Controller assembly and vehicle

Abstract

The utility model discloses a controller assembly and a vehicle, the controller assembly comprises a box body, the box body comprises a lower shell with an accommodating cavity and an upper cover used for covering the lower shell; the driving circuit board comprises a first hole and a second hole, and the driving circuit board is connected with the lower shell; the power module comprises a positioning screw and a connecting part, the positioning screw is matched with the first hole, and the connecting part is matched with the second hole, so that the driving circuit board is connected with the power module; the height corresponding to a connecting point formed between the driving circuit board and the lower shell is larger than the height corresponding to a connecting point formed between the driving circuit board and the power module. In the utility model, the driving circuit board is respectively connected with the lower shell and the power module, and the connecting point between the driving circuit board and the lower shell is higher than the connecting point between the driving circuit board and the power module, so that the driving circuit board is arched at the mounting surface of the power module, a certain pressure stress is formed at the connecting part, and the electric connection reliability is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to vehicle technical field, concretely is a kind of controller assembly and vehicle. BACKGROUND

[0002] Controller assembly as a key electric drive assembly component of new energy vehicle, it is widely applied in vehicle. Controller assembly is responsible for receiving and processing input signals from other components of vehicle, and the current, voltage, frequency of motor are controlled and regulated, to realize efficient energy conversion and driving force output. Therefore, the working reliability of controller assembly has influence on vehicle control.

[0003] Controller assembly is integrated in controller box power module, drive circuit board, capacitor, filter assembly and other components, since controller assembly adopts stacking design, therefore, there can be unstable connection between each component, and further affect the performance of controller assembly work. UTILITY MODEL CONTENT

[0004] In view of the above defects of prior art, the technical problem to be solved by the utility model is how to improve the structural reliability of controller assembly.

[0005] In order to solve at least one of the above technical problems, the utility model discloses a kind of controller assembly and vehicle.

[0006] According to one aspect of the present disclosure, a kind of controller assembly and vehicle are provided, comprising:

[0007] Box, including the lower shell with accommodating cavity, and the upper cover for covering the lower shell;

[0008] Drive circuit board, including first hole and second hole, the drive circuit board is connected with the lower shell;

[0009] Power module, including positioning screw and connecting portion, the positioning screw is matched with the first hole, the connecting portion is matched with the second hole, so that the drive circuit board is connected with the power module;

[0010] The height corresponding to the connecting point formed between the drive circuit board and the lower shell is greater than the height corresponding to the connecting point formed between the drive circuit board and the power module.

[0011] In some possible embodiments, the controller assembly further comprises:

[0012] Capacitor, including first DC busbar, at least a portion of the first DC busbar is covered with heat conduction part, the capacitor is arranged inside the accommodating cavity;

[0013] The filter assembly comprises a second DC bus bar connected with the first DC bus bar of the capacitor;

[0014] A heat dissipation member is arranged in the accommodating cavity and close to one side of the filter assembly.

[0015] In some possible embodiments, the capacitor is filled in the accommodating cavity and forms a filling surface above the accommodating cavity, so that the capacitor forms an integrated structure with the lower shell, and at least a part of the first DC bus bar is arranged outside the filling surface.

[0016] In some possible embodiments, the second DC bus bar comprises a first segment extending in a horizontal direction and a second segment extending in a direction perpendicular to the lower shell; and the second segment is arranged above the heat dissipation member.

[0017] In some possible embodiments, a plurality of glue storage grooves are arranged in the accommodating cavity, and the glue storage grooves are used for accommodating the heat-conducting glue.

[0018] The first DC bus bar comprises a first threaded column, and one end of the first threaded column extends into a first glue storage groove filled with the heat-conducting glue.

[0019] In some possible embodiments, the second DC bus bar comprises a second threaded column, and one end of the second threaded column extends into a second glue storage groove filled with the heat-conducting glue.

[0020] In some possible embodiments, the controller assembly further comprises:

[0021] The water-cooled plate comprises a water-cooled plate body and a heat-conducting back plate connected with the water-cooled plate body; the water-cooled plate is arranged on the capacitor, and the heat-conducting back plate is in contact with the heat-conducting part.

[0022] The power module is arranged on the water-cooled plate and in contact with the water-cooled plate body.

[0023] In some possible embodiments, the thickness of the heat-conducting back plate is smaller than the thickness of the water-cooled plate body.

[0024] In some possible embodiments, the water-cooled plate comprises a water inlet, and the water inlet has a first surface and a second surface; the first surface of the water inlet is arranged in an inclined manner, and a plurality of first guide ribs are arranged on the first surface of the water inlet; and

[0025] The water-cooled plate comprises a water outlet, and the water outlet has a first surface and a second surface; the first surface of the water outlet is arranged in an inclined manner, and a plurality of second guide ribs are arranged on the first surface of the water outlet.

[0026] According to a second aspect of the present disclosure, there is provided a vehicle comprising the controller assembly of any one of the preceding aspects.

[0027] The utility model discloses, has following beneficial effect:

[0028] In the utility model, the lower shell and the upper cover are arranged, the lower shell is formed with the accommodation cavity inside to arrange each structure of the controller assembly in the accommodation cavity, thereby stacking and accommodating each component to realize the isolation protection of each component, the driving circuit board is connected with the power module and the lower shell respectively, the height of the connecting point between the driving circuit board and the lower shell is greater than the height of the connecting point between the driving circuit board and the power module, so that the driving circuit board is arched on the side close to the power module due to the height difference after connection, thereby providing certain compressive stress for the connecting part, improving the reliability of the connection between the power module and the driving circuit board, and further improving the working reliability of the controller assembly. BRIEF DESCRIPTION OF DRAWINGS

[0029] In order to more clearly illustrate the technical scheme of the utility model, the following will be briefly introduced the drawings needed to be used in the prior art description, and obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can be obtained according to these drawings without creative labor.

[0030] Figure 1 The controller assembly provided by the embodiments of the utility model provides the overall structure schematic diagram corresponding to the controller assembly;

[0031] Figure 2 The lower shell provided by the embodiments of the utility model provides the structure schematic diagram corresponding to the lower shell;

[0032] Figure 3 The capacitor and the water-cooled plate connecting structure provided by the embodiments of the utility model provide the side view;

[0033] Figure 4 The water-cooled plate provided by the embodiments of the utility model provides the structure side view corresponding to the water-cooled plate;

[0034] Figure 5 The water-cooled plate provided by the embodiments of the utility model provides the structure top view corresponding to the water-cooled plate;

[0035] Figure 6 The first structure schematic diagram in the accommodation cavity provided by the embodiments of the utility model;

[0036] Figure 7 The second structure schematic diagram in the accommodation cavity provided by the embodiments of the utility model;

[0037] Figure 8The utility model provides a partial view of driving circuit board cooperation connecting piece.

[0038] Wherein, the reference numerals are:

[0039] 100 - box, 110 - lower shell, 120 - upper cover, 130 - containing cavity, 131 - potting surface, 132 - first glue storage groove, 133 - second glue storage groove;

[0040] 200 - capacitor, 210 - first DC bus, 211 - first threaded column, 220 - heat conduction part;

[0041] 300 - water cooling plate, 310 - water cooling plate main body, 311 - water inlet, 312 - first guide rib, 313 - water outlet, 314 - second guide rib, 320 - heat conduction back plate;

[0042] 400 - filter assembly, 410 - second DC bus, 411 - second threaded column;

[0043] 500 - heat dissipation piece;

[0044] 600 - power module, 610 - connecting part;

[0045] 700 - driving circuit board, S1 - first installation surface, S2 - second installation surface. DETAILED DESCRIPTION

[0046] The technical solutions in the embodiments of the present specification will be described clearly and completely in the following with reference to the drawings in the embodiments of the present specification, obviously, the described embodiments are only part of the embodiments of the present specification, not all the embodiments. Based on the embodiments in the present specification, all other embodiments obtained by the person skilled in the art without making creative efforts belong to the protection scope of the present specification.

[0047] It should be noted that the terms "first", "second" and the like in the specification and claims of the present specification and the above-mentioned drawings are used to distinguish similar objects, and do not have to be used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of the present specification described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion, for example, a process, method, system, product or server including a series of steps or units does not have to be limited to those steps or units clearly listed, but can include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0048] Various exemplary embodiments, features, and aspects of the present disclosure will be described in detail below with reference to the accompanying drawings. The same reference numbers in different drawings represent the same or similar elements. Although various aspects of embodiments are illustrated in the drawings, the drawings are not necessarily drawn to scale unless specifically indicated.

[0049] The term "exemplary" is used herein to mean "serving as an example, instance, or illustration." Any implementation described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other implementations.

[0050] The term "and / or" used herein only means an association relationship of associated objects, which means that there can be three relationships, for example, A and / or B can mean that A exists alone, A and B exist together, and B exists alone. In addition, the term "at least one" herein means any one of a plurality or any combination of at least two of a plurality, for example, including at least one of A, B, and C can mean including any one or more elements selected from the set consisting of A, B, and C.

[0051] In addition, in order to better illustrate the present disclosure, numerous specific details are given in the specific embodiments below. Those skilled in the art should understand that the present disclosure can also be implemented without certain specific details. In some examples, methods, means, elements and circuits well known to those skilled in the art are not described in detail in order to highlight the main idea of the present disclosure.

[0052] Figure 1 The overall structure of a controller assembly is shown, and Figure 2 The structure of the lower shell 110 corresponding to the embodiment of the utility model is shown. Please refer to Figures 1-2 A controller assembly can include:

[0053] The box body 100 includes a lower shell 110 having a receiving cavity 130, and an upper cover 120 for covering the lower shell 110;

[0054] The capacitor 200 includes a first DC bus 210, at least a portion of the first DC bus 210 is covered with a heat-conducting portion 220, and the capacitor 200 is arranged inside the receiving cavity 130;

[0055] The water-cooled plate 300 includes a water-cooled plate body 310 and a heat-conducting back plate 320 connected to the water-cooled plate body 310; the water-cooled plate 300 is arranged on the capacitor 200, and the heat-conducting back plate 320 is in contact with the heat-conducting portion 220;

[0056] The filter assembly 400 includes a second DC bus 410 connected to the first DC bus 210 of the capacitor 200;

[0057] The heat dissipation piece 500 is arranged in the accommodating cavity 130 and close to one side of the filter assembly 400.

[0058] In one specific embodiment, the controller assembly comprises a box body 100 and components stacked in the box body 100, such as the capacitor 200, the water-cooled plate 300, the filter assembly 400, etc. The box body 100 comprises a lower shell 110 and an upper cover 120 arranged on the lower shell 110. The lower shell 110 has an accommodating cavity 130 inside for stacking and accommodating the components to achieve isolation and protection of the components.

[0059] For the capacitor 200, please refer to Figure 2 The capacitor 200 is arranged in the accommodating cavity 130 of the lower shell 110 and comprises a first DC bus 210. At least a part of the first DC bus 210 is covered with a heat-conducting part 220. The heat-conducting part 220 can be heat-conducting glue or other structures with small size and heat-conducting capability.

[0060] The capacitor 200 is filled in the accommodating cavity 130 and forms a filling surface 131 above the accommodating cavity 130, so that the capacitor 200 and the lower shell 110 form an integrated structure, and at least a part of the first DC bus 210 is arranged outside the filling surface 131.

[0061] Specifically, the capacitor 200 can be filled in the accommodating cavity 130 of the lower shell 110 by using epoxy glue, so that the capacitor 200 and the lower shell 110 form an integrated structure, thereby reducing the size of the controller assembly in the thickness direction. The epoxy glue forms the filling surface 131 after filling the capacitor 200, so that the capacitor 200 is divided into at least a part exposed outside the filling surface 131 and at least a part arranged inside the filling surface 131, i.e. inside the accommodating cavity 130. This can avoid heat accumulation caused by arranging the capacitor 200 entirely inside the accommodating cavity 130. In addition, the heat-conducting part 220 is arranged on the capacitor 200 exposed outside the filling surface 131, which cooperates with the heat-conducting back plate 320 of the water-cooled plate 300 to dissipate heat generated by the capacitor 200.

[0062] For the water-cooled plate 300, it comprises a water-cooled plate body 310 and a heat-conducting back plate 320. The thickness of the heat-conducting back plate 320 is smaller than that of the water-cooled plate body 310. The water-cooled plate body 310 can be formed by die casting, and the heat-conducting back plate 320 can be made of metal material to dissipate heat of the capacitor 200. One side surface of the water-cooled plate body 310 is welded with the heat-conducting back plate 320 to form the water-cooled plate 300. The thickness of the heat-conducting back plate 320 can be 1 mm. Figure 3 The side view of the capacitor 200 and the water-cooled plate 300 connection structure provided by the embodiment of the utility model is shown in Figure 3As shown, the water-cooled plate 300 is arranged inside the accommodating cavity 130, and the heat-conducting back plate 320 is in contact with the heat-conducting part 220 arranged on at least a part of the encapsulation surface 131 outside the capacitor 200; through cooperation of the heat-conducting back plate 320 and the heat-conducting part 220, the heat dissipation performance of the capacitor 200 is improved.

[0063] Meanwhile, since the water-cooled plate 300 can be regarded as including a water-cooled plate body 310 formed by die casting and a heat-conducting back plate 320 welded with the water-cooled plate body 310, the thickness of the heat-conducting back plate 320 is smaller than the thickness of the water-cooled plate body 310, so compared with the water-cooled plate formed by completely machining the die casting in the prior art, the machining area of the water-cooled plate 300 in the utility model is smaller, the influence of the machining process on the air tightness of the water-cooled plate 300 can be reduced, and the thickness of the water-cooled plate 300 is about 3mm-5mm smaller than the thickness of the water-cooled plate formed by completely machining the die casting, so the size of the controller assembly in the thickness direction can be further reduced.

[0064] Specifically, Figure 4 a structure side view of the water-cooled plate 300 provided by the utility model embodiment, Figure 5 a structure top view of the water-cooled plate 300 provided by the utility model embodiment; as Figure 4 and Figure 5 As shown, the water-cooled plate 300 includes a water inlet 311, the water inlet 311 has a first surface and a second surface, the first surface of the water inlet 311 is arranged obliquely, and a plurality of first guide ribs 312 are arranged on the first surface of the water inlet 311; and,

[0065] The water-cooled plate 300 includes a water outlet 313, the water outlet 313 has a first surface and a second surface, the first surface of the water outlet 313 is arranged obliquely, and a plurality of second guide ribs 314 are arranged on the first surface of the water outlet 313.

[0066] The water-cooled plate 300 has the water inlet 311 and the water outlet 313 arranged respectively on the other side surface not welded with the heat-conducting back plate 320, the first surface of the water inlet 311 and the first surface of the water outlet 313 are both arranged obliquely, a plurality of first guide ribs 312 are arranged on the first surface of the water inlet 311, and a plurality of second guide ribs 314 are arranged on the first surface of the water outlet 313, so that the condensed water can flow into a larger area along the obliquely arranged first surface and second surface and cooperate with the plurality of guide ribs, the condensed water is uniformly distributed, the risk of insulation failure caused by local humidity increase due to evaporation of the condensed water after the assembly is heated is reduced, and then the reliability and safety of the controller assembly in operation are improved.

[0067] In one specific embodiment, the accommodating cavity 130 formed by the lower shell 110 is provided with a plurality of glue storage grooves for accommodating heat-conducting glue; the first DC busbar 210 comprises a first threaded column 211, one end of the first threaded column 211 extending into a first glue storage groove 132 filled with heat-conducting glue.

[0068] Figure 6 A first structure diagram in the accommodating cavity 130 is shown in the embodiment of the utility model, as shown in the figure, Figure 6 by filling the glue storage groove with heat-conducting glue and extending part of the structure of the heating device, such as the capacitor 200, into the glue storage groove, further heat dissipation of the heating device is achieved; specifically, the first DC busbar 210 comprised by the capacitor 200 is provided with a first threaded column 211, and a first glue storage groove 132 is arranged at the corresponding position of the lower shell 110 close to the first threaded column 211, so that the first threaded column 211 can extend into the first glue storage groove 132 filled with heat-conducting glue, thereby achieving heat dissipation of the capacitor 200.

[0069] For the filter assembly 400, the second DC busbar 410 is connected with the first DC busbar 210, the second DC busbar 410 comprises a second threaded column 420, one end of the second threaded column 420 extending into a second glue storage groove 133 filled with heat-conducting glue.

[0070] The second DC busbar 410 comprises a first section extending in the horizontal direction and a second section extending in the direction perpendicular to the lower shell 110; the second section is arranged above the heat dissipation member 500.

[0071] Specifically, referring to Figure 6 , in the filter assembly 400, the second DC busbar 410 is provided with a second threaded column 420, and a second glue storage groove 133 is arranged at the corresponding position of the lower shell 110 close to the second threaded column 420, so that the second threaded column 420 can extend into the second glue storage groove 133 filled with heat-conducting glue, thereby achieving heat dissipation of the capacitor 200.

[0072] Meanwhile, continuing to refer to Figure 6 , the second DC busbar 410 can be of an L-shaped structure, comprising a first section extending in the horizontal direction and a second section extending in the direction perpendicular to the lower shell 110, and the second section is arranged above the heat dissipation member 500, that is, there is a gap between the heat dissipation member 500 and the second section of the second DC busbar 410, and the gap can be filled with heat-conducting glue or other materials capable of conducting heat and insulation; in combination with the second DC busbar 410 and the heat dissipation member 500 arranged in an L-shaped manner, electrical safety is achieved, heat dissipation of the filter assembly 400 is achieved, and the working reliability and service life of the structure in the filter assembly 400 under high temperature conditions are avoided.

[0073] In addition, the controller assembly further comprises a power module 600 and a drive circuit board 700, the power module 600 comprises a positioning screw and a connecting part 610; the power module 600 is arranged on the water-cooled plate 300 and is in contact with the water-cooled plate body 310.

[0074] Specifically, the drive circuit board 700 can be a control and drive integrated board in the controller assembly; the connecting part 610 can be a pin needle, and the power module 600 can be connected with other structures or other components through the pin needle to complete signal transmission. By arranging the power module 600 on the water-cooled plate body 310 and directly contacting the water-cooled plate body 310, heat dissipation of the power module 600 can be realized.

[0075] The drive circuit board 700 comprises a first hole matched with the positioning screw and a second hole matched with the connecting part 610; the drive circuit board 700 is connected with the lower shell 110;

[0076] The power module 600 and the drive circuit board 700 are connected through the positioning screw matched with the first hole and the connecting part 610 matched with the second hole. The height corresponding to the connecting point between the drive circuit board 700 and the lower shell 110 is greater than the height corresponding to the connecting point between the drive circuit board 700 and the power module 600.

[0077] Figure 7 A second structure in the accommodating cavity 130 is shown in the second structure schematic view provided by the utility model embodiment; Figure 8 A local schematic view of the drive circuit board 700 matched with the connecting part is shown in the second structure schematic view provided by the utility model embodiment; Figures 7-8 The power module 600 and the drive circuit board 700 are connected through the positioning screw matched with the first hole and the connecting part 610 matched with the second hole, but it can be understood that the connection and signal transmission between the two can be realized through the positioning screw matched with the first hole and the connecting part 610 (i.e. the pin needle) matched with the second hole.

[0078] Meanwhile, the drive circuit board 700 is also connected with the lower shell 110, as shown in Figure 7 S1 is a first mounting surface S1 at which the drive circuit board 700 is connected with the lower shell 110, and S2 is a second mounting surface S2 at which the drive circuit board 700 is connected with the power module 600; the height corresponding to the connecting point between the drive circuit board 700 and the lower shell 110 is greater than the height corresponding to the connecting point between the drive circuit board 700 and the power module 600, so that the drive circuit board 700 is arched in the area close to the power module 600 after being respectively mounted with the lower shell 110 and the power module 600 due to the height difference. Figure 8As shown, the driving circuit board 700 can further form a compressive stress on the connecting part 610, enhance the contact effect between the pin and the second hole, and improve the second reliability of the pin and the second hole, thereby ensuring the connection reliability between the power module 600 and the driving circuit board, and further ensuring the working reliability of the controller assembly.

[0079] According to the above-mentioned embodiments of the utility model, the box body includes a lower shell and an upper cover, the lower shell has an accommodating cavity formed therein to accommodate various structures of the controller assembly, thereby stacking and accommodating various components to achieve isolation protection of the components; the driving circuit board is connected with the power module and the lower shell, respectively, and the height of the connecting point between the driving circuit board and the lower shell is greater than the height of the connecting point between the driving circuit board and the power module, so that the driving circuit board is arched on the side close to the power module due to the height difference after connection, thereby providing a certain compressive stress to the connecting part, improving the connection reliability between the power module and the driving circuit board, and further improving the working reliability of the controller assembly. In addition, the heat-conducting back plate is arranged on one side of the water-cooled plate, and the heat-conducting back plate is attached to the capacitor, so that the water-cooled plate can improve the heat dissipation capacity of the heat generated by the capacitor during operation through the heat-conducting back plate; the capacitor is arranged in the accommodating cavity of the lower shell, and the first DC busbar included in the capacitor has at least a portion covered with a heat-conducting part, so that the heat-conducting part can cooperate with the heat-conducting back plate to further dissipate heat from the capacitor; at the same time, the heat dissipation member is arranged between the lower shell and the filter assembly in the accommodating cavity, which can improve the heat dissipation capacity of the heat generated by the filter assembly during operation, thereby avoiding the accumulation of heat caused by the stacking of various structures of the controller assembly in the accommodating cavity, and affecting the electrical performance and service life of the components. In summary, the utility model can improve the heat dissipation capacity, improve the flow guiding capacity of the condensate water by the water-cooled plate, and improve the connection reliability between the power module and the driving circuit board, thereby improving the working reliability of the controller assembly as a whole.

[0080] It should be noted that the above has described various embodiments of the present disclosure, and the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and changes are obvious to those skilled in the art without departing from the scope and spirit of the described embodiments. The choice of terms used herein is intended to best explain the principles, practical applications, or technical improvements in the art, or to enable other ordinary skilled persons in the art to understand the embodiments disclosed herein.

Claims

1. A controller assembly, characterized by, The controller assembly comprises: a box body comprising a lower shell having a receiving cavity, and an upper cover for covering the lower shell; a drive circuit board comprising a first hole and a second hole, the drive circuit board being connected with the lower shell; a power module comprising a positioning screw and a connecting portion, the positioning screw being matched with the first hole, and the connecting portion being matched with the second hole so that the drive circuit board is connected with the power module; a height corresponding to a connecting point formed between the drive circuit board and the lower shell being greater than a height corresponding to a connecting point formed between the drive circuit board and the power module.

2. A controller assembly according to claim 1, wherein, The controller assembly further comprises: a capacitor comprising a first DC bus, at least a portion of the first DC bus being covered with a heat-conducting portion, the capacitor being arranged inside the receiving cavity; a filter assembly comprising a second DC bus, the second DC bus being connected with the first DC bus of the capacitor; a heat-dissipating member arranged on a side of the receiving cavity close to the filter assembly.

3. A controller assembly according to claim 2, wherein, The capacitor is potted inside the receiving cavity and forms a potting surface above the receiving cavity, so that the capacitor and the lower shell form an integrated structure, and at least a portion of the first DC bus is arranged outside the potting surface.

4. The controller assembly of claim 2, wherein, The second DC bus comprises a first segment extending in a horizontal direction, and a second segment extending in a direction perpendicular to the lower shell, the second segment being arranged above the heat-dissipating member.

5. The controller assembly of claim 2, wherein, A plurality of glue storage grooves are arranged in the receiving cavity, the glue storage grooves being used for accommodating heat-conducting glue; The first DC bus comprises a first threaded column, one end of the first threaded column extending into a first glue storage groove filled with the heat-conducting glue.

6. A controller assembly according to claim 5, wherein, The second DC bus comprises a second threaded column; One end of the second threaded column extends into a second glue storage groove filled with the heat-conducting glue.

7. The controller assembly of claim 2, wherein, The controller assembly further comprises: a water-cooling plate comprising a water-cooling plate body and a heat-conducting back plate connected with the water-cooling plate body, the water-cooling plate being arranged on the capacitor, and the heat-conducting back plate being in contact with the heat-conducting portion; the power module being arranged on the water-cooling plate and being in contact with the water-cooling plate body.

8. A controller assembly according to claim 7, wherein, The thickness of the heat-conducting back plate is less than the thickness of the water-cooling plate body.

9. The controller assembly of claim 7, wherein, The water-cooling plate comprises a water inlet having a first surface and a second surface, the first surface of the water inlet being arranged obliquely, and a plurality of first guide ribs being arranged on the first surface of the water inlet; and the water-cooling plate comprises a water outlet having a first surface and a second surface, the first surface of the water outlet being arranged obliquely, and a plurality of second guide ribs being arranged on the first surface of the water outlet. The vehicle comprises the controller assembly according to any one of claims 1-9.

10. A vehicle characterized by comprising: ​

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