Semiconductor wafer transfer waterwheel

Abstract

The utility model relates to the technical field of wafer transportation, in particular to a semiconductor wafer transfer waterwheel, which comprises a vehicle body, walking wheels, a push handle, a cover plate, a limiting mechanism, a wafer placing mechanism, a drain pipe and a drain valve, the walking wheels are movably arranged below the vehicle body, the push handle is arranged outside the vehicle body, and the cover plate is detachably arranged on the vehicle body. The limiting mechanism is used for limiting and fixing the cover plate on the vehicle body, the wafer placing mechanism is located in the vehicle body and used for placing a wafer to be transferred, the drainage pipe is communicated with the vehicle body and located at the bottom in the vehicle body, and the drainage valve is communicated with the drainage pipe, extends out of the vehicle body and is used for controlling the flow speed of a water source drained by the drainage pipe. The cleaning liquid can clean impurities such as dust on the wafer at any time, so that cleaning is not needed again after the wafer is transferred, the production and processing time of the wafer is shortened, and the preparation efficiency of the wafer is improved.

Description

Technical Field

[0001] This utility model relates to the field of wafer transportation technology, and in particular to a semiconductor wafer transfer water truck. Background Technology

[0002] A wafer is a silicon wafer used to make silicon semiconductor circuits. In the wafer manufacturing process, a transfer vehicle is usually used to transfer the prepared wafers to facilitate subsequent processing. Existing transfer vehicles are generally manually operated, which is extremely labor-intensive and also poses a risk that the wafer may slip. Furthermore, if a person encounters an obstacle and falls, the wafer may also fall, ultimately causing the wafer to break and be damaged.

[0003] Existing technology CN217945264U discloses a wafer cassette transport vehicle. It features a shelf on the vehicle body, upon which a mounting base is arranged. Wafer cassettes are placed on the mounting base, ensuring a defined and reliable position. Secondly, a limiting groove is provided on the mounting base, within which the wafer cassettes are positioned. The groove wall provides horizontal stopping, preventing the wafer cassettes from sliding or shifting. Furthermore, a first limiting element on the mounting base further limits the wafer cassettes vertically, preventing them from swaying and detaching from the mounting base during bumpy road conditions. In practice, the vehicle moves forward using wheels, carrying all the wafer cassettes on the multi-layer shelf for batch transfer, significantly improving transport efficiency. Simultaneously, the limiting groove wall and the first limiting element ensure stable placement of the wafer cassettes on the vehicle body, effectively preventing them from falling and thus avoiding wafer breakage.

[0004] However, the aforementioned transfer vehicle was not equipped with a cleaning structure, which meant that after the wafers were transferred, the dust and other impurities on the wafer surface still needed to be cleaned, thereby increasing the wafer production and processing time and reducing the wafer fabrication efficiency. Utility Model Content

[0005] The purpose of this utility model is to provide a semiconductor wafer transfer water cart, which aims to solve the technical problem that existing transfer carts do not have a cleaning structure, which means that after the wafers are transferred, it is still necessary to clean the dust and other impurities on the wafer surface, thereby increasing the wafer production and processing time and reducing the wafer preparation efficiency.

[0006] To achieve the above objectives, this utility model provides a semiconductor wafer transport water truck, including a vehicle body, and further including wheels, a push handle, a cover plate, a limiting mechanism, a wafer placement mechanism, a drain pipe, and a drain valve. The wheels are movably disposed below the vehicle body, the push handle is disposed outside the vehicle body, the cover plate is detachably disposed on the vehicle body, the limiting mechanism is used to limit and fix the cover plate on the vehicle body, the wafer placement mechanism is located inside the vehicle body and is used to place the wafers to be transported, the drain pipe is connected to the vehicle body and is located at the bottom of the vehicle body, and the drain valve is connected to the drain pipe and extends outside the vehicle body to control the flow rate of the water discharged from the drain pipe.

[0007] The vehicle body includes a support base, a frame, and a partition. The support base is positioned above all the wheels, the frame is mounted on the support base, the push handle is positioned outside the frame, and the partition is positioned inside the frame to divide the frame into upper and lower spaces.

[0008] The wafer placement mechanism includes a support frame and a placement frame. The support frame is disposed on the partition plate and has a mounting groove. The placement frame is detachably disposed in the mounting groove of the support frame.

[0009] The limiting mechanism includes a fixing block, a connecting block, and a limiting member. The fixing block is disposed outside the frame body. The connecting block is detachably connected to the fixing block and disposed outside the cover plate. The limiting member is used to limit and fix the connecting block inside the fixing block.

[0010] The limiting component includes a movable rod and a spring. The movable rod is slidably connected to the fixed block and the connecting block, and passes through the fixed block and the connecting block respectively. The spring is disposed between the end of the movable rod and the fixed block, and is sleeved on the outside of the rod portion of the movable rod.

[0011] This utility model discloses a semiconductor wafer transfer water cart. The wafers to be transferred are placed in a wafer placement mechanism, and a cleaning solution is placed in the upper space of the cart body, allowing the wafers to be immersed in the cleaning solution. This enables continuous cleaning of dust and other impurities on the wafers during the transfer process. A cover plate is placed on the cart body and fixed by a limiting mechanism to prevent the cleaning solution in the upper space of the cart body from splashing out during transfer. Then, pushing the push handle moves the wheels on the ground, thereby moving the cart body to transfer the wafers. Because the cleaning solution continuously cleans dust and other impurities on the wafers during transfer, no further cleaning is required after transfer, thus shortening wafer production processing time and improving wafer fabrication efficiency. This solves the technical problem of existing transfer carts lacking a cleaning structure, which requires cleaning of dust and other impurities on the wafer surface after transfer, increasing wafer production processing time and reducing wafer fabrication efficiency. Attached Figure Description

[0012] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below.

[0013] Figure 1 This is a schematic diagram of the overall structure of the semiconductor wafer transfer water cart according to the first embodiment of this utility model.

[0014] Figure 2 This is a cross-sectional view of the semiconductor wafer transport water cart along the drain pipe according to the first embodiment of this utility model.

[0015] Figure 3 This is a cross-sectional schematic diagram of the semiconductor wafer transfer water cart along the movable rod according to the first embodiment of this utility model.

[0016] In the diagram: 101-Walking wheel, 102-Push handle, 103-Cover plate, 104-Drain pipe, 105-Drain valve, 106-Support base, 107-Frame, 108-Partition, 109-Support frame, 110-Placement rack, 111-Fixing block, 112-Connecting block, 113-Moving rod, 114-Spring. Detailed Implementation

[0017] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0018] First Embodiment

[0019] Please see Figures 1-3 , Figure 1 This is a schematic diagram of the overall structure of the semiconductor wafer transfer water cart according to the first embodiment of this utility model. Figure 2 This is a cross-sectional view of the semiconductor wafer transport water cart along the drain pipe 104 according to the first embodiment of this utility model. Figure 3 This is a cross-sectional schematic diagram of the semiconductor wafer transfer water cart along the movable rod 113 according to the first embodiment of this utility model.

[0020] This utility model provides a semiconductor wafer transport water cart, comprising a cart body, wheels 101, a push handle 102, a cover plate 103, a limiting mechanism, a wafer placement mechanism, a drain pipe 104, and a drain valve 105. The cart body includes a support base 106, a frame 107, and a partition 108. The wafer placement mechanism includes a support frame 109 and a placement frame 110. The limiting mechanism includes a fixing block 111, a connecting block 112, and a limiting component, the limiting component including a movable rod 113 and a spring 114. This solution solves the problem of the aforementioned transport cart lacking a cleaning structure, which requires cleaning of dust and other impurities on the wafer surface after transport, thus increasing wafer production time and reducing wafer fabrication efficiency. It is understood that this solution can be used in scenarios involving the transport of fabricated wafers.

[0021] In this embodiment, the wafer to be transported is placed in the wafer placement mechanism, and cleaning fluid is placed in the upper space of the vehicle body, allowing the wafer to be immersed in the cleaning fluid. This enables continuous cleaning of dust and other impurities on the wafer during the transport process. The cover plate 103 is placed on the vehicle body and fixed by the limiting mechanism to prevent the cleaning fluid in the upper space of the vehicle body from splashing out during transport. Then, the push handle 102 is pushed to move the traveling wheels 101 on the ground, thereby moving the vehicle body to transport the wafer. Because the cleaning fluid continuously cleans dust and other impurities on the wafer during transport, no further cleaning is required after transport, thus shortening the wafer production time and improving wafer fabrication efficiency. This solves the technical problem of existing transport vehicles lacking a cleaning structure, which requires cleaning of dust and other impurities on the wafer surface after transport, increasing wafer production time and reducing wafer fabrication efficiency.

[0022] The vehicle features a walking wheel 101 movably mounted below the vehicle body, a push handle 102 mounted outside the vehicle body, a cover plate 103 detachably mounted on the vehicle body, a limiting mechanism for fixing the cover plate 103 to the vehicle body, a wafer placement mechanism located inside the vehicle body for placing wafers to be transported, a drain pipe 104 connected to the vehicle body and located at the bottom of the vehicle body, and a drain valve 105 connected to the drain pipe 104 and extending outside the vehicle body for controlling the flow rate of water discharged from the drain pipe 104. Because the drain pipe 104 is connected to the vehicle body, cleaning fluid in the upper space of the vehicle body can be discharged from the drain pipe 104. Because the drain valve 105 is connected to the drain pipe 104, opening the drain valve 105 opens the channel of the drain pipe 104, allowing cleaning fluid in the upper space of the vehicle body to be discharged from the drain pipe 104.

[0023] Secondly, the support base 106 is positioned above all the walking wheels 101, the frame 107 is positioned on the support base 106, the push handle 102 is positioned outside the frame 107, and the partition 108 is provided inside the frame 107 to divide the frame 107 into upper and lower spaces. Cleaning fluid is placed in the upper space of the frame 107, and a wafer is placed in the cleaning fluid, so that the cleaning fluid can clean the dust and other impurities present on the wafer at all times.

[0024] Furthermore, the support frame 109 is disposed on the partition plate 108. The support frame 109 has a mounting groove. The placement frame 110 is detachably disposed in the mounting groove of the support frame 109, so that the placement frame 110 can be placed in the mounting groove of the support frame 109. Several placement positions are evenly distributed among the placement frames 110, and each placement position is separated from each other, so that several wafers can be placed at the placement positions of the placement frame 110, thereby realizing the common transfer of several wafers.

[0025] Furthermore, the fixing block 111 is disposed outside the frame 107, the connecting block 112 is detachably connected to the fixing block 111 and disposed outside the cover plate 103, and the limiting member is used to limit and fix the connecting block 112 inside the fixing block 111. The fixing block 111 has a hollow structure inside, and the connecting block 112 can be inserted into the fixing block 111 or slide out from the fixing block 111, so that the cover plate 103 can be installed or removed above the frame 107.

[0026] Finally, the movable rod 113 is slidably connected to the fixed block 111 and the connecting block 112 respectively, and passes through the fixed block 111 and the connecting block 112 respectively. The spring 114 is disposed between the end of the movable rod 113 and the fixed block 111, and is sleeved on the rod portion of the movable rod 113. The fixed block 111 and the connecting block 112 both have through holes. The movable rod 113 passes through the through holes of the fixed block 111 and the connecting block 112, and the movable rod 113 can slide longitudinally within the through holes of the fixed block 111 and the connecting block 112, so that the spring 114 will extend and retract. Since the spring 114 has a self-restoring function, after the extension force on the spring 114 disappears, the spring 114 will drive the movable rod 113 to move in the direction of returning to its original position.

[0027] When using this utility model, open the upper space of the frame 107, insert the placement rack 110 into the mounting slot of the support frame 109, so that the placement rack 110 is installed on the partition 108. Then, place the wafers to be transferred one by one at the placement position of the placement rack 110, pour cleaning fluid into the upper space of the frame 107, so that the wafers are completely immersed in the cleaning fluid, thereby cleaning the dust and other impurities on the wafers at all times during the transfer process.

[0028] Then move the movable rod 113 away from the frame 107, so that the spring 114 is stretched. When the spring 114 is stretched to its limit position, align the connecting block 112 with the internal space of the fixing block 111, and insert the connecting block 112 into the fixing block 111, so that the cover plate 103 is placed on the frame 107. Then, release the movable rod 113, so that the tension force on the spring 114 disappears. Since the spring 114 has a self-recovering function, the spring 114 will drive the movable rod 113 to move in the direction of returning to its original position until the movable rod 113 is fully inserted into the through hole of the fixing block 111 and the connecting block 112, so that the connecting block 112 is limited and fixed in the fixing block 111, and the cover plate 103 is limited and fixed on the frame 107, thus realizing the installation of the cover plate 103 to prevent the cleaning fluid in the upper space of the vehicle body from splashing out during transportation.

[0029] Subsequently, by pushing the push handle 102, the walking wheels 101 are moved on the ground, thereby moving the vehicle body to realize the transfer of the wafer. After the wafer is transferred to the designated position, the fixed state of the cover plate 103 is released, and the cover plate 103 is removed, so that the wafer in the upper space of the frame 107 can be taken out. Then, the drain valve 105 is opened, so that the channel of the drain pipe 104 is opened, so that the cleaning fluid in the upper space of the vehicle body can be discharged from the drain pipe 104, completing the entire wafer transfer process.

[0030] Because the cleaning fluid can continuously clean dust and other impurities on the wafer during the transfer process, no further cleaning is required after the transfer is completed. This shortens the wafer production and processing time, improves wafer fabrication efficiency, and solves the technical problem that existing transfer vehicles do not have a cleaning structure, which means that dust and other impurities on the wafer surface still need to be cleaned after transfer, thus increasing wafer production and processing time and reducing wafer fabrication efficiency.

[0031] The above-disclosed embodiments are merely preferred embodiments of the present utility model and should not be construed as limiting the scope of the present utility model. Those skilled in the art can understand that implementing all or part of the above-described embodiments and making equivalent changes in accordance with the claims of the present utility model are still within the scope of the utility model.

Claims

1. A semiconductor wafer transport water truck, comprising a truck body, characterized in that: It also includes wheels, a push handle, a cover plate, a limiting mechanism, a wafer placement mechanism, a drain pipe, and a drain valve. The wheels are movably mounted under the vehicle body, the push handle is mounted outside the vehicle body, the cover plate is detachably mounted on the vehicle body, the limiting mechanism is used to limit and fix the cover plate on the vehicle body, the wafer placement mechanism is located inside the vehicle body and is used to place the wafers to be transported, the drain pipe is connected to the vehicle body and is located at the bottom of the vehicle body, and the drain valve is connected to the drain pipe and extends outside the vehicle body to control the flow rate of the water discharged from the drain pipe.

2. The semiconductor wafer transfer water cart as described in claim 1, characterized in that: The vehicle body includes a support base, a frame, and a partition. The support base is positioned above all the wheels, the frame is mounted on the support base, the push handle is positioned outside the frame, and the partition is positioned inside the frame to divide the frame into upper and lower spaces.

3. The semiconductor wafer transfer water cart as described in claim 2, characterized in that: The wafer placement mechanism includes a support frame and a placement frame. The support frame is disposed on the partition plate and has a mounting groove. The placement frame is detachably disposed in the mounting groove of the support frame.

4. The semiconductor wafer transfer water cart as described in claim 2, characterized in that: The limiting mechanism includes a fixing block, a connecting block, and a limiting member. The fixing block is disposed outside the frame body. The connecting block is detachably connected to the fixing block and disposed outside the cover plate. The limiting member is used to limit and fix the connecting block inside the fixing block.

5. The semiconductor wafer transfer water cart as described in claim 4, characterized in that: The limiting component includes a movable rod and a spring. The movable rod is slidably connected to the fixed block and the connecting block respectively, and passes through the fixed block and the connecting block respectively. The spring is disposed between the end of the movable rod and the fixed block, and is sleeved on the outside of the rod portion of the movable rod.

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