Pressure equalization chip sintering fixture

Abstract

The utility model discloses a pressure equalization's chip sintering fixture is provided with the V -shaped groove and the side baffle of 90 DEG on the base, sets up the heat sink fixed establishment on one slope of V -shaped groove, sets up chip pressure tight mechanism on the other slope, and chip pressure tight mechanism includes guide rail, screw rod, pressure block and spring pressure piece, and the two guide rails of parallel arrangement are fixedly arranged on the slope of V -shaped groove, and pressure block is slidably connected with guide rail, and the first baffle of first baffle lower end connection spring pressure piece's center is set up fixedly on the upper end of guide rail, and the two legs of spring pressure piece press the two sides of pressure block upper surface. Two guide rails restrict the pressure block and do not skew, and the pressure balance of chip two ends, ensure that the thickness of solder is even in the sintering process of chip, make the force balanced effect of screw rod through spring pressure piece and the two ends of pressure block and chip, prevent the pressure block from possibly jamming with guide rail in the sintering process, guarantee the sustained, balanced pressure of chip two ends in the sintering process.

Description

TECHNICAL FIELD

[0001] The utility model belongs to semiconductor laser tooling fixture technical field, concretely relates to a chip sintering fixture of pressure balance.

[0002] The application belongs to the 1.3.3 new type component of 1.3 electronic core industry key direction in the 1.3 new generation information technology industry in strategic new type industry catalogue No. BACKGROUND

[0003] In the chip sintering process, often encounter strip-shaped chip, if this kind of chip is not balanced in soldering two ends pressure, will produce the cavity in the solder, lead to chip work when bad heat dissipation even burn out, or the solder thickness of chip two ends is uneven, one end is thick and the other end is thin, in the chip work will due to heat and produce stress, cause chip damage. SUMMARY

[0004] In view of above-mentioned problem of prior art, the application provides a chip sintering fixture of pressure balance.

[0005] The utility model discloses a chip sintering fixture of pressure balance.

[0006] A chip sintering fixture of pressure balance, the bottom seat is provided with 90 ° V-shaped groove, the side of V-shaped groove adjacent is provided with side baffle, one inclined surface of V-shaped groove is provided with heat sink fixing mechanism, and the other inclined surface is provided with chip compression mechanism, and the chip compression mechanism includes guide rail, screw rod, pressing block and elastic pressing piece, and the parallelly arranged two guide rails are fixedly arranged on the inclined surface of V-shaped groove, and the pressing block is slidably connected with the guide rail, and the first baffle is arranged on the upper end of guide rail, and the first baffle is fixedly arranged on the bottom seat, and the upper end of screw rod is threadedly connected with the first baffle, and the lower end of screw rod is connected with the center of elastic pressing piece, and the two legs of elastic pressing piece press the two sides of the upper surface of pressing block.

[0007] The heat sink fixing mechanism includes L-shaped spring clamp, and the side opposite to the side baffle of the bottom seat is provided with screw hole, and the two edges of the L-shaped spring clamp are provided with screw holes, and one edge is threadedly connected with the heat sink through screw, and the other edge is threadedly connected with the side of the bottom seat through screw.

[0008] The bottom seat and the pressing block are made of material with good heat conduction performance.

[0009] The bottom seat and the pressing block are made of metal, ceramic or graphite.

[0010] Compared to existing technologies, this invention adjusts the pressure on the pressure block and chip by tightening the screw; two guide rails prevent the pressure block from tilting, ensuring even pressure on both ends of the chip and uniform solder thickness during sintering; a spring-loaded pressure plate is placed between the screw and the pressure block, distributing the force applied by the screw evenly to both ends of the spring-loaded pressure plate, thus achieving balanced pressure on both ends of the pressure block and even force on the chip. Furthermore, it prevents the pressure block from jamming with the guide rails during sintering, ensuring balanced and continuous pressure on both ends of the chip from the pressure block and the spring-loaded pressure plate. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of the structure of this utility model.

[0012] Figure 2 This is a structural diagram of the base.

[0013] Figure 3 This is a schematic diagram of the elastic compression tablet structure. Detailed Implementation

[0014] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. It should be understood that these embodiments are only for illustrating the present invention and are not intended to limit the scope of the present invention. After reading the contents of the present invention, those skilled in the art can make various modifications or alterations to the present invention, and these equivalent forms also fall within the scope defined by the present invention.

[0015] like Figure 1 , Figure 2 As shown, a pressure-equalizing chip sintering fixture has a 90° V-groove 11 on the base 1, and side baffles 12 on the adjacent sides of the V-groove 11. The V-groove and side baffles 12 provide side and front-end positioning for the chip and heat sink. A heat sink fixing mechanism is set on one inclined surface of the V-groove 11, and a chip clamping mechanism is set on the other inclined surface. The chip clamping mechanism includes a guide rail 13, a screw 16, a pressure block 2, and an elastic pressure plate 3. Two parallel guide rails are fixed on one inclined surface of the V-groove. The back of the pressure block 2 has two rows of slots corresponding to the guide rails, so that the pressure block 2 fits tightly with the guide rail 13 and slides freely along the guide rail 13. The guide rail 13 allows the pressure block to move only in one dimension. When the base 1 is changed in placement angle, such as rotating 90° counterclockwise as shown in the figure, the pressure block 2 can still remain stable and will not tilt, maintaining uniform and unbiased pressure on the chip. The upper end of the guide rail 13 is provided with a first baffle 15, which is fixedly mounted on the base 1. The upper end of the screw 16 passes through the threaded hole 17 in the center of the first baffle 15 and is threadedly connected to the first baffle 15. The lower end of the screw 16 is connected to the elastic pressure plate 3, the structure of which is as follows: Figure 3As shown, the elastic pressing piece 3 has two legs 31 at both ends, a pressing portion 32 protruding from the middle of the legs, and a recess 33 in the center of the pressing portion for connecting with the screw rod. The lower end of the screw rod 16 is connected to the recess in the center of the pressing portion of the elastic pressing piece 3, and the two legs of the elastic pressing piece 3 press against the two sides of the upper surface of the pressing block 2. The screw rod 16 applies pressure to the elastic pressing piece 3, and the pressure can be adjusted according to the tightness of the screw rod 16. The design of the elastic pressing piece 3 ensures that, after the pressing block 2 contacts the chip, the force of the screw rod on the elastic pressing piece is evenly distributed to both ends of the elastic pressing piece, and the pressure on both ends of the pressing block is balanced. This is done to prevent the pressing block from being stuck with the guide rail during sintering, to ensure that the pressing block and the elastic pressing piece continuously press the chip during sintering, and to ensure that the pressure on both ends of the chip is balanced.

[0016] At least one of the connections between the elastic pressing piece 3, the screw rod 16, and the pressing block 2 is a fixed connection, which prevents the elastic pressing piece 3 from moving.

[0017] The heat sink fixing mechanism includes an L-shaped spring clamp 4. The base 1 has screw holes on the side opposite to the side plate 12. The L-shaped spring clamp 4 has threaded holes 17 on both sides. Tightening screws are inserted into the threaded holes to connect one side of the L-shaped spring clamp 4 to the heat sink (usually with multiple mounting screw holes) and the other side to the base 1, thereby fixing the heat sink in the V-shaped groove and preventing it from moving.

[0018] The base 1 and the pressing block 2 are made of materials with good heat conductivity, preferably metals, ceramics, or graphite.

[0019] Working process:

[0020] 1. Place the heat sink 5 and the chip 6 on the two inclined surfaces of the V-shaped groove of the base, respectively. The heat sink 5 is fixed to the base by the spring clamp 4.

[0021] 2. Install the pressing block. Align the back clamping slot of the pressing block with the guide rail, and then install the pressing block on the guide rail. The pressing block can slide freely on the guide rail without shaking.

[0022] 3. Insert the screw rod through the threaded hole in the center of the first baffle 15, and press the lower end of the screw rod against the elastic pressing piece 3. Tighten the screw rod to apply pressure to the elastic pressing piece 3. The pressure is evenly distributed to both ends of the elastic pressing piece, and the pressure on both ends of the pressing block is balanced. The pressure on both ends of the chip is also balanced. Furthermore, during sintering, the pressing block 2 is prone to being stuck with the guide rail 13 due to thermal expansion and contraction. Without the elastic pressing piece, the force applied by the screw rod directly acts on the pressing block and the chip, which can easily damage the chip. With the elastic pressing piece, the pressure on both ends of the chip is balanced and continuous, which better protects the chip.

[0023] The utility model discloses a screw rod is twisted and realizes the pressure regulation of briquetting and chip to two guide rails make briquetting not be skew, and the pressure balance of chip both ends, ensure that the thickness of solder is even in the sintering process of chip, set up elastic tablet between screw rod and briquetting, and the force of screw rod is evenly distributed to the both ends of elastic tablet, thereby the pressure balance of briquetting both ends, and chip stress balance. Further, prevent briquetting from being possibly stuck with guide rail in the sintering process, guarantee that there is balanced, continuous pressure in briquetting and elastic tablet both ends of chip.

[0024] The above only is the preferred implementation of the utility model, should point out, for the person skilled in the art, without departing from the overall concept of the utility model, can also make a number of changes and improvements, these also should be regarded as the protection scope of the utility model.

Claims

1. A pressure-equalizing chip sintering fixture, characterized in that: A 90° V-groove (11) is provided on the base (1). A side baffle (12) is provided on the side adjacent to the V-groove (11). A heat sink fixing mechanism is provided on one inclined surface of the V-groove (11), and a chip pressing mechanism is provided on the other inclined surface. The chip pressing mechanism includes a guide rail (13), a screw (16), a pressing block (2), and an elastic pressing plate (3). Two parallel guide rails (13) are fixedly provided on the inclined surface of the V-groove (11). The pressing block (2) is slidably connected to the guide rail. A first baffle (15) is provided at the upper end of the guide rail. The first baffle (15) is fixedly provided on the base (1). The upper end of the screw (16) is threadedly connected to the first baffle (15). The lower end of the screw (16) is connected to the center of the elastic pressing plate (3). The two legs of the elastic pressing plate (3) press down on the two sides of the upper surface of the pressing block (2).

2. The pressure-equalizing chip sintering fixture according to claim 1, characterized in that: The heat sink fixing mechanism includes an L-shaped spring clip (4), and a screw hole is provided on one side of the base (1) opposite to the side baffle (12). Threaded holes are provided on both sides of the L-shaped spring clip (4). One side is connected to the heat sink by a screw thread, and the other side is connected to the side of the base (1) by a screw thread.

3. The pressure-equalizing chip sintering fixture according to claim 1, characterized in that: The base (1) and the pressure block (2) are made of materials with good thermal conductivity.

4. The pressure-equalizing chip sintering fixture according to claim 3, characterized in that: The base (1) and the pressure block (2) are made of metal, ceramic or graphite.

Images