Voltage acquisition board and battery management system

Abstract

The utility model relates to a voltage acquisition board and a battery management system, and the voltage acquisition board comprises an acquisition board body, and an acquisition connector, a daisy chain connector and at least two groups of acquisition modules which are disposed on the acquisition board body. The acquisition connector is sequentially connected with each group of acquisition modules through a daisy chain connector to form a daisy chain communication link; each collection module comprises a collection chip and a corresponding short circuit; the short circuit is used for connecting the corresponding acquisition chip into or out of the daisy chain communication link; the daisy chain communication link keeps at least one acquisition chip to work. According to the invention, the acquisition string number is configurable, the universality is high, and the cost of chip devices is saved; the problems that the sampling string number range is small and the universality is poor in the prior art are solved.

Description

Technical Field

[0001] This utility model relates to the field of battery technology, and in particular to a voltage acquisition board and a battery management system. Background Technology

[0002] In the field of battery technology, one of the core functions of a Battery Management System (BMS) is to collect voltage and temperature information from all cells within the battery pack. A battery pack contains multiple battery modules, each composed of multiple cells arranged and connected in series, forming a single-row battery module or a U-shaped battery module. Generally, each module has a voltage acquisition board, which is connected to the cells via a flexible printed circuit board (FPC) or wiring harness. Voltage acquisition boards from different modules are connected in series via daisy-chain wiring harnesses, and daisy-chain communication transmits cell information to the main control board. Due to varying battery pack capacities and limitations imposed by the external and internal space of the battery pack, module arrangements differ, resulting in a variety of module types and inconsistent number of cells in series. Consequently, there are numerous types of voltage acquisition boards, increasing product models and costs. Furthermore, with the development of CTP (Cell to Pack) and CTC (Cell to Chassis) technologies for power batteries, power batteries are becoming increasingly integrated, with cell arrangements becoming more compact, requiring a single voltage acquisition board to collect data on an ever-increasing number of cell cells in series.

[0003] Currently, for voltage acquisition boards in battery modules, the number of acquisition channels supported by the AFE chip is limited to a fixed range. The daisy-chain communication path involves the chip entering through the daisy-chain communication interface, passing through each AFE chip on the acquisition board sequentially, and finally exiting through the daisy-chain communication interface. Each AFE chip needs to function normally. For example, if an AFE chip supports 4-12 series voltage acquisition, then a voltage acquisition board with one AFE chip can be designed to acquire 4-12 series battery modules, a board with two AFE chips can be designed to acquire 8-24 series battery modules, and so on, a board with n AFE chips can be designed to acquire 4*n-12*n series battery modules. Each of these voltage acquisition boards has a small range of compatible sampling series and poor versatility.

[0004] Currently, no effective solution has been proposed to address the issues of small sampling string range and poor versatility in voltage acquisition boards in related technologies. Utility Model Content

[0005] In view of this, it is necessary to provide a voltage acquisition board and a battery management system to solve the problems of small sampling string range and poor versatility in related technologies.

[0006] In a first aspect, the present invention provides a voltage acquisition board, including an acquisition board body, an acquisition connector, a daisy-chain connector and at least two acquisition modules disposed on the acquisition board body;

[0007] The acquisition connector connects each group of acquisition modules sequentially via the daisy-chain connector to form a daisy-chain communication link; each group of acquisition modules includes an acquisition chip and a corresponding shorting circuit;

[0008] The shorting circuit is used to allow the corresponding acquisition chip to connect to or disconnect from the daisy-chain communication link; the daisy-chain communication link retains at least one acquisition chip for operation.

[0009] In one embodiment, the configurable number of acquisition strings of the voltage acquisition board ranges from the minimum number of acquisition strings supported by a single acquisition chip to the sum of the maximum number of acquisition strings supported by all acquisition chips.

[0010] In one embodiment, the shorting circuit includes a shorting unit;

[0011] The shorting unit is connected in parallel with the acquisition chip in the daisy-chain communication link.

[0012] In one embodiment, the shorting unit is one of a first shorting resistor, a jumper cap, or an isolation control switch.

[0013] In one embodiment, the two sets of acquisition modules are a low-end acquisition module and a high-end acquisition module, respectively;

[0014] The input terminal of the low-end acquisition module is connected to the output terminal of the acquisition connector; the output terminal of the low-end acquisition module is connected to the output terminal of the high-end acquisition module.

[0015] The output end of the high-end acquisition module is connected to the input end of the acquisition connector.

[0016] In one embodiment, the voltage acquisition board further includes a communication transformer;

[0017] The communication transformer is disposed between the daisy-chain connector and each group of the acquisition modules;

[0018] The communication transformer is also provided between the acquisition modules.

[0019] In one embodiment, the voltage acquisition board further includes a communication shorting circuit;

[0020] The communication shorting circuit is connected in parallel with the communication transformer in the daisy-chain communication link.

[0021] In one embodiment, the communication shorting circuit includes a shorting line;

[0022] The short-circuit line is used to short-circuit either side of the communication transformer;

[0023] A second shorting resistor is provided on the shorting line.

[0024] In one embodiment, the communication shorting circuit includes two shorting lines;

[0025] The two short-circuit lines are used to short-circuit both sides of the communication transformer;

[0026] A second shorting resistor is provided on each of the aforementioned shorting lines.

[0027] In a second aspect, embodiments of this application provide a battery management system, including a battery module and a voltage acquisition board as described in the first aspect above, connected to the battery module.

[0028] This utility model provides a voltage acquisition board and a battery management system. The voltage acquisition board includes an acquisition board body, an acquisition connector, a daisy-chain connector, and at least two sets of acquisition modules disposed on the acquisition board body. The acquisition connector connects each set of acquisition modules sequentially through the daisy-chain connector to form a daisy-chain communication link. Each set of acquisition modules includes an acquisition chip and a corresponding shorting circuit. The shorting circuit is used to allow the corresponding acquisition chip to enter or exit the daisy-chain communication link. At least one of the acquisition chips is kept operational in the daisy-chain communication link. This application utilizes the shorting circuit to allow the corresponding acquisition chip to enter or exit the daisy-chain communication link, thereby changing the number of acquisition chips in the daisy-chain communication link, thus expanding the range of acquisition series, achieving configurable acquisition series, high versatility, and saving chip device costs; it solves the problems of small sampling series range and poor versatility in related technologies. Attached Figure Description

[0029] Figure 1 This is a structural block diagram of a voltage acquisition board provided in an embodiment of the present invention;

[0030] Figure 2 A structural block diagram of a voltage acquisition board provided in another embodiment of this utility model;

[0031] Figure 3 This is a structural block diagram of a voltage acquisition board provided in a preferred embodiment of the present invention;

[0032] Figure 4 This is a structural block diagram of a voltage acquisition board provided in another preferred embodiment of the present invention. Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of this application clearer, the application is described and illustrated below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the application. All other embodiments obtained by those skilled in the art based on the embodiments provided in this application without inventive effort are within the scope of protection of this application. Furthermore, it is understood that although the efforts made in such a development process may be complex and lengthy, for those skilled in the art related to the content disclosed in this application, modifications to design, manufacturing, or production based on the technical content disclosed in this application are merely conventional technical means and should not be construed as insufficient disclosure of the content of this application.

[0034] In this application, the reference to "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment that is mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described in this application may be combined with other embodiments without conflict.

[0035] Unless otherwise defined, the technical or scientific terms used in this application shall have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. When an element is referred to as being "located" on another element, it may be directly disposed on the other element or may have an intervening element. When an element is considered to be "disposed on" another element, it may be directly disposed on the other element or may have an intervening element present. When an element is considered to be "fixed to" another element, it may be directly fixed to the other element or may have an intervening element present. The terms "first," "second," "third," etc., used in this application are merely to distinguish similar objects and do not represent a specific order of objects. The terminology used in the specification of this application is for the purpose of describing particular embodiments only and is not intended to limit this application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0036] In the voltage acquisition boards of battery modules in related technologies, the number of acquisition channels supported by the AFE chip is within a fixed range. The daisy-chain communication path enters from the daisy-chain communication interface, passes through each AFE chip on the acquisition board sequentially, and finally exits from the daisy-chain communication interface. Each AFE chip needs to function normally. For example, if an AFE chip supports 4-12 series voltage acquisition, then a voltage acquisition board with one AFE chip can be designed to acquire 4-12 series battery modules, a voltage acquisition board with two AFE chips can be designed to acquire 8-24 series battery modules, and so on, a voltage acquisition board with n AFE chips can be designed to acquire 4*n-12*n series battery modules. Each of these voltage acquisition boards has a small range of compatible sampling series and poor versatility.

[0037] For voltage acquisition boards with at least two AFE chips, for example, a voltage acquisition board with two AFE chips can be compatible with acquiring data from 8-24 battery modules. When the number of battery modules in strings is 8-12, the voltage acquisition board requires the operation of two AFE chips to acquire the data and transmit the voltage information via daisy-chain communication. Using two AFE chips results in low utilization of the chip acquisition channel (in reality, this range of battery module numbers can be acquired using only one AFE chip, saving on chip and related circuitry costs). However, designing a voltage acquisition board with only one AFE chip increases the number of component types and increases the costs of component design, production, and management.

[0038] To address the aforementioned issues, this application provides a voltage acquisition board and a battery management system to solve the problems of small sampling string range, poor versatility, low channel utilization, and increased cost associated with voltage acquisition boards using two AFE chips in related technologies.

[0039] Please see Figure 1 and Figure 2 This utility model provides a voltage acquisition board, including an acquisition board body 10, an acquisition connector 100, a daisy-chain connector 200 and at least two sets of acquisition modules 300 disposed on the acquisition board body 10.

[0040] The acquisition connector 100 is connected to each acquisition module 300 in sequence through the daisy-chain connector 200 to form a daisy-chain communication link; each acquisition module 300 includes an acquisition chip 310 and a corresponding shorting circuit 320.

[0041] The shorting circuit 320 is used to allow the corresponding acquisition chip 310 to be connected to or disconnected from the daisy-chain communication link; the daisy-chain communication link keeps at least one acquisition chip 310 working.

[0042] It should be noted that the acquisition board body 10 is the foundation for supporting all components, and all components in the voltage acquisition board can be mounted on the acquisition board body 10; for example: acquisition connector 100, daisy-chain connector 200, and at least two sets of acquisition modules 300, etc. In other embodiments, other components can also be mounted on the acquisition board body 10, and there is no limitation on this.

[0043] The acquisition connector 100 is used to connect all cell voltage acquisition lines and temperature detection acquisition lines of the battery module, and the connected voltage and temperature signal distribution lines are connected to the acquisition chip 310 of the acquisition module 300.

[0044] The daisy-chain connector 200 is connected externally in series with the interface between the previous-level acquisition connector 100 and the next-level daisy-chain communication link. Internally, it leads out a pair of input signals (daisy-chain inlet) and a pair of output signals (daisy-chain outlet) for the daisy-chain communication link. Starting from the acquisition connector 100, each acquisition module 300 is sequentially connected to the daisy-chain communication link inlet, and then back to the daisy-chain communication link outlet to form the daisy-chain communication link.

[0045] The acquisition module 300 is connected in series in the daisy-chain communication link. The acquisition module 300 includes an acquisition chip 310 and a corresponding shorting circuit 320. The shorting circuit 320 is used to connect or disconnect the corresponding acquisition chip 310 from the daisy-chain communication link. When the acquisition chip 310 is connected to the daisy-chain communication link, it can acquire the voltage and temperature of the battery module series. When the acquisition chip 310 is disconnected from the daisy-chain communication link, it cannot acquire the voltage and temperature of the battery module series. This allows for configurable acquisition of the number of series to match different acquisition requirements, resulting in high versatility. Furthermore, by using the shorting circuit 320, unnecessary acquisition chips 310 can be bypassed, thereby improving the utilization rate of the transmission channel in the daisy-chain communication link. Since one voltage acquisition board can acquire the series of multiple battery modules, there is no need to design multiple voltage acquisition boards, thus saving chip device costs.

[0046] The following is a detailed description of each of the above components:

[0047] In one embodiment, the configurable number of acquisition strings of the voltage acquisition board ranges from the minimum number of acquisition strings supported by a single acquisition chip 310 to the sum of the maximum number of acquisition strings supported by all acquisition chips 310.

[0048] Specifically, the minimum number of configurable acquisition strings for the voltage acquisition board is the minimum number of acquisition strings supported by a single acquisition chip 310; the maximum number of configurable acquisition strings for the voltage acquisition board is the sum of the maximum number of acquisition strings supported by all acquisition chips 310. The voltage acquisition board has two acquisition chips 310; each acquisition chip 310 supports 4-12 acquisition strings; therefore, the configurable number of acquisition strings for the voltage acquisition board ranges from 4 to 24.

[0049] This embodiment uses a single voltage acquisition board to adapt to various acquisition series numbers and clarifies the range of acquisition series numbers that can be adapted, making it convenient to use.

[0050] In one embodiment, the shorting circuit 320 includes a shorting unit;

[0051] The shorting unit is connected in parallel with the acquisition chip 310 in the daisy-chain communication link.

[0052] Specifically, the shorting unit and the acquisition chip 310 are connected in parallel in the daisy-chain communication link. The shorting unit can be at least one first shorting resistor; the resistance of the first shorting resistor is 0 ohms; then the acquisition chip 310 connected in parallel with the shorting unit will be short-circuited by it, thereby removing the acquisition string number corresponding to the acquisition chip 310.

[0053] In this embodiment, a first shorting resistor is used to further reduce hardware costs.

[0054] It should be noted that if the acquisition chip 310 has two acquisition signals, then two shorting units need to be set to short-circuit the corresponding acquisition signals respectively. In other embodiments, there can be multiple first shorting resistors, and the shorting units can also be replaced by connecting wires, jumper caps, or isolation control switches; there are no restrictions on this.

[0055] In this embodiment, the use of a shorting unit will result in at least one end of the daisy chain having a long branch (forming an antenna). Without using the shorting circuit 320, this will affect the quality of daisy chain communication and EMC performance.

[0056] In one embodiment, the two sets of acquisition modules 300 are a low-end acquisition module and a high-end acquisition module, respectively;

[0057] The input terminal of the low-end acquisition module is connected to the output terminal of the acquisition connector 100; the output terminal of the low-end acquisition module is connected to the output terminal of the high-end acquisition module.

[0058] The output of the high-end acquisition module is connected to the input of the acquisition connector 100.

[0059] Specifically, for better control of information acquisition, the acquisition module 300 is divided into a low-end acquisition module and a high-end acquisition module. The shorting circuit 320 in the low-end acquisition module and the high-end acquisition module is the same. The difference lies in the acquisition chip 310 in the low-end acquisition module and the high-end acquisition module, which are respectively a low-end acquisition chip and a high-end acquisition chip. The low-end acquisition module and the high-end acquisition module are connected in series in a daisy-chain communication link. Of course, the positions of the low-end acquisition module and the high-end acquisition module can be interchanged.

[0060] Among them, the low-end acquisition chip can collect the voltage and temperature of the low-end serial number of the battery module; the high-end acquisition chip can collect the voltage and temperature of the high-end serial number of the battery module.

[0061] In one embodiment, the voltage acquisition board also includes a communication transformer 400;

[0062] A communication transformer 400 is positioned between the daisy-chain connector 200 and each set of acquisition modules 300;

[0063] The communication transformer 400 is also set up between the acquisition module 300 and the transformer.

[0064] Specifically, the number of communication transformers 400 depends on the number and type of acquisition modules. Generally, a transformer 400 is installed between the daisy-chain connector 200 and each acquisition module 300; it can also be installed between the acquisition modules 300 themselves. For example, if there are two acquisition modules 300, one a low-end module and the other a high-end module, then there are three communication transformers 400. Alternatively, if there are three acquisition modules 300, all of which are high-end modules, then there can be only one communication transformer 400, located between the daisy-chain connector 200 and the first acquisition module 300. In other embodiments, the communication transformer 400 can be replaced with an isolation capacitor, or other devices; there are no limitations on this.

[0065] In this embodiment, a communication transformer 400 is used to isolate acquisition chips 310 with different voltages, thereby enabling a single acquisition board to acquire signals of different voltages.

[0066] In one embodiment, the voltage acquisition board further includes a communication shorting circuit 500;

[0067] The communication shorting circuit 500 and the communication transformer 400 are connected in parallel in the daisy-chain communication link.

[0068] Specifically, the communication shorting circuit 500 is used to connect or disconnect the communication transformer 400 to a daisy-chain communication link. The specific structure of the communication shorting circuit 500 can be the same as that of the shorting circuit 320, only the placement is different, and will not be described again.

[0069] In this embodiment, the communication shorting circuit 500 is used to short-circuit the corresponding communication transformer 400, thereby further improving the channel utilization rate of the daisy-chain communication link.

[0070] In one embodiment, the communication shorting circuit 500 includes a shorting line;

[0071] The short-circuit line is used to short-circuit either side of the communication transformer 400;

[0072] A second shorting resistor is installed on the shorting line.

[0073] Specifically, the short-circuit line is connected in parallel with any side of the communication transformer 400, and the resistance value of the second short-circuit resistor can be 0 ohms, which can short-circuit any side of the communication transformer 400 to realize signal transmission.

[0074] In one embodiment, the communication shorting circuit 500 includes two shorting lines;

[0075] Two short-circuit lines are used to short-circuit both sides of the communication transformer 400;

[0076] A second shorting resistor is installed on each shorting line.

[0077] Specifically, each short-circuit line is connected in parallel with one side of the communication transformer 400, thereby short-circuiting both sides of the communication transformer 400 by the two short-circuit lines; the resistance value of the second short-circuit resistor can be 0 ohms, which can short-circuit either side of the communication transformer 400 to realize signal transmission.

[0078] Since the second shorting resistors at both ends of the transformer are close to their respective transformer end pads, compared to using a single 0Ω second shorting resistor, two 0Ω second shorting resistors can meet the greater electrical clearance and withstand voltage requirements at both ends when the shorting circuit 320 is not used.

[0079] The following example illustrates the overall solution:

[0080] Example 1:

[0081] like Figure 3The diagram shows a structural block diagram of a voltage acquisition board according to another embodiment, which includes two acquisition modules. Specifically, the voltage acquisition board includes: an acquisition connector 100, a daisy-chain connector 200, a low-end acquisition chip, a high-end acquisition chip, a communication transformer T1 between the daisy-chain inlet and the low-end acquisition chip, a communication transformer T2 between the low-end acquisition chip and the high-end acquisition chip, and a communication transformer T3 between the high-end acquisition chip and the daisy-chain outlet. In addition, it also includes input lines and output lines for connecting the various devices. For example: daisy-chain connector 200 input line, low-end acquisition chip daisy-chain input line, low-end acquisition chip daisy-chain output line, high-end acquisition chip daisy-chain input line, high-end acquisition chip daisy-chain output line, daisy-chain connector 200 output line, first group positive shorting circuit 320 (first group communication positive shorting wire), first group negative shorting circuit 320 (first group communication negative shorting wire), second group positive communication shorting circuit 500 (second group communication positive shorting wire), second group negative communication shorting circuit 500 (second group communication negative shorting wire).

[0082] The data acquisition connector 100 is used to connect all cell voltage acquisition lines and temperature detection acquisition lines of the battery module. The connected voltage and temperature signals are routed to the low-end acquisition chip and the high-end acquisition chip. The daisy-chain connector 200 is connected in series with the interface between the previous-level data acquisition connector 100 and the next-level daisy-chain communication link. Internally, it leads out a pair of input signals (daisy-chain inlet) and a pair of output signals (daisy-chain outlet) of the daisy-chain communication link.

[0083] The low-end acquisition chip can acquire the voltage and temperature of the low-end serial number in the battery module. The voltage and temperature acquisition traces are connected to the acquisition connector 100. The daisy-chain communication of the low-end acquisition chip has a pair of input lines connected to the communication transformer 400 and a pair of output lines connected to the communication transformer 400.

[0084] The high-end acquisition chip can acquire the voltage and temperature of the high-end serial number in the battery module. The voltage and temperature acquisition traces are connected to the acquisition connector 100. The daisy-chain communication of the high-end acquisition chip is connected to the communication transformer 400. The output line is connected to the communication transformer 400.

[0085] Communication transformer T1 between acquisition connector 100 and the low-end acquisition chip has one end connected to a pair of daisy-chain connector 200 input lines and the other end connected to a pair of daisy-chain input lines of the low-end acquisition chip; it is used to isolate the external upstream voltage acquisition board from the low-end acquisition chip. Communication transformer T2 between the low-end and high-end acquisition chips has one end connected to a pair of daisy-chain output lines of the low-end acquisition chip and the other end connected to a pair of daisy-chain input lines of the high-end acquisition chip; it is used to isolate the high-end and low-end acquisition chips. Communication transformer T3 between the high-end acquisition chip and acquisition connector 100 has one end connected to a pair of daisy-chain output lines of the high-end acquisition chip and the other end connected to a pair of output lines of daisy-chain connector 200; it is used to isolate the high-end acquisition chip from the next-stage voltage acquisition board.

[0086] The daisy-chain connector 200 has input lines including a positive daisy-chain input IPA_C and a negative daisy-chain input IMA_C. This pair of signal lines connects to the output lines of the daisy-chain connector 200 on the previous stage voltage acquisition board. The low-end acquisition chip's daisy-chain input lines include a positive daisy-chain input IPA_1 and a negative daisy-chain input IMA_1. This pair of signal lines is the daisy-chain communication input line for the low-end acquisition chip. The low-end acquisition chip's daisy-chain output lines include a positive daisy-chain output IPB_1 and a negative daisy-chain output IMB_1. This pair of signal lines is the daisy-chain communication output line for the low-end acquisition chip. The high-end acquisition chip's daisy-chain input lines include a positive daisy-chain input IPA_2 and a negative daisy-chain input IMA_2. This pair of signal lines is the daisy-chain communication input line for the high-end acquisition chip. The high-end acquisition chip's daisy-chain output lines include a positive daisy-chain output IPB_2 and a negative daisy-chain output IMB_2. This pair of signal lines is the daisy-chain communication output line for the high-end acquisition chip. The output lines of the daisy-chain connector 200 include a daisy-chain input positive terminal IPB_C and a negative terminal IMB_C. This pair of signal lines connects to the input lines of the daisy-chain connector 200 on the next stage voltage acquisition board.

[0087] The first set of positive communication jumpers includes two 0Ω resistors, R1 and R2. Resistor R1 is near the IPA_2 line, and resistor R2 is near the IPB_2 line. A trace connects resistors R1 and R2. This jumper is used to short-circuit the positive terminals of the daisy-chain input line (IPA_2) and the positive terminal of the daisy-chain output line (IPB_2) of the high-end acquisition chip. The first set of negative communication jumpers includes two 0Ω resistors, R3 and R4. Resistor R3 is near the IMA_2 line, and resistor R4 is near the IMB_2 line. A trace connects resistors R3 and R4. This jumper is used to short-circuit the negative terminals of the daisy-chain input line (IMA_2) and the negative terminal of the daisy-chain output line (IMB_2) of the high-end acquisition chip. The second set of positive communication shorting wires includes two 0Ω resistors, R5 and R6. Resistor R5 is near the IPB_2 line, and resistor R6 is near the IPB_C line. A trace connects resistors R5 and R6. This shorting wire is used to short the positive terminal of the daisy-chain output line IPB_2 of the high-end acquisition chip and the positive terminal of the daisy-chain connector 200 output line IPB_C. The second set of negative communication shorting wires includes two 0Ω resistors, R7 and R8. Resistor R7 is near the IMA_2 line, and resistor R8 is near the IMB_C line. A trace connects resistors R7 and R8. This shorting wire is used to short the negative terminal of the daisy-chain output line IMA_2 of the high-end acquisition chip and the negative terminal of the daisy-chain connector 200 output line IMB_C.

[0088] In this preferred embodiment, each acquisition chip 310 supports 4-12 acquisitions.

[0089] 1. When applying data acquisition to 13-24 battery modules, the corresponding acquisition devices are attached to both the low-end acquisition chip AFE1 and the high-end acquisition chip AFE2; the 0Ω resistors of resistors R1, R2, R3, R4, R5, R6, R7, and R8 are not attached. The daisy-chain communication path is as follows: the signal enters through daisy-chain connector 200, is isolated by communication transformer T1, and is transmitted to the low-end acquisition chip. The signal output from the low-end acquisition chip is transmitted to the high-end acquisition chip through communication transformer T2, and finally, the signal output from the high-end acquisition chip is transmitted to daisy-chain connector 200 through communication transformer T3.

[0090] 2. When applying data acquisition to 4-12 series battery modules, the corresponding acquisition components are attached to the low-end acquisition chip AFE1, while all related acquisition circuit components of the high-end acquisition chip AFE2 are left unattached. The 0Ω resistors R1, R2, R3, R4, R5, R6, R7, and R8 are attached, and the communication transformer T3 is left unattached. After shorting the corresponding communication jumpers, the daisy-chain communication path enters through daisy-chain connector 200, is isolated by communication transformer T1, and is transmitted to the low-end acquisition chip. The signal output from the low-end acquisition chip is directly transmitted to daisy-chain connector 200 through the aforementioned shorted 0Ω resistors. This achieves data acquisition by a single acquisition chip 310 on the voltage acquisition board and enables normal daisy-chain communication signal transmission, while saving the cost of one acquisition chip 310 and related components.

[0091] Example 2:

[0092] like Figure 4 The diagram shows a structural block diagram of a voltage acquisition board provided in another embodiment, which includes three acquisition modules. Specifically, the voltage acquisition board includes: an acquisition connector 100, a daisy-chain connector 200, a low-end acquisition chip, a mid-end acquisition chip, a high-end acquisition chip, a communication transformer T4 between the daisy-chain inlet and the low-end acquisition chip, a communication transformer T5 between the low-end acquisition chip and the mid-end acquisition chip, a communication transformer T6 between the mid-end acquisition chip and the high-end acquisition chip, and a communication transformer T7 between the high-end acquisition chip and the daisy-chain outlet. In addition, it also includes input lines, output lines, and jumper wires for connecting each device; the connection principle between the devices can be referred to Example 1 and will not be repeated here.

[0093] In this preferred embodiment, each acquisition chip 310 supports 4-12 acquisitions.

[0094] 1. When applying data acquisition to 25-36 series battery modules, the corresponding components are attached to the low-end acquisition chip AFE1, the mid-end acquisition chip AFE3, and the high-end acquisition chip AFE2. The 0Ω resistors from R9 to R24 are not attached. The daisy-chain communication path is as follows: the data enters through daisy-chain connector 200, is transmitted to the low-end acquisition chip through communication transformer T4, then is transmitted out by the low-end acquisition chip through communication transformer T5 to the mid-end acquisition chip, then is transmitted out by the mid-end acquisition chip through communication transformer T6 to the high-end acquisition chip, and finally is transmitted out by the high-end acquisition chip through communication transformer T7 to daisy-chain connector 200.

[0095] 2. When applied to the acquisition of 13 - 24 series battery modules, the corresponding devices are pasted on the low - end acquisition chip AFE1 and the high - end acquisition chip AFE2. The relevant acquisition devices of the middle - end acquisition chip AFE3 are not pasted. The 0Ω resistors of resistors R9 - R16 are pasted, the communication transformer T6 is not pasted, and the 0Ω resistors of resistors R17 - R24 are not pasted. After being short - circuited by the corresponding short - connection wires, the daisy - chain communication path enters through the daisy - chain connector 200, is transmitted to the low - end acquisition chip through the communication transformer T4, then is transmitted from the low - end acquisition chip through the communication transformer T5 to the high - end acquisition chip, and then is transmitted from the high - end acquisition chip through the communication transformer T7 to the daisy - chain connector 200. The acquisition of the two acquisition chips 310 of this voltage acquisition board is realized, and normal daisy - chain communication can transmit signals, and the cost of the relevant devices of one acquisition chip 310 is saved.

[0096] 3. When applied to the acquisition of 4 - 12 series battery modules, the corresponding acquisition circuit devices are pasted on the low - end acquisition chip AFE1. The relevant acquisition devices of the middle - end acquisition chip AFE3 and the high - end acquisition chip AFE2 are not pasted. The 0Ω resistors of resistors R9 - R24 are all pasted, and both the communication transformer T6 and the communication transformer T7 are not pasted. After being short - circuited by the relevant short - connection wires, the daisy - chain communication path enters through the daisy - chain connector 200, is transmitted to the low - end acquisition chip through the communication transformer T4, and then is transmitted from the low - end acquisition chip through the communication transformer T5 directly to the daisy - chain connector 200. The acquisition of one acquisition chip 310 of this acquisition board is realized, and normal daisy - chain communication can transmit signals, and the cost of the relevant devices of two acquisition chips 310 is saved.

[0097] The effects of the above preferred embodiments are as follows: 1. For a voltage acquisition board with at least two acquisition chips 310, there is a short - circuit circuit 320 for the reserved acquisition chip 310 and the communication transformer 400 on the voltage acquisition board, which can short - circuit one or several of the intermediate related devices, enabling the daisy - chain communication link to skip the short - circuited acquisition chip 310 to the next acquisition chip 310 or communication transformer 400, so as to apply the voltage acquisition board to low - series - number battery modules. For example: There are x acquisition chips 310 (x≥2) on the voltage acquisition board, and the acquisition series - number range supported by each acquisition chip 310 is n~m (n≤m / 2); the maximum acquisition series - number range of the traditional voltage acquisition board for batteries is x*n~x*m. While the present utility model can acquire the battery module series - number range of n~x*m; when the battery module series - number is y(m + 1)~y*m (y < x), x - y acquisition chips 310 can be short - circuited through the short - circuit circuit 320, with high versatility. In addition, when the battery module series - number is x*n~(x - 1)*m, the traditional voltage acquisition board requires all x acquisition chips 310 to perform acquisition, while the present utility model can save costs by short - circuiting the irrelevant acquisition chips 310 (the devices of the acquisition chip 310 are left unpasted).

[0098] 2. One shorting solution involves connecting the acquisition chip 310 or the communication transformer 400 in parallel with the shorting circuit 320. Specifically, this shorts the daisy-chain communication input and output lines of the same acquisition chip 310, while simultaneously shorting one end of the communication transformer 400 at that acquisition chip 310. Another solution is to short the daisy-chain communication lines between different acquisition chips 310. However, due to the different voltage platforms of the two acquisition chips 310, routing the shorting wires on the acquisition board body 10 (PCB board) is difficult, potentially violating electrical isolation and affecting daisy-chain routing rules. The shorting circuit 320 solution of this invention avoids this problem.

[0099] 3. The shorting circuit 320 can be used for routing between two 0Ω resistors; between the daisy-chain input and output lines of the acquisition chip 310, the two 0Ω resistors are placed close to their respective original daisy-chain traces. Compared to using a single 0Ω resistor for shorting, this would result in at least one end of the daisy-chain trace having a longer branch (forming an antenna), which would affect the daisy-chain communication quality and EMC performance when the shorting circuit 320 is not used. The 0Ω resistors at both ends of the communication transformer 400 are placed close to their respective transformer pads. Compared to a single 0Ω resistor, without using the shorting circuit 320, two 0Ω resistors can provide a larger electrical clearance and withstand voltage at both ends.

[0100] Those skilled in the art will understand that the structures illustrated in Examples 1 and 2 are merely illustrative and do not limit the structure of the voltage acquisition board described above. For example, the voltage acquisition board may also include components such as... Figure 3 or Figure 4 The more or fewer components shown, or having the same Figure 3 or Figure 4 The different configurations shown are illustrated.

[0101] Furthermore, in conjunction with the voltage acquisition board in the above embodiments, this application embodiment can provide a battery management system. This battery management system includes a battery module and a voltage acquisition board connected to the battery module, which is one of the voltage acquisition boards described in the above embodiments.

[0102] The technical features of the above-described embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0103] Those skilled in the art should recognize that the above embodiments are only used to illustrate the present utility model and are not intended to limit the present utility model. Any appropriate changes and variations made to the above embodiments within the scope of the essential spirit of the present utility model shall fall within the scope of protection claimed by the present utility model.

Claims

1. A voltage acquisition board, characterized in that, It includes a data acquisition board body, a data acquisition connector, a daisy-chain connector and at least two data acquisition modules disposed on the data acquisition board body; The acquisition connector connects each group of acquisition modules sequentially via the daisy-chain connector to form a daisy-chain communication link; each group of acquisition modules includes an acquisition chip and a corresponding shorting circuit; The shorting circuit is used to allow the corresponding acquisition chip to connect to or disconnect from the daisy-chain communication link; the daisy-chain communication link retains at least one acquisition chip for operation.

2. The voltage acquisition board according to claim 1, characterized in that, The configurable number of acquisition strings for the voltage acquisition board ranges from the minimum number of acquisition strings supported by a single acquisition chip to the sum of the maximum number of acquisition strings supported by all acquisition chips.

3. The voltage acquisition board according to claim 1, characterized in that, The shorting circuit includes a shorting unit; The shorting unit is connected in parallel with the acquisition chip in the daisy-chain communication link.

4. The voltage acquisition board according to claim 3, characterized in that, The shorting unit is one of a first shorting resistor, a jumper cap, or an isolation control switch.

5. The voltage acquisition board according to claim 1, characterized in that, The two sets of acquisition modules are a low-end acquisition module and a high-end acquisition module, respectively; The input terminal of the low-end acquisition module is connected to the output terminal of the acquisition connector; the output terminal of the low-end acquisition module is connected to the output terminal of the high-end acquisition module. The output end of the high-end acquisition module is connected to the input end of the acquisition connector.

6. The voltage acquisition board according to claim 1, characterized in that, The voltage acquisition board also includes a communication transformer; The communication transformer is disposed between the daisy-chain connector and each group of the acquisition modules; The communication transformer is also provided between the acquisition modules.

7. The voltage acquisition board according to claim 6, characterized in that, The voltage acquisition board also includes a communication shorting circuit; The communication shorting circuit is connected in parallel with the communication transformer in the daisy-chain communication link.

8. The voltage acquisition board according to claim 7, characterized in that, The communication shorting circuit includes a shorting line; The short-circuit line is used to short-circuit either side of the communication transformer; A second shorting resistor is provided on the shorting line.

9. The voltage acquisition board according to claim 7, characterized in that, The communication shorting circuit includes two shorting lines; The two short-circuit lines are used to short-circuit both sides of the communication transformer; A second shorting resistor is provided on each of the aforementioned shorting lines.

10. A battery management system, characterized in that, It includes a battery module and a voltage acquisition board as described in any one of claims 1-9 connected to the battery module.

Images