Efficient wafer drying device

Abstract

The utility model discloses an efficient wafer drying device which comprises a box body, the bottom of the box body is provided with a water outlet pipe, the top of the box body is provided with an opening, and the opening can be sealed by a sealing plate; the box body is internally provided with a bearing assembly for bearing a wafer, the bearing assembly can be driven by a driving assembly to rotate, the periphery of the bearing assembly is surrounded by an air blowing assembly for blowing air to the wafer, and the box body is also internally provided with a heating assembly for heating. The wafer cleaning and drying device has the advantages that layout is reasonable, the structure is compact, wafers rotate under the action of the rotating rollers, it can be guaranteed that the wafers are cleaned and heated evenly in the cleaning, air drying and drying processes, and the yield of the wafers is guaranteed. In addition, the driving structure is simple and convenient to disassemble, replace and maintain, the working efficiency is greatly improved, and the driving structure has wide applicability.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing technology, and more specifically, to a high-efficiency wafer drying device. Background Technology

[0002] In semiconductor cleaning processes in related technologies, wafer drying, as the final step in wet cleaning, is a very important step. It is necessary to ensure the effective removal of residual moisture from the wafer surface and to control the number of particles inside the equipment to ensure the cleanliness of the equipment and the wafer.

[0003] For example, Chinese patent CN113063271A discloses a drying device and a wafer drying method. The drying device includes: a drying zone with an exhaust chamber and a drying chamber that can be opened or closed, the drying chamber being used to place workpieces, and the exhaust chamber being interconnected with the drying chamber; an air path installation zone connected to the drying chamber via pipelines, the air path installation zone being used to input heating nitrogen into the drying chamber; a main exhaust duct connected to the drying zone, the main exhaust duct being used to exhaust waste gas; and a frame for setting up the drying zone, the air path installation zone, and the main exhaust duct. However, this device has a complex structure and an unreasonable layout. Although the drying zone and the air path installation zone can dry and air-dry the wafers respectively, the position of the wafers remains unchanged during the drying and air-drying processes, resulting in uneven heating during drying and air-drying, which can easily cause damage and affect the service life. Utility Model Content

[0004] The purpose of this invention is to overcome the shortcomings of the existing technology and provide a measuring device for the perpendicularity and slope of a cylindrical workpiece.

[0005] The objective of this utility model is achieved through the following technical solution:

[0006] A high-efficiency wafer drying device includes a housing with a water outlet pipe at the bottom and an opening at the top, which can be sealed by a sealing plate. The housing contains a support component for supporting the wafer, which can rotate under the drive of a drive component. The outer periphery of the support component is surrounded by a blower component for blowing air onto the wafer. The housing also contains a heating component for heating.

[0007] Preferably, the bearing assembly includes at least a bearing plate fixed to the housing, the bearing plate having symmetrically arranged fixing shafts, and a set of equidistant fixing rings on the fixing shafts, the distance between adjacent fixing rings being greater than or equal to the thickness of the wafer; the housing also has a set of equidistant limiting rods fixed on it, the limiting rods being located directly above the fixing rings and corresponding to them one by one.

[0008] Preferably, a support plate is also fixed on the housing, and a rotating roller is pivotally mounted on the support plate. The rotating roller is located below the fixed shaft and is always tangent to the outer circumference of the wafer.

[0009] Preferably, the drive assembly includes at least a drive motor fixed on the support plate, a drive gear fixed on the motor shaft of the drive motor, a driven gear fixed on the rotating roller, and the drive gear meshing with the driven gear.

[0010] Preferably, the blowing assembly includes at least an air pipe fixed to the top of the housing, the air pipe being connected to an external air source; the air pipes are evenly distributed around the support assembly, and their nozzles are facing the wafer.

[0011] Preferably, a nozzle is fixedly installed in the middle of the housing, and the nozzle is connected to an external air source; a set of nozzles are provided on the nozzle.

[0012] Preferably, the heating assembly includes at least a fixing block fixed to the housing, and an infrared heating tube is fixed on the fixing block.

[0013] The beneficial effects of this utility model are mainly reflected in:

[0014] 1. The layout is reasonable and the structure is compact. The wafer rotates under the action of the rotating roller, which can ensure that it is cleaned and heated evenly during cleaning, air drying and baking, thus ensuring a high yield. In addition, the drive structure is simple, easy to disassemble, replace and maintain, which greatly improves work efficiency and has a wide range of applications.

[0015] 2. The fixed axis and the limiting rod work together to support and limit the wafer, accurately positioning it and preventing wafer damage, thereby improving its yield. Attached Figure Description

[0016] The technical solution of this utility model will be further described below with reference to the accompanying drawings:

[0017] Figure 1 : A perspective view of the preferred embodiment of this utility model in the first direction;

[0018] Figure 2 : A perspective view of the preferred embodiment of this utility model in the second direction;

[0019] Figure 3 : A perspective view of the preferred embodiment of this utility model in the first direction, in which the box body is removed. Detailed Implementation

[0020] The present invention will now be described in detail with reference to the specific embodiments shown in the accompanying drawings. However, these embodiments are not limited to the present invention, and any structural, methodological, or functional modifications made by those skilled in the art based on these embodiments are included within the protection scope of the present invention.

[0021] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0022] The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0023] like Figures 1 to 3 As shown, this utility model discloses a high-efficiency wafer drying device, including a box body 1. The top of the box body 1 has an opening 12, which can be sealed by a sealing plate 2. The structure of the opening 12 being sealed by the sealing plate 2 is not the design point of this utility model and is existing technology. Therefore, this utility model will not elaborate on it here, and all of them fall within the protection scope of this utility model.

[0024] The bottom of the box 1 is provided with a water outlet pipe 11, and the bottom of the box 1 is funnel-shaped, which can quickly drain the liquid inside the box 1, avoid the accumulation of liquid, and ensure the cleanliness of the box 1.

[0025] The housing 1 contains a support assembly 3 for supporting the wafer 100. The support assembly 3 includes at least a support plate 31 fixed to the housing 1. The support plate 31 has symmetrically arranged fixing shafts 32, and each fixing shaft 32 has a set of equidistant fixing rings 33. The distance between adjacent fixing rings 33 is greater than or equal to the thickness of the wafer 100. The housing 1 also has a set of equidistant limiting rods 34 fixed on it, located directly above and corresponding to each fixing ring 33. The housing 1 also has a support plate 35 fixed on it, with a pivotally mounted parallel rotating roller 36 located below the fixing shafts 32 and always tangent to the outer circumference of the wafer 100. The fixing shafts and limiting rods work together to support and limit the wafer, ensuring precise positioning, preventing wafer damage, and improving yield.

[0026] In this preferred embodiment, the supporting component 3 can rotate under the drive of the driving component 4. The driving component 4 includes at least a drive motor 41 fixed on the support plate 35. A driving gear 42 is fixed on the motor shaft of the drive motor 41, and a driven gear 43 is fixed on the rotating roller 32. The driving gear 42 and the driven gear 43 mesh with each other. This layout is reasonable and the structure is compact. The wafer rotates under the action of the rotating roller 32, which can ensure that it is cleaned and heated evenly during cleaning, air drying, and baking, thus ensuring its yield. In addition, the driving structure is simple, easy to disassemble, replace, and maintain, greatly improving work efficiency and having wide applicability.

[0027] The outer periphery of the support component 3 is surrounded by a blower component 5 for blowing air onto the wafer 100. The blower component 5 includes at least an air pipe 51 fixed to the top of the housing 1, which is connected to an external air source. The air pipes 51 are evenly distributed around the support component 3, and their nozzles are directly facing the wafer 100. A nozzle 52 is also fixed in the middle of the housing 1, which is connected to an external air source. A set of nozzles 53 are provided on the nozzle 52.

[0028] The housing 1 is also provided with a heating component 6 for heating, the heating component 6 includes at least a fixing block 61 fixed on the housing 1, and an infrared heating tube 62 is fixed on the fixing block 61.

[0029] It should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This way of describing the specification is only for clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0030] The detailed descriptions listed above are merely specific descriptions of feasible implementations of this utility model, and are not intended to limit the scope of protection of this utility model. All equivalent implementations or modifications made without departing from the spirit of this utility model should be included within the scope of protection of this utility model.

Claims

1. A high-efficiency wafer drying device, comprising a housing (1), characterized in that: The bottom of the box (1) is provided with a water outlet pipe (11) and the top of the box is provided with an opening (12). The opening (12) can be sealed by a sealing plate (2). The box (1) is equipped with a support component (3) for carrying the wafer (100). The support component (3) can rotate under the drive of the drive component (4). The outer periphery of the support component (3) is surrounded by a blower component (5) for blowing air onto the wafer (100). The box (1) is also equipped with a heating component (6) for heating.

2. The high-efficiency wafer drying apparatus according to claim 1, characterized in that: The bearing assembly (3) includes at least a bearing plate (31) fixed on the housing (1). The bearing plate (31) is provided with symmetrically arranged fixing shafts (32). The fixing shafts (32) are provided with a set of equidistant fixing rings (33). The distance between adjacent fixing rings (33) is greater than or equal to the thickness of the wafer (100). The housing (1) is also provided with a set of equidistant limiting rods (34). The limiting rods (34) are located directly above the fixing rings (33) and correspond to them one by one.

3. The high-efficiency wafer drying apparatus according to claim 2, characterized in that: A support plate (35) is also fixed on the housing (1). A rotating roller (36) is pivotally mounted on the support plate (35) and is located below the fixed shaft (32). The rotating roller (36) is always tangent to the outer circumference of the wafer (100).

4. The high-efficiency wafer drying apparatus according to claim 3, characterized in that: The drive assembly (4) includes at least a drive motor (41) fixed on the support plate (35), a drive gear (42) fixed on the motor shaft of the drive motor (41), and a driven gear (43) fixed on the rotating roller (36), wherein the drive gear (42) meshes with the driven gear (43).

5. The high-efficiency wafer drying apparatus according to claim 3, characterized in that: The blower assembly (5) includes at least an air pipe (51) fixed to the top of the housing (1), the air pipe (51) being connected to an external air source; the air pipe (51) is evenly distributed around the support assembly (3), and its nozzle is facing the wafer (100).

6. The high-efficiency wafer drying apparatus according to claim 5, characterized in that: The middle part of the housing (1) is also fixed with a nozzle (52), which is connected to an external air source; a set of nozzles (53) are provided on the nozzle (52).

7. The high-efficiency wafer drying apparatus according to claim 4, characterized in that: The heating assembly (6) includes at least a fixing block (61) fixed on the housing (1), and an infrared heating tube (62) is fixed on the fixing block (61).

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