Virtuality and reality combined PVD sputtering principle demonstration device
By using a virtual and real PVD sputtering principle demonstration device, which simulates the PVD sputtering process through projection and simulation modules, the problem of traditional teaching methods being unable to display dynamic details is solved, and the sputtering principle is demonstrated intuitively and deeply.
Patent Information
- Application Number
- CN202423060139.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-12
- Publication Date
- 2025-11-28
- Estimated Expiration
- 2034-12-12
AI Technical Summary
Existing technologies cannot intuitively demonstrate the dynamic details of the PVD sputtering process, and traditional teaching methods cannot meet learners' needs for a deeper understanding of sputtering technology.
By combining virtual and real methods, the projection module and PVD sputtering simulation module are used to play 3D videos on the projection screen and simulate the sputtering process with a simulated ion emitter. Combined with the operation of mechanical equipment, the macroscopic visualization of the microscopic process is realized.
It significantly improves the teaching effectiveness of sputtering principles, enhances learners' understanding, provides intuitive and dynamic demonstration tools, and improves learning efficiency and teaching effectiveness.
Smart Images
Figure CN223612027U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to teaching experiment demonstration equipment technical field, concretely relates to a kind of PVD sputtering principle demonstration device of virtual and real combination. BACKGROUND
[0002] PVD (Physical Vapor Deposition) sputtering technology is a key process widely used in surface coating and thin film preparation, and its core principle involves particle collision and deposition process at microscale. However, for beginners, the specific process of sputtering is abstract and difficult to understand. Traditional teaching methods usually rely on video or two-dimensional image display, which cannot fully demonstrate the details and dynamic characteristics of the sputtering process. The limitations of this expression method make it difficult for learners to intuitively understand the whole picture of sputtering principle, and the learning efficiency is affected.
[0003] Currently, the learning and understanding of PVD sputtering process mainly rely on traditional teaching methods, such as reading book content, watching video animation and teacher's oral explanation. However, these methods have certain limitations. Static graphics in books cannot fully demonstrate the dynamic details of the sputtering process, and video animation can provide certain intuitive feeling, but still lack the real operation experience combined with actual equipment. For learners who have not actually touched PVD sputtering equipment, this learning method is difficult to deeply understand the complex microphenomenon involved in the process and the specific operation principle of the equipment.
[0004] In particular, PVD sputtering involves ion interaction with target material, sputtering particle motion path in space and uniformity in deposition process, etc. These microphenomenon are difficult to understand intuitively through two-dimensional plane demonstration or theoretical description. Therefore, the existing teaching effect is generally poor, and students are difficult to fully master the overall process and working mechanism of sputtering process, which cannot meet the increasing demand for sputtering process teaching effect.
[0005] In summary, there is still much room for improvement in the existing technology in terms of teaching and understanding of PVD sputtering principle, and there is an urgent need for a new solution that can intuitively and vividly demonstrate the sputtering process. UTILITY MODEL CONTENT
[0006] The utility model aims at providing a kind of PVD sputtering principle demonstration device of virtual and real combination, and demonstrates PVD sputtering principle by virtual and real combination, and the purpose of the utility model is realized by the following technical scheme:
[0007] The utility model provides a kind of PVD sputtering principle demonstration device of virtual and real combination, and is characterized by comprising: projection module and PVD sputtering simulation module, the PVD sputtering simulation module is located in the projection orientation of projection module;
[0008] The PVD sputtering simulation module comprises:
[0009] a sputtering chamber;
[0010] a wafer disc placed inside the sputtering chamber;
[0011] a sputtering target with a simulated ion emitter placed inside;
[0012] a simulated ion emitter for simulating the effect of ion emission;
[0013] a projection module comprising a projection screen for playing a video of sputtering principle and projecting to a position between the sputtering target and the wafer disc.
[0014] Preferably, the PVD sputtering simulation module further comprises a rotating disc rudder fixing member fixed to the sputtering chamber by screws.
[0015] Preferably, the PVD sputtering simulation module further comprises a rotating disc on which the wafer disc is placed; the rotating disc is fixedly connected to the sputtering chamber through the rotating disc rudder fixing member and is in transmission connection with a motor fixed to the rotating disc rudder fixing member.
[0016] Further, the PVD sputtering simulation module further comprises a sputtering target baffle in transmission connection with the sputtering target through a rotating shaft; when the sputtering target moves to a predetermined position, the sputtering target baffle opens outward, and the simulated ion emitter is powered to emit light.
[0017] Further, the PVD sputtering simulation module further comprises a sputtering target fixing member, the sputtering target is fixed to the lower end surface of the sputtering target fixing member, and the sputtering target is fixedly connected to the inner wall of the sputtering chamber through the sputtering target fixing member.
[0018] Further, the PVD sputtering simulation module further comprises a sputtering target moving fixing member, the sputtering target fixing member is connected to the sputtering target moving fixing member, and the sputtering target moving fixing member is fixed to the inner wall of the sputtering chamber.
[0019] Further, the PVD sputtering simulation module further comprises a ball screw kit for driving the sputtering target moving fixing member to move the sputtering target up and down; the sputtering target moving fixing member is fixed to the inner wall of the sputtering chamber through the ball screw kit; the ball screw kit drives the sputtering target moving fixing member to move downward, thereby driving the sputtering target, the simulated ion emitter and the sputtering target baffle to move downward.
[0020] Preferably, the projection module further comprises a 3D cavity, an inner wall of the 3D cavity is provided with a transparent glass plate, and a projection screen is arranged at the top of the 3D cavity; the projection screen plays the content of the sputtering principle video, the video content is refracted to the sputtering cavity through the transparent glass plate, and the video content is projected to a position between the sputtering target and the wafer disc, so that the virtual-real combined demonstration of the sputtering process is realized.
[0021] Compared with the prior art, the above at least one technical scheme adopted by the embodiment of the present application can achieve at least the following beneficial effects:
[0022] Firstly, the utility model can intuitively demonstrate the sputtering principle, the sputtering process is presented in the form of macroscopic visualization from the microscopic level by combining the operation of the mechanical equipment and the 3D projection technology, so that the viewer can intuitively understand the principle and details of sputtering.
[0023] Secondly, the utility model enhances the demonstration effect by virtual-real combination, the video content played by the projection screen is superimposed with the simulation ion emission effect in the actual sputtering cavity through the refraction of the transparent glass plate, a dynamic demonstration of virtual-real combination is formed, and the teaching and display effect of the sputtering principle is greatly improved.
[0024] Thirdly, the utility model can highly simulate the real process, the simulation ion emitter can simulate the ion emission effect, and cooperates with the movement of the sputtering target and the opening and closing action of the baffle, so that each key link in the sputtering process is accurately reproduced, and the audience can deeply understand.
[0025] Fourthly, the detachable design of the wafer disc and the rotating disc of the utility model makes the operation of the equipment simple, and the components are convenient to clean and replace, so that the use convenience and maintenance efficiency of the equipment are improved. BRIEF DESCRIPTION OF DRAWINGS
[0026] In order to more clearly illustrate the technical scheme of the embodiments of the utility model, the drawings needed to be used in the embodiments will be briefly introduced below, and obviously, the drawings in the following description are only some embodiments of the utility model, and those skilled in the art can also obtain other drawings according to these drawings without creating creative labor.
[0027] Figure 1 It is an internal structure view of the PVD sputtering simulation module of the utility model;
[0028] Figure 2 It is a structural schematic view of the PVD sputtering simulation module of the utility model;
[0029] Figure 3 It is a structural schematic view of the projection module of the utility model.
[0030] EXPLANATION OF REFERENCE NUMERALS
[0031] 1, sputtering chamber; 2, wafer disc; 3, rotating disc; 4, rotating disc rudder engine fixing piece; 5, sputtering target fixing piece; 6, sputtering target moving fixing piece; 7, sputtering target; 8, simulated ion emitter; 9, sputtering target baffle; 10, ball screw sleeve; 11, 3D chamber; 12, projection screen; 13, transparent glass plate. DETAILED DESCRIPTION
[0032] The embodiments of the present application will be described in detail below with reference to the drawings.
[0033] The embodiments of the present application will be described in detail below with reference to the drawings.
[0034] In the prior art, in order to demonstrate the PVD sputtering principle, only one of the PVD sputtering simulation and video demonstration can be used, and the demonstration effect is poor, and the PVD sputtering principle cannot be well demonstrated. Under this premise, how to use the PVD sputtering simulation combined with the video demonstration device to achieve better PVD sputtering principle demonstration effect has become an urgent problem in the industry.
[0035] Based on this, the present application provides a solution for PVD sputtering principle demonstration: the solution demonstrates the PVD sputtering principle in a virtual-real combined manner.
[0036] As shown in Figure 1 and Figure 2 The present application provides a virtual-real combined PVD sputtering principle demonstration device for directly demonstrating the PVD sputtering principle, which comprises a PVD sputtering simulation module and a projection module. The PVD sputtering simulation module comprises a sputtering chamber 1, a ball screw sleeve 10, a rotating disc 3, a wafer disc 2, a sputtering target 7, a simulated ion emitter 8, and a sputtering target baffle 9. The projection module comprises a projection screen 12. The sputtering chamber 1 is located at the projection position of the projection module, and the projection screen 12 can be directly projected into the sputtering chamber 1 to simulate the actual PVD sputtering environment. The wafer disc 2 is placed on the rotating disc 3 to simulate the target material in the sputtering process.
[0037] In a preferred embodiment, the rotating disc 3 is fixed with the sputtering cavity 1 through the rotating disc rudder machine fixing part 4 and is connected with the motor for rotating the wafer disc 2; the ball screw sleeve kit 10 is installed on the inner wall of the sputtering cavity 1 and drives the sputtering target moving fixing part 6 to move up and down to drive the sputtering target 7 to move up and down; the sputtering target moving fixing part 6 is fixed with the inner wall of the sputtering cavity 1 through the ball screw sleeve kit 10; the ball screw sleeve kit 10 drives the sputtering target moving fixing part 6 to move downward, thereby driving the sputtering target 7, the simulated ion emitter 8 and the sputtering target baffle 9 to move downward; the sputtering target 7 is fixed on the lower end surface of the sputtering target fixing part 5, and the simulated ion emitter 8 is arranged in the sputtering target 7 for simulating the ion emission effect; the sputtering target baffle 9 is connected with the sputtering target 7 through the rotating shaft and is used for opening when the sputtering target 7 works and closing to protect the target material when it is static.
[0038] In the present scheme, the rotating disc 3 is fixed with the sputtering cavity 1 through the rotating disc rudder machine fixing part 4 and is driven to rotate through the motor, so as to realize the precise control of the wafer disc 2 and ensure the stable rotation of the wafer disc 2 in the sputtering process, thereby ensuring the consistency and uniformity of the sputtering process; the cooperation of the ball screw sleeve kit 10 and the sputtering target moving fixing part 6 can realize the precise up and down movement of the sputtering target 7. The ball screw system provides efficient and stable transmission, ensures that the target material can be accurately adjusted in position in different operation stages, and avoids the positioning error that may occur in the traditional mechanical device; the simulated ion emitter 8 arranged in the sputtering target 7 can simulate the ion emission effect and improve the authenticity of the demonstration. At the same time, the sputtering target baffle 9 is connected with the target through the rotating shaft and can be automatically opened or closed according to the working state of the sputtering target 7, so as to protect the target material from being damaged; the design of the sputtering target baffle 9 effectively prevents the accidental exposure or pollution of the target material and guarantees the long-term use of the target material; the automatic opening and closing of the sputtering target baffle 9 not only improves the automation degree of the operation, but also increases the protection function of the target material. When the target material is static, the baffle is closed to prevent pollution; when it works, the baffle is automatically opened to ensure that the ions can normally act on the surface of the target material and the wafer disc 2, thereby improving the safety and operation efficiency.
[0039] In a preferred embodiment, as shown in Figure 3 The projection module further includes a 3D cavity 11 and a transparent glass plate 13; the projection screen 12 is installed on the top of the 3D cavity 11 and is used for playing the video content of the sputtering process; the transparent glass plate 13 is fixed on the inner wall of the 3D cavity 11 and is used for refracting the video content played by the projection screen 12 into the sputtering cavity 1; the sputtering video played by the projection screen 12 is refracted through the transparent glass plate 13, combined with the actual structure of the sputtering target 7 and the wafer disc 2, to form a naked-eye 3D effect, which integrates the micro process and the macro equipment simulation, intuitively demonstrates through dynamic demonstration and 3D visual effect, and is helpful for students and researchers to quickly understand the micro principles such as ion bombardment and target reaction, greatly improves the learning efficiency and teaching effect.
[0040] In this scheme, the video content played by the projection screen 12 is superimposed with the simulated ion emission effect in the actual sputtering cavity 1 through the refraction of the transparent glass plate 13, forming a dynamic demonstration combining virtual and real, greatly improving the teaching and display effect of sputtering principle, suitable for teaching, scientific research and display scenes, providing students and researchers of related majors with intuitive and vivid learning tools, which helps to quickly master complex sputtering principle and process.
[0041] The embodiment also provides a PVD sputtering principle demonstration method combining virtual and real, and the steps are as follows:
[0042] S1, turn on the projection screen 12 and play the video content of sputtering principle.
[0043] S2, place the wafer disc 2 on the rotating disc 3 when starting the device.
[0044] S3, the ball screw assembly 10 drives the sputtering target moving fixture 6 to move downward, driving the sputtering target 7, the simulated ion emitter 8 and the sputtering target baffle 9 to move downward synchronously.
[0045] S4, after the ball screw assembly 10 stops moving, the sputtering target baffle 9 opens outward, the simulated ion emitter 8 is powered on to emit light, and the light irradiates to the upper end surface of the rotating disc 3, simulating the process of ion impacting target material.
[0046] S5, the video content played by the projection screen 12 is refracted through the transparent glass plate 13 and projected to the position between the sputtering target 7 and the wafer disc 2 in the sputtering cavity 1, forming a dynamic demonstration combining virtual and real.
[0047] S6, after the demonstration is completed, the sputtering target baffle 9 is reset and closed, the simulated ion emitter 8 is powered off, the ball screw assembly 10 drives the sputtering target moving fixture 6 to reset upward, and at the same time, the wafer disc 2 is removed and the projection screen 12 is turned off, completing the whole demonstration process.
[0048] The embodiment combines mechanical movement with 3D projection, and the sputtering process is presented in the form of dynamic pictures and actual device movement, so that the viewer can intuitively understand the key links of PVD sputtering principle, including ion emission, target impact, sputtered material deposition and other details, which significantly improves the teaching and display effect.
[0049] In the specification, the same and similar parts among the various embodiments can be referred to each other, and each embodiment focuses on the difference from other embodiments. Especially for the embodiments described later, the description is relatively simple, and the related parts can be referred to the part of the foregoing embodiment.
[0050] The above merely describes a specific implementation of the present application, but the protection scope of the present application is not limited thereto, any person skilled in the art can easily think of changes or replacements within the technical range disclosed by the present application, which should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.
Claims
1. A virtual-real combined PVD sputtering principle demonstration device, characterized in that, The application relates to a PVD sputtering simulation module and a projection module. The PVD sputtering simulation module comprises: a sputtering cavity (1); a wafer disc (2) arranged in the sputtering cavity (1); a sputtering target (7) internally provided with a simulated ion emitter (8); the simulated ion emitter (8) is used for simulating the effect of ion emission; the projection module comprises a projection screen (12) used for playing a sputtering principle video and projecting the video to a position between the sputtering target (7) and the wafer disc (2). The PVD sputtering simulation module further comprises a rotating disc rudder engine fixing piece (4) fixed to the sputtering cavity (1) through screws.
2. The virtual-real combined PVD sputtering principle demonstration device according to claim 1, characterized in that, The PVD sputtering simulation module further comprises a rotating disc (3) on which the wafer disc (2) is arranged; the rotating disc (3) is fixedly connected to the sputtering cavity (1) through the rotating disc rudder engine fixing piece (4) and is in transmission connection with a motor fixed to the rotating disc rudder engine fixing piece (4).
3. The virtual-real combined PVD sputtering principle demonstration device according to claim 2, characterized in that, The PVD sputtering simulation module further comprises a sputtering target baffle (9) rotationally connected to the sputtering target (7) through a rotating shaft; when the sputtering target (7) moves to a predetermined position, the sputtering target baffle (9) is opened outward, and the simulated ion emitter (8) is electrified to emit light.
4. The virtual-real combined PVD sputtering principle demonstration device according to claim 1, characterized in that, The PVD sputtering simulation module further comprises a sputtering target fixing piece (5) with the lower end face of the sputtering target (7) fixed thereto; the sputtering target (7) is fixedly connected to the inner wall of the sputtering cavity (1) through the sputtering target fixing piece (5).
5. The virtual-real combined PVD sputtering principle demonstration device according to claim 4, characterized in that, The PVD sputtering simulation module further comprises a sputtering target moving fixing piece (6) to which the sputtering target fixing piece (5) is connected; the sputtering target moving fixing piece (6) is fixed to the inner wall of the sputtering cavity (1).
6. The virtual-real combined PVD sputtering principle demonstration device according to claim 5, characterized in that, The PVD sputtering simulation module further comprises a ball screw sleeve (10) used for driving the sputtering target moving fixing piece (6) to move the sputtering target (7) up and down; the sputtering target moving fixing piece (6) is fixed to the inner wall of the sputtering cavity (1) through the ball screw sleeve (10); the ball screw sleeve (10) drives the sputtering target moving fixing piece (6) to move downward, thereby driving the sputtering target (7), the simulated ion emitter (8) and the sputtering target baffle (9) to move downward.
7. The virtual-real combined PVD sputtering principle demonstration device according to claim 6, characterized in that, The projection module further comprises a 3D cavity (11) with a transparent glass plate (13) arranged on the inner wall of the 3D cavity (11) and a projection screen (12) arranged on the top of the 3D cavity (11); the projection screen (12) plays the content of the sputtering principle video and refracts the video content to the sputtering cavity (1) through the transparent glass plate (13), so that the video content is projected to a position between the sputtering target (7) and the wafer disc (2), and the virtual and real combination demonstration of the sputtering process is realized.
8. The virtual-real combined PVD sputtering principle demonstration device according to claim 1, characterized in that,