Portable container

Abstract

The utility model discloses a portable container which comprises a first shell and a second shell, the first shell and the second shell are detachably connected together to form a sealed containing cavity, the portable container further comprises a conduction piece, a semiconductor chilling plate and a control circuit for controlling the operation of the semiconductor chilling plate are arranged in the first shell, and the conduction piece is arranged in the second shell. The inner end of the conduction piece is arranged in the first shell in a sealed mode and abuts against the cold end of the semiconductor chilling plate, the outer end of the conduction piece extends out of the first shell and then extends into the containing cavity, and the cold end of the semiconductor chilling plate absorbs heat in the containing cavity through the conduction piece. The semiconductor chilling plate makes contact with the containing cavity through the conduction piece, the refrigeration efficiency is high, energy consumption is reduced, meanwhile, the conduction piece extends into the containing cavity, the contact area of the conduction piece and the containing cavity is increased, the refrigeration efficiency can be improved, and the refrigeration speed is higher.

Description

TECHNICAL FIELD

[0001] The utility model relates to portable container technical field, especially portable container with refrigeration and heating function. BACKGROUND

[0002] The existing portable container, such as the intelligent temperature control double-water-port water cup disclosed by CN222149619U, needs to be provided with two cup covers to meet the installation of the refrigeration unit and the heating unit, resulting in a complex overall structure and poor sealing of the cup body. Among them, the cup body is refrigerated by the semiconductor refrigerating sheet, but the semiconductor refrigerating sheet is separated from the cup body by the first partition plate, and the refrigeration efficiency is poor, and the overall energy consumption is high. Moreover, after the cup body is refrigerated by the semiconductor refrigerating sheet, the air pressure in the cup body becomes smaller, that is, the cup body is in a negative pressure state, and the cup cover cannot be opened. SUMMARY

[0003] The utility model aims at providing a portable container with improved refrigeration efficiency.

[0004] The utility model is realized as follows.

[0005] The portable container comprises a first shell and a second shell, the first shell and the second shell are detachably connected together and form a sealed container cavity, and further comprises a conducting member, a semiconductor refrigerating sheet and a control circuit for controlling the operation of the semiconductor refrigerating sheet are arranged in the first shell, the inner end of the conducting member is sealingly arranged in the first shell and abuts against the cold end of the semiconductor refrigerating sheet, the outer end of the conducting member extends into the container cavity after extending out of the first shell, and the cold end of the semiconductor refrigerating sheet absorbs heat in the container cavity through the conducting member.

[0006] The semiconductor refrigerating sheet of the utility model contacts the container cavity through the conducting member, so that the refrigeration efficiency is high and the energy consumption is reduced. Meanwhile, the conducting member extends into the container cavity, the contact area between the conducting member and the container cavity is increased, the refrigeration efficiency is improved, and the refrigeration speed is faster.

[0007] Further, the conducting member comprises a first section and a second section, the diameter of the first section is greater than that of the second section, the outer end surface of the first section and the surface of the second section are exposed to the container cavity, and the inner end surface of the first section abuts against the cold end of the semiconductor refrigerating sheet.

[0008] The first section has a larger contact area with the semiconductor refrigerating sheet, the volume of the second section is reduced, and the actual volume of the container cavity is increased.

[0009] Further, a heating body is arranged in the conducting member, the heating body is electrically connected with the control circuit, and the heat generated by the heating body is released into the container cavity through the conducting member.

[0010] The heating body realizes the heating function of the container cavity through the conducting member, the conducting member increases the contact area between the heating body and the container cavity, and the heating efficiency is improved.

[0011] Further, the conducting element is provided with a vertical fixing hole, the heating body is fixed in the fixing hole, the conducting element is provided with a first accommodating channel on one side of the fixing hole, the first accommodating channel is communicated with the fixing hole and the inner cavity of the first shell, and the wire of the heating body is connected with the control circuit through the first accommodating channel.

[0012] The heating body is easy to install, and the control circuit is convenient for supplying power to the heating body.

[0013] Further, the fixing hole is a stepped hole, the fixing hole comprises a first hole section and a second hole section, the diameter of the first hole section is larger than that of the second hole section, the second hole section extends out of the outer end of the conducting element, the heating body is limited in the first hole section, the NTC temperature sensor is arranged in the second hole section, the NTC temperature sensor seals the second hole section, the conducting element is provided with a second accommodating channel on one side of the fixing hole, one end of the second accommodating channel is communicated with the first accommodating channel, and the other end of the second accommodating channel is communicated with the second hole section, and the wire of the NTC temperature sensor is electrically connected with the control circuit through the second accommodating channel and the first accommodating channel.

[0014] The NTC temperature sensor is convenient for detecting the temperature of the cavity, and the portable container is convenient for realizing accurate temperature control. The second accommodating channel is convenient for connecting the NTC temperature sensor and the control circuit.

[0015] Further, the first shell is provided with a heat dissipation assembly, and the inner end surface of the conducting element is provided with a groove, and the heat dissipation assembly is arranged in the groove.

[0016] The heat dissipation assembly is convenient for dissipating heat from the hot end of the semiconductor refrigeration piece.

[0017] Further, the heat dissipation assembly comprises a heat dissipation fin, a fixing support and a fan, the fixing support makes the heat dissipation fin closely adhere to the hot end of the semiconductor refrigeration piece, the fixing support is provided with a heat dissipation channel at the center corresponding to the heat dissipation fin, and the fan is fixed in the heat dissipation channel.

[0018] The heat dissipation assembly and the semiconductor refrigeration piece are easy to install, and the heat dissipation fin and the fan improve the heat dissipation efficiency.

[0019] Further, the first shell is provided with a control circuit board near the top, the heat dissipation channel faces the control circuit board, the top surface of the first shell is provided with a control panel, the control panel is electrically connected with the control circuit on the control circuit board, the outer periphery of the first shell is provided with a heat dissipation ring network, and the heat dissipation channel is outwardly radiated to the outside through the control circuit board and the heat dissipation ring network.

[0020] The heat dissipation channel is also used for dissipating heat for the control circuit board, and the heat dissipation ring network improves the heat dissipation efficiency of the first shell.

[0021] Further, the first shell or the conducting member is provided with an air inlet valve corresponding to the cavity, the air inlet valve is provided with a normally closed air hole for gas only, the first shell is provided with an air path, one end of the air path is communicated with the outside, and the other end of the air path is communicated with the air hole; when the outside and the cavity are balanced in air pressure, the air hole is closed to make the air inlet valve in a sealed state; when there is an air pressure difference between the outside and the cavity, the cavity discharges or inhales air through the air hole.

[0022] The cavity is in a negative pressure state in a refrigeration state, inhales air through the air inlet valve, and ensures that the first shell can normally separate from the second shell; the cavity is in a positive pressure state in a heating state, discharges air through the air inlet valve, and ensures that the first shell separates from the second shell due to high pressure; in a normal state, the air inlet valve is sealed, and the cavity is closed and cannot leak water.

[0023] Further, the first shell is a cover body, the outer end of the conducting member extends out of the bottom surface of the cover body, the second shell is a cup body, the cavity is arranged in the cup body, and the cover body and the cup body are connected, and the outer end of the conducting member extends into the cavity.

[0024] The first shell is provided with the conducting member as the cover body, the second shell is provided with the cavity, and the second shell is convenient for a user to use.

[0025] The semiconductor refrigeration sheet contacts the cavity through the conducting member, has high refrigeration efficiency and reduces energy consumption, meanwhile, the conducting member extends into the cavity, increases the contact area of the conducting member and the cavity, and helps to improve the refrigeration efficiency and refrigeration speed. The heating body is arranged in the conducting member, the heating body realizes the heating function of the cavity through the conducting member, the conducting member increases the contact area of the heating body and the cavity, and further improves the heating efficiency. The cavity is in a negative pressure state in a refrigeration state, inhales air through the air inlet valve, and ensures that the first shell can normally separate from the second shell; the cavity is in a positive pressure state in a heating state, discharges air through the air inlet valve, and ensures that the first shell separates from the second shell due to high pressure; in a normal state, the air inlet valve is sealed, and the cavity is closed and cannot leak water. Compared with the prior art, the portable container reduces the possibility of being used upside down and reduces the risk of water leakage of the container. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 It is a three-dimensional structure schematic diagram of the embodiment one.

[0027] Figure 2 It is an exploded structure schematic diagram of the embodiment one.

[0028] Figure 3 It is a sectional structure schematic diagram of the embodiment one.

[0029] Figure 4 It is Figure 3 It is an enlarged view of the middle A part.

[0030] Figure 5 It is a structure schematic diagram of the first shell in the embodiment one.

[0031] Figure 6 The electrical schematic diagram of Example 1. DETAILED DESCRIPTION

[0032] The utility model will be further described below in combination with the drawings and examples.

[0033] Example 1, referring to Figures 1-6 As shown in the figure, a portable container includes a first shell 1, a second shell 2, a conducting element 3, a semiconductor refrigeration sheet 41, a heating body 42, an NTC temperature sensor 43, a heat dissipation assembly 5, an air inlet valve 6, a control circuit board 7, and a control panel 71, and the control circuit board 7 is provided with a control circuit.

[0034] The first shell 1 and the second shell 2 can be detachably connected together and form a sealed cavity 20, and the sealing means that at least six sides of the cavity 20 are shielded, and the closed state is to a certain extent. In this embodiment, the first shell 1 is a cover, the second shell 2 is a cup, the second shell 2 is provided with the cavity 20, the top of the cavity 20 is open and provided with an internal thread, the bottom surface of the cover extends downward to form a circular table 11, the circumferential surface of the circular table 11 is provided with an external thread, the first shell 1 is covered on the second shell 2, the circular table 11 is inserted into the cavity 20 and the external thread and the internal thread are threadedly connected to form the detachable connection. Preferably, the second shell 2 includes an outer shell 21 and an inner container 22, the inner container 22 forms the cavity 20, the inner container 22 is placed in the outer shell 21, and a heat preservation cavity 23 is arranged between the inner container 22 and the outer shell 21.

[0035] The semiconductor refrigeration sheet 41, the heat dissipation assembly 5, and the control circuit board 7 are all arranged in the first shell 1, and the control panel 71 is arranged on the top surface of the first shell 1. The inner end of the conducting element 3 is arranged in the first shell 1 and abuts against the cold end of the semiconductor refrigeration sheet 41, and the outer end of the conducting element 3 extends out of the first shell 1 from the bottom surface of the circular table 11. That is, the outer end of the conducting element 3 protrudes significantly from the bottom surface of the circular table 11, and the length of the conducting element 3 protruding from the bottom surface of the circular table 11 is much greater than the length of the conducting element 3 in the first shell 1. For example, the length of the conducting element 3 protruding from the bottom surface of the circular table 11 is several times or more than the length of the conducting element 3 in the first shell 1, so that the length of the conducting element 3 protruding from the bottom surface of the circular table 11 reaches at least half of the height of the cavity.

[0036] Specifically, the bottom surface of the circular platform 11 is provided with a mounting hole 10, and a stepped portion 12 is arranged between the periphery of the mounting hole 10 and the bottom surface of the circular platform 11. The inner end of the conducting member 3 extends outward in the circumferential direction to form a protruding edge 31, and the protruding edge 31 and the inner end of the conducting member 3 are formed with an annular step 32 in the circumferential direction. The protruding edge 31 is arranged on the stepped portion 12, the stepped portion 12 is inserted into the annular step 32, and a sealing ring 33 is arranged between the bottom surface of the protruding edge 31 and the top surface of the stepped portion 12. The inner end of the conducting member 3 extends out of the mounting hole 10 to form the first shell 1. The inner end surface of the conducting member 3 is provided with a recess 34, and the heat dissipation assembly 5 is arranged in the recess 34. The heat dissipation assembly 5 also clamps the sealing ring 33 between the protruding edge 31 and the stepped portion 12. Preferably, a non-heat-conducting partition piece 8 is arranged between the heat dissipation assembly 5 and the protruding edge 31. The partition piece 8 is provided with a positioning hole 81, and the semiconductor refrigeration sheet 41 is embedded in the positioning hole 81. The cold end and the hot end of the semiconductor refrigeration sheet 41 are exposed. The partition piece 8 prevents heat conduction between the conducting member 3 and the heat dissipation assembly 5.

[0037] Of course, the first shell 1 can also extend to form a surrounding wall to form the cavity. The surrounding wall surrounds the conducting member 3.

[0038] A battery can be arranged in the first shell 1 to supply power to the control circuit board 7, the semiconductor refrigeration sheet 41, and the heat-generating body 42.

[0039] The heat dissipation assembly 5 includes a heat dissipation fin 51, a fixing bracket 52, and a fan 53. The fixing bracket 52 allows the heat dissipation fin 51 to tightly adhere to the hot end of the semiconductor refrigeration sheet 41, and the bottom surface of the fixing bracket 52 abuts against the partition piece 8. The fixing bracket 52 is provided with a heat dissipation channel 50 at the center corresponding to the heat dissipation fin 51, and the fan 53 is fixed in the heat dissipation channel 50 above the heat dissipation fin 51. The control circuit board 7 is arranged in the first shell 1 close to the top, the heat dissipation channel 50 faces the control circuit board 7, the first shell 1 is provided with a heat dissipation circular ring network 13 on the outer periphery, and the inner cavity of the first shell 1 is connected to the outside through the heat dissipation holes 14 of the heat dissipation circular ring network 13. The heat dissipation channel 50 dissipates heat to the outside through the heat dissipation holes 14 of the heat dissipation circular ring network 13 via the control circuit board 7.

[0040] The conducting member 3 comprises a first section 35 and a second section 36, the diameter of the first section 35 is larger than that of the second section 36, and the first section 35 and the second section 36 are connected by a circular arc surface, the outer end surface of the first section 35 and the surface of the second section 36 are exposed in the cavity 20, and the inner end surface of the first section 35 abuts against the cold end of the semiconductor refrigeration sheet 41. A vertical fixing hole 37 is arranged in the center of the conducting member 3, the fixing hole 37 extends from the inner end surface of the first section 35 to the outer end surface of the second section 36, the fixing hole 37 is a stepped hole, the fixing hole 37 comprises a first hole section 371 and a second hole section 372, the diameter of the first hole section 371 is larger than that of the second hole section 372, and the second hole section 372 extends out of the outer end of the conducting member 3. A first displacement channel 38 is arranged on one side of the fixing hole 37 in the conducting member 3, the top of the first displacement channel 38 extends to the bottom surface of the groove 34, and the first displacement channel 38 is connected with the inner cavity of the first shell 1. A second displacement channel 39 is arranged on one side of the fixing hole 37 in the conducting member 3, one end of the second displacement channel 39 is connected with the first displacement channel 38, and the other end of the second displacement channel 39 is connected with the second hole section 372. In this embodiment, the first displacement channel 38 is located above the second displacement channel 39, and the bottom of the first displacement channel 38 is connected with the top of the second displacement channel 39. The third displacement channel 54 is arranged in the third displacement channel 54 corresponding to the first displacement channel 38, and the gap 55 for the wire is arranged between the fixed support 52 and the fan 53. The displacement gap 82 is arranged in the partition sheet 8 corresponding to the third displacement channel 54, and the groove 34 is connected with the third displacement channel 54 through the displacement gap 82.

[0041] The heating body 42 is fixed in the fixing hole 37. Specifically, the heating body 42 is in a cylindrical shape, the diameter of the heating body 42 is smaller than that of the first hole section 371 and larger than that of the second hole section 372. The heating body 42 is arranged in the first hole section 371 in a limiting manner, and the heating body 42 is arranged in a spaced manner with the semiconductor refrigeration sheet 41. The wire of the heating body 42 is connected with the control circuit board 7 after passing through the first displacement channel 38, the third displacement channel 54 and the gap 55.

[0042] The NTC temperature sensor 43 is fixed in the second hole section 372, and the temperature sensing end of the NTC temperature sensor 43 extends out of the conducting member 3, the NTC temperature sensor 43 seals the second hole section 372, and the wire of the NTC temperature sensor 43 is connected with the control circuit in an electrical manner after passing through the second displacement channel 39, the first displacement channel 38, the third displacement channel 54 and the gap 55. The NTC temperature sensor 43 is used for detecting the temperature at the outer end of the conducting member 3. The control panel 71 can adjust the required temperature in the cavity.

[0043] The outer end surface of the first section 35 of the conducting member 3 is provided with a through hole 30 communicating with the groove 34, and the air inlet valve 6 is arranged in the through hole 30. The top of the air inlet valve 6 is limited by the partition piece 8, and the top of the air inlet valve 6 is provided with a gas path 61 communicating with the gas path 61 of the groove 34. One end of the gas path 61 communicates with the outside, and the air inlet valve 6 is provided with a gas hole 60 which is normally closed and only allows gas to pass through. The other end of the gas path 61 communicates with the gas hole 60. In this embodiment, the air inlet valve 6 is made of silica gel or fluorine rubber material, and the very fine hole in the middle of the air inlet valve 6 constitutes the gas hole 60. When the air pressure of the outside and the cavity 20 is balanced, the gas hole 60 is closed, and the air inlet valve 6 is in a sealed state. When there is a pressure difference between the outside and the cavity 20, the gas hole 60 is opened, and the cavity 20 discharges or intakes gas through the gas hole 60.

[0044] Working principle, after the first shell 1 and the second shell 2 are connected, the outer end of the conducting member 3 extends into the cavity 20. In this embodiment, the conducting member 3 extends into the cavity 20 by a distance of at least half the height of the cavity 20. The control circuit of the control circuit board 7 controls the operation of the semiconductor refrigeration piece 41 or the heating body 42 to realize the refrigeration or heating function. Generally, the control circuit controls one of the semiconductor refrigeration piece 41 and the heating body 42 to operate alone.

[0045] Refrigeration state, the semiconductor refrigeration piece 41 and the fan 53 operate at the same time, the cold end of the semiconductor refrigeration piece 41 absorbs the heat in the cavity 20 through the conducting member 3, so that the temperature of the liquid in the cavity 20 decreases, and the NTC temperature sensor 43 stops after detecting that the temperature reaches the preset value. In this process, due to the temperature drop in the cavity 20, the cavity 20 is in a negative pressure state, at this time, the gas hole 60 of the air inlet valve 6 is opened, and the outside gas enters the cavity 20 through the gas path 61 and the gas hole 60, so that the air pressure of the cavity 20 is balanced. After the refrigeration is finished, the first shell 1 can be normally and easily separated from the second shell 2, and the user can use it conveniently. Generally, boiling water is poured into the cavity, and in the refrigeration state, the cold end of the semiconductor refrigeration piece 41 absorbs the heat of the boiling water through the conducting member 3, so that the boiling water is rapidly cooled to the preset temperature, and then the user can drink conveniently.

[0046] Heating state, when the heating body 42 operates, the heat generated by the heating body 42 is released to the cavity 20 through the conducting member 3, so that the temperature of the liquid in the cavity 20 rises, and the NTC temperature sensor 43 stops after detecting that the temperature reaches the preset value. In this process, due to the temperature rise in the cavity 20, the cavity 20 is in a positive pressure state, at this time, the gas hole 60 of the air inlet valve 6 is opened, and the gas in the cavity 20 flows out to the outside through the gas hole 60 and the gas path 61, so that the air pressure of the cavity 20 is balanced. Avoiding high pressure makes the first shell 1 separate from the second shell 2 to cause accidental danger. After the heating is finished, the first shell 1 can be normally and easily separated from the second shell 2, and the user can use it safely.

[0047] As used in the present utility model, the terms first, second, etc. do not denote any order, quantity or importance, but are merely used for differentiation.

[0048] As used in the present utility model, the terms one, an, etc. do not denote a limitation on quantity, but denote the existence of at least one of the objects mentioned.

[0049] As used in the present utility model, the terms indicating direction or position, such as front end, rear end, top, bottom, side, longitudinal, transverse, middle, center, outer, inner, horizontal, vertical, left, right, upper, lower, etc., mean reflecting relative position, not absolute position.

[0050] As used in the present utility model, the terms substantially, overall, approximately, similar, etc. are limiting terms used to indicate the existence of a feature but allow a certain deviation. The amount of the allowed deviation can vary depending on the specific context.

Claims

1. A portable container comprising a first housing (1) and a second housing (2) which are detachably connected together and formed with a sealed cavity (20), characterized in that, The conductive element (3) is sealed in the first shell (1) and abuts against the cold end of the semiconductor refrigerating sheet (41), and the outer end of the conductive element (3) extends into the cavity (20) after extending out of the first shell (1), and the cold end of the semiconductor refrigerating sheet (41) absorbs heat in the cavity (20) through the conductive element (3).

2. The portable container of claim 1, wherein, The conductive element (3) includes a first section (35) and a second section (36), the diameter of the first section (35) is greater than that of the second section (36), and the first section (35) and the second section (36) are connected through a circular arc surface, and the outer end surface of the first section (35) and the surface of the second section (36) are exposed in the cavity (20), and the inner end surface of the first section (35) abuts against the cold end of the semiconductor refrigerating sheet (41).

3. The portable container of claim 1, wherein, The conductive element (3) is provided with a heating body (42), the heating body (42) is electrically connected with the control circuit, and the heat generated by the heating body (42) is released into the cavity (20) through the conductive element (3).

4. The portable container of claim 3, wherein, The conductive element (3) is provided with a vertical fixing hole (37), and the heating body (42) is fixed in the fixing hole (37), and the conductive element (3) is provided with a first accommodating channel (38) on one side of the fixing hole (37), the first accommodating channel (38) is connected with the fixing hole (37) and the inner cavity of the first shell (1), and the wire of the heating body (42) passes through the first accommodating channel (38) and is connected with the control circuit.

5. The portable container of claim 4, wherein, The fixing hole (37) is a stepped hole, the fixing hole (37) includes a first hole section (371) and a second hole section (372), the diameter of the first hole section (371) is greater than that of the second hole section (372), the second hole section (372) extends out of the outer end of the conductive element (3), the heating body (42) is limitedly arranged in the first hole section (371), the NTC temperature sensor (43) is arranged in the second hole section (372), the NTC temperature sensor (43) seals the second hole section (372), the conductive element (3) is provided with a second accommodating channel (39) on one side of the fixing hole (37), one end of the second accommodating channel (39) is connected with the first accommodating channel (38), the other end of the second accommodating channel (39) is connected with the second hole section (372), and the wire of the NTC temperature sensor (43) is electrically connected with the control circuit through the second accommodating channel (39) and the first accommodating channel (38).

6. The portable container of claim 1, wherein, The first shell (1) is provided with a heat dissipation assembly (5), and the inner end surface of the conductive element (3) is provided with a groove (34), and the heat dissipation assembly (5) presses the semiconductor refrigerating sheet (41) in the groove (34).

7. The portable container of claim 6, wherein, The heat dissipation assembly (5) includes a heat dissipation fin (51), a fixing support (52) and a fan (53), the fixing support (52) makes the heat dissipation fin (51) tightly adhere to the hot end of the semiconductor refrigerating sheet (41), the fixing support (52) is provided with a heat dissipation channel (50) at the center corresponding to the heat dissipation fin (51), and the fan (53) is fixed in the heat dissipation channel (50).

8. The portable container of claim 7, wherein, The first shell (1) is provided with a control circuit board (7) near the top, the heat dissipation channel (50) faces the control circuit board (7), the top surface of the first shell (1) is provided with a control panel (71), the control panel (71) and the control circuit on the control circuit board (7) are electrically connected, the outer periphery of the first shell (1) is provided with a heat dissipation circular ring net (13), the heat dissipation channel (50) is outwardly heat dissipated to the heat dissipation circular ring net (13) through the control circuit board (7).

9. The portable container of claim 1, wherein, The first shell (1) or the conducting element (3) is provided with an air inlet valve (6) corresponding to the cavity (20), the air inlet valve (6) is provided with a gas hole (60) which is normally closed and only allows gas to pass through, the first shell (1) is provided with an air path (61), one end of the air path (61) is communicated with the outside, and one end of the air path (61) is communicated with the gas hole (60), when the air pressure of the outside and the cavity (20) is balanced, the gas hole (60) is closed to make the air inlet valve (6) in a sealed state, when there is a pressure difference between the outside and the cavity (20), the cavity (20) discharges or intakes air through the gas hole (60).

10. The portable container of claim 1, wherein, The first shell (1) is a cover body, the outer end of the conducting element (3) extends out of the bottom surface of the cover body, the second shell (2) is a cup body, the second shell (2) is provided with the cavity (20), and after the cover body and the cup body are connected, the outer end of the conducting element (3) extends into the cavity (20).

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