrical second structure body has a preset distance from the two side surfaces of the sheet-shaped body in the thickness direction.

6. The soldering paste according to claim 5, wherein the receiving space comprises a plurality of first subspaces and a plurality of second subspaces, the plurality of second subspaces are distributed around the plurality of first subspaces, and the first structure body and the second structure body are both in a plurality and correspondingly arranged in the plurality of first subspaces and the plurality of second subspaces, respectively.

7. The soldering paste according to claim 6, wherein the second structure body is a high-temperature alloy solder, and the first structure body is a low-temperature alloy solder; or the second structure body is a high-temperature alloy solder, and the first structure body is a medium-temperature alloy solder; or the second structure body is a medium-temperature alloy solder, and the first structure body is a low-temperature alloy solder.

8. The soldering paste according to claim 2 or 4, wherein the receiving space further comprises a third subspace, the sheet-shaped body further comprises a filler adapted to the shape of the third subspace, and the filler is correspondingly arranged in the third subspace; wherein at a second preset temperature, the filler is capable of wrapping the solder structure in the process of solidified flux volatilization, and the second preset temperature is lower than the first preset temperature.

9. A circuit board structure, characterized by The soldering paste comprises: a first layer of circuit board; a second layer of circuit board; A solder patch is disposed between the first layer circuit board and the second layer circuit board, the solder patch comprising: a body, the body being in a patch shape, the patch shape body comprising a preformed solidified flux and a solder structure, the solidified flux forming an accommodation space therein, the solder structure being correspondingly disposed in the accommodation space, the solder structure being capable of being melted at a first preset temperature to form a solder joint for signal communication of the first layer circuit board and the second layer circuit board.

10. The circuit board structure of claim 9, wherein, opposite side surfaces of the first layer circuit board and the second layer circuit board respectively have at least one first soldering area and at least one second soldering area corresponding thereto, the solder patch is at least one and is correspondingly disposed between the first soldering area and the second soldering area.

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