High and low temperature integrated temperature control system for semiconductor probe station

Abstract

The utility model discloses a high and low temperature integrated temperature control system for a semiconductor probe station. The high and low temperature integrated temperature control system comprises a compressor, an oil separator, an air-cooled condenser, a fan, a dry filter, a plurality of bypass valves, an electromagnetic valve, an expansion tank, an evaporative condenser, an evaporator, a magnetic drive pump and a connecting pipeline. The beneficial effects of the utility model are that the single-compressor automatic cascade technology is simple in structure and high in reliability; the evaporator and the evaporative condenser adopt modular design, so that the heat preservation effect is good; the hot gas bypass valve and the electronic expansion valve are used for temperature regulation and control to realize accurate regulation and control of cold and hot, an expansion tank refrigerant management technology is adopted, a pressure relief point is selected at a low-temperature liquid pipe section, and the flow of a low-temperature refrigerant in the system is regulated according to a load, so that a compressor always operates at a lower load, and energy conservation and noise reduction are realized; the problem that a conventional pump shaft seal is prone to leakage at low temperature is solved, and the maintenance and use cost can be greatly reduced for high-volatility and expensive fluorinated liquid.

Description

TECHNICAL FIELD

[0001] The utility model relates to semiconductor probe station temperature control device technical field, concretely is semiconductor probe station high low temperature integral temperature control system. BACKGROUND

[0002] In the semiconductor manufacturing process, the probe station is mainly used for wafer detection, chip research and development and fault analysis. Through the test of the probe station, the function, electrical parameter and radio frequency of the bare chip on the wafer can be tested, which plays a crucial role in ensuring product quality and reliability. And the probe station test process needs rapid temperature rise and fall and accurate temperature control of each temperature point in a large temperature range, the temperature control range is -70 DEG C~25 DEG C, which cannot be separated from the high-precision high-low temperature integrated unit.

[0003] At present, the high-low temperature integrated unit matched with the probe station on the market is basically monopolized by a few brands in Japan, South Korea and Germany. These brands develop products based on double-compressor mechanical cascade technology. With the rapid development of the domestic industry, it is urgent to replace imported products with domestic models. UTILITY MODEL CONTENTS

[0004] The utility model aims at providing semiconductor probe station high low temperature integral temperature control system to solve the problems in the above background technology.

[0005] In order to achieve the above-mentioned purpose, the utility model provides the following technical scheme: semiconductor probe station high low temperature integral temperature control system, including the evaporimeter, the evaporimeter both sides are equipped with the first pipe, the second pipe, the third pipe and the fourth pipe connected with it, the first pipe and the second pipe the other end is equipped with the fluorination liquid inlet and the fluorination liquid outlet connected with it, the fourth pipe is equipped with the evaporative condenser connected with it at the other end away from the evaporimeter, the evaporative condenser is equipped with the throttling capillary and the gas-liquid separator, the gas-liquid separator is connected with the air-cooled condenser through the fifth pipe, the third pipe is connected with the other end of the air-cooled condenser at the other end away from the evaporimeter.

[0006] Further optimization, the first pipe and the fluorination liquid inlet are equipped with magnetic drive pump and gas collecting cylinder in sequence, the magnetic drive pump solves the problem that the conventional pump shaft seal is easy to leak at low temperature. In the face of high volatility and expensive fluorination liquid, the maintenance and use cost can be greatly reduced.

[0007] Further optimization, the gas collecting cylinder is equipped with the sixth pipe connected with it at the other end away from the magnetic drive pump, and the other end is equipped with the liquid supplement tank connected with it.

[0008] Further optimization, the temperature sensor is arranged between the second pipe and the fluorination liquid outlet.

[0009] Further optimization, the third pipeline is sequentially provided with a pressure relief solenoid valve, an expansion tank, a fluorine supplement solenoid valve, a compressor and an oil separator, the expansion tank refrigerant management technology, the pressure relief point is selected in the low-temperature level liquid pipe section, the flow of the low-temperature refrigerant in the system is adjusted according to the load, so that the compressor always operates at a lower load, thereby realizing energy saving and noise reduction.

[0010] Further optimization, the fifth pipeline and the air-cooled condenser are provided with a dry filter connected thereto.

[0011] Further optimization, the third pipeline is provided with a seventh pipeline connected thereto, and the seventh pipeline is provided with a hot gas bypass valve connected thereto.

[0012] Further optimization, an electronic expansion valve is arranged on the third pipeline between the evaporator and the evaporative condenser.

[0013] Further optimization, the pressure relief solenoid valve is arranged between the evaporative condenser and the expansion tank and located on the third pipeline.

[0014] Further optimization, the air-cooled condenser is provided with a fan at one end, and the evaporative condenser is provided with an eighth pipeline connected with the third pipeline at one end.

[0015] Beneficial effects

[0016] The semiconductor probe station high and low temperature integrated temperature control system provided by the utility model adopts single compressor automatic cascade technology, which is simpler in structure and higher in reliability than double compressor mechanical cascade technology; the evaporator, the evaporative condenser and the corresponding connecting pipeline and valve are designed in a modular way, and the whole is concentrated for polyurethane foaming insulation process, so that the insulation effect is good; the hot gas bypass valve and the electronic expansion valve are used for temperature regulation and control, so that accurate cold and hot regulation and control are realized, thereby achieving high-precision temperature control; the expansion tank refrigerant management technology selects the pressure relief point in the low-temperature level liquid pipe section, adjusts the flow of the low-temperature refrigerant in the system according to the load, so that the compressor always operates at a lower load, thereby realizing energy saving and noise reduction; the magnetic drive pump solves the problem that the conventional pump shaft seal is easy to leak at low temperature, and can greatly reduce the maintenance and use cost of the high-volatility and expensive fluorinated liquid. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 It is a whole structure plane schematic view of the utility model. DETAILED DESCRIPTION

[0018] The following is a specific embodiment of the utility model and is further described in combination with the drawings, but the utility model is not limited to these embodiments.

[0019] EMBODIMENT

[0020] As Figure 1 shown, the semiconductor probe station high and low temperature integrated temperature control system, including evaporator 14, evaporator 14 both sides are respectively connected with the first pipeline 21, second pipeline 22, third pipeline 24 and fourth pipeline 25, the first pipeline 21 and the second pipeline 22 the other end is respectively provided with fluorinated liquid inlet 20 and fluorinated liquid outlet 19, the fourth pipeline 25 away from the other end of the evaporator 14 is provided with the evaporative condenser 12 connected therewith, the evaporative condenser 12 is provided with throttling capillary tube 8 and gas-liquid separator 7, the gas-liquid separator 7 is connected with the air-cooled condenser 4 through the fifth pipeline 28, the third pipeline 24 away from the other end of the evaporator 14 is connected with the other end of the air-cooled condenser 4.

[0021] In this embodiment, the first pipeline 21 and the fluorinated liquid inlet 20 are sequentially provided with magnetic drive pump 16 and gas collecting cylinder 15.

[0022] The other end of the gas collecting cylinder 15 away from the magnetic drive pump 16 is provided with the sixth pipeline 23 connected therewith, and the other end is provided with the liquid supplement tank 18 connected therewith.

[0023] The second pipeline 22 and the fluorinated liquid outlet 19 are provided with temperature sensor 17.

[0024] The third pipeline 24 is sequentially provided with pressure relief solenoid valve 9, expansion tank 10, fluorine supplement solenoid valve 11, compressor 1 and oil separator 2.

[0025] The fifth pipeline 28 and the air-cooled condenser 4 are provided with the drying filter 6 connected therewith.

[0026] The third pipeline 24 is provided with the seventh pipeline 29 connected therewith, the seventh pipeline 29 is provided with the hot gas bypass valve 5 connected therewith, the third pipeline 24 between the evaporator 14 and the evaporative condenser 12 is provided with the electronic expansion valve 13, the hot gas bypass valve (hot) and the electronic expansion valve (cold) are used for temperature adjustment control, through the precise PID algorithm, the precise control of cold and hot is realized, so that the high-precision temperature control is achieved. Compared with the traditional electric heating tube, no additional heat source is required, energy and operation cost are saved.

[0027] The pressure relief solenoid valve 9 is arranged between the evaporative condenser 12 and the expansion tank 10, and is located on the third pipeline 24. The expansion tank refrigerant management technology selects the pressure relief point in the low temperature level liquid pipe section, adjusts the flow of low temperature refrigerant in the system according to the load, so that the compressor always operates at low load, thereby realizing energy saving and noise reduction.

[0028] One end of the air-cooled condenser 4 is provided with the fan 3, and one end of the evaporative condenser 12 is provided with the eighth pipeline 27 connected with the third pipeline 24.

[0029] Single-compressor automatic cascade technology, which is simpler in structure and higher in reliability than double-compressor mechanical cascade technology; single compressor reduces components and connection points, improves system reliability and service life, saves equipment installation space and use cost.

[0030] Magnetic drive pump solves the problem of easy leakage of conventional pump shaft seal at low temperature. Facing high volatility and expensive fluorinated liquid, it can greatly reduce maintenance and use cost.

[0031] Finally, it should be noted that: the above only for the preferred embodiments of the utility model, and is not used to limit the utility model, although the utility model has been described in detail with reference to the foregoing embodiments, for the person skilled in the art, it still can modify the technical scheme recorded in the foregoing each embodiment, or equivalent replacement to part of the technical features. Any modification, equivalent replacement, improvement, etc. within the spirit and principles of the utility model, should be included in the protection scope of the utility model content of the utility model.

Claims

1. A high and low temperature integrated temperature control system for a semiconductor probe station, characterized in that: The application relates to a fluorination device, which comprises an evaporator (14), first, second, third and fourth pipes (21, 22, 24 and 25) connected to the evaporator (14) respectively, a fluorination liquid inlet (20) and a fluorination liquid outlet (19) connected to the other ends of the first and second pipes (21 and 22) respectively, an evaporative condenser (12) connected to the other end of the fourth pipe (25) away from the evaporator (14), a throttling capillary tube (8) and a gas-liquid separator (7) arranged in the evaporative condenser (12), a wind-cooled condenser (4) connected to the gas-liquid separator (7) through a fifth pipe (28), and the other end of the third pipe (24) away from the evaporator (14) is connected to the other end of the wind-cooled condenser (4). ​ 2. The semiconductor probe station high and low temperature integrated temperature control system of claim 1, wherein: A magnetic drive pump (16) and a gas collecting cylinder (15) are sequentially arranged between the first pipe (21) and the fluorination liquid inlet (20).

3. The semiconductor probe station high and low temperature integrated temperature control system of claim 2, wherein: The other end of the gas collecting cylinder (15) away from the magnetic drive pump (16) is provided with a sixth pipe (23) connected thereto, and the other end of the sixth pipe (23) is provided with a liquid supplement tank (18) connected thereto.

4. The semiconductor probe station high and low temperature integrated temperature control system of claim 1, wherein: A temperature sensor (17) is arranged between the second pipe (22) and the fluorination liquid outlet (19).

5. The semiconductor probe station high and low temperature integrated temperature control system of claim 1, wherein: A pressure relief electromagnetic valve (9), an expansion tank (10), a fluorine supplement electromagnetic valve (11), a compressor (1) and an oil separator (2) are sequentially arranged on the third pipe (24).

6. The semiconductor probe station high and low temperature integrated temperature control system of claim 1, wherein: A drying filter (6) is arranged between the fifth pipe (28) and the wind-cooled condenser (4).

7. The semiconductor probe station high and low temperature integrated temperature control system of claim 1, wherein: A seventh pipe (29) is arranged on the third pipe (24) and connected thereto, and a hot gas bypass valve (5) is arranged on the seventh pipe (29) and connected thereto. 8.The semiconductor probe station high and low temperature integrated temperature control system according to claim 1, wherein: An electronic expansion valve (13) is arranged on the third pipe (24) between the evaporator (14) and the evaporative condenser (12).

9. The semiconductor probe station high and low temperature integrated temperature control system of claim 5, wherein: The pressure relief electromagnetic valve (9) is arranged between the evaporative condenser (12) and the expansion tank (10) and on the third pipe (24).

10. The semiconductor probe station high and low temperature integrated temperature control system of claim 1, wherein: One end of the wind-cooled condenser (4) is provided with a fan (3), and one end of the evaporative condenser (12) is provided with an eighth pipe (27) connected to the third pipe (24).

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