Memory bank dismounting device
By designing a memory module removal device, which utilizes the combination of a grip and a push rod, the latch can be easily unlocked, solving the problems of difficult removal and hand cuts, and realizing a simple memory module removal operation.
Patent Information
- Application Number
- CN202422763575.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-12
- Publication Date
- 2025-12-02
- Estimated Expiration
- 2034-11-12
AI Technical Summary
When removing memory modules, the current technology is difficult to operate due to the limitations of the internal space and structure of the computer case, and it is easy to cut your hands.
Design a memory module removal device, including a grip and a push rod. The grip has a groove that engages with the outside of a clip, and the push rod abuts against the top of the clip to form a clamp. The clip can be easily unlocked by rotating the grip and the push rod.
It allows for easy removal of memory modules, avoiding hand injuries, and is simple to operate without taking up too much space.
Smart Images
Figure CN223617128U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of electronic equipment technology, and more specifically to a memory module removal device. Background Technology
[0002] Computers, servers, and other electronic devices are indispensable carriers of the Internet and information technology. As an important component for storing CPU processing data, memory modules play a crucial role in electronic devices.
[0003] Currently, when disassembling, replacing, or repairing memory modules, the common practice is to use one hand to press down on the clips on the memory module mounting bracket to open it, and then use the other hand to pull the memory module out of the slot. Due to the limitations of the internal space and structure of the computer case, this disassembly operation is quite difficult, and hands are easily scratched by the components attached to the casing. Utility Model Content
[0004] In view of the above problems, this application provides a memory module removal device, which can be used as an auxiliary tool to easily remove memory modules.
[0005] According to one aspect of the embodiments of this application, a memory module removal device is provided, comprising: a grip and a push rod. A groove is provided on the side of one end of the grip. The push rod is slidably disposed on the side of the groove opening on the grip and can slide toward the groove opening. The groove is used to engage with the outer side of a latch on a memory module mounting base. When the groove engages with the outer side of the latch, the push rod slides toward the groove opening and its end abuts against the top of the latch, so that the end of the push rod cooperates with the inner wall of the groove to clamp the latch. The grip and the push rod are used to rotate together when the end of the push rod engages with the groove to clamp the latch, so as to actuate the latch to release it from locking the memory module.
[0006] In one alternative embodiment, the sidewall of the groove away from the push rod along the sliding direction of the push rod is used to abut against the first stepped surface on the outer side of the buckle; the end of the push rod is provided with a stepped structure, which is used to abut against the first stepped surface in the groove away from the push rod along the sliding direction of the push rod, and when the push rod slides toward the opening of the groove, it abuts against the second stepped surface at the top of the buckle, so that the sidewall of the groove away from the push rod along the sliding direction of the push rod and the stepped structure respectively cooperate with the first stepped surface and the second stepped surface to lock the buckle.
[0007] In one alternative embodiment, the grip has an abutment surface formed on the side where the groove opening is located. Along the sliding direction of the push rod, the abutment surface is located on the side of the groove away from the push rod. The abutment surface is used to abut against the outer wall of the buckle located below the first step surface, so that the stepped structure is aligned with the second step surface along the sliding direction of the push rod.
[0008] In one alternative configuration, the grip is configured to be held by the hand; a protrusion is provided on the side of the push rod opposite the grip, the protrusion being configured to allow the thumb to apply force to push the push rod toward the groove of the groove when the grip is held by the hand.
[0009] In one alternative approach, the protrusion is provided with a plurality of raised strips arranged in a row.
[0010] In one alternative, a groove is provided on the grip along its extension direction, and the push rod is at least partially slidably connected within the groove.
[0011] In one alternative embodiment, the inner wall of the groove is provided with a first sliding guide portion, and the side wall of the push rod is provided with a second sliding guide portion, with the first sliding guide portion and the second sliding guide portion slidingly engaged.
[0012] In one alternative, an elastic element is connected between the grip and the push rod, the elastic element being used to provide a restoring force to the grip to slide away from the groove.
[0013] In one alternative embodiment, the push rod has a receiving groove at the end opposite to the groove, and the elastic element is disposed in the receiving groove.
[0014] In one alternative, both the grip and the pusher are made of metal.
[0015] The memory module removal device provided in this application embodiment first adopts a rod-shaped structure to facilitate insertion into the chassis of electronic devices without taking up too much space. Then, a groove on the side of one end of the handle engages with the outer side of the latch, achieving initial positioning of the handle when removing the memory module. Next, a sliding push rod abuts against the top of the latch, causing the inner wall of the groove and the end of the push rod to cooperate in clamping the latch. Finally, simply apply force to the end of the handle and push rod away from the groove to rotate and unlock the latch. The entire operation is easy and quick, and does not require the hand to be inserted into the latch, preventing hand injuries.
[0016] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, the following are specific embodiments of this application. Attached Figure Description
[0017] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:
[0018] Figure 1a This is a schematic diagram of the structure of a memory module after it has been inserted into a slot on a mounting bracket in the prior art.
[0019] Figure 1b This is a schematic diagram of the structure of the mounting bracket after the memory module is inserted into the memory module in the prior art;
[0020] Figure 2 A schematic diagram of the memory module disassembly device provided in this embodiment of the utility model;
[0021] Figure 3a A schematic diagram of the usage scenario after the initial positioning of the memory module disassembly device provided in this embodiment of the utility model;
[0022] Figure 3b exist Figure 3a A schematic diagram illustrating the usage scenario after the sliding push rod is used to clamp the buckle;
[0023] Figure 3c In order to be in Figure 3b A schematic diagram illustrating the usage scenario after the memory module removal device is rotated to unlock the latch;
[0024] Figure 4 This is a structural diagram of the force-applying part of the buckle;
[0025] Figure 5 A schematic diagram of the memory module disassembly device provided in this embodiment of the invention under an explosive state;
[0026] Figure 6 This is a schematic diagram of the memory module disassembly device provided in an embodiment of the present invention from another perspective under an explosion condition.
[0027] The reference numerals in the detailed embodiments are as follows:
[0028] 10. Mounting base; 10-1. Rotating shaft; 10-2. Snap fastener; 10-2-1. First step surface; 10-2-2. Second step surface;
[0029] 20. Memory module; 20-1. Card slot;
[0030] 100. Memory module removal device;
[0031] 110. Grip; 111. Groove; 112. Abutment surface; 113. Slide groove; 114. First sliding guide;
[0032] 120. Push rod; 121. End; 122. Stepped structure; 123. Protrusion; 1231. Raised strip; 124. Second sliding guide; 125. Receiving groove;
[0033] 130. Elastic component. Detailed Implementation
[0034] The embodiments of the technical solution of this application will now be described in detail with reference to the accompanying drawings. These embodiments are only used to more clearly illustrate the technical solution of this application and are therefore merely examples, and should not be used to limit the scope of protection of this application.
[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.
[0036] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.
[0037] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.
[0038] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A exists, A and B exist simultaneously, and B exists. In addition, the character " / " in this document generally indicates that the related objects before and after it have an "or" relationship.
[0039] In the description of the embodiments of this application, the term "multiple" refers to two or more (including two), similarly, "multiple sets" refers to two or more (including two sets), and "multiple pieces" refers to two or more (including two pieces).
[0040] In the description of the embodiments of this application, the technical terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.
[0041] In the description of the embodiments of this application, unless otherwise expressly specified and limited, technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.
[0042] For installation instructions on existing memory modules, please refer to [link / reference]. Figure 1a and Figure 1b The image shows a side perspective view. First, as... Figure 1a As shown, the mounting base 10 has latches 10-2 rotatably connected to both sides via pivots 10-1. When installing the memory module 20, first rotate the latches 10-2 on both sides to open them in the direction shown by arrow A in the figure, and then insert the memory module 20 into the slot of the mounting base 10 in the direction shown by arrow B in the figure, forming... Figure 1a The state shown. In Figure 1a With the memory module 20 inserted as shown, the latch 10-2 springs back and engages with the slots 20-1 on both sides of the memory module 20, thus restricting the removal of the memory module 20. Figure 1b The state shown.
[0043] Currently, when removing memory modules for replacement or repair, most of the disassembly is done manually. Specifically, in Figure 1b With the memory module 20 installed as shown, open the mounting bracket 10 by moving the latches 10-2 at both ends with your fingers. Figure 1a After reaching the indicated state, pinch the memory stick 20 with your fingers and pull it out of the slot on the mounting bracket 10.
[0044] Because there are many components on the motherboard inside the electronic device chassis and the layout is compact, the space around the mounting bracket 10 is limited. When manually removing the memory module 20, it is difficult to operate by hand due to the limitations of the internal space and the structure of other components. In addition, the edges and corners of the memory module 20 and some other components are quite sharp, and if you are not careful, you may cut your hand.
[0045] In order to make the memory module 20 easier and safer to remove, this application designs a memory module removal device. The groove on the handle engages with the outside of the latch 10-2, and then the push rod that slides on the handle abuts against the top of the latch 10-2. The two clamp the latch 10-2 without taking up too much space around the mounting base 10, ensuring smooth operation. Then, by rotating the handle and the push rod, the latch 10-2 can be easily unlocked. Finally, the memory module 20 can be pulled out by hand to complete the removal.
[0046] Please refer to details. Figure 2 The figure shows the structure of the memory module removal device provided in this application embodiment. As shown in the figure, the memory module removal device 100 includes a grip 110 and a push rod 120. A groove 111 is provided on the side of one end of the grip 110. The push rod 120 is slidably disposed on the side of the groove 111 on the grip 110, and can slide toward the groove 111, that is, the push rod 120 can slide in the direction shown by arrow Z in the figure.
[0047] Next, please refer to Figures 3a to 3c The image illustrates a usage scenario for the memory module removal device, such as... Figure 3a As shown, when removing the memory module 20, first engage the groove 111 on the handle 110 with the outer side of the latch 10-2 on the mounting base 10. Then, push the push rod 120 in the direction indicated by arrow Z in the figure to slide towards the side where the groove 111 is located, so that the end 121 of the push rod 120 abuts against the top of the latch 10-2, forming a... Figure 3b As shown, in this state, the end 121 of the push rod 120 engages with the inner wall of the groove 111 to clamp the buckle 10-2.
[0048] exist Figure 3b Based on this, when the grip 110 and push rod 120 are rotated together in the direction shown by arrow C in the figure, they will pull the clamped buckle 10-2 to rotate together, forming a... Figure 3c As shown in the diagram, in this state, the latch 10-2 rotates and moves out of the slot 20-1 on the memory module 20, thereby releasing the lock on the memory module 20. Then, pinch the memory module 20 and pull it upwards.
[0049] It should be noted that, in Figures 3a to 3cIn the disassembly scenarios shown, the unlocking of one side of the clip 10-2 is used as an example. The other side of the clip 10-2 on the mounting base 10 can be unlocked in the same way, so it will not be described in detail here.
[0050] In summary, the memory module removal device 100 provided in this application embodiment first adopts a rod-shaped structure to facilitate insertion into the chassis of electronic devices without occupying too much space. Then, the groove 111 on one side of the grip 110 engages with the outer side of the latch 10-2, achieving initial positioning of the grip 110 when removing the memory module 20. Next, the sliding push rod 120 abuts against the top of the latch 10-2, causing the inner wall of the groove 111 and the end 121 of the push rod 120 to cooperate in clamping the latch 10-2. Finally, by simply applying force to rotate the grip 110 and the push rod 120 at the end opposite to the groove 111, the latch 10-2 can be unlocked. The entire operation is easy and quick, and there is no need to insert the hand into the latch 10-2, preventing hand injuries.
[0051] The structure of the part of the buckle 10-2 originally used for applying force with the fingers is as follows: Figure 4 As shown, its outer side (right side of the viewpoint in the figure) has a first stepped surface 10-2-1, and its top has a second stepped surface 10-2-2 near the outer side. To enable the memory module removal device 100 to better cooperate with the force-applying part, as... Figure 3a As shown, the groove 111 is located away from the side wall of the push rod 120 along the sliding direction of the push rod 120 (i.e., Figure 3a The lower side wall of the groove 111 (under normal viewing angle) can abut against the first step surface 10-2-1 on the outer side of the buckle 10-2.
[0052] Please refer to further information. Figure 5 The exploding structure of the memory module removal device 100 shown in the figure has a stepped structure 122 at the end of the push rod 120. Figure 3a Based on this, when the push rod 120 is slid towards the groove opening of the groove 111, the step structure 122 abuts against the second step surface 10-2-2. Thus, the lower side wall of the groove 111 and the step structure 122 respectively engage with the first step surface 10-2-1 and the second step surface 10-2-2, locking the force-applying part of the latch 10-2, forming a... Figure 3b The state shown.
[0053] exist Figure 3b Based on this, that is, with the memory module removal device 100 locking the latch 10-2, rotating the memory module removal device 100 will easily unlock the latch 10-2. Figure 3c The state shown.
[0054] To ensure that the stepped structure 122 on the push rod 120 can accurately abut against the first stepped surface 10-2-1 when the push rod 120 slides, this application further proposes an implementation method, which please refer to for details. Figure 5 The grip 110 has an abutment surface 112 on the side where the groove 111 is located, along the sliding direction of the push rod 120 ( Figure 5 (As indicated by the middle arrow Z), the contact surface 112 is located on the side of the groove 111 opposite to the push rod 120. Please refer again next. Figure 3a and Figure 3b The abutment surface 112 is used to abut against the outer wall of the buckle 10-2 located below the first step surface 10-2-1, so that the step structure 122 is aligned with the second step surface 10-2-2 along the sliding direction of the push rod 120, thereby... Figure 3a With the abutting surface 112 abutting against the outer wall below the first step surface 10-2-1, when the push rod 120 is slid downwards in the direction indicated by arrow Z, it can be as follows: Figure 3b The step structure 122 is designed to accurately engage with the second step surface 10-2-2, thereby effectively locking the buckle 10-2.
[0055] To facilitate the operation of the memory module removal device 100, such as Figure 2 As shown, the grip 110 is configured to be held by the user's hand, and the push rod 120 has a protrusion 123 on the side opposite to the grip 110. The protrusion 123 is configured so that when the grip 110 is held by the hand, the thumb can apply force to push the push rod 120 to slide in the direction shown by arrow Z in the figure toward the groove 111.
[0056] Specifically, during operation, after the user holds the handle 110, their thumb is positioned on the side of the push rod 120 away from the handle 110. Then, the user inserts the handle 110 and the push rod 120 together into the mounting base 10 inside the chassis, where they engage with the latch 10-2 and are initially positioned (e.g., ...). Figure 3a (As shown in the diagram), place your thumb on the protrusion 123 and apply continuous pushing force to make the push rod 120 slide and abut against the top of the buckle 10-2 (as shown in the diagram). Figure 3b (as shown in the figure), and then, while maintaining this state, the hand drives the grip 110 and push rod 120 to rotate as a whole to open and unlock the buckle 10-2.
[0057] Furthermore, in order for the thumb to better push the push rod 120 through the protrusion 123, such as Figure 2 As shown, a plurality of protrusions 1231 can be arranged on the protrusion 123. The arrangement of the plurality of protrusions 1231 can increase the friction between the thumb and the protrusion, preventing slippage during pushing.
[0058] In addition to setting the raised strip 1231, structures such as anti-slip pads and textured surfaces can be used to increase friction and achieve better pushing of the push rod 120. The specific method is not limited here.
[0059] Regarding the sliding connection between the push rod 120 and the grip rod 110, this application proposes an implementation method, specifically as follows: Figure 5 As shown, a groove 113 is provided on the grip 110 along its extension direction, and the push rod 120 is at least partially slidably connected in the groove 113.
[0060] In this embodiment, since the push rod 120 is slidably connected to the groove 113 on the grip 110, when the push rod 120 is slidably moved, the memory module removal device 100 moves along... Figure 5 The outer walls on both sides in the direction indicated by the double arrow X do not move, thus allowing the user to move along the three sides in the circumferential direction (along...). Figure 5 The grip bar 110 is held by the two sides (as indicated by the double arrow X) and the side of the grip bar 110 away from the push rod 120, to ensure the reliability of the hand grip.
[0061] Furthermore, such as Figure 5 As shown, the inner sidewall of the slide groove 113 can be provided with a first sliding guide 114, and the sidewall of the push rod 120 can be provided with a second sliding guide 124. The relative sliding between the push rod 120 and the grip rod 110 is achieved by the sliding cooperation between the first sliding guide 114 and the second sliding guide 124.
[0062] exist Figure 5 In the specific embodiment shown, the first sliding guide 114 is a strip-shaped protrusion, and the second sliding guide 124 is a strip-shaped groove, with the protrusion slidably connected within the groove. Of course, in other embodiments, the first sliding guide 114 can also be a strip-shaped groove, and the second sliding guide 124 a strip-shaped protrusion, with the same principle of sliding engagement. Besides using a strip-shaped protrusion and a strip-shaped groove, other methods such as a slide rail and a slider, or a roller and a slide rail, can also be used; specific methods are not limited here.
[0063] In practice, the memory module removal device 100 is typically placed with the recessed end 111 facing downwards for memory module removal. This means that if the user does not restrain the push rod 120 with their hand, it will slide down under gravity before the recessed end 111 engages with the latch 10-2. This not only affects the operation but may also damage the memory module or other components inside the computer case. However, if the user presses down on the push rod 120 to prevent it from sliding down, the operation is laborious and requires constant vigilance, making it inconvenient to adjust the grip on the memory module removal device 100.
[0064] Based on the above issues, such as Figure 5 As shown, an elastic element 130 can be connected between the grip 110 and the push rod 120. The elastic element 130 is used to provide a restoring force to the grip 110 to slide away from the groove 111, so that when the user does not apply force to the push rod 120 to drive it to slide, the push rod 120 can be kept at the position furthest from the groove 111, regardless of the placement angle of the push rod 120. Therefore, when performing the operation of fastening the groove 111 to the outside of the buckle 10-2, the push rod 120 can be guaranteed not to slip without the need for additional hand force, making the removal and removal of the memory stick easier and more convenient.
[0065] To ensure the memory module removal device 100 has a clean appearance, this application also incorporates a hidden design for the elastic element 130. Please refer to the following for details. Figure 5 and further combine Figure 6 , Figure 6 The diagram shows the memory module removal device from another angle in an exploded state. As shown, the push rod 120 has a receiving groove 125 at the end opposite to the groove 111, and the elastic element 130 is disposed in the receiving groove 125.
[0066] In this embodiment, based on the push rod 120 being slidably connected to the groove 113 on the grip 110, a receiving groove 125 is further opened at the end of the push rod 120 away from the groove 111. The elastic element 130 is housed in the receiving groove 125 and connected to the push rod 120 and the grip 110 respectively. In the default state where the push rod 120 is not slidable, the elastic element 130 is completely covered and hidden by the grip 110 and the push rod 120, making the memory stick removal device 100 simple and beautiful overall.
[0067] Both the grip 110 and the push rod 120 can be made of metal to ensure the reliability of their sliding connection, and to ensure that the grip 110 and the push rod 120 are not easily disengaged when the buckle 10-2 is activated by rotating the grip 110 and the push rod 120.
[0068] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way.
Claims
1. A memory module disassembly device, characterized in that, include: The grip and push rod are provided. A groove is provided on the side of one end of the grip. The push rod is slidably disposed on the side of the groove opening on the grip and can slide toward the groove opening. The groove is used to engage with the outer side of the buckle on the memory module mounting base. The push rod is used to slide towards the opening of the groove and abut against the top of the buckle when the groove is engaged with the outer side of the buckle, so that the end of the push rod cooperates with the inner wall of the groove to clamp the buckle. The grip and the push rod are used to rotate together when the end of the push rod engages with the groove to clamp the buckle, thereby moving the buckle to release it from locking the memory module.
2. The memory module disassembly device according to claim 1, characterized in that, The side wall of the groove away from the push rod along the sliding direction of the push rod is used to abut against the first stepped surface on the outer side of the buckle; The end of the push rod is provided with a stepped structure. The stepped structure is used to abut against the first stepped surface in the groove away from the side wall of the push rod along the sliding direction of the push rod. When the push rod slides toward the opening of the groove, it abuts against the second stepped surface at the top of the buckle. This allows the side wall of the groove away from the push rod along the sliding direction of the push rod and the stepped structure to cooperate with the first stepped surface and the second stepped surface respectively to lock the buckle in place.
3. The memory module disassembly device according to claim 2, characterized in that, The grip has an abutment surface on the side where the groove is located. Along the sliding direction of the push rod, the abutment surface is located on the side of the groove away from the push rod. The abutment surface is used to abut against the outer wall of the buckle located below the first step surface, so that the step structure is aligned with the second step surface along the sliding direction of the push rod.
4. The memory module disassembly device according to claim 1, characterized in that, The grip bar is configured to be held by the hand; The push rod has a protrusion on the side opposite to the grip, and the protrusion is configured such that when the grip is held by the hand, the thumb can apply force to push the push rod to slide toward the groove opening.
5. The memory module disassembly device according to claim 4, characterized in that, The protrusion is provided with a plurality of raised strips arranged in a row.
6. The memory module disassembly device according to claim 1, characterized in that, The grip has a groove along its extension direction, and the push rod is at least partially slidably connected in the groove.
7. The memory module disassembly device according to claim 6, characterized in that, The inner sidewall of the slide groove is provided with a first sliding guide portion, and the sidewall of the push rod is provided with a second sliding guide portion, with the first sliding guide portion and the second sliding guide portion slidingly engaged.
8. The memory module disassembly device according to claim 6, characterized in that, An elastic element is connected between the grip and the push rod, and the elastic element is used to provide a restoring force to the grip to slide away from the groove.
9. The memory module disassembly device according to claim 8, characterized in that, The push rod has a receiving groove at one end away from the groove, and the elastic element is disposed in the receiving groove.
10. The memory module removal device according to any one of claims 1-9, characterized in that, Both the grip and the push rod are made of metal.