Electroplating cleaning equipment for electronic components

Abstract

The utility model relates to the technical field of electronic component production, and discloses electronic component electroplating cleaning equipment which comprises a bottom plate, a cleaning mechanism for cleaning an electronic component is arranged at the top of the bottom plate, and a drying mechanism for cleaning the electronic component is arranged above the cleaning mechanism. A placing frame for placing electronic elements is arranged above the drying mechanism, an adjusting mechanism for adjusting the height of the placing frame is arranged at the top of the placing frame, the adjusting mechanism comprises a fixing frame, first lead screws are rotationally connected to the top and the bottom of the inner wall of the fixing frame, and matched lead screw sliding sleeves are arranged on the outer walls of the first lead screws; a sliding block is fixed to the outer wall of the lead screw sliding sleeve. According to the electronic component cleaning and drying device, the cleaning process and the drying process are combined together, the time for waiting for natural drying of electronic components after being cleaned is shortened, and therefore the overall working efficiency is improved, the whole cleaning and drying process can be completed more quickly, the production efficiency is improved, and the electronic components can be taken conveniently.

Description

Technical Field

[0001] This utility model relates to the field of electronic component manufacturing technology, and in particular to an electronic component electroplating cleaning equipment. Background Technology

[0002] Electroplating of electronic components is a process that uses the principle of electrolysis to plate a thin layer of other metals or alloys onto the surface of electronic components. It is a process that uses electrolysis to coat the surface of metal or other material parts with a metal film, thereby preventing metal oxidation. After electroplating is completed, the surface of the parts needs to be cleaned.

[0003] However, most existing methods for cleaning electroplated electronic components involve immersion in a cleaning tank. This method, which cleans the electroplated parts while they are stationary, often results in poor cleaning effectiveness. Furthermore, after cleaning, the components need to be automatically dried before being removed, which is time-consuming and delays subsequent cleaning. Therefore, there is an urgent need for an electronic component electroplating cleaning device to solve these problems. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing an electronic component electroplating and cleaning device.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] An electronic component electroplating cleaning device includes a base plate, a cleaning mechanism for cleaning electronic components is provided on the top of the base plate, a drying mechanism for cleaning electronic components is provided above the cleaning mechanism, a placement frame for placing electronic components is provided above the drying mechanism, and an adjustment mechanism for adjusting the height of the placement frame is provided on the top of the placement frame.

[0007] The adjustment mechanism includes a fixed frame. A first lead screw is rotatably connected to the top and bottom of the inner wall of the fixed frame. A matching lead screw sleeve is provided on the outer wall of the first lead screw, and a slider is fixed on the outer wall of the lead screw sleeve. An L-shaped connecting rod is fixed to both ends of the slider. The bottom of the two L-shaped connecting rods is fixed to the same sealing plate. The bottom four corners of the sealing plate are fixed with first connecting rods. The bottom of the first connecting rods is fixed with the same placement frame. Through holes are opened on all four sides of the bottom of the placement frame. Vertical slots for the L-shaped connecting rods to pass through are opened at both ends of the fixed frame. The through holes allow air to blow into the interior of the placement frame to dry the electronic components.

[0008] As a further embodiment of this utility model, a second motor is installed on the top of the fixed frame, and the output shaft of the second motor is fixedly connected to the top of the first lead screw.

[0009] As a further embodiment of this utility model, the cleaning mechanism includes a cleaning tank located on the top of the base plate. The cleaning tank contains cleaning fluid. Multiple ultrasonic generators are installed on one side of the cleaning tank. A drain pipe communicating with the interior is connected to the bottom of the outer wall of one end of the cleaning tank. A valve is installed inside the drain pipe. Rotary rods are rotatably connected to both ends of the inner wall of the cleaning tank. Several stirring blades are fixed to the outer walls of the two rotating rods. Two synchronous wheels are provided on the outer wall of the cleaning tank away from the ultrasonic generators. Matching synchronous belts are provided on the outer walls of the two synchronous wheels. The two synchronous wheels are fixedly connected to one side of the two rotating rods respectively. The stirring blades will stir the cleaning fluid inside the cleaning tank, so that the cleaning fluid can thoroughly clean the electronic components.

[0010] As a further embodiment of this utility model, a first motor is installed on the other side of the cleaning tank, and the output shaft of the first motor is fixedly connected to the other end of one of the rotating rods.

[0011] As a further embodiment of this utility model, mounting plates are fixed at both ends of the top of the cleaning tank, and a drying mechanism is provided on the top of each of the two mounting plates.

[0012] As a further embodiment of this utility model, the drying mechanism includes a hot air blower installed at one end of the top of the mounting plate, two hot air blowers connected to air outlet pipes, a collecting hood fixed on the side of the two air outlet pipes that are close to each other, a mounting block fixed on the top of each of the two mounting plates, and through slots for the air outlet pipes to pass through at both ends of the two mounting blocks. The air blown out by the collecting hood will pass through the through hole of the placement frame to dry the electronic components.

[0013] As a further embodiment of this utility model, the top four corners of the base plate are fixed with fixing rods, the tops of the four fixing rods are fixed with the same top plate, and the bottom of the fixing frame is fixed with the top of the top plate. The top and bottom of the top plate have two holes for the L-shaped connecting rods to pass through.

[0014] The beneficial effects of this utility model are as follows:

[0015] This invention utilizes a hot air blower. A second motor drives a first lead screw to rotate, causing a slider to move the L-shaped connecting rods at both ends downwards. The sealing plate then moves the placement frame through the two mounting plates into the cleaning tank for cleaning. After cleaning, the second motor is activated, moving the placement frame between the two air collection hoods. The hot air blower then circulates hot air through the through-holes in the placement frame to dry the internal electronic components. This effectively solves the problem mentioned in the background technology where cleaning and subsequent removal of the electronic components requires automatic drying, which is time-consuming and delays subsequent cleaning. By combining the cleaning and drying processes, the time required for the electronic components to air dry naturally after cleaning is reduced, thereby improving overall work efficiency. The entire cleaning and drying process can be completed faster, increasing production efficiency and facilitating the handling of electronic components.

[0016] This invention utilizes a stirring blade. A first motor drives a rotating rod to rotate, and through a synchronous pulley and belt, the two rotating rods rotate synchronously. The rotating rods drive the stirring blade to agitate the cleaning solution inside the cleaning tank. Then, an ultrasonic generator is activated, allowing for a more thorough cleaning of electronic components. This effectively solves the problem mentioned in the background technology, where most cleaning methods involve immersion in a cleaning tank, which often results in poor cleaning effects due to the static state of the electroplated parts. The stirring blade design ensures that the cleaning solution is fully agitated, resulting in more uniform contact between the cleaning solution and the electronic components, thereby improving the cleaning effect. Furthermore, the high-frequency vibration of the ultrasonic waves further removes dirt and impurities from the surface of the electronic components, thus enhancing the thoroughness of the cleaning. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural diagram of an electronic component electroplating cleaning equipment proposed in this utility model;

[0018] Figure 2 This is a partial structural diagram of the adjustment mechanism of an electronic component electroplating and cleaning equipment proposed in this utility model;

[0019] Figure 3 This is a schematic diagram of the drying mechanism of an electronic component electroplating and cleaning equipment proposed in this utility model;

[0020] Figure 4 This is a partial structural diagram of the internal structure of the cleaning tank of an electronic component electroplating cleaning equipment proposed in this utility model.

[0021] In the diagram: 1. Base plate; 101. Fixing rod; 102. Top plate; 2. Cleaning tank; 201. Ultrasonic generator; 202. First motor; 203. Drain pipe; 204. Valve; 205. Synchronous pulley; 206. Synchronous belt; 207. Mounting plate; 208. Rotating rod; 209. Agitator blade; 3. Hot air blower; 301. Air collector hood; 302. Air outlet pipe; 303. Mounting block; 4. Fixing frame; 401. Placement frame; 402. First connecting rod; 403. Sealing plate; 404. First lead screw; 405. Vertical slot; 406. Slider; 407. Second motor; 408. L-shaped connecting rod. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0023] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0024] Reference Figure 1 - Figure 4 An electronic component electroplating cleaning device includes a base plate 1, a cleaning mechanism for cleaning electronic components is provided on the top of the base plate 1, a drying mechanism for cleaning electronic components is provided above the cleaning mechanism, a placement frame 401 for placing electronic components is provided above the drying mechanism, and an adjustment mechanism for adjusting the height of the placement frame 401 is provided on the top of the placement frame 401.

[0025] The adjustment mechanism includes a fixed frame 4. A first lead screw 404 is rotatably connected to the top and bottom of the inner wall of the fixed frame 4. The outer wall of the first lead screw 404 is provided with a suitable lead screw sleeve, and a slider 406 is fixed to the outer wall of the lead screw sleeve. Both ends of the slider 406 are fixed with L-shaped connecting rods 408. The bottom of the two L-shaped connecting rods 408 is fixed with the same sealing plate 403. The sealing plate 403 will seal the top of the cleaning tank 2. The bottom four corners of the sealing plate 403 are fixed with first connecting rods 402. The bottom of the first connecting rods 402 is fixed with the same placement frame 401. The bottom of the placement frame 401 is provided with through holes to allow air to blow into the interior of the placement frame 401 to dry the electronic components. Both ends of the fixed frame 4 are provided with vertical slots 405 for the L-shaped connecting rods 408 to pass through.

[0026] In this embodiment, a second motor 407 is installed on the top of the fixed frame 4, and the output shaft of the second motor 407 is fixedly connected to the top of the first lead screw 404.

[0027] In this embodiment, the cleaning mechanism includes a cleaning tank 2 located on the top of the base plate 1. The cleaning tank 2 contains cleaning fluid. Multiple ultrasonic generators 201 are installed on one side of the cleaning tank 2. A drain pipe 203 communicating with the interior is connected to the bottom of the outer wall of one end of the cleaning tank 2. A valve 204 is installed inside the drain pipe 203. Rotary rods 208 are rotatably connected to both ends of the inner wall of the cleaning tank 2. Several stirring blades 209 are fixed on the outer wall of each of the two rotating rods 208. The stirring blades 209 will stir the cleaning fluid inside the cleaning tank 2, so that it can thoroughly clean the electronic components. Two synchronous wheels 205 are provided on the outer wall of the cleaning tank 2 away from the ultrasonic generators 201. The outer wall of the two synchronous wheels 205 is provided with a matching synchronous belt 206. The two synchronous wheels 205 are respectively fixedly connected to one side of the two rotating rods 208.

[0028] In this embodiment, a first motor 202 is installed on the other side of the cleaning tank 2, and the output shaft of the first motor 202 is fixedly connected to the other end of one of the rotating rods 208.

[0029] In this embodiment, mounting plates 207 are fixed at both ends of the top of the cleaning tank 2, and a drying mechanism is provided on the top of both mounting plates 207.

[0030] In this embodiment, the drying mechanism includes a hot air blower 3 installed at one end of the top of the mounting plate 207. The air outlets of the two hot air blowers 3 are connected to air outlet pipes 302. An air collecting hood 301 is fixed on the side of the two air outlet pipes 302 that are close to each other. The air blown out by the air collecting hood 301 will pass through the through hole of the placement frame 401 to dry the electronic components. The tops of the two mounting plates 207 are each fixed with a mounting block 303, and both ends of the two mounting blocks 303 are provided with through slots for the air outlet pipes 302 to pass through.

[0031] In this embodiment, four fixing rods 101 are fixed at the top corners of the base plate 1, and the top of the four fixing rods 101 is fixed to the same top plate 102. The bottom of the fixing frame 4 is fixed to the top of the top plate 102. Two holes are opened at the top and bottom of the top plate 102 for the L-shaped connecting rod 408 to pass through.

[0032] Working principle: In use, first, place the electronic components to be cleaned in the placement frame 401. Then, start the second motor 407. The second motor 407 will drive the first lead screw 404 to rotate. The first lead screw 404 will drive the slider 406 to move down. The slider 406 will drive the L-shaped connecting rods 408 at both ends to move down. The L-shaped connecting rods 408 will drive the sealing plate 403 to move down. The sealing plate 403 will drive the placement frame 401 through the two mounting plates 207 into the cleaning tank 2. At this time, the sealing plate 403 will seal the top of the cleaning tank 2. Then, start the first motor 202. The first motor 202 will drive the rotating rod 208 to rotate. The rotating rod 208 will drive one of the synchronous pulleys 205 to rotate. The synchronous pulley 205 will drive the other synchronous pulley 205 to rotate through the synchronous belt 206. At this time, the two rotating rods 208 will... Synchronously rotating, the rotating rod 208 drives the stirring blade 209 to stir the cleaning liquid inside the cleaning tank 2. Then, the ultrasonic generator 201 is activated, which allows the electronic components to be cleaned more thoroughly. After cleaning, the dirt will enter the interior of the cleaning tank 2 through the through hole in the placement frame 401. Then, the second motor 407 is run to raise the placement frame 401 away from the top of the cleaning tank 2. When the placement frame 401 moves between the two air collection hoods 301, the hot air blower 3 is activated. The hot air blower 3 blows hot air into the air outlet duct 302, and then blows it onto the placement frame 401 through the air collection hood 301. The hot air passes through the through hole of the placement frame 401 to dry the electronic components inside. After drying, the electronic components are taken out and the next process can be carried out. The contents not described in detail in this description are existing technologies known to those skilled in the art.

[0033] For ease of description, spatial relative terms such as "above," "over," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "above" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0034] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0035] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0036] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. An electronic component electroplating cleaning device, comprising a base plate (1), characterized in that, The top of the base plate (1) is provided with a cleaning mechanism for cleaning electronic components, and above the cleaning mechanism is a drying mechanism for cleaning electronic components. Above the drying mechanism is a placement frame (401) for placing electronic components, and the top of the placement frame (401) is provided with an adjustment mechanism for adjusting the height of the components. The adjustment mechanism includes a fixed frame (4), and a first lead screw (404) is rotatably connected to the top and bottom of the inner wall of the fixed frame (4). The outer wall of the first lead screw (404) is provided with a suitable lead screw sleeve, and a slider (406) is fixed to the outer wall of the lead screw sleeve. Both ends of the slider (406) are fixed with L-shaped connecting rods (408). The bottom of the two L-shaped connecting rods (408) is fixed with the same sealing plate (403). The bottom four corners of the sealing plate (403) are fixed with first connecting rods (402). The bottom of the first connecting rods (402) is fixed with the same placement frame (401). The bottom of the placement frame (401) is provided with through holes. Both ends of the fixed frame (4) are provided with vertical slots (405) for the L-shaped connecting rods (408) to pass through.

2. The electronic component electroplating cleaning equipment according to claim 1, characterized in that, A second motor (407) is mounted on the top of the fixed frame (4), and the output shaft of the second motor (407) is fixedly connected to the top of the first lead screw (404).

3. The electronic component electroplating cleaning equipment according to claim 1, characterized in that, The cleaning mechanism includes a cleaning tank (2) located on the top of the base plate (1). The cleaning tank (2) contains cleaning fluid. Multiple ultrasonic generators (201) are installed on one side of the cleaning tank (2). A drain pipe (203) communicating with the interior is connected to the bottom of the outer wall of one end of the cleaning tank (2). A valve (204) is installed inside the drain pipe (203). Rotating rods (208) are rotatably connected to both ends of the inner wall of the cleaning tank (2). Several stirring blades (209) are fixed on the outer walls of the two rotating rods (208). Two synchronous wheels (205) are provided on the outer wall of the cleaning tank (2) away from the ultrasonic generators (201). The outer walls of the two synchronous wheels (205) are provided with matching synchronous belts (206). The two synchronous wheels (205) are fixedly connected to one side of the two rotating rods (208) respectively.

4. The electronic component electroplating cleaning equipment according to claim 3, characterized in that, A first motor (202) is installed on the other side of the cleaning tank (2), and the output shaft of the first motor (202) is fixedly connected to the other end of one of the rotating rods (208).

5. The electronic component electroplating cleaning equipment according to claim 3, characterized in that, The top of the cleaning tank (2) is fixed with mounting plates (207) at both ends, and the top of the two mounting plates (207) is provided with a drying mechanism.

6. The electronic component electroplating cleaning equipment according to claim 1, characterized in that, The drying mechanism includes a hot air blower (3) installed at one end of the top of the mounting plate (207). The air outlet ends of the two hot air blowers (3) are connected to air outlet pipes (302). The side of the two air outlet pipes (302) that are close to each other is fixed with an air collecting cover (301). The top of the two mounting plates (207) is fixed with a mounting block (303), and both ends of the two mounting blocks (303) are provided with through slots for the air outlet pipes (302) to pass through.

7. The electronic component electroplating cleaning equipment according to claim 1, characterized in that, The base plate (1) has four fixed rods (101) at the top corners, and the top of the four fixed rods (101) is fixed to the same top plate (102). The bottom of the fixed frame (4) is fixed to the top of the top plate (102). The top and bottom of the top plate (102) have two holes for the L-shaped connecting rod (408) to pass through.

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