Heat dissipation structure of power adapter

By combining the tight fit between the aluminum substrate and the heat transfer surface with the fan mounting area and the heat dissipation fins, the problem of low heat dissipation efficiency of the power adapter is solved, achieving efficient heat transfer and heat dissipation, and improving the stability and service life of the power adapter.

CN223613672UActive Publication Date: 2025-11-28FUYUAN ELECTRONICS CO LTD
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Patent Information

Application Number
CN202422894636.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-27
Publication Date
2025-11-28
Estimated Expiration
2034-11-27

AI Technical Summary

Technical Problem

Existing power adapter heat dissipation structures have low heat transfer efficiency, which affects rapid heat dissipation.

Method used

The design employs a tight fit between the aluminum substrate and the heat transfer surface, combined with the fan mounting area and heat dissipation fins, to form a forced convection cooling system. This utilizes the excellent thermal conductivity of aluminum to improve heat transfer efficiency.

Benefits of technology

It improves the overall heat dissipation of the power adapter, ensures smooth heat transfer and avoids heat accumulation, enhances the heat dissipation area and heat exchange efficiency, and improves the stability and service life of the power adapter.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of heat dissipation of electronic products, in particular to a heat dissipation structure of a power adapter, which comprises an aluminum shell and an aluminum substrate, the aluminum shell is provided with a placement cavity, the aluminum substrate is arranged on the placement cavity, the bottom surface of the placement cavity is provided with a heat transfer surface, one surface of the aluminum substrate is attached to the heat transfer surface, and the other surface of the aluminum substrate is attached to the heat transfer surface. A heat dissipation part is arranged on the face, away from the heat transfer face, of the aluminum shell, the heat dissipation part is provided with a fan installation area and heat dissipation fins, and the heat dissipation fins are located on the periphery of the fan installation area. Due to the design that the aluminum substrate is attached to the heat transfer surface, heat resistance is further reduced, and heat can be transmitted to the aluminum shell more smoothly. The close contact mode is beneficial for avoiding accumulation of heat in the transfer process, and therefore the overall heat dissipation effect is improved.
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Description

TECHNICAL FIELD

[0001] The utility model relates to electronic product heat dissipation technical field especially relates to a power adapter heat dissipation structure. BACKGROUND

[0002] Power adapter, also known as external power supply, is a small portable electronic equipment and electronic power supply voltage conversion equipment. It is widely used in mobile phones, LCD, computer notebook and other small electronic equipment, and is also commonly used in security cameras, TV set top boxes, wireless routers, light bars, massage instruments and other equipment. The basic working principle of power adapter is to convert AC input into DC output, which is usually composed of shell, transformer, inductor, capacitor, control IC, PCB and other components.

[0003] The heat dissipation structure of the power adapter is an important part of its internal design, especially in the switching power supply working in high voltage and large current state, which has heavy workload and is usually fully enclosed structure without heat dissipation holes on the shell, so the heat dissipation design is particularly important. The existing heat dissipation structure generally has built-in or external fan to dissipate heat of the power adapter. However, the existing fan heat dissipation method has low heat transfer efficiency, which affects rapid heat dissipation. Therefore, new improvement is needed for the existing heat dissipation structure. SUMMARY

[0004] To solve the above problems, the aluminum substrate is attached to the heat transfer surface, which further reduces the thermal resistance, so that the heat can be more smoothly transferred to the aluminum shell. This close contact method helps to avoid the accumulation of heat in the transmission process, thereby improving the overall heat dissipation effect of the power adapter heat dissipation structure.

[0005] The technical scheme adopted by the utility model is: a power adapter heat dissipation structure, comprising an aluminum shell and an aluminum substrate, the aluminum shell is provided with a placing cavity, the aluminum substrate is arranged on the placing cavity, the bottom surface of the placing cavity is provided with a heat transfer surface, one side of the aluminum substrate is attached to the heat transfer surface, the side of the aluminum shell away from the heat transfer surface is provided with a heat dissipation part, the heat dissipation part is provided with a fan mounting area and a heat dissipation fin, and the heat dissipation fin is located at the outer periphery of the fan mounting area.

[0006] Further improvement of the above scheme is that the outer periphery of the aluminum shell in the placing cavity is provided with a fitting outer edge, and the fitting outer edge is provided with a sealing groove for accommodating a sealing ring to seal the placing cavity.

[0007] Further improvement of the above scheme is that the fitting outer edge is provided with a plurality of connecting columns, and the connecting columns are provided with connecting holes.

[0008] Further improvement of the above scheme is that the fitting outer edge is provided with a plurality of mounting positioning pins.

[0009] Further, the aluminum shell is integrally formed by casting from an aluminum alloy or pure aluminum.

[0010] Further, the aluminum shell is integrally formed by casting from an aluminum alloy or pure aluminum.

[0011] Further, the aluminum shell is integrally formed by casting from an aluminum alloy or pure aluminum.

[0012] Further, the aluminum shell is integrally formed by casting from an aluminum alloy or pure aluminum.

[0013] Further, the aluminum shell is integrally formed by casting from an aluminum alloy or pure aluminum.

[0014] Further, the aluminum shell is integrally formed by casting from an aluminum alloy or pure aluminum.

[0015] The utility model has the advantages of:

[0016] Compared with the existing power adapter heat dissipation, the utility model adopts aluminum shell as the shell material, and utilizes the accommodation cavity arranged in the aluminum shell to accommodate the aluminum substrate. The structure fully utilizes the excellent heat conduction performance of aluminum material. The aluminum shell not only serves as a protective structure, but also serves as a medium for heat transfer, effectively improving the heat conduction efficiency. In particular, the heat transfer surface design of the bottom surface of the accommodation cavity enables the aluminum substrate to be closely attached, ensuring efficient transfer of heat from the internal components of the power adapter to the aluminum shell. Secondly, the attachment design of the aluminum substrate and the heat transfer surface further reduces the thermal resistance, enabling heat to be more smoothly transferred to the aluminum shell. This close contact method helps to avoid the accumulation of heat during the transfer process, thereby improving the overall heat dissipation effect. Furthermore, the innovative design of the heat dissipation part is another highlight of the heat dissipation structure. By arranging the fan mounting area and the heat dissipation fins on the side of the aluminum shell opposite to the heat transfer surface, a forced convection heat dissipation system is formed. The fan mounting area allows the installation of a fan to generate airflow, while the heat dissipation fins increase the heat dissipation area and improve the heat exchange efficiency. The heat dissipation fins are arranged at the outer periphery of the fan mounting area, which helps to guide the airflow to flow uniformly through the fins, further enhancing the heat dissipation effect. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1The utility model discloses a power adapter heat dissipation structure's three-dimensional schematic view;

[0018] Figure 2 For Figure 1 The utility model discloses a power adapter heat dissipation structure's explosion schematic view;

[0019] Figure 3 For Figure 1 The utility model discloses a power adapter heat dissipation structure another perspective three-dimensional schematic view.

[0020] Mark explanation: aluminium shell 1, the accommodation cavity 11, the heat transfer surface 12, the briquetting 121, the heat dissipation part 13, the fan installation area 131, the heat dissipation fin 132, the fixed mounting column 133, the fixed hole 134, the adhering outer edge 14, the sealing recess 141, the connecting column 142, the connecting hole 143, the installation positioning pin 144, the first interface groove 15, the second interface groove 16, aluminium base plate 2, through -hole 21, the pressure groove 22. DETAILED DESCRIPTION

[0021] In order to facilitate understanding the utility model, below will be with reference to relevant drawings more comprehensive description of the utility model. The preferred embodiment of the utility model is given in the drawings. However, the utility model can be realized in many different forms, and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the utility model more thorough and comprehensive.

[0022] It should be noted that when an element is referred to as "fixed to" another element, it can be directly on the other element or there can be an intervening element. When an element is referred to as "connected to" another element, it can be directly connected to the other element or intervening elements can be present.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the utility model belongs. The term used in the specification of the utility model herein is only for the purpose of describing the specific embodiments, and is not intended to limit the utility model. As Figures 1-3As shown, in one embodiment of the utility model, a kind of power adapter heat dissipation structure, including aluminium shell 1 and aluminium substrate 2, the aluminium shell 1 is provided with setting chamber 11, the aluminium substrate 2 is arranged on setting chamber 11, the bottom surface of setting chamber 11 is provided with heat transfer surface 12, one side of the aluminium substrate 2 is attached with heat transfer surface 12, the one side of aluminium shell 1 and heat transfer surface 12 is provided with heat dissipation part 13, the heat dissipation part 13 is provided with fan mounting area 131 and heat dissipation fin 132, and heat dissipation fin 132 is located at the outer periphery of fan mounting area 131.This embodiment is by using aluminium shell 1 as shell material, and using the setting chamber 11 arranged in it to accommodate aluminium substrate 2, and the structure makes full use of the excellent heat conductivity of aluminium material.Aluminium shell 1 not only serves as protective structure, but also as heat transfer medium, effectively improve the heat conduction efficiency.Especially the design of heat transfer surface 12 on the bottom surface of setting chamber 11 makes aluminium substrate 2 can be closely attached, and ensures that heat is efficiently transferred from the internal components of power adapter to aluminium shell 1.Secondly, the attachment design of aluminium substrate 2 and heat transfer surface 12 further reduces thermal resistance, so that heat can be more smoothly transferred to aluminium shell 1.This close contact mode helps to avoid heat accumulation during transmission, thereby improving the overall heat dissipation effect.Furthermore, the innovative design of heat dissipation part 13 is another highlight of the heat dissipation structure.By setting fan mounting area 131 and heat dissipation fin 132 on the side of aluminium shell 1 and heat transfer surface 12, a forced convection heat dissipation system is formed.Fan mounting area 131 allows the installation of fans to generate airflow, while heat dissipation fin 132 increases the heat dissipation area and improves heat exchange efficiency.Heat dissipation fin 132 is located at the outer periphery of fan mounting area 131, which helps to guide the airflow evenly through the fins, further enhancing the heat dissipation effect.

[0024] Aluminium shell 1 is located at the outer periphery of setting chamber 11 and provided with a matching outer edge 14, which is provided with a sealing groove 141 for accommodating a sealing ring to seal the setting chamber 11.Specifically, the matching outer edge 14 is provided with a plurality of connecting columns 142, and the connecting columns 142 are provided with connecting holes 143.The matching outer edge 14 is provided with a plurality of mounting positioning pins 144.In this embodiment, first, the sealing groove 141 provided on the matching outer edge 14 can effectively accommodate the sealing ring, thereby ensuring the sealing of the setting chamber 11 and preventing foreign matter such as dust and moisture from entering, ensuring the safe operation of the internal components of the power adapter.Secondly, the design of the plurality of connecting columns 142 and connecting holes 143 on the matching outer edge 14 not only enhances the connection strength between the aluminium shell 1 and the setting chamber 11, but also provides convenience for subsequent assembly and disassembly, improving the maintainability of the product.In addition, the provision of a plurality of mounting positioning pins 144 further ensures the accurate positioning of the aluminium shell 1 on the setting chamber 11, avoiding problems such as poor heat dissipation or sealing failure caused by installation deviation.

[0025] The aluminum shell 1 is integrally formed by casting from an aluminum alloy or pure aluminum. Specifically, the aluminum shell 1 is provided with a first interface groove 15 and a second interface groove 16 on two sides, and one end of each of the first interface groove 15 and the second interface groove 16 is communicated to the accommodation cavity 11. In this embodiment, the high thermal conductivity of the aluminum shell 1 enables the heat generated by the power adapter during operation to be quickly conducted to the surface of the shell, thereby achieving efficient heat dissipation through natural convection or the assistance of a cooling fan, effectively reducing the operating temperature of the internal components and improving the stability and service life of the power adapter. In addition, the first interface groove 15 and the second interface groove 16 cleverly arranged on the two sides of the aluminum shell 1 not only meet the needs of connecting the power adapter with external devices, but also have a reasonable design, with one end communicated to the accommodation cavity 11, making the heat transfer path smoother and further enhancing the heat dissipation effect.

[0026] A copper cladding layer is formed on the heat transfer surface 12 by spraying, and the surface of the copper cladding layer is a flat surface for bonding the aluminum substrate 2. In this embodiment, the copper cladding layer has excellent electrical conductivity, which can effectively improve the circuit power quality of the power adapter and reduce resistance loss, thereby improving energy utilization efficiency. Secondly, the copper cladding layer has good thermal conductivity, which can quickly conduct the heat generated inside the power adapter to the aluminum substrate 2 and discharge it through the heat dissipation system, thereby effectively controlling the operating temperature of the power adapter and avoiding overheating that causes circuit failure or performance degradation.

[0027] The heat transfer surface 12 is provided with a mounting hole, and the aluminum substrate 2 is provided with a through hole 21 to fix the aluminum substrate 2 on the heat transfer surface 12 by a screw. Specifically, the heat transfer surface 12 is provided with a fixed pressing hole, and the fixed pressing hole is provided with a pressing block 121, and the aluminum substrate 2 is provided with a pressing groove 22, and the pressing block 121 is arranged on the pressing groove 22 to press the aluminum substrate 2 tightly on the heat transfer surface 12. In this embodiment, through the precisely arranged mounting hole and the through hole 21, the screw can stably lock the aluminum substrate 2 on the heat transfer surface 12, ensuring that the connection between the two is not only firm but also reliable. Further, the fixed pressing hole and the pressing block 121 structure arranged on the heat transfer surface 12 cooperate with the pressing groove 22 on the aluminum substrate 2 to achieve an additional pressing effect on the aluminum substrate 2. This pressing mechanism not only enhances the bonding degree between the aluminum substrate 2 and the heat transfer surface 12, but also effectively reduces the gap between the two, thereby improving the heat conduction efficiency.

[0028] The heat dissipation fins 132 are provided in multiple numbers, and the multiple heat dissipation fins 132 are arranged around the fan mounting area 131. The heat dissipation fins 132 are provided with fixed mounting columns 133, and the fixed mounting columns 133 are provided with fixed holes 134. In this embodiment, the fixed mounting columns 133 and the fixed holes 134 provided on the heat dissipation fins 132 provide reliable guarantee for the stable installation of the heat dissipation fins 132. This design ensures the stability and durability of the heat dissipation structure under long-time and high-load working conditions, effectively preventing the overheating problem of the power adapter caused by poor heat dissipation or loose structure. In addition, the heat dissipation structure also has good compatibility and expandability. By adjusting the number and arrangement of the heat dissipation fins 132, the heat dissipation requirements of power adapters of different powers and different sizes can be flexibly adapted. This not only improves the application range of the product, but also reserves sufficient space for future technical upgrading and performance improvement.

[0029] The above embodiments only express several embodiments of the present application, and the description is more specific and detailed, but it cannot be understood as a limitation on the scope of the present application. It should be noted that for ordinary skilled persons in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are all within the scope of protection of the present application. Therefore, the scope of protection of the present application should be subject to the appended claims.

Claims

1. A power adapter heat dissipation structure, characterized in that: The application relates to an aluminum shell and an aluminum substrate, the aluminum shell is provided with a placing cavity, the aluminum substrate is arranged on the placing cavity, the bottom surface of the placing cavity is provided with a heat transfer surface, one surface of the aluminum substrate is attached to the heat transfer surface, the surface of the aluminum shell, which is away from the heat transfer surface, is provided with a heat dissipation part, the heat dissipation part is provided with a fan mounting area and heat dissipation fins, and the heat dissipation fins are located at the outer periphery of the fan mounting area.

2. The power adapter heat dissipation structure of claim 1, wherein: The outer periphery of the aluminum shell at the outer periphery of the placing cavity is provided with an attached outer edge, the attached outer edge is provided with a sealing groove for accommodating a sealing ring to seal the placing cavity.

3. The power adapter heat dissipation structure of claim 2, wherein: The attached outer edge is provided with a plurality of connecting columns, and the connecting columns are provided with connecting holes.

4. The power adapter heat dissipation structure of claim 2, wherein: The attached outer edge is provided with a plurality of mounting positioning pins.

5. The power adapter heat dissipation structure of claim 1, wherein: The aluminum shell is integrally formed by casting from aluminum alloy or pure aluminum.

6. The power adapter heat dissipation structure of claim 5, wherein: The aluminum shell is provided with a first interface groove and a second interface groove at two sides, and the first interface groove and the second interface groove are both communicated to the placing cavity at one end.

7. The power adapter heat dissipation structure of claim 1, wherein: A copper coating is formed on the heat transfer surface by spraying, and the surface of the copper coating is a flat surface for attaching the aluminum substrate.

8. The power adapter heat dissipation structure of claim 1, wherein: The heat transfer surface is provided with a mounting hole, and the aluminum substrate is provided with a through hole for fixing the aluminum substrate on the heat transfer surface through a screw.

9. The power adapter heat dissipation structure of claim 1, wherein: The heat transfer surface is provided with a fixed pressing hole, the fixed pressing hole is provided with a pressing block, the aluminum substrate is provided with a pressing groove, and the pressing block is arranged on the pressing groove to tightly attach the aluminum substrate on the heat transfer surface.

10. The power adapter heat dissipation structure of claim 1, wherein: The heat dissipation fins are provided with a plurality of fixed mounting columns, and the fixed mounting columns are provided with fixed holes.